Vacuum adsorption deviation correcting device for substrate film pasting machine
Patent Information
- Application Number
- CN202521722443.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-13
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-08-13
AI Technical Summary
[0007]为了解决现有技术中基板贴膜过程中存在定位不准确、纠偏困难的问题,难以实现基板在贴膜过程中的精准定位和微调,导致贴膜质量不佳,同时现有技术缺乏有效的基板固定和转移机构,使得贴膜过程中基板容易发生位移,影响贴膜效果,本发明提供一种基板贴膜机用真空吸附纠偏装置
[0017]本实用新型的有益效果在于:本实用新型通过设置初定位机构和纠偏压紧机构,实现了基板的初步定位和精准纠偏,提高了贴膜精度;通过真空吸附机构中的负压载台和吸嘴设计,实现了基板的稳固吸附,防止贴膜过程中基板发生位移;通过升降承接机构的设计,实现了基板的平稳承接,配合外接上下料机构便于基板的上下料操作;通过四组纠偏压紧机构的协同工作,可以同时对基板进行多方位的微调,确保基板处于水平状态并居中定位;通过传感器的设置,可以实时监测基板高度,便于调整吸嘴与基板之间的高度,保证基板处于同一水平面内;整体结构设计合理,操作流程清晰,提高了贴膜效率和贴膜质量。
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Figure CN224782443U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of film lamination equipment, specifically to a vacuum adsorption correction device for a substrate lamination machine. Background Technology
[0002] With the widespread application of electronic products such as display panels and touch screens, substrate lamination technology plays a crucial role in the electronics manufacturing industry. Substrate lamination refers to the process of precisely attaching protective or functional films to the surface of a substrate. This process demands extremely high precision and quality. During lamination, accurate positioning and correction of the substrate are key steps to ensuring the quality of the lamination.
[0003] Currently, there are various substrate lamination equipment on the market. For example, CN115339685B discloses an automatic lamination robot, which includes a machine base, a product loading mechanism, a moving execution mechanism, and a lamination mechanism. The lamination mechanism includes a vacuum adsorption component and a lifting roller component, enabling one-time rapid application of protective film to the top and sides of the product. CN115009582B discloses an automated lamination equipment, which includes a machine base, a conveying mechanism, and a lamination mechanism. The lamination mechanism includes a material transfer mechanism, a lamination component, and a film supply component. Automated lamination is achieved by setting the lamination mechanism on the unloading conveyor belt assembly and the loading conveyor belt assembly.
[0004] Regarding substrate positioning and correction, CN118025808A discloses a correction and conveying device for a display panel and an inkjet printing system. This device includes a support platform, a linear drive module, a clamping assembly, and a lifting assembly. After the clamping assembly corrects the substrate's alignment, the support platform adheres and fixes the substrate, ensuring high stability and preventing deflection during its movement in the printing direction. CN110654596B discloses an automatic alignment and bonding machine, including a machine base, a liquid crystal substrate feeding platform, a film bonding platform, and a CCD positioning device. The positioning device automatically captures and positions the substrate for precise and rapid bonding. CN112938422B discloses a bonding machine monitoring and correction device and method, including a frame, a conveyor belt, a monitoring mechanism, and a correction mechanism. The monitoring mechanism includes multiple linear modules and a camera, and the correction mechanism includes a correction slide rail, a correction slider, and a correction electric cylinder.
[0005] However, existing substrate lamination equipment still suffers from the following problems: First, existing substrate positioning mechanisms often only achieve preliminary substrate positioning, lacking precise correction functions, leading to inaccurate substrate positioning during lamination and affecting lamination quality. Second, existing vacuum adsorption devices have simple structures and uneven adsorption force distribution, making it difficult to effectively fix substrates of different sizes and shapes, easily causing slight displacement of the substrate during lamination. Third, existing technologies lack effective substrate receiving and transfer mechanisms, easily causing positional deviations during substrate transport, making it difficult to ensure accurate placement of the substrate on the lamination platform. Finally, existing correction mechanisms typically only allow adjustment in a single direction, failing to achieve precise correction of the substrate in multiple directions, thus failing to meet the requirements of high-precision lamination processes.
[0006] Therefore, there is an urgent need for a vacuum adsorption correction device for substrate laminating machines that can achieve precise substrate positioning, multi-directional correction, and stable adsorption and fixation, so as to improve the accuracy and quality of the lamination process. Summary of the Invention
[0007] To address the problems of inaccurate positioning and difficulty in correction during substrate lamination in existing technologies, which make it difficult to achieve precise positioning and fine-tuning of the substrate during lamination and result in poor lamination quality, and the lack of effective substrate fixing and transfer mechanisms in existing technologies, which makes the substrate prone to displacement during lamination and affects the lamination effect, this invention provides a vacuum adsorption correction device for substrate lamination machines.
[0008] The purpose of this utility model is achieved through the following technical solution: a vacuum adsorption correction device for a substrate laminating machine, comprising a conveying mechanism, a preliminary positioning mechanism, a vacuum adsorption mechanism, and a correction pressing mechanism;
[0009] The conveying mechanism includes a first drive module and a second drive module arranged in parallel. The vacuum adsorption mechanism is mounted between the first drive module and the second drive module and is slidably connected to the first drive module and the second drive module respectively. The initial positioning mechanism is located between the first drive module and the second drive module and is located on one side of the vacuum adsorption mechanism.
[0010] The correction and clamping mechanism is provided in four sets, and each correction and clamping mechanism is respectively set on the four sides of the vacuum adsorption mechanism to adjust the position of the substrate placed at the vacuum adsorption mechanism.
[0011] Furthermore, the vacuum adsorption mechanism includes a base, an adsorption mechanism, and a lifting receiving mechanism. The adsorption mechanism is disposed on the upper end surface of the base, and the lifting receiving mechanism is disposed on the base and located below the adsorption mechanism. The upper end of the lifting receiving mechanism can extend out of the adsorption mechanism to receive the substrate.
[0012] Furthermore, the adsorption mechanism includes a film-applying platform and a negative pressure stage. The upper surface of the negative pressure stage is provided with several evenly distributed air channels, and the negative pressure stage is also provided with several airflow pipes penetrating the negative pressure stage. Each air channel is connected to a corresponding airflow pipe. The film-applying platform is sealed and encapsulated between the upper surface of the negative pressure stage and the negative pressure stage to form a negative pressure cavity. The negative pressure stage is provided with several evenly distributed suction nozzles, one end of which is connected to the negative pressure cavity. The upper end of the lifting and receiving mechanism can extend through the film-applying platform to receive the substrate.
[0013] Furthermore, the lifting and receiving mechanism includes a fixed frame, a first cylinder, and several ejector pins. Each ejector pin is evenly and vertically arranged at the upper end of the fixed frame. The fixed frame is located inside the base, and each ejector pin penetrates the film-applying platform. The first cylinder is located on the lower end face of the base and is drivenly connected to the bottom of the fixed frame. The first cylinder can drive the fixed frame to lift and lower relative to the film-applying platform.
[0014] Furthermore, a negative pressure suction pipe is provided below the base. One end of the negative pressure suction pipe is connected to the airflow pipe, and the other end of the negative pressure suction pipe is connected to an external negative pressure machine to generate negative pressure.
[0015] Furthermore, the alignment and clamping mechanism includes a fixed plate, an alignment mounting base, a first driving device, a second driving device, and a clamping plate. The alignment mounting base is slidably sleeved on the upper end face of the fixed plate. The first driving device is fixed to the upper end face of the fixed plate and can drive the alignment mounting base to move along its power output direction. The clamping plate is slidably sleeved on the side of the alignment mounting base. The second driving device is fixed to the alignment mounting base and can drive the clamping plate to move vertically along the side wall of the alignment mounting base. The fixed plate is fixed to the four sides of the base for adjusting the position of the substrate placed on the film-applying platform.
[0016] Furthermore, the film application platform is also equipped with several sensors, which are evenly distributed on the film application platform.
[0017] The beneficial effects of this utility model are as follows: By setting up an initial positioning mechanism and a correction and pressing mechanism, this utility model achieves initial positioning and precise correction of the substrate, improving the film application accuracy; through the design of the negative pressure stage and suction nozzle in the vacuum adsorption mechanism, it achieves stable adsorption of the substrate, preventing the substrate from shifting during the film application process; through the design of the lifting and receiving mechanism, it achieves stable receiving of the substrate, and with the external loading and unloading mechanism, it facilitates the loading and unloading operation of the substrate; through the coordinated work of four sets of correction and pressing mechanisms, it can simultaneously perform multi-directional fine adjustments to the substrate, ensuring that the substrate is in a horizontal state and centered; through the setting of sensors, it can monitor the height of the substrate in real time, making it easy to adjust the height between the suction nozzle and the substrate, ensuring that the substrate is in the same horizontal plane; the overall structural design is reasonable, the operation process is clear, and it improves the film application efficiency and film application quality. Attached Figure Description
[0018] Figure 1 This is a three-dimensional view of the vacuum adsorption correction device of this utility model;
[0019] Figure 2 This is a first exploded schematic diagram of the vacuum adsorption correction device of this utility model.
[0020] Figure 3 This is a second exploded view of the vacuum adsorption correction device of this utility model;
[0021] Figure 4 This is a schematic diagram of the vacuum adsorption mechanism of this utility model;
[0022] Figure 5 This is a first exploded schematic diagram of the vacuum adsorption mechanism of this utility model;
[0023] Figure 6 This is a second exploded view of the vacuum adsorption mechanism of this utility model;
[0024] Figure 7 This is a schematic diagram of the corrective clamping mechanism of this utility model;
[0025] Figure 8 This is a schematic diagram of another correction and clamping mechanism of this utility model;
[0026] Figure 9 This is a structural schematic diagram of the lifting and receiving mechanism of this utility model.
[0027] The attached figures are labeled as follows: 1-Conveying mechanism, 11-First drive module, 12-Second drive module, 2-Initial positioning mechanism, 3-Vacuum adsorption mechanism, 31-Base, 32-Adsorption mechanism, 321-Film application platform, 322-Negative pressure platform, 323-Air passage, 324-Airflow pipe, 325-Nozzle, 33-Lifting and receiving mechanism, 331-Fixed frame, 332-First cylinder, 333-Ejector pin, 34-Negative pressure suction pipe, 4-Correction and clamping mechanism, 41-Fixed plate, 42-Correction mounting base, 43-First drive device, 44-Second drive device, 45-Clamping plate, 46-Sensor, 5-Loading and unloading mechanism, 6-Base plate. Detailed Implementation
[0028] To facilitate understanding by those skilled in the art, the following description is provided in conjunction with embodiments and appendices. Figure 1-9 The present invention will be further described below. The content mentioned in the embodiments is not intended to limit the present invention.
[0029] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or indirectly on that other component.
[0030] When a component is said to be "connected to" another component, it can be directly connected to the other component or indirectly connected to that other component.
[0031] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.
[0033] In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically defined.
[0034] See Figure 1-9 A vacuum adsorption correction device for a substrate laminating machine includes a conveying mechanism 1, a preliminary positioning mechanism 2, a vacuum adsorption mechanism 3, and a correction and pressing mechanism 4.
[0035] The conveying mechanism 1 includes a first drive module 11 and a second drive module 12 arranged in parallel. A vacuum adsorption mechanism 3 is mounted between the first drive module 11 and the second drive module 12, and is slidably connected to both. An initial positioning mechanism 2 is located between the first drive module 11 and the second drive module 12, and is situated on one side of the vacuum adsorption mechanism 3. Four sets of correction and clamping mechanisms 4 are provided, each located on one of the four sides of the vacuum adsorption mechanism 3, for adjusting the position of the substrate 6 placed at the vacuum adsorption mechanism 3.
[0036] The vacuum adsorption mechanism 3 includes a base 31, an adsorption mechanism 32, and a lifting and receiving mechanism 33. The adsorption mechanism 32 is disposed on the upper end surface of the base 31. The lifting and receiving mechanism 33 is disposed on the base 31 and located below the adsorption mechanism 32, and the upper end of the lifting and receiving mechanism 33 can extend out of the adsorption mechanism 32 to receive the substrate 6.
[0037] The adsorption mechanism 32 includes a film-applying platform 321 and a negative pressure stage 322. The upper surface of the negative pressure stage 322 has several evenly distributed air channels 323, and the negative pressure stage 322 also has several airflow pipes 324 penetrating through it, with each air channel 323 communicating with a corresponding airflow pipe 324. The film-applying platform 321 is sealed within the upper surface of the negative pressure stage 322, forming a negative pressure cavity between itself and the negative pressure stage 322. The negative pressure stage 322 has several evenly distributed suction nozzles 325, one end of which communicates with the negative pressure cavity. The upper end of the lifting and receiving mechanism 33 extends through the film-applying platform 321 to receive the substrate 6.
[0038] The lifting and receiving mechanism 33 includes a fixed frame 331, a first cylinder 332, and several ejector pins 333. Each ejector pin 333 is evenly and vertically arranged at the upper end of the fixed frame 331, which is located within the base 31, and each ejector pin 333 penetrates the film-applying platform 321. The first cylinder 332 is located on the lower end face of the base 31 and is drivenly connected to the bottom of the fixed frame 331. The first cylinder 332 can drive the fixed frame 331 to lift relative to the film-applying platform 321.
[0039] A negative pressure suction pipe 34 is also provided below the base 31. One end of the negative pressure suction pipe 34 is connected to the airflow pipe 324, and the other end of the negative pressure suction pipe 34 is connected to an external negative pressure machine to generate negative pressure.
[0040] The alignment and clamping mechanism 4 includes a fixed plate 41, an alignment mounting base 42, a first driving device 43, a second driving device 44, and a clamping plate 45. The alignment mounting base 42 is slidably sleeved on the upper end surface of the fixed plate 41. The first driving device 43 is fixed to the upper end surface of the fixed plate 41 and can drive the alignment mounting base 42 to move along its power output direction. The clamping plate 45 is slidably sleeved on the side of the alignment mounting base 42. The second driving device 44 is fixed to the alignment mounting base 42 and can drive the clamping plate 45 to move vertically along the side wall of the alignment mounting base 42. The fixed plate 41 is fixed to the four sides of the base 31 for adjusting the position of the substrate 6 placed on the film application platform 321.
[0041] The film application platform 321 is also equipped with several sensors 46, which are evenly distributed on the film application platform 321.
[0042] In actual operation, the substrate 6 is transported to the initial positioning mechanism 2 for preliminary positioning by manual labor or a robotic arm, and then transferred to the vacuum adsorption mechanism 3 by the loading and unloading mechanism 5. At this time, the ejector pin 333 of the lifting receiving mechanism 33 extends upwards from the film-applying platform 321 under the drive of the first cylinder 332 to receive the substrate 6. After the substrate 6 is placed in position, the ejector pin 333 descends, and the substrate 6 falls onto the film-applying platform 321. The negative pressure suction pipe 34 is connected to an external negative pressure machine to generate negative pressure, which is transmitted to the negative pressure chamber through the airflow pipe 324 and the air passage 323, and then adsorbed and fixed by the suction nozzle 325.
[0043] Four sets of alignment and clamping mechanisms 4 precisely position and clamp the substrate 6 from four sides. In specific operation, the first drive device 43 drives the alignment mounting base 42 to move horizontally, adjusting the horizontal position of the clamping plate 45; the second drive device 44 drives the clamping plate 45 to move vertically, clamping the edges of the substrate 6, thereby achieving precise positioning and alignment of the substrate 6. The sensor 46 on the film application platform 321 can detect the position information of the substrate 6, providing data support for the alignment process.
[0044] Through this structural design, the vacuum adsorption correction device of the substrate 6 laminating machine can achieve precise positioning, stable adsorption and precise correction of the substrate 6, which improves the accuracy and efficiency of the laminating process, reduces the problems of bubbles and offset during the laminating process, and improves the product yield.
[0045] Finally, it should be noted that the above descriptions are merely preferred embodiments of this application, and this application is not limited to the above embodiments. It is understood that other improvements and variations directly derived or conceived by those skilled in the art without departing from the spirit and concept of this application should be considered to be included within the protection scope of this application.
Claims
1. A vacuum adsorption correction device for a substrate laminating machine, characterized in that: This includes a conveying mechanism, a preliminary positioning mechanism, a vacuum adsorption mechanism, and a correction and clamping mechanism; The conveying mechanism includes a first drive module and a second drive module arranged in parallel. The vacuum adsorption mechanism is mounted between the first drive module and the second drive module and is slidably connected to the first drive module and the second drive module respectively. The initial positioning mechanism is located between the first drive module and the second drive module and is located on one side of the vacuum adsorption mechanism. The correction and clamping mechanism is provided in four sets, and each correction and clamping mechanism is respectively set on the four sides of the vacuum adsorption mechanism to adjust the position of the substrate placed at the vacuum adsorption mechanism.
2. The vacuum adsorption correction device for a substrate laminating machine according to claim 1, characterized in that: The vacuum adsorption mechanism includes a base, an adsorption mechanism, and a lifting and receiving mechanism. The adsorption mechanism is disposed on the upper surface of the base, and the lifting and receiving mechanism is disposed on the base and located below the adsorption mechanism. The upper end of the lifting and receiving mechanism can extend out of the adsorption mechanism to receive the substrate.
3. The vacuum adsorption correction device for a substrate laminating machine according to claim 2, characterized in that: The adsorption mechanism includes a film-applying platform and a negative pressure platform. The upper surface of the negative pressure platform is provided with several evenly distributed air channels, and the negative pressure platform is also provided with several airflow pipes penetrating the negative pressure platform. Each air channel is connected to a corresponding airflow pipe. The film-applying platform is sealed and encapsulated between the upper surface of the negative pressure platform and the negative pressure platform to form a negative pressure cavity. The negative pressure platform is provided with several evenly distributed suction nozzles, one end of which is connected to the negative pressure cavity. The upper end of the lifting and receiving mechanism can extend through the film-applying platform to receive the substrate.
4. The vacuum adsorption correction device for a substrate laminating machine according to claim 3, characterized in that: The lifting and receiving mechanism includes a fixed frame, a first cylinder and several ejector pins. Each ejector pin is evenly and vertically arranged at the upper end of the fixed frame. The fixed frame is located inside the base, and each ejector pin passes through the film application platform. The first cylinder is located on the lower end face of the base and is driven to the bottom of the fixed frame. The first cylinder can drive the fixed frame to lift relative to the film application platform.
5. The vacuum adsorption correction device for a substrate laminating machine according to claim 3, characterized in that: A negative pressure suction pipe is also provided below the base. One end of the negative pressure suction pipe is connected to the airflow pipe, and the other end of the negative pressure suction pipe is connected to an external negative pressure machine to generate negative pressure.
6. The vacuum adsorption correction device for a substrate laminating machine according to claim 3, characterized in that: The alignment and clamping mechanism includes a fixed plate, an alignment mounting base, a first driving device, a second driving device, and a clamping plate. The alignment mounting base is slidably sleeved on the upper end face of the fixed plate. The first driving device is fixed to the upper end face of the fixed plate and can drive the alignment mounting base to move along its power output direction. The clamping plate is slidably sleeved on the side of the alignment mounting base. The second driving device is fixed to the alignment mounting base and can drive the clamping plate to move vertically along the side wall of the alignment mounting base. The fixed plate is fixed to the four sides of the base for adjusting the position of the substrate placed on the film-applying platform.
7. The vacuum adsorption correction device for a substrate laminating machine according to claim 3, characterized in that: The film application platform is also equipped with several sensors, which are evenly distributed on the film application platform.
Citation Information
Patent Citations
Automatic alignment and biasing machine
CN110654596B
Monitoring and correction device and correction method for film laminating machine
CN112938422B
Automatic film pasting equipment
CN115009582B
Automatic screen protector robot
CN115339685B