Heat-reflecting cover and heat-field assembly

CN224784284UActive Publication Date: 2026-09-22SHANGHAI INTEGRATED CIRCUIT EQUIPMENT & MATERIALS INDUSTRY INNOVATION CENTER CO LTD
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Patent Information

Application Number
CN202522395352.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-12
Publication Date
2026-09-22
Estimated Expiration
2035-11-12

AI Technical Summary

Technical Problem

[0004]本申请所要解决的技术问题在于提供一种热反射罩及热场组件,以解决现有技术中半导体工艺设备中热反射罩不便于拆卸或安装的技术问题

Benefits of technology

热反射罩,设置在所述加热器的外侧,所述热反射罩为上述任意一项所述的热反射罩,通过所述第一连接件上的第一定位结构与所述插接结构插接。

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a heat reflecting cover and a thermal field assembly, wherein the heat reflecting cover comprises a plate body and a first connecting piece protruding on the inner wall of the plate body, a first positioning structure is arranged on the first connecting piece, the first positioning structure is used for being connected with a plug-in structure arranged on a heater in a limiting mode, so that the heat reflecting cover is quickly fixed on the outer side of the heater, and the heat reflecting cover is also convenient to disassemble quickly. Through the plug-in cooperation of the first connecting piece and the plug-in structure on the heater, the installation and disassembly of the heat reflecting cover can be realized without using fasteners, so that the disassembly difficulty of the heat reflecting cover is reduced, and the falling of the fasteners is prevented.
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Description

Technical Field

[0001] This application belongs to the field of semiconductor manufacturing technology, and more specifically, relates to a thermal reflector and thermal field assembly. Background Technology

[0002] Atomic layer deposition (ALD) equipment is used to deposit ultrathin and highly uniform films on wafer surfaces with atomic-level precision. It achieves precise control over film thickness by alternately introducing different precursor gases and conducting self-limiting surface reactions under controlled temperature and vacuum conditions, ensuring that only one atomic layer is formed per reaction. The equipment typically includes a reaction chamber, a substrate and heater to support the wafer, a gas supply and exhaust system, and a heat reflector to maintain thermal uniformity. The heat reflector has a connection on its inner wall, which is secured to the outside of the heater by fasteners.

[0003] Currently, during periodic maintenance of atomic layer deposition equipment, the heat reflector needs to be removed to facilitate the inspection or replacement of components inside the reaction chamber. However, the heat reflector is located at the bottom of the base, in a confined space. Operators can only blindly disassemble the heat reflector and fasteners, which is inconvenient for disassembly and installation. Furthermore, the fasteners used to fix the heat reflector are located near the gas inlets of the gas supply and exhaust system. These fasteners are very likely to fall into the gas inlets during disassembly. If a fastener falls into the gas inlet, many components at the bottom of the chamber need to be removed to retrieve the fastener, resulting in time-consuming and laborious work. Utility Model Content

[0004] The technical problem to be solved by this application is to provide a heat reflector and a thermal field component to solve the technical problem that heat reflectors in semiconductor process equipment are inconvenient to disassemble or install in the prior art.

[0005] To achieve the above objectives, a first aspect of this application provides a heat reflector, comprising: A plate, used to be arranged around the outer periphery of the heater; A first connector protrudes from the inner wall of the plate, and a first positioning structure is provided on the first connector. The first connector is used to limit the connection between the first positioning structure and the second positioning structure of the plug-in structure, and the plug-in structure is disposed on the heater.

[0006] Optionally, the first positioning structure is located at the end of the first connector that is away from the plate.

[0007] Optionally, the first positioning structure is a groove structure, and the second positioning structure is a positioning protrusion.

[0008] Optionally, the first positioning structure is a positioning protrusion, and the second positioning structure is a groove structure.

[0009] Optionally, there may be multiple first connectors, which are spaced apart circumferentially along the plate.

[0010] Optionally, the heat reflector further includes a second connector that protrudes from the outer wall of the plate and is designed for detachable connection with a mounting bracket in the thermal field assembly.

[0011] Optionally, the second connector is provided with an adjustment through hole. The adjustment through hole has a first length dimension along the length direction of the second connector and a second length dimension along the width direction of the second connector. The first length dimension is greater than the second length dimension.

[0012] Optionally, there may be multiple second connectors, which are spaced apart circumferentially along the plate.

[0013] The beneficial effects of the heat reflector provided in this application are as follows: Compared with the prior art, the heat reflector provided in this application includes a plate and a first connecting member protruding from the inner wall of the plate. The first connecting member is provided with a first positioning structure, which is used to limit and connect with the plug-in structure provided on the heater or mounting bracket, thereby realizing the quick fixation of the heat reflector to the outside of the heater and facilitating the quick disassembly of the heat reflector. By plugging and engaging the first connecting member with the plug-in structure on the heater or mounting bracket, the heat reflector can be installed and disassembled without the use of fasteners, which not only reduces the difficulty of assembling and disassembling the heat reflector, but also prevents fasteners from falling off.

[0014] Secondly, this application provides a thermal field component for use in an atomic layer deposition apparatus, comprising: The base, installed inside the reaction chamber of the atomic layer deposition equipment, is used to support the wafer; A heater is connected to the reaction chamber and located on the side of the base away from the wafer; The third connector is connected to the heater or mounting bracket, and the third connector is provided with a plug-in structure. A heat reflector is disposed on the outside of the heater. The heat reflector is any one of the heat reflectors described above and is inserted into the plug-in structure through a first positioning structure on the first connector.

[0015] Optionally, the third connector is a bolt fixed to the heater, and the top of the bolt is provided with the insertion structure, the insertion structure including a slot extending along the circumference of the bolt, and the first connector is inserted into the slot.

[0016] The beneficial effects of the thermal field assembly provided in this application are as follows: Compared with the prior art, the thermal field assembly provided in this application is applied to an atomic layer deposition equipment, including a base, a heater, and a thermal reflector. The thermal reflector is connected to the third connector via a first connector, which enables rapid installation of the thermal reflector. At the same time, the first connector and the plug-in structure can be used to install and remove the thermal reflector without the need for fasteners, which not only reduces the difficulty of installing and removing the thermal reflector but also prevents fasteners from falling off. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a thermal field component in the prior art; Figure 2 This is a schematic diagram of the structure of the heat reflector provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the heat reflector provided in an embodiment of this application from another perspective; Figure 4 A schematic diagram of the structure of the first connector provided in this application; Figure 5 This is a schematic diagram of the structure of the first connector provided in another embodiment of this application; Figure 6 A schematic diagram of the structure of the thermal field assembly provided in this application; Figure 7 For along Figure 6 Enlarged view of the structure of section A in the middle; Figure 8 This is a schematic diagram of the structure of a thermal field component provided in another embodiment of this application; Figure 9 For along Figure 8 Enlarged view of the structure of section B in the middle.

[0019] The following are the labeling elements in the figure: 10. Reaction chamber; 11. Outer cavity; 12. Inner cavity; 13. Mounting bracket; 14. Fastener; 20. Base; 30. Heater; 40. Heating wire; 50. Wafer; 60. Heat reflector; 61. Plate; 611. First plate; 612. Second plate; 70. First connector; 71. First positioning structure; 80. Second connector; 81. Adjustment through hole; 90. Third connector; 91. Slot; 92. Second positioning structure. Detailed Implementation

[0020] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0024] like Figure 1 As shown, an atomic layer deposition (ALD) apparatus is used to deposit ultrathin and highly uniform films on a wafer surface with atomic precision. This apparatus typically includes a reaction chamber 10, a base 20 for supporting the wafer 50, a heater 30, and a gas supply and exhaust system (not shown). A heat reflector 60 is located on the outside of the heater 30 to maintain thermal uniformity. The reaction chamber 10 is a dual-chamber configuration, including an outer chamber 11 and an inner chamber 12. The inner chamber 12 is used for reaction and precise control of the deposition process, while the outer chamber 11 contains a heating wire 40 to maintain thermal stability. The base 20 is located within the inner chamber 12, and the heater 30 is located on the side of the base 20 facing away from the wafer 50. The heat reflector 60 is connected to the heater 30 by fasteners 14, or fixedly connected by fasteners 14 to a mounting bracket 13 located in the inner chamber 12 for mounting the heater 30. The heat reflector 60 is located in the inner chamber 12 and outside the heater 30 to reflect the heat generated by the heating wire 40.

[0025] In the prior art, since the heat reflector 60 is fixed by the fastener 14, it is not convenient to disassemble the heat reflector 60. During the disassembly process, the fastener 14 is easy to fall into the gas port of the gas supply and exhaust system. Based on this, this application provides a heat reflector 60 and a thermal field assembly to solve the above-mentioned technical problems.

[0026] Please refer to the following: Figures 2 to 9 First, the thermal reflector and thermal field components provided in this application will be described.

[0027] The first aspect of this application provides a heat reflector; please refer to [link / reference]. Figure 2 The heat reflector 60 includes a plate 61 and a first connector 70.

[0028] like Figure 2 , Figures 4 to 7 As shown, the heat reflector 60 is disposed outside the heater 30. The plate 61 is at least part of an annular structure, which surrounds the outer perimeter of the heater. That is, the plate 61 can be a closed ring or a non-closed ring. The ring is not limited to a circle; it can also be a polygonal ring. The plate 61 can be an arc-shaped structure or a polygonal structure, which is not limited here. The specific circumferential dimensions of the plate 61 can be set as needed, such as occupying one-quarter, half, three-quarters, or the entire outer circumference of the heater. The first connecting member 70 protrudes from the inner wall of the plate 61. The first connecting member 70 is provided with a first positioning structure 71, which is used to limit the connection between the first connecting member 70 and the heater through the first positioning structure 71. In this embodiment, the limiting connection can be understood as any connection method without fasteners (such as bolts, pins, etc.). Generally, a concave-convex mating insertion method is used, but it can also be a snap-fit ​​connection, or a limiting connection through friction or adhesion. The heater 30 itself or its mounting bracket 13 is provided with a plug-in structure. The plug-in structure is provided with a second positioning structure 92. The first connector 70 is plugged into the plug-in structure to limit and fix the plate 61. When the first connector 70 is plugged into the plug-in structure, the second positioning structure 92 is adapted to the first positioning structure 71 to limit the depth of the first connector 70 in the plug-in structure, thereby positioning the first connector 70.

[0029] Two heat reflectors 60 are provided, and they are spliced ​​together around the outer periphery of the heater 30 to achieve full coverage of the heater's outer periphery. This is used to reflect the heat generated by the heating wire 40, preventing heat radiation from accumulating at the bottom of the base 20 and at the location of the heater 30. Specifically, the plate 61 has a semi-annular structure, and two plates 61 can be spliced ​​together to form a ring structure, which facilitates the installation and positioning of the heat reflectors 60 and achieves full coverage of the heater's outer periphery.

[0030] By connecting the first connector 70 to the plug-in structure, compared with the prior art of fixing the heat reflector 60 with fasteners 14, it is not only easier to quickly install the heat reflector 60 on the outside of the heating plate, but also, when disassembling or installing the heat reflector 60, there is no need to use fasteners 14, thereby preventing fasteners 14 from falling into the gas port of the gas supply and exhaust system.

[0031] In this application, as Figure 2 As shown, the heat reflector 60 is formed by stamping to improve its structural strength and prevent deformation during assembly and disassembly. The heat reflector 60 is an integrally formed arc-shaped structure using stamping, which can be divided into multiple sub-plates 61 along its arc length. Each sub-plate 61 includes a first plate 611 and a second plate 612. The first plate 611 and the second plate 612 are integrally formed and angled together. Along the direction from the first plate 611 to the second plate 612, the width of the second plate 612 gradually increases. A first connecting member 70 protrudes from the inner wall of the first plate 611.

[0032] In this application, as Figure 2 As shown, the first connector 70 is a plate-shaped or sheet-shaped structure, the insertion structure is a slot, a part of the first connector 70 is inserted into the insertion structure, and the first positioning structure 71 is disposed at the end of the first connector 70 away from the plate 61.

[0033] In one embodiment of this application, such as Figure 4 As shown, the first positioning structure 71 is a groove structure. When the first positioning structure 71 is a groove structure recessed at the end of the first connector 70, the second positioning structure 92 is a positioning protrusion disposed in the insertion structure. The outer contour of the second positioning structure 92 is adapted to the shape of the first positioning structure 71. When the first connector 70 is inserted into the insertion structure, the second positioning structure 912 is adapted to the first positioning structure 71 to position the first connector 70.

[0034] In another embodiment of this application, such as Figure 5 As shown, the first positioning structure 71 is a positioning protrusion. When the first positioning structure 71 is a positioning protrusion protruding from the end of the first connector 70, the second positioning structure 92 is a positioning groove provided in the insertion structure. The outer contour of the first positioning part is adapted to the shape of the second positioning structure 92. When the first connector 70 is inserted into the insertion structure, the second positioning structure 92 is adapted to the first positioning structure 71 to position the first connector 70.

[0035] In this application, as Figure 2As shown, there are multiple first connectors 70, which are spaced apart circumferentially along the plate 61. By providing multiple first connectors 70 on the inner wall of the plate 61, the inner wall of the heat reflector 60 is fixed at multiple points, thereby improving the reliability of fixing the heat reflector 60. For example, there may be two first connectors 70.

[0036] In one embodiment of this application, such as Figure 3 As shown, the heat reflector 60 also includes a second connector 80, which protrudes from the outer wall of the plate 61 and is detachably connected to the mounting bracket 13. The heat reflector 60 is fixedly connected to the mounting bracket 13 via the second connector 80 to further improve the reliability of the fixed installation of the heat reflector 60.

[0037] The second connector 80 is disposed on the outer wall of the first plate 611, and the second connector 80 is a plate-shaped or sheet-shaped structure. The second connector 80 has an adjustment through hole 81. The second connector 80 is fixedly connected to the mounting bracket 13 by a fastener 14, which, after passing through the adjustment through hole 81, is threadedly connected to the mounting bracket 13. The length and width directions of the second connector 80 are both perpendicular to the direction of the plate. Along the length direction of the second connector 80, the adjustment through hole 81 has a first length dimension, and along the width direction of the second connector 80, the adjustment through hole 81 has a second length dimension, the first length dimension being greater than the second length dimension. Specifically, by setting the first length dimension to be greater than the second length dimension, the position of the fastener 14 in the length direction of the second connector 80 can be adjusted. By adjusting the position of the fastener 14 in the adjustment through hole 81 along the length direction of the second connector 80, the position of the heat reflector 60 can be fine-tuned, thereby ensuring that the distance between the heat reflector 60 and the heater 30 is within a preset tolerance range.

[0038] In this application, as Figure 3 As shown, there are multiple second connectors 80, which are spaced apart circumferentially along the plate 61. By providing multiple second connectors 80 on the outer wall of the plate 61, the outer wall of the heat reflector 60 is fixed at multiple points, thereby improving the reliability of the connection between the heat reflector 60 and the mounting bracket 13. Preferably, there are two second connectors 80.

[0039] Secondly, this application provides a thermal field assembly applied to an atomic layer deposition apparatus, including a base 20, a heater 30, a third connector 90, and a thermal reflector 60.

[0040] like Figure 6As shown, the base 20 is installed in the inner cavity 12 of the reaction chamber 10 of the atomic layer deposition equipment to support the wafer 50. The heater 30 is connected to the reaction chamber 10 and is located on the side of the base 20 away from the wafer 50. For example, the heater 30 is located below the base 20 and mounted on the mounting bracket 13. The heater 30 is used to heat the wafer 50.

[0041] In one embodiment of this application, such as Figure 6 and Figure 7 As shown, the third connector 90 is connected to the mounting bracket 13, and the third connector 90 is provided with a plug-in structure.

[0042] The heat reflector 60 is the heat reflector 60 provided in any of the above embodiments. The heat reflector 60 is disposed on the outside of the heater 30, and the heat reflector 60 is inserted into the first positioning structure 71 on the first connector 70 and the insertion structure on the third connector 90 to fix the heat reflector 60 on the outside of the heater 30.

[0043] By providing a plug-in structure on the third connector 90, the first connector 70 can be plugged into the plug-in structure, which not only facilitates the disassembly and installation of the heat reflector 60, but also reduces the difficulty of disassembly and installation of the heat reflector 60. Moreover, when disassembling and installing the heat reflector 60, it is not necessary to disassemble the third connector 90, thereby eliminating the possibility of the third connector 90 falling into the air port of the supply and exhaust system.

[0044] In another embodiment of this application, such as Figure 8 and Figure 9 As shown, the third connector 90 is connected to the heater 30.

[0045] In one embodiment of this application, the third connector 90 is threadedly connected to the heater 30 or the mounting bracket 13. Specifically, as shown... Figure 7 and Figure 9 As shown, the insertion structure provided on the third connector 90 includes a slot 91 and a second positioning structure 92. For example, the third connector 90 is a bolt, and the top of the bolt forms an insertion structure, that is, a recessed slot is formed by extending circumferentially along the top of the bolt, and the body of the top of the bolt constitutes the second positioning structure 92.

[0046] The first connector 70 is inserted into the slot 91. The second positioning structure 92 is disposed in the slot 91. When the first connector 70 is inserted into the slot 91, the second positioning structure 92 is adapted to the first positioning structure 71 on the first connector 70 to limit the first connector 70.

[0047] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat reflector, characterized in that, include: A plate, used to be arranged around the outer periphery of the heater; A first connector protrudes from the inner wall of the plate, and a first positioning structure is provided on the first connector. The first connector is used to limit the connection between the first positioning structure and the second positioning structure of the plug-in structure, and the plug-in structure is disposed on the heater.

2. The heat reflector as described in claim 1, characterized in that, The first positioning structure is located at the end of the first connector that is away from the plate.

3. The heat reflector as described in claim 2, characterized in that, The first positioning structure is a groove structure, and the second positioning structure is a positioning protrusion.

4. The heat reflector as described in claim 2, characterized in that, The first positioning structure is a positioning protrusion, and the second positioning structure is a groove structure.

5. The heat reflector as described in claim 1, characterized in that, The number of the first connectors is multiple, and the multiple first connectors are arranged at intervals along the circumference of the plate.

6. The heat reflector as described in claim 1, characterized in that, It also includes a second connector, which protrudes from the outer wall of the plate.

7. The heat reflector as described in claim 6, characterized in that, The second connector is provided with an adjustment through hole. The adjustment through hole has a first length dimension along the length direction of the second connector and a second length dimension along the width direction of the second connector. The first length dimension is greater than the second length dimension.

8. The heat reflector as described in claim 6, characterized in that, The number of the second connectors is multiple, and the multiple second connectors are arranged at intervals along the circumference of the plate.

9. A thermal field assembly used in an atomic layer deposition apparatus, characterized in that, include: The base, installed inside the reaction chamber of the atomic layer deposition equipment, is used to support the wafer; A heater is connected to the reaction chamber and located on the side of the base away from the wafer; A third connector is connected to the heater, and the third connector is provided with a plug-in structure; A heat reflector is disposed on the outside of the heater, the heat reflector being the heat reflector as described in any one of claims 1-8, and is inserted into the plug-in structure via a first positioning structure on the first connector.

10. The thermal field assembly as claimed in claim 9, characterized in that, The third connector is a bolt fixed to the heater, and the top of the bolt is provided with the insertion structure, which includes a slot extending along the circumference of the bolt, and the first connector is inserted into the slot.