Stack switching type continuous vacuum coating production line

Abstract

The utility model relates to vacuum coating equipment field discloses a kind of stack switching type continuous vacuum coating production line, from front to rear sequentially including feeding mechanism, in stack mechanism, process procedure vacuum cavity, out stack mechanism and discharging mechanism. Wherein in stack mechanism and out stack mechanism are all provided with left and right two vacuum cavities, and the cavity bottom of left and right two vacuum cavities is respectively provided with a group of cavity body docking assembly for independently controlling vacuum cavity front and rear movement and process procedure vacuum cavity docking.Cavity body docking assembly below is provided with the cavity switching assembly of common use, for controlling vacuum cavity left and right movement, back and forth switching and process procedure vacuum cavity docking cavity. The vacuum cavity of in stack mechanism and out stack mechanism is all provided with multilayer stack mechanism for storing and transmitting multiple pieces of carrier plate. The utility model reduces front end pretreatment beat, improves production efficiency, shortens production line length, simplifies cavity structure, reduces factory and equipment factory affairs expenditure, reduces equipment failure and improves production quality.

Description

Technical Field

[0001] This utility model relates to the field of vacuum coating equipment, and in particular to a stack-switching continuous vacuum coating production line. Background Technology

[0002] In the fabrication of heterojunction solar cells, the common existing technology involves first depositing an amorphous silicon thin film in a PECVD (Physical Electrochemical Vapor Deposition) device, followed by the deposition of a transparent conductive film (TCO) in a PVD (Polymerization and Deposition) device. These PECVD / PVD devices employ a continuous flat-plate deposition structure, where a certain number of silicon wafers are laid flat on a carrier plate and fed into a vacuum chamber for deposition. As silicon wafer production capacity increases in the market, process cycle times are continuously reduced to improve production efficiency. To achieve this, the market utilizes multiple chambers connected in series to reduce the pre-processing cycle times, such as by setting up multiple vacuum-breaking chambers for staged vacuum breaking to reduce the pre-processing cycle time. Alternatively, a stacked approach is used, placing multiple carrier plates within a single chamber and coordinating with multiple buffer chambers for multi-carrier plate transport. While these methods can reduce pre-processing cycle times and increase yield, they also introduce the problem of large footprint. For example, the length of PECVD equipment in a 500MW production line often needs to be hundreds of meters, which brings many problems and difficulties to the construction of the plant and the operation and maintenance of the equipment. At the same time, because the inlet and outlet chambers need to be frequently evacuated to keep up with the process rhythm, the inlet and outlet chambers often deform and eventually crack. The chamber structure requires the design of complex pipelines and reinforcing ribs to meet the rhythm requirements, and the frequent evacuation leads to a high breakage rate. The mechanical pump set needs to complete the evacuation and devastation of the chamber within a few seconds. Frequent start and stop will severely shorten the service life of the pump set and cause frequent failures. The construction cost of a production line composed of multiple vacuum transition sections, preheating sections, process sections and cooling sections arranged in a row is high. Utility Model Content

[0003] The purpose of this invention is to solve the problems of high production line construction costs, difficult operation and maintenance, and frequent vacuuming in the existing technology. It provides a stack-switching continuous vacuum coating production line, which reduces the pre-processing cycle time, improves production efficiency, shortens the production line length, simplifies the cavity structure, reduces factory and equipment expenses, reduces equipment failures, and improves production quality.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] This utility model discloses a stack-switching continuous vacuum coating production line, which includes, from front to back, a feeding mechanism, a stacking mechanism, a process vacuum chamber, a stacking mechanism, and a unloading mechanism.

[0006] The stacking mechanism includes a left stacking vacuum chamber and a right stacking vacuum chamber. A set of stacking cavity docking components is respectively provided under the left and right stacking vacuum chambers to independently control the left or right stacking vacuum chamber to move back and forth and dock with the process vacuum chamber. A shared stacking cavity switching component is provided below the stacking cavity docking components to control the left and right stacking vacuum chambers to move left and right, switching back and forth between the cavity docking with the process vacuum chamber.

[0007] The popping mechanism includes a left popping vacuum cavity and a right popping vacuum cavity; a set of popping cavity docking components are respectively provided under the left and right popping vacuum cavities, which are used to independently control the left or right popping vacuum cavity to move back and forth and dock with the process vacuum cavity; a common popping cavity switching component is provided below the popping cavity docking components, which is used to control the left and right popping vacuum cavities to move left and right and switch back and forth between the cavity docked with the process vacuum cavity;

[0008] The left push vacuum cavity, right push vacuum cavity, left pop vacuum cavity, and right pop vacuum cavity are all equipped with multi-layer stacking mechanisms for storing and transferring multiple carrier boards.

[0009] Furthermore, the left and right stacking vacuum chambers are equipped with a stacking pump group and heating module shared by the two stacking vacuum chambers, which are used to evacuate and preheat the chambers.

[0010] The left and right ejection vacuum chambers are equipped with a set of ejection pumps and cooling modules shared by the two ejection vacuum chambers, which are used to evacuate and cool the chambers.

[0011] Furthermore, both ends of the left and right stack vacuum chambers are equipped with forward stack GV valves and backward stack GV valves.

[0012] Both ends of the left and right pop vacuum chambers are equipped with a front pop GV valve and a rear pop GV valve.

[0013] Furthermore, the process vacuum chamber is provided with one or more, and the process vacuum chamber is provided with a single layer or multiple layers of coating chambers. The multiple layers of coating chambers are provided with an isolation layer to avoid process interference and facilitate the arrangement of special gas pipelines. The process vacuum chamber is provided with a process pump group for maintaining the vacuum level in the chamber. A front process GV valve is provided at the front end of the process vacuum chamber and a rear process GV valve is provided at the rear end.

[0014] Furthermore, the vacuum coating production line also includes a carrier plate return mechanism, which is located at the bottom of the production line and is used to transfer empty carrier plates to the loading mechanism for reloading silicon wafers.

[0015] Furthermore, the feeding mechanism and the unloading mechanism are provided with multiple feeding and unloading positions, which correspond to the vacuum chambers before and after the switching of the stacking mechanism and the unloading mechanism, respectively.

[0016] The advantages of this utility model are:

[0017] 1. This utility model shortens the production line length by setting up multiple infeed vacuum chambers and multiple outfeed vacuum chambers in a left-right arrangement. Simultaneously, it employs infeed / outfeed cavity docking components and infeed / outfeed cavity switching components to switch between the multiple infeed and outfeed vacuum chambers and the process vacuum chambers for transporting the carrier plate. This reduces the need for multiple buffer chambers and multi-stage vacuum chambers added in existing technologies to lower the pre-processing cycle time without affecting production speed, thus significantly shortening the overall production line length and further reducing factory construction and equipment maintenance costs.

[0018] 2. This utility model utilizes a stacked cavity to store multiple carrier plates before processing, avoiding the deformation and cracking of the cavity caused by frequent vacuuming of the material inlet and outlet cavities. It also effectively avoids frequent start-stop and switching of mechanical pump units and vacuum valves, reducing the failure rate and extending service life. Smaller vacuum pump units can be selected, which is more energy-efficient, reducing purchase and operating energy costs, and reducing noise. The elimination of frequent vacuuming allows for a simpler and more optimized cavity structure, reducing equipment processing costs and effectively reducing the breakage rate caused by vacuum breaking. At the same time, the multi-layer structure of the process cavity can effectively shorten the length of the entire production line, reducing factory and equipment maintenance expenses. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the main structure of this embodiment.

[0021] Figure 2 This is a flowchart of the process of this embodiment.

[0022] Figure 3 This is the first working method of this embodiment.

[0023] Figure 4 This is the second working method in this embodiment.

[0024] Explanation of key component symbols:

[0025] 1. Stacking mechanism; 11. Left stacking vacuum chamber; 12. Right stacking vacuum chamber; 13. Forward stacking GV valve; 14. Rear stacking GV valve; 15. Stacking chamber docking assembly; 16. Stacking chamber switching assembly; 17. Stacking pump group; 18. Heating module.

[0026] 2. Popping mechanism, 21. Left popping vacuum chamber, 22. Right popping vacuum chamber, 23. Front popping GV valve, 24. Rear popping GV valve, 25. Popping chamber docking assembly, 26. Popping chamber switching assembly, 27. Popping pump assembly, 28. Cooling module.

[0027] 3. Process vacuum chamber; 31. Pre-process GV valve; 32. Post-process GV valve; 33. Carrier plate; 34. Process pump set; 35. Isolation layer.

[0028] 4. Feeding mechanism;

[0029] 5. Feeding mechanism;

[0030] 6. Carrier plate return mechanism. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0032] In this utility model, unless otherwise stated, directional terms such as "up," "down," "left," and "right" are generally understood in conjunction with the accompanying drawings and the directions shown in actual applications.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0034] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein. The terms "optional" and "discretionary" mean that they may or may not be included (or may or may not be present).

[0036] like Figures 1 to 4 As shown, this utility model discloses a stack-switching continuous vacuum coating production line, which includes a loading mechanism 4, a stacking mechanism 1, a process vacuum chamber 3, a stacking mechanism 2, and a unloading mechanism 5 connected sequentially from front to back, as well as a carrier plate return mechanism 6 disposed at the bottom of the production line. The carrier plate return mechanism 6 is used to transfer empty carrier plates to the loading mechanism 4 for reloading of silicon wafers.

[0037] The stacking mechanism 1 includes a left stacking vacuum chamber 11, a right stacking vacuum chamber 12, a stacking pump group 17, and a heating module 18. The left stacking vacuum chamber 11 and the right stacking vacuum chamber 12 share a set of stacking pump group 17 and heating module 18, which are used to evacuate and preheat the chambers.

[0038] Specifically, both the front and rear ends of the left and right entry vacuum chambers 11 and 12 are equipped with forward GV valves 13 and backward GV valves 14, respectively. A set of entry cavity docking assemblies 15 is respectively installed at the bottom of the left and right entry vacuum chambers 11 and 12, used to independently control the forward and backward movement of either the left or right entry vacuum chamber 11 or 12 to dock with the process vacuum chamber 3. Below the entry cavity docking assemblies 15 is a shared entry cavity switching assembly 16, used to control the left and right movement of the left and right entry vacuum chambers 11 and 12, switching back and forth between the cavity docking with the process vacuum chamber 3.

[0039] In use, when the stacking vacuum chamber needs to be connected to the process vacuum chamber 3, the stacking vacuum chamber is first moved up or down by the stacking chamber switching component 16 to align it with the process vacuum chamber 3. Then, the stacking vacuum chamber is moved forward by the stacking chamber docking component 15 to seal and connect with the process vacuum chamber 3. When the stacking vacuum chamber needs to be separated from the process vacuum chamber 3, the stacking vacuum chamber is first moved backward by the stacking chamber docking component 15 to detach it from the process vacuum chamber 3. Then, the stacking vacuum chamber is moved up or down by the stacking chamber switching component 16 to offset it from the process vacuum chamber 3.

[0040] The popping mechanism 2 includes a left popping vacuum chamber 21, a right popping vacuum chamber 22, a popping pump assembly 27, and a cooling module 28. The left popping vacuum chamber 21 and the right popping vacuum chamber 22 share a set of popping pump assembly 27 and cooling module 28, which are used to evacuate and cool the chambers of the popping mechanism 2.

[0041] Specifically, a front pop GV valve 23 and a rear pop GV valve 24 are provided at both ends of the left pop vacuum cavity 21 and the right pop vacuum cavity 22. A set of pop cavity docking components 25 are respectively provided at the bottom of the left pop vacuum cavity 21 and the right pop vacuum cavity 22, used to independently control the forward and backward movement of the left pop vacuum cavity 21 or the right pop vacuum cavity 22 to dock with the process vacuum cavity 3. A shared pop cavity switching component 26 is provided below the pop cavity docking components 25, used to control the left pop vacuum cavity 21 and the right pop vacuum cavity 22 to move left and right, switching back and forth between the cavity docked with the process vacuum cavity 3.

[0042] The operation principle of the popping mechanism is similar to that of the pushing mechanism 1. When the popping vacuum chamber needs to be connected to the process vacuum chamber 3, the popping vacuum chamber is first moved up or down by the popping chamber switching component 26 to align the popping vacuum chamber with the process vacuum chamber 3. Then, the popping vacuum chamber is moved backward by the popping chamber docking component 25 to seal and connect with the process vacuum chamber 3. When the popping vacuum chamber needs to be separated from the process vacuum chamber 3, the popping vacuum chamber is first moved forward by the popping chamber docking component 25 to detach from the process vacuum chamber 3. Then, the popping vacuum chamber is moved up or down by the popping chamber switching component 26 to offset the popping vacuum chamber from the process vacuum chamber 3.

[0043] The left push vacuum cavity 11, right push vacuum cavity 12, left pop vacuum cavity 21 and right pop vacuum cavity 22 are all equipped with multi-layer stacking mechanisms for storing and transferring multiple carrier boards.

[0044] The stacking cavity docking component 15, the stacking cavity switching component 16, the popping cavity docking component 25, and the popping cavity switching component 26 can use a sliding rail in conjunction with a drive motor to achieve the movement effect.

[0045] Specifically, the process vacuum chamber 3 is provided with one or more, and each process vacuum chamber 3 is provided with a single-layer or multi-layer coating chamber. An isolation layer 35 is provided between the multi-layer coating chambers to avoid process interference and facilitate the arrangement of special gas pipelines. A process pump unit 34 is provided within the process vacuum chamber 3 to maintain the vacuum level within the chamber. A pre-process GV valve 31 is provided at the front end of the process vacuum chamber 3, and a post-process GV valve 32 is provided at the rear end.

[0046] Specifically, the loading mechanism 4 and the unloading mechanism 5 are equipped with multiple loading and unloading positions, which correspond to the vacuum chambers before and after the switching of the stacking mechanism 1 and the unloading mechanism 2, respectively.

[0047] The following describes the operation process of the coating production line in conjunction with the structure of the embodiment: Figure 1-4 As shown:

[0048] The pre-process GV valve 31 and post-process GV valve 32 of the process vacuum chamber 3 are closed, and the process pump group 34 is started to begin vacuuming.

[0049] With the front and rear GV valves 23 and 24 of the left ejection vacuum chamber 21 closed, the ejection pump assembly 27 starts to evacuate the left ejection vacuum chamber 21. After the left ejection vacuum chamber 21 is moved downward to the same horizontal level as the process vacuum chamber 3 via the ejection chamber switching assembly 26, it is sealed and connected to the process vacuum chamber 3 using the ejection chamber docking assembly 25.

[0050] The forward stacking GV valve 13 of the left stacking vacuum chamber 11 opens, and the rear stacking valve 14 closes. The left stacking vacuum chamber 11 transports the completed carrier plate 33 into the chamber through the loading mechanism 4. The multi-layer stacking mechanism inside the left stacking vacuum chamber 11 can store multiple carrier plates 33. After the left stacking vacuum chamber 11 finishes storing the carrier plates 33, the forward stacking GV valve 13 closes, the stacking pump group 17 starts to start vacuuming, and at the same time, the heating module 18 starts to preheat the silicon wafer. After the left stacking vacuum chamber 11 moves down to the same horizontal line as the process vacuum chamber 3 through the stacking chamber switching assembly 16, it is sealed and connected to the process vacuum chamber 3 using the stacking chamber docking assembly 15.

[0051] While the left infeed vacuum chamber 11, process vacuum chamber 3, and left outfeed vacuum chamber 21 are being evacuated, the loading mechanism 4 continues to transport the completed carrier plate 33 to the right infeed vacuum chamber 12. The right infeed vacuum chamber 12 has a lifting mechanism that can store multiple carrier plates 33. After storage, the forward stacking GV valve 13 and the rear stacking GV valve 14 of the right infeed vacuum chamber 12 are closed. At the same time, the forward stacking GV valve 23 and the rear stacking GV valve 24 of the right outfeed vacuum chamber 22 are also closed, waiting for evacuation.

[0052] Once the vacuum levels in the left infeed vacuum chamber 11 and the left outfeed vacuum chamber 21 reach the required levels, and the process vacuum chamber 3 completes its process, the rear infeed GV valve 14, the front process GV valve 31, the rear process GV valve 32 of the left infeed vacuum chamber 11, and the front outfeed GV valve 23 of the left outfeed vacuum chamber 21 are opened. The carrier plate 33, after the process is completed, is transferred to the chamber of the left outfeed vacuum chamber 21 via a conveyor line, and the carrier plate is stored in the left outfeed vacuum chamber 21 using a lifting mechanism. At the same time, the carrier plate 33 is continuously fed into the process vacuum chamber 3 for process processing using the lifting mechanism and conveyor line in the left infeed vacuum chamber 11.

[0053] The process vacuum chamber 3, under the action of the isolation layer 35, can simultaneously process silicon wafers in multiple carriers.

[0054] After all the carrier plates in the left stacking vacuum chamber 11 have been output, the rear stacking GV valve 14 and the front process GV valve 31 of the left stacking vacuum chamber 11 are closed. The left stacking vacuum chamber 11 begins to break the air vent, and at the same time, the stacking pump group 17 begins to evacuate the right stacking vacuum chamber 12. The left stacking vacuum chamber 11 begins to return to the state of docking with the loading mechanism 4. The right stacking vacuum chamber 12 moves to the same horizontal line as the process vacuum chamber 3 through the stacking chamber switching component 16, and then docks with the process vacuum chamber 3 using the stacking chamber docking component 15 of the right stacking vacuum chamber 12.

[0055] After the carrier plates 33 in the process vacuum chamber 3 are all transported to the left ejection vacuum chamber 21, the rear ejection GV valve 24 and the rear process GV valve 32 of the left ejection vacuum chamber 21 are closed. The silicon wafers in the left ejection vacuum chamber 21 begin to be cooled and de-vacuumed through the cooling module 28, while the ejection pump group 27 begins to evacuate the chamber of the right ejection vacuum chamber 22. The left ejection vacuum chamber 21 begins to return to the state of docking with the unloading mechanism 5. The right ejection vacuum chamber 22 moves to the same horizontal line as the process vacuum chamber 3 through the ejection chamber switching component 26, and then docks with the process vacuum chamber 3 using the ejection chamber docking component 25 of the right ejection vacuum chamber 22.

[0056] After the left ejection vacuum chamber 21 is connected to the unloading mechanism 5, the rear ejection GV valve 24 is opened, and the conveyor line continuously transports the carrier plate 33 to the unloading mechanism 5. The unloading mechanism 5 begins to pick up the silicon wafers on the carrier plate 33, and at the same time lowers the empty carrier plate 33 to the carrier plate 33 return mechanism 6. The carrier plate 33 return mechanism 6 transports the empty carrier plate 33 to the loading mechanism 4. The loading mechanism 4 puts the silicon wafers back onto the empty carrier plate 33 and then transports them to the left entry vacuum chamber 11.

[0057] Once the vacuum levels of the right infeed vacuum chamber 12 and the right outfeed vacuum chamber 22 reach the required levels, and the process vacuum chamber 3 completes its process, the rear infeed GV valve 14, the front process GV valve 31, the rear process GV valve 32 of the right infeed vacuum chamber 12, and the front outfeed GV valve 23 of the right outfeed vacuum chamber 22 open, and a new round of process begins, repeating in this cycle.

[0058] In summary, this invention shortens the production line by setting up multiple infeed vacuum chambers and multiple outfeed vacuum chambers in a left-right arrangement. It utilizes stacked chambers to store multiple carrier plates before processing, avoiding the deformation and cracking problems caused by frequent vacuuming of the infeed and outfeed chambers. This achieves the goals of reducing the pre-processing cycle time, improving production efficiency, shortening the production line, simplifying the chamber structure, reducing factory and equipment costs, minimizing equipment failures, and improving production quality.

[0059] The preferred embodiments of this utility model have been described in detail above; however, this utility model is not limited thereto. Within the scope of the technical concept of this utility model, various simple modifications can be made to the technical solution of this utility model, including combining the various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed by this utility model and are all within the protection scope of this utility model.

Claims

1. A stack-switching continuous vacuum coating production line, comprising, from front to back, a feeding mechanism (4), a stacking mechanism (1), a process vacuum chamber (3), a stacking mechanism (2), and a unloading mechanism (5). Its features are: The stacking mechanism (1) includes a left stacking vacuum cavity (11) and a right stacking vacuum cavity (12); a set of stacking cavity docking components (15) are respectively provided under the left stacking vacuum cavity (11) and the right stacking vacuum cavity (12) to independently control the left stacking vacuum cavity (11) or the right stacking vacuum cavity (12) to move back and forth and dock with the process vacuum cavity (3); a common stacking cavity switching component (16) is provided below the stacking cavity docking component (15) to control the left stacking vacuum cavity (11) and the right stacking vacuum cavity (12) to move left and right and switch back and forth to dock with the process vacuum cavity (3); The popping mechanism (2) includes a left popping vacuum cavity (21) and a right popping vacuum cavity (22); a set of popping cavity docking components (25) are respectively provided under the left popping vacuum cavity (21) and the right popping vacuum cavity (22), which are used to independently control the left popping vacuum cavity (21) or the right popping vacuum cavity (22) to move back and forth and dock with the process vacuum cavity (3); a common popping cavity switching component (26) is provided below the popping cavity docking component (25), which is used to control the left popping vacuum cavity (21) and the right popping vacuum cavity (22) to move left and right and switch back and forth to dock with the process vacuum cavity (3); The left push vacuum cavity (11), right push vacuum cavity (12), left pop vacuum cavity (21), and right pop vacuum cavity (22) are all equipped with multi-layer stacking mechanisms for storing and transmitting multiple carrier boards.

2. The stack-switching continuous vacuum coating production line according to claim 1, characterized in that: The left stacking vacuum chamber (11) and the right stacking vacuum chamber (12) are equipped with a stacking pump group (17) and a heating module (18) shared by the two stacking vacuum chambers, which are used to evacuate and preheat the chambers; The left and right pop-out vacuum chambers (21 and 22) are equipped with a set of pop-out pump group (27) and cooling module (28) shared by the two pop-out vacuum chambers, which are used to evacuate and cool the chambers.

3. The stack-switching continuous vacuum coating production line according to claim 1, characterized in that: Both ends of the left stack vacuum chamber (11) and the right stack vacuum chamber (12) are provided with a forward stack GV valve (13) and a rear stack GV valve (14). The front and rear ends of the left pop vacuum chamber (21) and the right pop vacuum chamber (22) are equipped with a front pop GV valve (23) and a rear pop GV valve (24).

4. The stack-switching continuous vacuum coating production line according to claim 1, characterized in that: The process vacuum chamber (3) is provided with one or more, and the process vacuum chamber (3) is provided with a single layer or multiple layers of coating chambers. The multiple layers of coating chambers are provided with an isolation layer (35) to avoid process interference and facilitate the arrangement of special gas pipelines. The process vacuum chamber (3) is provided with a process pump group (34) for maintaining the vacuum level in the chamber. The front end of the process vacuum chamber (3) is provided with a front process GV valve (31), and the rear end is provided with a rear process GV valve (32).

5. The stack-switching continuous vacuum coating production line according to claim 1, characterized in that: The vacuum coating production line also includes a carrier plate return mechanism (6), which is located at the bottom of the production line and is used to transfer empty carrier plates to the loading mechanism (4) for reloading silicon wafers.

6. The stack-switching continuous vacuum coating production line according to claim 1, characterized in that: The loading mechanism (4) and unloading mechanism (5) are provided with multiple loading and unloading positions, which correspond to the vacuum chambers before and after the switching of the stacking mechanism (1) and the unloading mechanism (2).

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