A spray plate structure with adjustable airflow distribution and a thin film deposition device

Abstract

The utility model discloses a kind of airflow distribution adjustable spray tray structure and thin film deposition equipment, the spray tray structure includes: spray tray chamber, the spray tray chamber is provided with air inlet and air outlet;Uniform gas unit, between the air inlet and air outlet of the spray tray chamber is set;Driving unit is connected with the uniform gas unit, for driving the uniform gas unit movement in the spray tray chamber, to adjust the interval of the uniform gas unit and air inlet, air outlet.The utility model changes the interval of uniform gas unit and air outlet by design liftable uniform gas unit, so that gas passing through uniform gas unit can flow into air outlet with different state, realize the controllable gas distribution of spray tray air outlet, to increase the utilization of spray tray, reduce spray tray replacement cycle, to improve the spray effect of spray tray, and can shorten the overall product processing cycle.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, specifically to a spray disk structure with adjustable airflow distribution and a thin film deposition device. Background Technology

[0002] In existing semiconductor deposition processes, uniform gas distribution during thin film deposition via the spray plate is crucial for the quality and uniformity of the film. However, traditional spray plate structures have certain drawbacks. On the one hand, due to the need for customized film thickness deposition maps (which can be understood as film thickness deposition distribution patterns) based on different customers' individual requirements, operators must frequently change suitable spray plates; and the design and fabrication of spray plates often takes a considerable amount of time. This directly leads to prolonged downtime of semiconductor deposition equipment, severely impacting production efficiency and the response speed to customer orders. On the other hand, from a technical perspective, spray discs also have two major limitations: First, once the structure of the spray disc is completed, its airflow distribution is limited by its own pore design, making it impossible to flexibly adjust according to the dynamic needs of the actual deposition process, and difficult to adapt to the changing requirements of parameters such as airflow uniformity under different working conditions; Second, the gas mixing function inside the spray disc lacks adjustability, and the relevant gas mixing structure can only be set on the outside of the deposition chamber. This design not only increases the uncertainty in the gas delivery process, but also makes it impossible to achieve precise control of the gas mixing state inside the chamber, further restricting the optimization of semiconductor deposition process and the improvement of film thickness deposition quality stability. Utility Model Content

[0003] This utility model provides a spray disc structure with adjustable airflow distribution and a thin film deposition device, which aims to improve the spraying effect of the spray disc.

[0004] This utility model embodiment provides a spray disc structure with adjustable airflow distribution, including:

[0005] A spray tray chamber, wherein the spray tray chamber is provided with an air inlet and an air outlet;

[0006] An air distribution unit is disposed between the air inlet and the air outlet of the spray disc chamber;

[0007] A drive unit, connected to the air distribution unit, is used to drive the air distribution unit to move in the spray disc chamber to adjust the distance between the air distribution unit and the air inlet and outlet.

[0008] Furthermore, the gas equalization unit includes a gas equalization disc with gas equalization holes.

[0009] Furthermore, the gas equalization disk is provided with multiple gas equalization zones from the inside to the outside.

[0010] Furthermore, each of the gas-uniformation regions is provided with gas-uniformation pores of different densities.

[0011] Furthermore, multiple air distribution discs are provided.

[0012] Furthermore, the specifications of the air distribution holes on each of the aforementioned air distribution plates may be the same or different.

[0013] Furthermore, a gap is left between the air distribution plate and the inner wall of the spray plate chamber.

[0014] Furthermore, a sealing ring is provided between the air distribution plate and the inner wall of the spray plate chamber.

[0015] Furthermore, the driving unit includes a drive motor connected to the gas equalization unit.

[0016] This utility model embodiment also provides a thin film deposition apparatus, including a spray disc structure with adjustable airflow distribution as described in any of the preceding embodiments.

[0017] This invention provides a spray plate structure with adjustable airflow distribution and a thin film deposition device. The spray plate structure includes: a spray plate chamber with an air inlet and an air outlet; a gas equalization unit disposed between the air inlet and the air outlet of the spray plate chamber; and a drive unit connected to the gas equalization unit for driving the gas equalization unit to move within the spray plate chamber, thereby adjusting the distance between the gas equalization unit and the air inlet and outlet. This invention, by designing a liftable gas equalization unit, changes the distance between the gas equalization unit and the air outlet, allowing the gas passing through the gas equalization unit to flow into the air outlet in different states (e.g., divergent or concentrated states), achieving controllable gas distribution at the spray plate outlet. This increases the utilization rate of the spray plate, reduces the spray plate replacement cycle, improves the spraying effect, and shortens the overall product processing cycle. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a spray disc structure with adjustable airflow distribution provided for an embodiment of this utility model;

[0020] Figure 2 Another structural schematic diagram of a spray disc structure with adjustable airflow distribution provided for an embodiment of this utility model;

[0021] Figure 3 A schematic diagram of the air distribution equalization disk structure in a spray disk structure with adjustable airflow distribution provided in an embodiment of this utility model;

[0022] Figure 4 This is another structural schematic diagram of a spray disc structure with adjustable airflow distribution provided for an embodiment of the present utility model.

[0023] Markings in the image:

[0024] 10. Sprayer tray chamber; 11. Air inlet; 12. Air outlet;

[0025] 20. Gas equalization unit; 21. Gas equalization hole; 22. First gas equalization region; 23. Second gas equalization region;

[0026] 30. Drive unit;

[0027] 40. Heating plate. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0029] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0030] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0031] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0032] Please see below. Figure 1 and Figure 2 The present invention provides a spray disc structure with adjustable airflow distribution, comprising:

[0033] The spray tray chamber 10 is provided with an air inlet 11 and an air outlet 12.

[0034] An air distribution unit 20 is disposed between the air inlet 11 and the air outlet 12 of the spray disc chamber 10;

[0035] The drive unit 30 is connected to the air distribution unit 20 and is used to drive the air distribution unit 20 to move in the spray disc chamber 10 to adjust the distance between the air distribution unit 20 and the air inlet 11 and the air outlet 12.

[0036] In this embodiment, the spray disc structure includes a spray disc chamber 10, an air equalization unit 20 disposed between the air inlet 11 and the air outlet 12, and a drive unit 30 connected to the air equalization unit 20. The drive unit 30 can drive the air equalization unit 20 to move up and down within the spray disc chamber 10, thereby adjusting and controlling the distance between the air equalization unit 20 and the air inlet 11 and the air outlet 12. For example... Figure 1 and Figure 2 As shown, Figure 1 In this configuration, the gas distribution unit 20 is relatively far from the gas outlet 12, so the gas passing through the gas distribution unit 20 flows into the gas outlet 12 in a more dispersed manner. Figure 2 In this system, the gas equalization unit 20 is located close to the gas outlet 12, allowing the gas passing through the equalization unit 20 to flow into the gas outlet 12 in a more concentrated manner. This enables the gas distribution at the gas outlet 12 of the spray plate to be adjusted according to actual needs, achieving flexible control of the airflow distribution and thus altering the distribution of the deposited film. During the operation of the spray plate, gas enters the spray plate chamber 10 through the gas inlet 11, undergoes equalization treatment by the equalization unit 20, and is then uniformly discharged through the gas outlet 12, providing a stable and uniform gas environment for thin film deposition.

[0037] This embodiment designs a height-adjustable gas equalization unit 20 to change the distance between the gas equalization unit 20 and the gas outlet 12. This allows the gas passing through the gas equalization unit 20 to flow into the gas outlet 12 in different states (e.g., divergent or concentrated), achieving controllable gas distribution at the spray plate outlet 12. For example, when a thinner film layer needs to be deposited, the driving unit 30 can drive the gas equalization unit 20 upward, increasing the distance between the gas equalization unit 20 and the gas outlet 12. This causes the gas to flow into the gas outlet 12 more dispersedly after passing through the gas equalization unit 20, thereby achieving uniform gas distribution and improving the uniformity of the deposited film layer. Conversely, when a thicker film layer needs to be deposited, the driving unit 30 can drive the gas equalization unit 20 downward, decreasing the distance between the gas equalization unit 20 and the gas outlet 12. This causes the gas to flow into the gas outlet 12 more concentratedly after passing through the gas equalization unit 20, thereby achieving concentrated gas distribution and improving the thickness and deposition efficiency of the deposited film layer. This increases the utilization rate of the spray tray, reduces the replacement cycle of the spray tray, thereby improving the spraying effect of the spray tray and shortening the overall product processing cycle.

[0038] In one embodiment, the gas equalization unit 20 includes a gas equalization disc with gas equalization holes 21.

[0039] In this embodiment, a gas equalization disk is used as the gas equalization unit 20. The gas equalization disk is provided with gas equalization holes 21. When the gas passes through the gas equalization holes 21, it will be throttled, thereby achieving uniform distribution.

[0040] In a specific embodiment, the gas equalization disk is provided with multiple gas equalization areas from the inside to the outside. Each gas equalization area has gas equalization holes 21 of different densities distributed on it.

[0041] In this embodiment, multiple gas equalization zones are set on the gas equalization disk, such as... Figure 3 As shown, it specifically includes a first gas-uniformation region 22 and a second gas-uniformation region 23, and the density of the gas-uniformation holes 21 on the first gas-uniformation region 22 and the second gas-uniformation region 23 is different, which can further improve the effect of flexibly adjusting the gas flow rate in different regions. Here, combined with Figure 3 The central region of the gas equalization disk is the first gas equalization region 22, and the outer region is the second gas equalization region 23. The density of the gas equalization holes 21 in the first gas equalization region 22 is greater than that in the second gas equalization region 23. This allows the gas flow rate in the central region to be greater than that in the outer region, thereby achieving more precise gas distribution control and influencing the membrane layer map distribution. This embodiment uses a gas equalization disk with multiple open areas to increase the gas distribution adjustment range of the spray disk outlet 12, thereby improving the spraying effect of the spray disk.

[0042] In practical applications, the density of the gas-uniforming holes 21 in each gas-uniforming region of the gas-uniforming disk can be rationally designed according to the specific requirements of the deposition process to meet the requirements for gas flow rate and uniformity under different operating conditions. For example, more gas-uniforming regions can be set up, and each gas-uniforming region can be equipped with gas-uniforming holes 21 of different densities to achieve more refined control of gas distribution. In addition, by adjusting the density of the gas-uniforming holes 21 in each gas-uniforming region of the gas-uniforming disk, the gas flow rate can also be flexibly adjusted to adapt to the gas flow rate requirements of different deposition processes.

[0043] In one embodiment, multiple air distribution plates are provided. The air distribution holes 21 on each air distribution plate may have the same or different specifications.

[0044] The gas equalization disc described in this embodiment can be a multi-layer structure, such as a double-layer gas equalization disc, where two gas equalization discs are arranged vertically between the air inlet 11 and the air outlet 12 of the spray disc. This not only adjusts the airflow distribution of the spray disc but also improves the uniformity of the reaction gas mixing. Furthermore, the mixing effect and the gas outlet distribution of the spray disc can be changed by altering the distance between the gas equalization discs and the distance between the gas equalization discs and the air outlet 12.

[0045] In practical applications, the number of gas distribution plates, the number, density, and pore size of the gas distribution holes 21 on each plate can be rationally designed according to actual needs to achieve more precise gas distribution and mixing effects. For example, by setting gas distribution holes 21 of different specifications, the gas flow rate and uniformity can be further adjusted to meet the high requirements of specific deposition processes for the gas environment.

[0046] In addition, when a multi-layer gas equalization plate is used, each layer of gas equalization plate can be independently raised and lowered. Even if the drive unit 30 is connected to each layer of gas equalization plate and controls the driving and raising of each layer of gas equalization plate, this can not only increase the gas distribution at the spray plate outlet 12, but also make the gas between the gas equalization plates fully mixed.

[0047] In one embodiment, a gap is left between the air distribution plate and the inner wall of the spray plate chamber 10.

[0048] In this embodiment, a gap is provided between the air distribution plate and the inner wall of the spray plate chamber 10, allowing gas to pass through the slit. Thus, with a fixed number of slits around the perimeter, the airflow in the central region of the spray plate chamber 10 can be altered by adjusting the air distribution plate, thereby affecting the gas uniformity at the spray plate outlet 12.

[0049] In another embodiment, a sealing ring is provided between the air distribution plate and the inner wall of the spray plate chamber 10.

[0050] In addition to creating a gap between the gas equalization plate and the inner wall of the spray plate chamber 10, a sealing ring can also be provided between the gas equalization plate and the inner wall of the spray plate chamber 10. This sealing ring ensures a tight seal between the gas equalization plate and the spray plate chamber 10, preventing gas leakage from the edge of the gas equalization plate and ensuring a stable gas environment inside the spray plate. Specifically, the sealing ring is an elastic sealing ring that can wrap around the edge of the gas equalization plate. When the gas equalization plate moves up and down, the elastic sealing ring also slides along the inner wall of the spray plate chamber. This ensures both the tight seal between the gas equalization plate and the inner wall of the spray plate chamber 10 and prevents damage to the edge of the gas equalization plate during movement.

[0051] In one embodiment, the drive unit 30 includes a drive motor connected to the air distribution unit 20.

[0052] In this embodiment, a drive motor drives the air distribution unit 20 to move up and down. The drive motor can be a stepper motor or a servo motor, etc., to achieve precise control of the air distribution unit 20's movement, thereby further improving the accuracy of airflow distribution regulation in the spray plate. The drive motor can be positioned above the spray plate; correspondingly, a through hole is provided above the spray plate, through which the drive motor connects to the air distribution unit 20 and achieves the driving effect. In practical applications, the drive unit 30, in addition to the drive motor, may also include connecting rods, gears, and other transmission components to achieve a stable and reliable connection and transmission between the drive motor and the air distribution unit 20. The drive motor can drive the air distribution unit 20 to move up and down within the spray plate chamber 10 via the connecting rods and other transmission components, and the stroke and speed of the movement can be precisely controlled by adjusting the operation of the drive motor.

[0053] Furthermore, to achieve real-time monitoring and feedback of the lifting position of the air distribution unit 20, a position sensor, such as a photoelectric sensor or a magnetic induction sensor, can be installed in the drive unit 30. The position sensor can monitor the lifting position of the air distribution unit 20 in real time and feed the position information back to the control system corresponding to the drive motor. The control system can then precisely control the drive motor based on the position information to ensure that the air distribution unit 20 can be lifted to the predetermined position.

[0054] This utility model embodiment also provides a thin film deposition apparatus, including the spray disk structure with adjustable airflow distribution as described above.

[0055] like Figure 1As shown, the thin film deposition equipment includes a spray disk chamber 10, a gas equalization unit 20, a drive unit 30, and a heating disk 40. Heating brings the wafer to the temperature required for the deposition process. During deposition, the gas in the spray disk structure is uniformly processed by the gas equalization unit 20 and then flows uniformly into the gas outlet 12, providing a stable and uniform gas environment for the wafer, thereby achieving high-quality thin film deposition.

[0056] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple; relevant parts can be referred to in the method section. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

[0057] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A spray disc structure with adjustable airflow distribution, characterized in that, include: A spray tray chamber, wherein the spray tray chamber is provided with an air inlet and an air outlet; An air distribution unit is disposed between the air inlet and the air outlet of the spray disc chamber; A drive unit, connected to the air distribution unit, is used to drive the air distribution unit to move in the spray disc chamber to adjust the distance between the air distribution unit and the air inlet and outlet. The driving unit includes a driving motor connected to the air distribution unit. The driving motor drives the air distribution unit to move up and down. The driving motor is located above the spray plate. A through hole is provided above the spray plate. The driving motor is connected to the air distribution unit through the through hole to achieve the driving effect. The drive unit also includes a position sensor, which monitors the lifting and lowering position of the air distribution unit in real time and feeds the position information back to the control system corresponding to the drive motor. The control system controls the drive motor according to the position information to ensure that the air distribution unit is lifted and lowered to the predetermined position.

2. The spray disc structure with adjustable airflow distribution according to claim 1, characterized in that, The gas equalization unit includes a gas equalization disc with gas equalization holes.

3. The spray disc structure with adjustable airflow distribution according to claim 2, characterized in that, The gas equalization plate has multiple gas equalization zones arranged from the inside to the outside.

4. The spray disc structure with adjustable airflow distribution according to claim 3, characterized in that, Each of the aforementioned uniform gas distribution areas has uniform gas distribution pores of different densities.

5. The spray disc structure with adjustable airflow distribution according to claim 2, characterized in that, Multiple gas distribution discs are provided.

6. The spray disc structure with adjustable airflow distribution according to claim 5, characterized in that, The specifications of the air distribution holes on each of the aforementioned air distribution plates may be the same or different.

7. The spray disc structure with adjustable airflow distribution according to claim 2, characterized in that, A gap is left between the air distribution plate and the inner wall of the spray plate chamber.

8. The spray disc structure with adjustable airflow distribution according to claim 2, characterized in that, A sealing ring is provided between the air distribution plate and the inner wall of the spray plate chamber.

9. A thin film deposition apparatus, characterized in that, Includes the spray disc structure with adjustable airflow distribution as described in any one of claims 1-8.

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