Chip feed shuttle for a semiconductor chip tester

Abstract

The utility model discloses a kind of chip conveying shuttle of semiconductor chip testing machine, including conveyor body, reciprocating conveying belt is provided on the conveyor body;Two groups of displacement plates are provided on the conveying belt, displacement plate is provided on the chip magazine plate, mounting groove is provided on the chip magazine plate, chip magazine tray is provided in the mounting groove, mounting assembly is also provided in the mounting groove, the mounting assembly is cooperated with chip magazine tray, so that chip magazine tray is positioned in mounting groove;The beneficial effects of the utility model are: through the basic conveying structure of conveyor body, reciprocating conveying belt, in combination with two groups of displacement plates, double-station design of corresponding chip magazine plate, realize single-time synchronous conveying two groups of chip magazine tray, compared with single-station chip magazine, significantly shorten the transfer cycle of chip in testing machine, improve test operation efficiency.

Description

Technical Field

[0001] This utility model relates to a chip conveying shuttle for a semiconductor chip testing machine. Background Technology

[0002] In semiconductor chip testing, the chip feed shuttle is a core transmission component connecting the chip memory cells and the testing mechanism. Its performance directly determines the testing capacity, chip yield, and testing accuracy. Currently, the mainstream chip feed shuttles in the industry have several technical shortcomings.

[0003] Existing chip conveying shuttles generally adopt a single-station design, capable of carrying and transporting only one set of chip trays at a time. This results in a long transfer cycle of chips within the testing machine, failing to meet the high-efficiency requirements of large-scale chip mass production testing and hindering the overall improvement of testing capacity. Furthermore, the positioning structure design of the chip trays is imperfect, lacking an active and reliable positioning constraint mechanism. During the reciprocating transport process, the chip trays are susceptible to inertial impacts and equipment vibrations, causing horizontal shifting or vertical lifting, making it difficult to ensure the accuracy of chip placement and pickup. This leads to misalignment between the testing mechanism and the chips, affecting the accuracy of test results. Therefore, this invention proposes a chip conveying shuttle for a semiconductor chip testing machine to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a chip conveying shuttle for a semiconductor chip testing machine to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A chip conveying shuttle for a semiconductor chip testing machine includes a conveyor body, on which a reciprocating conveyor belt is provided; The conveyor belt is equipped with two sets of displacement plates, each with a shuttle plate and a mounting groove. A chip tray is placed in the mounting groove, and a mounting assembly is also placed in the mounting groove. The mounting assembly cooperates with the chip tray to position the chip tray in the mounting groove.

[0006] As an improvement to the above technical solution, the shuttle plate is provided with a first positioning plate and a second positioning plate, and the mounting groove is provided between the first positioning plate and the second positioning plate; The mounting components are positioned between the first positioning plate and the second positioning plate.

[0007] As an improvement to the above technical solution, a drive slot is provided in the mounting slot; The mounting assembly includes a drive mounting screw, which is rotatably disposed in a drive groove. A drive plate is provided on the outer wall of the drive mounting screw, and a threaded hole is provided on the drive plate. The threaded hole is threadedly engaged with the drive mounting screw. The drive plate is also slidably disposed in the drive groove.

[0008] As an improvement to the above technical solution, a mounting plate is provided on the driver board, the mounting plate is disposed between the first positioning plate and the second positioning plate, and the chip tray is disposed between the mounting plate and the first positioning plate.

[0009] As an improvement to the above technical solution, the mounting assembly further includes a drive rod, which is connected to the drive mounting screw via a transmission connection. An external hexagonal toggle block is provided on the drive rod.

[0010] As an improvement to the above technical solution, the conveyor body includes two sets of side plates, which are symmetrically arranged, and a connecting plate is provided between the two sets of side plates. The connecting plate is provided with an active wheel and a driven wheel, and the conveyor belt is arranged between the active wheel and the driven wheel. The bottom end of the connecting plate is provided with a drive servo motor that is connected to the active wheel.

[0011] As an improvement to the above technical solution, a guide rail is provided on the side plate; Both sets of displacement plates are equipped with sliders, which are slidably mounted on guide rails to guide the displacement plates.

[0012] As an improvement to the above technical solution, a positioning clamping plate is provided on the displacement plate, and the positioning clamping plate is connected to the displacement plate by bolts; The conveyor belt is positioned between the positioning clamping plate and the displacement plate.

[0013] As an improvement to the above technical solution, the shuttle plate is provided with an extension plate, which is connected to the displacement plate by bolts, so that the upper and lower positions of the two sets of shuttle plates are matched.

[0014] Compared with the prior art, the beneficial effects of this utility model are: The basic conveying structure, consisting of the conveyor body and reciprocating conveyor belt, combined with a dual-station design featuring two sets of displacement plates and corresponding shuttle plates, enables the synchronous conveying of two sets of chip trays in a single operation. Compared to a single-station shuttle, this significantly shortens the chip transfer cycle within the testing machine and improves testing efficiency. Simultaneously, the coordinated structure of the mounting slot and mounting components provides active positioning constraints for the chip trays, preventing them from shifting horizontally or lifting vertically due to inertia or vibration during reciprocating conveying. This ensures the positional accuracy of the chip trays and the embedded chips, meeting the stringent requirements of the testing machine for chip placement and removal. The reciprocating conveyor belt provides smooth power transmission to the displacement plate and shuttle plate, avoiding the impact and vibration that are easily generated by traditional rigid conveyor structures. The mounting groove limits the capacity of the chip tray, and the positioning function of the mounting components can effectively prevent the chips from scratching the inner wall of the shuttle plate during the conveying process, or from being damaged due to the chip tray tipping over, thus ensuring the structural integrity of the chips during the conveying process. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This utility model Figure 1 Enlarged structural diagram at point A; Figure 3 This is a test diagram of the present invention; Figure 4 This utility model Figure 3 Enlarged structural diagram at point B; Figure 5 This is a schematic diagram showing the positions of the displacement plate and the shuttle plate of this utility model; Figure 6 This is a schematic diagram showing the positions of another set of displacement plates and shuttle plates of this utility model; Figure 7 This is a schematic diagram of the structure of the feed shuttle plate of this utility model; Figure 8 This utility model Figure 7 Enlarged structural diagram at point C; Figure 9 This is a schematic diagram of the drive board of this utility model.

[0016] In the diagram: 10. Conveyor body; 11. Side plate; 12. Connecting plate; 13. Driven wheel; 14. Driven wheel; 15. Guide rail; 16. Slider; 20. Conveyor belt; 30. Chip tray; 40. Displacement plate; 41. Positioning clamping plate; 50. Shuttle plate; 51. Extension plate; 52. Mounting slot; 53. First positioning plate; 54. Drive slot; 55. Second positioning plate; 60. Mounting assembly; 61. Drive mounting screw; 62. Mounting plate; 63. Drive rod; 64. External hexagonal actuating block; 65. Drive plate; 66. Threaded hole. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Example: like Figure 1-9 As shown, this embodiment proposes a chip conveying shuttle for a semiconductor chip testing machine, including a conveyor body 10, on which a reciprocating conveyor belt 20 is provided; The conveyor belt 20 is provided with two sets of displacement plates 40, each displacement plate 40 is provided with a shuttle plate 50, each shuttle plate 50 is provided with an installation groove 52, each installation groove 52 is provided with a chip tray 30, and each installation groove 52 is also provided with an installation component 60, which cooperates with the chip tray 30 to position the chip tray 30 in the installation groove 52.

[0019] In this embodiment, during use, the two sets of shuttle plates 50 are connected to the two sets of conveyor belts 20 respectively, and the shuttle plates 50 are tested to see if they can move smoothly. Then, the chip tray 30 is placed in the mounting slot 52, and the chip tray 30 is positioned by the mounting component 60. Then, the chip is placed in the chip tray 30, and the shuttle plates 50 are moved by the displacement plate 40, thereby moving the chip on the chip tray 30 to complete the chip conveying process. Through the basic conveying structure of the conveyor body 10 and the reciprocating conveyor belt 20, combined with the dual-station design of two sets of displacement plates 40 and corresponding shuttle plates 50, two sets of chip trays 30 can be conveyed synchronously in a single operation. Compared with a single-station shuttle, this significantly shortens the transfer cycle of chips in the testing machine and improves the efficiency of testing operations. At the same time, the cooperative structure of the mounting slot 52 and the mounting component 60 can form an active positioning constraint on the chip trays 30, preventing the chip trays 30 from horizontally shifting or vertically lifting due to inertia and vibration during reciprocating conveying. This ensures the positional accuracy of the chip trays 30 and the built-in chips, meeting the stringent requirements of the testing machine for chip pick-up and placement positions. The reciprocating conveyor belt 20 provides stable power transmission to the displacement plate 40 and the shuttle plate 50, avoiding the impact and vibration that are easily generated by traditional rigid conveying structures such as gears and racks. The mounting groove 52 limits the intake of the chip tray 30, and the positioning function of the mounting component 60 can effectively prevent the chip from scratching the inner wall of the shuttle plate 50 during the conveying process, or from being damaged due to the chip tray 30 tipping over, thus ensuring the structural integrity of the chip during the conveying process.

[0020] Specifically, the shuttle plate 50 is provided with a first positioning plate 53 and a second positioning plate 55, and the mounting groove 52 is disposed between the first positioning plate 53 and the second positioning plate 55; The installation component 60 is disposed between the first positioning plate 53 and the second positioning plate 55.

[0021] In this embodiment, the first positioning plate 53 and the second positioning plate 55 form the rigid boundaries on both sides of the mounting groove 52, which can form a lateral limit on the chip tray 30, limit the horizontal placement range of the chip tray 30, prevent the chip tray 30 from shifting laterally during the transportation process, and ensure the initial placement accuracy of the chip tray 30.

[0022] Specifically, a drive slot 54 is provided in the mounting slot 52; The mounting assembly 60 includes a drive mounting screw 61, which is rotatably disposed in a drive groove 54. A drive plate 65 is provided on the outer wall of the drive mounting screw 61. A threaded hole 66 is provided on the drive plate 65, which is threadedly engaged with the drive mounting screw 61. The drive plate 65 is also slidably disposed in the drive groove 54.

[0023] In this embodiment, the drive groove 54 provides radial support and coaxiality constraint for the drive mounting screw 61, which can effectively suppress the radial runout generated by the drive mounting screw 61 during rotation and ensure that the axis of the drive mounting screw 61 remains stable. At the same time, the drive plate 65 forms a precision threaded engagement with the drive mounting screw 61 through the threaded hole 66, which accurately converts the rotational motion of the drive mounting screw 61 into the linear motion of the drive plate 65 along the drive groove 54, avoiding idle error or displacement offset during transmission, and making the displacement accuracy of the positioning point of the drive plate 65 on the chip tray 30 controllable, meeting the micron-level accuracy requirements of semiconductor chip testing for tray positioning. The inner wall of the drive groove 54 and the outer wall of the drive plate 65 form a sliding fit, providing bidirectional guidance and limiting the drive plate 65. This restricts the drive plate 65 to only move in a straight line along the extension direction of the drive groove 54, preventing lateral offset or torsion caused by conveying vibration and inertial impact. This ensures that the positioning force of the drive plate 65 on the chip tray 30 is always applied in the preset direction. Furthermore, the threaded fit structure has a self-locking characteristic. After the drive mounting screw 61 stops rotating, it can prevent the drive plate 65 from being accidentally displaced by external forces, further ensuring the positioning stability of the chip tray 30 throughout the conveying process and avoiding misalignment between the chip and the testing mechanism due to positioning failure.

[0024] Specifically, the drive board 65 is provided with a mounting plate 62, which is disposed between the first positioning plate 53 and the second positioning plate 55, and the chip tray 30 is disposed between the mounting plate 62 and the first positioning plate 53.

[0025] In this embodiment, the mounting plate 62 and the first positioning plate 53 form a lateral clamp for the chip tray 30 in order to maintain the stability of the chip tray 30, and at the same time, it can be replaced with chip trays 30 of different specifications in the future.

[0026] Specifically, the mounting assembly 60 further includes a drive rod 63, which is connected to the drive mounting screw 61 in a transmission manner; An external hexagonal toggle block 64 is provided on the drive rod 63.

[0027] In this embodiment, the drive rod 63 serves as an intermediate transmission component, directly forming a rigid transmission connection with the drive mounting screw 61. This establishes a stable transmission path between the external operating end and the internal drive mounting screw 61. This design allows operators to apply torque to the drive mounting screw 61 via the drive rod 63 without disassembling the shuttle plate 50 or exposing the internal structure of the mounting slot 52. This enables non-intrusive adjustment of the displacement of the drive plate 65, avoiding component damage and dust contamination caused by direct operation of the internal drive mounting screw 61, while ensuring the coaxiality and transmission accuracy of the drive mounting screw 61's rotation. This provides a reliable power transmission basis for the positioning and adjustment of the chip tray 30.

[0028] Specifically, the conveyor body 10 includes two sets of side plates 11, which are symmetrically arranged, and a connecting plate 12 is provided between the two sets of side plates 11. The connecting plate 12 is provided with an active wheel 14 and a driven wheel 13, and the conveyor belt 20 is arranged between the active wheel 14 and the driven wheel 13. The bottom end of the connecting plate 12 is provided with a drive servo motor that is connected to the active wheel 14.

[0029] In this embodiment, two sets of symmetrically arranged side plates 11 and connecting plates 12 form a closed rigid frame, which can evenly distribute the overall load of the conveyor belt 20, displacement plate 40, shuttle plate 50 and chip tray 30, avoid frame deformation or displacement caused by stress concentration on one side, ensure that the conveyor body 10 maintains structural accuracy in long-term reciprocating conveying operations, and provide stable basic bearing conditions for the subsequent accurate conveying of chip tray 30. The driving wheel 14 and the driven wheel 13 are both mounted on the connecting plate 12. The connecting plate 12 provides a unified mounting reference surface for the two wheels, which can effectively ensure the parallelism and spacing stability of the wheel axis and avoid problems such as belt misalignment and uneven tension caused by installation reference deviation. At the same time, this layout ensures that the conveyor belt 20 always fits in contact with the outer surface of the wheel, eliminating belt slippage and tooth skipping, and ensuring that the reciprocating motion trajectory of the conveyor belt 20 is accurate and controllable, providing reliable transmission support for the smooth displacement of the displacement plate 40 and the shuttle plate 50.

[0030] Specifically, a guide rail 15 is provided on the side plate 11; Both sets of displacement plates 40 are provided with sliders 16, which are slidably mounted on guide rails 15 to guide the displacement plates 40.

[0031] In this embodiment, the guide rail 15 is rigidly mounted on the side plate 11 to form a fixed linear guide path; the sliding cooperation between the slider 16 and the guide rail 15 can forcibly constrain the movement direction of the displacement plate 40, allowing the displacement plate 40 to only make linear reciprocating motion along the extension direction of the guide rail 15, effectively suppressing the lateral offset, torsion or up-down movement of the displacement plate 40 caused by the transmission deviation of the conveyor belt 20 and uneven load during the conveying process, ensuring that the movement trajectory of the displacement plate 40 driving the shuttle plate 50 and the chip tray 30 always maintains the preset straightness, meeting the stringent requirements of the semiconductor chip testing machine for the accuracy of the chip conveying path.

[0032] Specifically, the displacement plate 40 is provided with a positioning clamping plate 41, which is connected to the displacement plate 40 by bolts; The conveyor belt 20 is disposed between the positioning clamping plate 41 and the displacement plate 40.

[0033] In this embodiment, the positioning clamping plate 41 and the displacement plate 40 form a rigid clamping of the conveyor belt 20 through the pre-tightening force of the bolts. This allows the reciprocating motion force of the conveyor belt 20 to be directly and evenly transmitted to the displacement plate 40 through the clamping surface, avoiding relative sliding between the conveyor belt 20 and the displacement plate 40 due to insufficient friction, and eliminating the backlash error or lag phenomenon in the power transmission process.

[0034] Specifically, the shuttle plate 50 is provided with an extension plate 51, which is connected to the displacement plate 40 by bolts, so that the two sets of shuttle plates 50 are matched in vertical position.

[0035] In this embodiment, the extension plate 51 can be set according to the actual situation. Of course, in this embodiment, the extension plates 51 are set facing the same side, and the lengths of the extension plates 51 are different. By supplementing the length of the extension plates 51, the upper and lower positions of the shuttle plate 50 are matched so that other operations can be performed on the chip on the shuttle plate 50 in the future.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip conveying shuttle for a semiconductor chip testing machine, characterized in that: Includes a conveyor body (10), on which a reciprocating conveyor belt (20) is provided; Two sets of displacement plates (40) are provided on the conveyor belt (20). A shuttle plate (50) is provided on the displacement plate (40). An installation groove (52) is provided on the shuttle plate (50). A chip tray (30) is provided in the installation groove (52). An installation component (60) is also provided in the installation groove (52). The installation component (60) cooperates with the chip tray (30) so that the chip tray (30) is positioned in the installation groove (52).

2. The chip conveying shuttle of a semiconductor chip testing machine according to claim 1, characterized in that: The feed shuttle plate (50) is provided with a first positioning plate (53) and a second positioning plate (55), and the mounting groove (52) is provided between the first positioning plate (53) and the second positioning plate (55); The installation component (60) is disposed between the first positioning plate (53) and the second positioning plate (55).

3. The chip conveying shuttle of a semiconductor chip testing machine according to claim 2, characterized in that: A drive slot (54) is provided in the mounting slot (52); The mounting assembly (60) includes a drive mounting screw (61), which is rotatably disposed in a drive groove (54). A drive plate (65) is provided on the outer wall of the drive mounting screw (61). A threaded hole (66) is provided on the drive plate (65), which is threadedly engaged with the drive mounting screw (61). The drive plate (65) is also slidably disposed in the drive groove (54).

4. The chip conveying shuttle of a semiconductor chip testing machine according to claim 3, characterized in that: The drive board (65) is provided with an mounting plate (62), which is located between the first positioning plate (53) and the second positioning plate (55). The chip tray (30) is located between the mounting plate (62) and the first positioning plate (53).

5. The chip conveying shuttle of a semiconductor chip testing machine according to claim 4, characterized in that: The mounting assembly (60) further includes a drive rod (63), which is connected to the drive mounting screw (61) in a transmission manner; The drive rod (63) is provided with an external hexagonal toggle block (64).

6. The chip conveying shuttle of a semiconductor chip testing machine according to claim 1, characterized in that: The conveyor body (10) includes two sets of side plates (11), which are symmetrically arranged, and a connecting plate (12) is provided between the two sets of side plates (11). The connecting plate (12) is provided with an active wheel (14) and a driven wheel (13), and the conveyor belt (20) is provided between the active wheel (14) and the driven wheel (13). The bottom end of the connecting plate (12) is provided with a drive servo motor that is connected to the active wheel (14) for transmission.

7. The chip conveying shuttle of a semiconductor chip testing machine according to claim 6, characterized in that: The side plate (11) is provided with a guide rail (15); Both sets of displacement plates (40) are provided with sliders (16), which are slidably mounted on guide rails (15) to guide the displacement plates (40).

8. The chip conveying shuttle of a semiconductor chip testing machine according to claim 1, characterized in that: The displacement plate (40) is provided with a positioning clamping plate (41), and the positioning clamping plate (41) is connected to the displacement plate (40) by bolts; The conveyor belt (20) is disposed between the positioning clamping plate (41) and the displacement plate (40).

9. The chip conveying shuttle of a semiconductor chip testing machine according to claim 1, characterized in that: The shuttle plate (50) is provided with an extension plate (51), which is connected to the displacement plate (40) by bolts, so that the two sets of shuttle plates (50) are matched in the upper and lower positions.

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