PVDF plate with heat preservation function

Abstract

The utility model relates to PVDF board technical field discloses a PVDF board with heat preservation function, including substrate, the substrate from top to bottom includes surface layer, heat preservation core layer and bottom layer, surface layer, heat preservation core layer and bottom layer are combined through composite and are in turn laminated, constitute sandwich sandwich structure, the material of heat preservation core layer is polyurethane foam, the utility model discloses when the PVDF board uses, its adopted polyurethane foam heat preservation core layer can effectively make up the short board of pure PVDF board high heat conductivity coefficient, poor heat preservation performance, simultaneously, heat preservation core layer is integrally formed with surface layer, bottom layer through continuous foaming process, avoided the heat preservation failure problem that the interstice of middle layer, thermal bridge effect led to, ensure that heat preservation effect is durable and stable.

Description

Technical Field

[0001] This utility model relates to the field of PVDF board technology, and in particular to a PVDF board with heat insulation function. Background Technology

[0002] As is well known, PVDF board is a polymer board made of polyvinylidene fluoride resin through processes such as extrusion, molding or injection molding. Its core advantages are its excellent weather resistance and chemical stability, while also having a certain mechanical strength and stain resistance.

[0003] Traditional PVDF panels have a high thermal conductivity and poor insulation performance, requiring more energy to maintain room temperature in winter and increasing the air conditioning cooling load in summer, thus significantly increasing building operating energy consumption.

[0004] Therefore, those skilled in the art have provided a PVDF board with thermal insulation function to solve the problems mentioned in the background art. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a PVDF board with thermal insulation function. When this PVDF board is used, its polyurethane foam insulation core layer can effectively compensate for the shortcomings of pure PVDF boards, such as high thermal conductivity and poor thermal insulation performance. At the same time, the insulation core layer is integrally formed with the surface layer and bottom layer through a continuous foaming process, avoiding the problem of thermal insulation failure caused by gaps between the middle layers and thermal bridging effect, thus ensuring a long-lasting and stable thermal insulation effect.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A PVDF board with thermal insulation function includes a substrate. The substrate includes a top layer, a thermal insulation core layer and a bottom layer from top to bottom. The top layer, thermal insulation core layer and bottom layer are laminated and combined in sequence to form a sandwich structure. The thermal insulation core layer is made of polyurethane foam.

[0008] Compared with existing PVDF boards, the polyurethane foam insulation core layer used in this PVDF board can effectively compensate for the shortcomings of pure PVDF boards, such as high thermal conductivity and poor insulation performance. At the same time, the insulation core layer is integrally formed with the surface layer and bottom layer through a continuous foaming process, avoiding the insulation failure caused by gaps and thermal bridging effects between the middle layers, and ensuring long-lasting and stable insulation effect.

[0009] Furthermore, the surface layer is a solid PVDF board;

[0010] The above technical solution utilizes the dense structure of PVDF solid panels to more effectively prevent the penetration of moisture, dust, and corrosive media.

[0011] Furthermore, the insulation core layer is a polyurethane foam layer integrally formed with the surface layer and the bottom layer through a continuous foaming process;

[0012] Through the above technical solution, the polyurethane foam can form a tight and gapless bond with the surface layer and the bottom layer during the continuous foaming process, which completely eliminates the interlayer bubbles and gaps that may be generated by the traditional "bonding and composite" process, and avoids air convection heat loss caused by gaps.

[0013] Furthermore, the bottom layer is a metal plate;

[0014] The above technical solution utilizes the high strength of metal plates to improve their resistance to wind pressure, bending, and load-bearing capacity, preventing deformation of the plates due to external forces during installation or use.

[0015] This utility model has the following beneficial effects:

[0016] 1. The present invention proposes a PVDF board with thermal insulation function. Compared with existing PVDF boards, the polyurethane foam insulation core layer of the PVDF board can effectively make up for the shortcomings of pure PVDF boards, such as high thermal conductivity and poor thermal insulation performance. At the same time, the insulation core layer is integrally formed with the surface layer and the bottom layer through a continuous foaming process, avoiding the problem of thermal insulation failure caused by gaps and thermal bridging effects between the middle layers, and ensuring long-lasting and stable thermal insulation effect. Attached Figure Description

[0017] Figure 1 This is an isometric view of a PVDF board with heat insulation function proposed in this utility model;

[0018] Figure 2 This is an isometric schematic diagram of a PVDF board with heat insulation function proposed in this utility model.

[0019] Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0020] Explanation of reference numerals in the attached figures:

[0021] 1. Substrate; 2. Top layer; 3. Insulation core layer; 4. Bottom layer. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of specific embodiments. Obviously, the described specific embodiments are only a part of the specific embodiments of the present invention, and not all of them. Based on the specific embodiments of the present invention, all other specific embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Reference Figure 1-3 The present invention provides an embodiment of a PVDF board with heat insulation function, comprising a substrate 1, wherein the substrate 1 comprises a surface layer 2, a heat insulation core layer 3 and a bottom layer 4 from top to bottom, the surface layer 2, the heat insulation core layer 3 and the bottom layer 4 are laminated and stacked in sequence to form a sandwich structure, and the heat insulation core layer 3 is made of polyurethane foam.

[0024] Compared with existing PVDF boards, this PVDF board uses a polyurethane foam insulation core layer 3, which can effectively make up for the shortcomings of pure PVDF boards, such as high thermal conductivity and poor insulation performance. At the same time, the insulation core layer 3 is integrally formed with the surface layer 2 and the bottom layer 4 through a continuous foaming process, avoiding the insulation failure caused by gaps between the middle layers and thermal bridging effect, and ensuring long-lasting and stable insulation effect.

[0025] Surface layer 2 is a solid PVDF board;

[0026] The dense structure of PVDF solid sheets can more effectively prevent the penetration of moisture, dust and corrosive media.

[0027] The insulation core layer 3 is a polyurethane foam layer integrally formed with the surface layer 2 and the bottom layer 4 through a continuous foaming process.

[0028] Through continuous foaming, polyurethane foam can form a tight and gapless bond with the top layer 2 and the bottom layer 4, completely eliminating interlayer bubbles and gaps that may be generated by traditional "bonding and lamination" processes, and avoiding air convection heat dissipation caused by gaps.

[0029] The bottom layer 4 is a metal plate;

[0030] The high strength of metal sheets can improve the sheet's resistance to wind pressure, bending and load-bearing capacity, and prevent the sheet from deforming due to external forces during installation or use.

[0031] Working Principle: The core function is achieved through the synergistic effect of the "surface layer 2 - insulation core layer 3 - bottom layer 4" sandwich structure: First, the outermost PVDF solid board, with its dense structure, forms a protective barrier on the board surface, effectively preventing the penetration of external moisture, dust, and corrosive media, avoiding erosion of the inner insulation core layer 3. Simultaneously, the properties of PVDF material resist the effects of outdoor ultraviolet rays, high and low temperatures, and other environmental influences, protecting the overall structural stability. Second, the middle polyurethane foam insulation core layer 3 plays a core role in heat insulation; its low thermal conductivity can greatly reduce heat loss. This design significantly reduces heat transfer across the sides of the board, compensating for the shortcomings of pure PVDF boards in insulation. Furthermore, due to the continuous foaming process, it is integrally formed with the surface layer 2 and the bottom layer 4, creating a seamless and tight bond with the upper and lower layers. This completely eliminates interlayer bubbles and gaps that may occur with traditional bonding processes, preventing air convection heat loss and thermal bridging effects, and ensuring a long-lasting and stable heat insulation effect. Finally, the bottom layer 4 metal board provides structural support for the entire board with its high-strength characteristics, improving wind pressure resistance and bending resistance, and preventing the insulation core layer 3 from being crushed and damaged due to deformation caused by external forces during installation or use.

[0032] The following points should be noted in this article:

[0033] 1. The accompanying drawings of the embodiments disclosed herein only relate to the structures involved in the embodiments disclosed herein; other structures can be referred to in general design.

[0034] 2. Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing specific embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A PVDF board with heat insulation function, comprising a substrate (1), characterized in that: The substrate (1) includes a top layer (2), a thermal insulation core layer (3) and a bottom layer (4) from top to bottom. The top layer (2), the thermal insulation core layer (3) and the bottom layer (4) are stacked together in sequence to form a sandwich structure. The thermal insulation core layer (3) is made of polyurethane foam.

2. The PVDF board with heat insulation function according to claim 1, characterized in that: The surface layer (2) is a solid PVDF board.

3. The PVDF board with heat insulation function according to claim 1, characterized in that: The insulation core layer (3) is a polyurethane foam layer integrally formed with the surface layer (2) and the bottom layer (4) through a continuous foaming process.

4. A PVDF board with heat insulation function according to claim 1, characterized in that: The bottom layer (4) is a metal plate.

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