A device for localized gold plating of columnar products

Abstract

This utility model discloses a device for partial gold plating of columnar products, comprising: an electroplating tank for holding electrolyte, wherein at least two spaced-apart support strips are connected between the two inner walls of the electroplating tank; an electroplating tube having a cavity inside, with both ends overlapping the two support strips, and a top plane having a plurality of outlets communicating with the cavity; a circulation assembly; a water-absorbing sleeve covering the outer wall of the electroplating tube for uniformly absorbing electrolyte; and a power supply. The circulation assembly collects excess electrolyte from the electroplating tank and circulates it into the electroplating tube, spraying it out from the outlets and absorbing it onto the water-absorbing sleeve. Due to the flat top of the electroplating tube, it is suitable for the ends of columnar products to abut against each other, facilitating partial gold plating of the columnar products. Since the entire water-absorbing sleeve is filled with electrolyte, after connecting to the positive terminal of the power supply, the entire water-absorbing sleeve acts as the anode, and the product connected to the negative terminal of the power supply acts as the cathode. This allows for the placement of several products on the entire water-absorbing sleeve for partial gold plating, improving plating efficiency.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and more specifically, to a device for partial gold plating of columnar products. Background Technology

[0002] The core principle of localized gold plating equipment is selective electrodeposition. Simply put, without overall immersion, a specific method is used to allow current to pass only through the localized area of ​​the workpiece that needs to be gold-plated, thereby selectively reducing gold ions in that area and forming a plating layer.

[0003] In the prior art, the structure of the local gold plating device is relatively complex and it is not suitable for gold plating the ends of columnar or tubular products. Therefore, we propose a device with a simple structure that is more suitable for local gold plating of columnar products. Utility Model Content

[0004] In view of the problems existing in the prior art, the purpose of this utility model is to provide a simple structure and a device that is more suitable for partial gold plating of columnar products.

[0005] To solve the above problems, the present invention adopts the following technical solution.

[0006] A partial gold plating device for a columnar product, comprising: An electroplating tank for holding electrolyte, wherein at least two spaced-apart support strips are connected between the two inner walls of the electroplating tank; An electroplating tube, wherein the electroplating tube has a cavity inside, both ends are connected to the two support strips, and the top plane is provided with a number of water outlets that communicate with the cavity at intervals; A circulation component, connected to the electroplating tank and the electroplating pipe, is used to recover the electrolyte in the electroplating tank and to supply electrolyte to the electroplating pipe; The absorbent sleeve, which covers the outer wall of the electroplating tube, is used to uniformly absorb the electrolyte. A power source, the positive terminal of which is connected to the absorbent sleeve, and the negative terminal of which is connected to the product, with the end of the product in contact with the absorbent sleeve.

[0007] Compared with the prior art, the advantages of this utility model are as follows: The support strip allows the electroplating tube to be suspended within the electroplating tank during installation, avoiding direct contact with the electrolyte. This facilitates electroplating operations and improves safety. The circulation component collects excess electrolyte from the electroplating tank and circulates it into the electroplating tube, where it is sprayed out from the outlet and adsorbed onto the absorbent sleeve. The flat top of the electroplating tube is suitable for end-to-end contact with cylindrical products, facilitating localized gold plating. Since the entire absorbent sleeve is coated with electrolyte, when connected to the positive terminal of the power supply, the entire sleeve acts as the anode, while the product connected to the negative terminal becomes the cathode. This allows for the placement of multiple products on the absorbent sleeve for localized gold plating, improving efficiency. Furthermore, this invention features a simple overall structure and low manufacturing cost.

[0008] In some embodiments, the top of the electroplating tube is provided with an electrode plate connected to the positive terminal of the power supply, and the absorbent sleeve wraps around the electrode plate.

[0009] In some embodiments, a plurality of the water outlets are evenly spaced at the top of the electroplating tube.

[0010] In some embodiments, the support strip is provided with a slot, and both ends of the electroplating tube are provided with a snap-fit ​​part that engages with the slot.

[0011] In some embodiments, the circulation assembly includes a circulation machine and an outlet pipe and an inlet pipe connected to the circulation machine; the outlet pipe is connected to one or both ends of the electroplating tube, and the inlet pipe is connected to the bottom of the electroplating tank.

[0012] In some embodiments, the electroplating tank includes a frame with a perforated groove, and the electroplating tank rests within the perforated groove.

[0013] In some embodiments, the partial gold plating device further includes a horizontal plate, on which a plurality of fasteners for fixing the product are arranged at intervals along the axial direction of the horizontal plate, and the product is fixed perpendicular to the horizontal plate. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the electroplating tank and circulation component of this utility model. Figure 3 This is a schematic diagram of the product of this utility model resting against the electroplating tube; Figure 4 This is a cross-sectional view of the electroplating tube of this utility model; Figure 5 This is an exploded view of the electroplating tube of this utility model.

[0015] Explanation of the labels in the diagram: 1. Electroplating tank; 11. Supporting strip; 111. Slot; 2. Electroplating tube; 21. Cavity; 22. Outlet; 23. Connecting part; 24. Electrode; 3. Circulation assembly; 31. Circulation machine; 32. Outlet pipe; 33. Inlet pipe; 4. Suction sleeve; 5. Power supply; 6. Product; 7. Horizontal plate; 8. Frame. 2. Detailed Implementation The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] refer to Figure 1-5 A partial gold plating device for a columnar product includes: an electroplating tank 1, an electroplating tube 2, a circulation assembly 3, a water-absorbing sleeve 4, and a power supply 5. The electroplating tank 1 holds the electrolyte, and at least two spaced-apart support strips 11 connect the two inner walls of the electroplating tank. The electroplating tube 2 has an internal cavity 21, with both ends overlapping the two support strips 11, and a plurality of outlets 22 spaced apart on its top plane, communicating with the cavity 21. The circulation assembly 3 is connected to the electroplating tank 1 and the electroplating tube 2, and is used to recover the electrolyte in the electroplating tank 1 and supply electrolyte to the electroplating tube 2. The water-absorbing sleeve 4 covers the outer wall of the electroplating tube 2 and is used to uniformly absorb the electrolyte. The positive terminal of the power supply 5 is connected to the water-absorbing sleeve 4, and the negative terminal is connected to the product 6, with the end of the product 6 in contact with the water-absorbing sleeve 4.

[0017] Understandably, the electroplating tank 1 is a tank structure used to collect excess electrolyte sprayed from the electroplating tube 2, such as a square tank or a round tank, but not limited to these. The support strip and both ends of the electroplating tube 2 can be connected by snap-fit, bolts, etc., but not limited to these. The electroplating tube 2 is a tube structure, and its top plane can be set by setting the electroplating tank 1 as a semi-tube structure, or by setting a flat plate on the top of the electroplating tube 2, etc., but not limited to these. The circulation component 3 is a component used to circulate the electrolyte; this is existing technology and will not be described in detail here. The absorbent sleeve 4 is a component with water absorption properties; for example, it can be made of sponge, fiber cloth, etc., but not limited to these.

[0018] This configuration, with its support strip, allows the electroplating tube 2 to be suspended within the electroplating tank 1 during installation, avoiding direct contact with the electrolyte within the tank. This facilitates electroplating operations and enhances safety. The circulation component 3 collects excess electrolyte from the tank 1 and circulates it into the electroplating tube 2, spraying it out from the outlet 22 and adsorbing it onto the absorbent sleeve 4. The flat top of the electroplating tube 2 is suitable for contacting the ends of columnar products 6, facilitating localized gold plating. Since the entire absorbent sleeve 4 is coated with electrolyte, when connected to the positive terminal of the power supply 5, the entire sleeve acts as the anode, while the product 6, connected to the negative terminal, acts as the cathode. This allows for the placement of multiple products 6 on the absorbent sleeve 4 for localized gold plating, improving plating efficiency. Furthermore, this invention has a simple overall structure and low manufacturing cost.

[0019] In some embodiments, reference Figure 4-5 The electroplating tube 2 has an electrode 24 at its top that connects to the positive terminal of the power supply 5, and the absorbent sleeve 4 wraps around the electrode 24. Here, the electrode 24 is positioned to facilitate connection to the positive terminal of the power supply 5, and the absorbent sleeve 4 secures the electrode 24 in place. Alternatively, the electrode 24 can also be directly fixed to the electroplating tube 2 using screws, adhesive, or other methods.

[0020] In some embodiments, a plurality of outlets 22 are evenly spaced at the top of the electroplating tube 2. In this way, the electrolyte can be sprayed evenly on the electroplating tube 2 and then evenly absorbed by the absorbent sleeve 4, ensuring that there is sufficient electrolyte at any position on the absorbent sleeve 4, thereby ensuring that gold plating can be completed at any position on the absorbent sleeve 4.

[0021] In some embodiments, reference Figure 1 and Figure 3 The support 11 has a slot 111, and the electroplating tube 2 has a locking part 23 at both ends that engages with the slot 111. Here, the slot 111 is preferably a square slot or a V-shaped slot, and the locking part 23 is correspondingly set as a square block or a V-shaped block, but is not limited to these. In this way, the electroplating tube 2 can be quickly installed, and the electroplating tube 2 can be prevented from shifting or rotating.

[0022] In some embodiments, reference Figure 1-3 The circulation component 3 includes a circulation machine 31 and an outlet pipe 32 and an inlet pipe 33 connected to the circulation machine 31. The outlet pipe 32 is connected to one or both ends of the electroplating tube 2, and the inlet pipe 33 is connected to the bottom of the electroplating tank 1. Here, if the outlet pipe 32 is connected to one end of the electroplating tube 2, the electrolyte enters the electroplating tube 2 in one direction. If the outlet pipe 32 is connected to both ends of the electroplating tube 2, the electrolyte enters the electroplating tube 2 in both directions, and the water output will be more uniform.

[0023] In some embodiments, reference Figure 1The electroplating tank 1 includes a frame 8 with a perforated groove, and the electroplating tank 1 is supported in the perforated groove. Thus, the frame 8 and the electroplating tank 1 are separate designs, which facilitates subsequent disassembly and assembly.

[0024] In some embodiments, reference Figure 1 and Figure 3-4 The partial gold plating device also includes a horizontal plate 7, on which a number of fasteners for fixing the product 6 are arranged at intervals along the axial direction of the horizontal plate 7, and the product 6 is fixed perpendicular to the horizontal plate 7.

[0025] Understandably, the fastener is a component that secures product 6; it could be a spring clip or a magnetic closure, but is not limited to these. The negative terminal of power supply 5 can be directly connected to the horizontal plate 7.

[0026] With this setup, multiple products 6 can be vertically fixed on the horizontal plate 7. During operation, simply hold the horizontal plate 7 and press the ends of multiple products 6 onto the absorbent sleeve 4 to achieve simultaneous gold plating of the ends of multiple products 6.

[0027] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.

Claims

1. A device for partial gold plating of a columnar product, characterized in that, include: An electroplating tank for holding electrolyte, wherein at least two spaced-apart support strips are connected between the two inner walls of the electroplating tank; An electroplating tube, wherein the electroplating tube has a cavity inside, both ends are connected to the two support strips, and the top plane is provided with a number of water outlets that communicate with the cavity at intervals; A circulation component, connected to the electroplating tank and the electroplating pipe, is used to recover the electrolyte in the electroplating tank and to supply electrolyte to the electroplating pipe; The absorbent sleeve, which covers the outer wall of the electroplating tube, is used to uniformly absorb the electrolyte. A power source, the positive terminal of which is connected to the absorbent sleeve, and the negative terminal of which is connected to the product, with the end of the product in contact with the absorbent sleeve.

2. The device for partial gold plating of a columnar product according to claim 1, characterized in that, The top of the electroplating tube is provided with an electrode plate connected to the positive terminal of the power supply, and the absorbent sleeve wraps around the electrode plate.

3. The device for partial gold plating of a columnar product according to claim 1, characterized in that, Several of the aforementioned water outlets are evenly spaced at the top of the electroplating pipe.

4. The device for partial gold plating of a columnar product according to claim 1, characterized in that, The bearing strip has a slot, and the two ends of the electroplating tube are provided with a snap-fit ​​part that matches the slot.

5. The device for partial gold plating of a columnar product according to claim 1, characterized in that, The circulation assembly includes a circulation machine and an outlet pipe and an inlet pipe connected to the circulation machine; the outlet pipe is connected to one or both ends of the electroplating tube, and the inlet pipe is connected to the bottom of the electroplating tank.

6. The device for partial gold plating of a columnar product according to claim 1, characterized in that, The electroplating tank includes a frame with a hollowed-out groove, and the electroplating tank is supported in the hollowed-out groove.

7. The device for partial gold plating of a columnar product according to claim 1, characterized in that, The partial gold plating device also includes a horizontal plate, on which a plurality of fasteners for fixing the product are arranged at intervals along the axial direction of the horizontal plate, and the product is fixed perpendicular to the horizontal plate.

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