sequencer

Abstract

The utility model relates to sequencing field discloses a sequencer, include: temperature control area, sequencing biochip, sequencing biochip is located in temperature control area, heat exchange spare, heat exchange spare is located in temperature control area, and can conduct heat to change the ambient temperature of temperature control area, first temperature control mechanism, first temperature control mechanism is located in temperature control area at least partially, first temperature control mechanism is joined in heat exchange spare, and can heat or refrigeration to change the temperature of heat exchange spare, and, second temperature control mechanism, second temperature control mechanism is located in temperature control area and is close to sequencing biochip, and second temperature control mechanism can heat to make sequencing biochip reach required temperature, through above technical scheme, the utility model controls the overall temperature of temperature control area through first temperature control mechanism, and sequencing biochip can obtain stable ambient temperature, and accurate temperature compensation is carried out through the heating of second temperature control mechanism, and temperature is more accurate, stable, is favorable for subsequent sequencing operation.

Description

Technical Field

[0001] This utility model relates to the field of sequencing, and more specifically to a sequencer. Background Technology

[0002] The sequencer is the core equipment for gene sequencing. Sequencing biochips have high temperature requirements during the sequencing process, so precise temperature control is necessary.

[0003] Current technologies typically place sequencing-related components in a specific area and control the temperature of that area. However, this area is relatively large, making it difficult to respond quickly and promptly to temperature changes in the sequencing biochip. Alternatively, temperature control may be applied only to the sequencing biochip itself, which is susceptible to fluctuations in the internal ambient temperature, resulting in unstable temperature control for the sequencing biochip. Both of these approaches lead to unstable temperature control for the sequencing biochip, impacting its sequencing performance. Utility Model Content

[0004] The purpose of this invention is to overcome the technical problem of unstable temperature control in existing sequencers, which affects the sequencing of sequencing biochips.

[0005] To achieve the above objectives, this utility model provides a sequencer, comprising: Temperature-controlled area; Sequencing biochips are located in a temperature-controlled area. A heat exchanger is located in a temperature-controlled area and is capable of conducting heat to change the ambient temperature of the temperature-controlled area. A first temperature control mechanism, at least partially located within the temperature control area, is coupled to a heat exchanger and is capable of heating or cooling to change the temperature of the heat exchanger; and The second temperature control mechanism is located in the temperature control area and close to the sequencing biochip. The second temperature control mechanism can heat the sequencing biochip to reach the required temperature.

[0006] In some embodiments, the first temperature control mechanism includes a temperature control module, a semiconductor refrigeration chip connected to the temperature control module, and a first temperature sensor. The first temperature sensor is located in the temperature control area. The semiconductor refrigeration chip includes a first heat-conducting end and a second heat-conducting end. The first heat-conducting end is connected to a heat exchange component and can heat and cool the heat exchange component under the control of the temperature control module.

[0007] In some embodiments, the first temperature control mechanism further includes a heat conduction element disposed at the second heat conduction end and capable of balancing the temperature of the second heat conduction end.

[0008] In some embodiments, the heat conduction element includes a heat sink and a cooling fan, the heat sink being joined to a second heat conduction end, and the cooling fan being located on the side of the heat sink away from the second heat conduction end.

[0009] In some embodiments, the second heat-conducting end of the semiconductor cooling chip and the heat-conducting element are located outside the temperature control area.

[0010] In some embodiments, the second temperature control mechanism includes a resistance heater, the heating surface of which is attached to the sequencing biochip and is capable of heating the sequencing biochip.

[0011] In some embodiments, the second temperature control mechanism further includes a second temperature sensor disposed on the resistance heater, the resistance heater being communicatively connected to the second temperature sensor and capable of being turned on and off according to the signal from the second temperature sensor.

[0012] In some embodiments, the heat exchanger is a metal plate with an opening at the center, and the sequencing biochip is disposed in the opening.

[0013] In some embodiments, the sequencer further includes a circuit assembly located in a temperature-controlled area.

[0014] In some embodiments, the outer edge of the temperature control area is provided with a heat insulation layer.

[0015] Through the above technical solution, this utility model sets up a temperature control area inside the sequencer, and a heat exchange component is provided in the temperature control area. The heat exchange component is cooled or heated by the heating or cooling of the first temperature control mechanism to control the overall temperature of the temperature control area. The sequencing biochip is placed in the temperature control area and can obtain a stable ambient temperature. The precise temperature compensation is performed by the heating of the second temperature control mechanism, which can quickly respond to the temperature changes of the sequencing biochip caused by various factors, making the temperature of the sequencing biochip more accurate and stable, which is beneficial to subsequent sequencing operations. Attached Figure Description

[0016] Figure 1 This is an overall diagram of the sequencer according to an embodiment of the present invention; Figure 2 This is a cross-sectional view of the sequencer according to an embodiment of the present invention; Figure 3 yes Figure 2 A magnified view of a portion of the image; Figure 4 This is a structural diagram of the sequencer according to an embodiment of the present invention, with the top cover and upper heat insulation layer removed. Figure 5 This is a partial exploded view of the sequencer according to an embodiment of the present invention.

[0017] Explanation of reference numerals in the attached figures 1. Temperature control area; 11. Insulation layer; 111. Upper insulation layer; 112. Lower insulation layer; 113. Side insulation layer; 2. Sequencing biochip; 3. First temperature control mechanism; 31. Semiconductor cooling chip; 311. First heat-conducting end; 312. Second heat-conducting end; 32. First temperature sensor; 33. Heat conduction component; 331. Heat sink; 332. Cooling fan; 34. Temperature control module; 4. Second temperature control mechanism; 41. Resistance heater; 5. Heat exchange component; 6. Circuit assembly; 7. Top cover. Detailed Implementation

[0018] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0019] In this invention, unless otherwise stated, directional terms such as "up," "down," "left," "right," "inner," and "outer" are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0020] To address the technical problem of unstable temperature control in existing sequencers, which affects the sequencing of biological chips, this application provides a sequencer that provides more stable temperature control for biological chips. The overall shape of the sequencer is as follows: Figure 1 As shown, it is understandable that Figure 1 This is merely one embodiment of the sequencer of this utility model, and should not be construed as a limitation on the sequencer of this utility model. Figure 2 As shown, the sequencer of this utility model includes: a temperature control region 1, which is a region in the sequencer where temperature is controlled, so that components located in this region can be kept at a stable and suitable temperature; a sequencing biochip 2, which is located in the temperature control region 1 and is kept at a stable ambient temperature; a heat exchanger 5, which is disposed in the temperature control region 1 and can conduct heat, and the ambient temperature of the temperature control region 1 can be changed by raising or lowering the temperature of the heat exchanger 5; a first temperature control mechanism 3, which is at least partially disposed in the temperature control region 1, is connected to the heat exchanger 5, and can heat or cool to change the temperature of the heat exchanger 5, so that the temperature control region 1 has a stable ambient temperature; and a second temperature control mechanism 4, which is disposed in the temperature control region 1 and close to the sequencing biochip 2, and can compensate for the heating of the sequencing biochip 2, so that the sequencing biochip 2 reaches the required temperature.

[0021] Through the above technical solution, the sequencing biochip 2 is placed in the temperature-controlled region 1. The sequencing biochip 2 can avoid or mitigate temperature changes caused by external temperature variations and other factors affecting the sequencer's ambient temperature, thus maintaining a relatively stable temperature environment. Furthermore, a second temperature control mechanism 4 provides compensatory heating to the sequencing biochip 2, enabling it to more accurately reach the required temperature, which is more conducive to sequencing. In practical use, the temperature of the temperature-controlled region 1 can be set slightly lower than the required temperature of the sequencing biochip 2, and the second temperature control mechanism 4 will provide compensatory heating to achieve the required temperature.

[0022] In some embodiments, such as Figure 1 As shown, the first temperature control mechanism 3 includes a temperature control module 34, a semiconductor cooling chip 31 connected to the temperature control module 34 via a signal, and a first temperature sensor 32. The first temperature sensor 32 is located in the temperature control area 1 and can acquire temperature information in the temperature control area 1 and transmit it to the temperature control module 34, which then controls the current flow in the semiconductor cooling chip 31. The semiconductor cooling chip 31 is made of semiconductor material and includes a first heat-conducting end 311 and a second heat-conducting end 312. The specific temperature control principle is that when current passes through a thermocouple composed of two different semiconductor materials connected in series, heat is absorbed and released at the two ends of the thermocouple, respectively. When current is applied to the semiconductor cooling chip 31 in a first direction, the temperature of the first heat-conducting end 311 decreases (cooling), while the temperature of the second heat-conducting end 312 increases (heating). When current is applied in a second direction opposite to the first direction, the temperatures at the two ends of the thermocouple change in opposite directions, i.e., the temperature of the first heat-conducting end 311 increases (heating), while the temperature of the second heat-conducting end 312 decreases (cooling). Utilizing this characteristic of the thermoelectric cooler 31, the first heat-conducting end 311 is connected to the heat exchanger 5. The current flow direction in the thermoelectric cooler 31 is controlled by the temperature control module 34. When the first temperature sensor 32 detects that the temperature in the temperature control zone 1 is lower than the set temperature, the temperature of the first heat-conducting end 311 increases and heats the heat exchanger 5, thereby increasing the temperature in the temperature control zone 1 and decreasing the temperature of the second heat-conducting end 312. When the first temperature sensor 32 detects that the temperature in the temperature control zone 1 is higher than the set temperature, the temperature of the first heat-conducting end 311 decreases and cools the heat exchanger 5, thereby decreasing the temperature in the temperature control zone 1 and increasing the temperature of the second heat-conducting end 312.

[0023] In some embodiments, the first temperature control mechanism 3 further includes a heat conduction element 33, which is disposed on the second heat-conducting end 312 and is capable of balancing the temperature of the second heat-conducting end 312. When the temperature of the second heat-conducting end 312 rises, the heat conduction element 33 can absorb the heat from the second heat-conducting end 312; when the second heat-conducting end 312 cools, the heat conduction element 33 can absorb the heat from the surrounding environment and conduct the heat to the second heat-conducting end 312. The heat conduction element 33 can balance the temperature of the second heat-conducting end 312, preventing the second heat-conducting end 312 from becoming too cold or too hot and affecting the operation of the semiconductor cooling chip 31.

[0024] In some embodiments, such as Figure 2 and Figure 3 As shown, the heat conduction component 33 includes a heat sink 331 and a cooling fan 332. The heat sink 331 is connected to the second heat-conducting end 312, and the cooling fan 332 is located on the side of the heat sink 331 away from the second heat-conducting end 312. The cooling fan 332 remains on during sequencer operation, which can accelerate the heat dissipation rate of the second heat-conducting end 312 when the temperature rises, and increase the surrounding airflow when the temperature of the second heat-conducting end 312 decreases, thereby better balancing the temperature of the second heat-conducting end 312.

[0025] In some embodiments, since the temperature changes of the second heat-conducting end 312 and the heat-conducting element 33 of the semiconductor cooling chip 31 are opposite to those in the temperature control region 1, in order to avoid the second heat-conducting end 312 and the heat-conducting element 33 affecting the temperature of the temperature control region 1, the second heat-conducting end 312 and the heat-conducting element 33 are disposed outside the temperature control region 1.

[0026] In a preferred embodiment of this utility model, such as Figure 2As shown, the temperature control area 1 is located at the top of the sequencer. The thermoelectric cooler 31 is located below both ends of the heat exchanger 5. The contact end between the thermoelectric cooler 31 and the heat exchanger 5 is the first heat-conducting end 311, and the second heat-conducting end 312 is located at the lower end of the thermoelectric cooler 31. The lower end of the second heat-conducting end 312 is connected to the heat sink 331, which extends from the second heat-conducting end 312 to the bottom of the temperature control area 1. To increase the heat dissipation effect, the lower part of the heat sink 331 has multiple heat dissipation fins arranged side by side. The cooling fan 332 is located below the heat sink 331. The lower housing has openings to exchange heat with the outside air, increasing the airflow between the inside of the sequencer and the outside air, and improving the temperature regulation effect. Specifically, when the temperature of the heat sink 331 rises, the cooling fan 332 rapidly expels the high-temperature gas inside the sequencer, replacing it with cooler external gas, thus accelerating heat dissipation from the heat sink 331. When the temperature of the heat sink 331 decreases, the cooling fan 332 rapidly expels the low-temperature gas inside the sequencer, replacing it with warmer external gas, thus balancing the internal temperature of the sequencer. The temperature control module 34 is located between the exterior of the heat conduction component 33 and the housing.

[0027] In some embodiments, such as Figure 5 As shown, the second temperature control mechanism 4 includes a resistance heater 41. The heating surface of the resistance heater 41 is attached to the sequencing biochip 2. The resistance heater 41 is preferably located below the sequencing biochip 2 to compensate for heating the sequencing biochip 2 so that the sequencing biochip 2 accurately reaches the required temperature.

[0028] In some embodiments, the second temperature control mechanism 4 further includes a second temperature sensor (not shown) disposed on the resistance heater 41. The second temperature sensor is preferably attached to the sequencing biochip 2 and can acquire the temperature information of the sequencing biochip 2 in real time. The resistance heater 41 is communicatively connected to the second temperature sensor and can be turned on and off according to the signal from the second temperature sensor. When the second temperature sensor senses that the temperature of the sequencing biochip 2 is lower than the required temperature, the resistance heater 41 turns on to heat the sequencing biochip 2; when the second temperature sensor senses that the temperature of the sequencing biochip 2 is within the required temperature range or lower than the required temperature, the resistance heater 41 turns off.

[0029] In some embodiments, the heat exchanger 5 is a metal plate. Metal plates have good thermal conductivity and can quickly change the temperature of the temperature control zone 1. Figure 2 and Figure 4In the preferred embodiment shown, the metal plate has an opening at its center, and the sequencing biochip 2 is disposed in the opening. The metal plate can support and fix the sequencing biochip 2, making the internal structure of the sequencer more integrated and enabling the sequencing biochip 2 to quickly reach the same temperature as the temperature control zone 1. The first temperature sensor 32 is disposed on the metal plate near the sequencing biochip 2, which can more accurately obtain the temperature of the temperature control zone 1 and the sequencing biochip 2, thereby achieving precise temperature control.

[0030] In some embodiments, such as Figure 2 and Figure 5 As shown, the sequencer also includes a circuit component 6, which is located in the temperature control zone 1, providing a more suitable and stable operating temperature and enabling the sequencer to operate over a wider temperature range. Compared to ordinary sequencers (where the circuit component is not located in the temperature control zone described in this invention), where the circuit component's efficiency decreases or it may even fail to operate when the ambient temperature is higher or lower than its optimal operating temperature, the sequencer provided by this invention can be used in a wider temperature range, such as in both high- and low-temperature outdoor environments. Specifically, the sequencer in this invention can be used in environments ranging from 0℃ to 40℃ while maintaining high operating efficiency.

[0031] In some embodiments, a heat insulation layer 11 is provided at the outer edge of the temperature control region 1 to isolate the temperature control region 1 from other components of the sequencer and maintain a stable temperature. Specifically, as shown in the figure... Figure 2 and Figure 3 As shown, in the preferred embodiment of this utility model, the heat insulation layer 11 includes an upper heat insulation layer 111, a lower heat insulation layer 112, and a side heat insulation layer 113. The upper heat insulation layer 111 is disposed between the upper cover 7 and the sequencing biochip 2. The side heat insulation layer 113 extends downward along the end of the upper heat insulation layer 111 and is disposed on the outside of the heat exchange component 5. The upper end of the lower heat insulation layer 112 extends downward along the first heat-conducting end 311 of the semiconductor cooling chip 31 and is disposed between the heat sink 331 and the circuit assembly 6. In order to achieve temperature control of the temperature control area 1 by the first heat-conducting end 311, the second heat-conducting end 312 and the heat sink 331 are prevented from affecting the temperature of the temperature control area 1.

[0032] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings; however, the present invention is not limited thereto. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, including the combination of various specific technical features in any suitable manner. To avoid unnecessary repetition, the present invention will not describe the various possible combinations separately. However, these simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.

Claims

1. A sequencer, characterized in that, include: Temperature control area (1); A sequencing biochip (2) is located in the temperature-controlled region (1); Heat exchanger (5), which is disposed in the temperature control zone (1) and is capable of conducting heat to change the ambient temperature of the temperature control zone (1); A first temperature control mechanism (3) is at least partially disposed in the temperature control area (1), the first temperature control mechanism (3) is coupled to the heat exchanger (5), and is capable of heating or cooling to change the temperature of the heat exchanger (5); and, The second temperature control mechanism (4) is located in the temperature control area (1) and close to the sequencing biochip (2). The second temperature control mechanism (4) can heat the sequencing biochip (2) to reach the required temperature.

2. The sequencer according to claim 1, characterized in that, The first temperature control mechanism (3) includes a temperature control module (34), a semiconductor cooling chip (31) connected to the temperature control module (34) by signal, and a first temperature sensor (32). The first temperature sensor (32) is located in the temperature control area (1). The semiconductor cooling chip (31) includes a first heat-conducting end (311) and a second heat-conducting end (312). The first heat-conducting end (311) is connected to the heat exchange component (5) and can heat and cool the heat exchange component (5) under the control of the temperature control module (34).

3. The sequencer according to claim 2, characterized in that, The first temperature control mechanism (3) further includes a heat conduction element (33), which is disposed on the second heat conduction end (312) and can balance the temperature of the second heat conduction end (312).

4. The sequencer according to claim 3, characterized in that, The heat conduction element (33) includes a heat sink (331) and a cooling fan (332). The heat sink (331) is connected to the second heat conduction end (312), and the cooling fan (332) is located on the side of the heat sink (331) away from the second heat conduction end (312).

5. The sequencer according to claim 4, characterized in that, The second heat-conducting end (312) of the semiconductor cooling chip (31) and the heat-conducting element (33) are located outside the temperature control area (1).

6. The sequencer according to claim 1, characterized in that, The second temperature control mechanism (4) includes a resistance heater (41), the heating surface of which is attached to the sequencing biochip (2) and can heat the sequencing biochip (2).

7. The sequencer according to claim 6, characterized in that, The second temperature control mechanism (4) further includes a second temperature sensor disposed on the resistance heater (41). The resistance heater (41) is communicatively connected to the second temperature sensor and can be turned on and off according to the signal of the second temperature sensor.

8. The sequencer according to claim 1, characterized in that, The heat exchanger (5) is a metal plate with an opening in the center, and the sequencing biochip (2) is located in the opening.

9. The sequencer according to claim 1, characterized in that, The sequencer also includes a circuit assembly (6) located in the temperature control zone (1).

10. The sequencer according to claim 1, characterized in that, The outer edge of the temperature control area (1) is provided with a heat insulation layer (11).

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