Adjustable electroplating tank cover and electroplating equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, provide a kind of adjustable electroplating tank cover and electroplating equipment, adjustable electroplating tank cover includes: cover and press-down driving element;The cover includes multiple cover sub-pieces connected with each other, the cover sub-piece has sub-press-down surface, and the sub-press-down surface of each cover sub-piece constitutes the press-down surface of the cover;One cover sub-piece is connected with another cover sub-piece in the way of relative motion at least, so that the relative position of the sub-press-down surface of the above two cover sub-pieces is adjustable;One cover sub-piece is configured with a press-down driving element, and the output end of the press-down driving element is connected with the cover sub-piece for driving the cover sub-piece movement.The above-mentioned electroplating tank cover includes multiple cover sub-pieces, each cover sub-piece is driven to move, so that the shape of the contact surface of electroplating tank cover and semiconductor device can be fine-tuned, to adapt to the warping of semiconductor device, improve its application range, and operability and stability are effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to an adjustable electroplating tank cover and electroplating equipment. Background Technology

[0002] Metallization is the process of depositing a metal film on the insulating dielectric film of a semiconductor device during semiconductor manufacturing to achieve electrical interconnection.

[0003] Electroplating is one of the key processes in the metallization of semiconductor devices. Electroplating is a crucial process for depositing a thin metal film on the surface of semiconductor devices (such as wafers) using electrochemical methods. Its core principle involves placing the wafer as the cathode in an electrolyte solution. The metal is anolyzed, releasing ions. These ions migrate to the wafer surface under the influence of an electric field and are reduced to metal atoms, ultimately forming a uniform plating layer.

[0004] The electroplating tank cover is an important component in electroplating equipment. It is used to press the upper surface of semiconductor devices to fix them in place, while the lower surface of the semiconductor devices comes into contact with the electroplating solution to form a uniform plating layer on the lower surface of the semiconductor devices.

[0005] Existing electroplating tank covers are typically one-piece designs, driven by a single component to press against semiconductor devices. These covers are generally only suitable for semiconductor devices of a fixed thickness. For thinner semiconductor devices, which often exhibit greater warping, the existing covers pose a higher risk of breakage when pressed against them, thus reducing their applicability, operability, and stability.

[0006] Therefore, this utility model provides an adjustable electroplating tank cover and electroplating equipment to improve the problems of reduced applicability, poor operability and stability. Utility Model Content

[0007] The purpose of this utility model is to provide an adjustable electroplating tank cover and electroplating equipment. The electroplating tank cover includes multiple cover sub-components, each of which is driven to move, so that the shape of the contact surface between the electroplating tank cover and the semiconductor device can be finely adjusted to adapt to the warping of the semiconductor device, improve its applicability, and effectively improve its operability and stability.

[0008] This utility model provides an adjustable electroplating tank cover, including: a cover body and a pressing drive component;

[0009] The cover body includes a plurality of interconnected cover body sub-components, each cover body sub-component having a sub-pressing surface, and the sub-pressing surface of each cover body sub-component constitutes the pressing surface of the cover body;

[0010] One cover component is connected to at least another cover component in a manner of relative movement, such that the relative position of the sub-pressing surfaces of the two cover components is adjustable;

[0011] The cover sub-component is equipped with a pressing drive, the output end of which is connected to the cover sub-component for driving the cover sub-component to move.

[0012] Optionally, one cover sub-component is rotatably connected to another cover sub-component so that the relative angle between the sub-pressing surfaces of the two cover sub-components is adjustable;

[0013] Alternatively, the sub-pressing surfaces of each of the cover sub-components are arranged in parallel, and one cover sub-component is connected to another cover sub-component in a first direction, so that the relative position of the sub-pressing surfaces of the two cover sub-components in the first direction is adjustable, and the first direction is perpendicular to the sub-pressing surfaces.

[0014] Optionally, the cover body is disc-shaped, the cover body sub-components are fan-shaped, and each of the cover body sub-components is connected end to end in sequence along its circumferential direction.

[0015] Optionally, the center angles of all the said cover sub-components are the same.

[0016] Optionally, the adjustable electroplating tank cover further includes an elastic element, and the output end of the pressing drive is connected to the cover body sub-component through the elastic element.

[0017] Optionally, the adjustable electroplating tank cover further includes an intermediate layer, which is attached to the lower pressing surface and connected to each of the sub-lower pressing surfaces.

[0018] Optionally, the adjustable electroplating tank cover further includes an elastic sealing ring, which is disposed in the intermediate layer and protrudes from the side of the intermediate layer away from the lower pressing surface;

[0019] Along a direction perpendicular to the intermediate layer, the elastic sealing ring is positioned directly opposite each of the sub-pressure surfaces.

[0020] Optionally, when the cover is disc-shaped, the elastic sealing ring is coaxially arranged with the cover.

[0021] Optionally, the adjustable electroplating tank cover further includes a pressure detection unit, which is disposed on the cover body and is used to detect the force applied by the downward driving member to the cover body component.

[0022] This utility model also discloses an electroplating device, including the adjustable electroplating tank cover described above.

[0023] In this invention, the cover body comprises multiple cover body sub-components, each of which is equipped with a pressure driving component to drive its movement. One cover body sub-component is connected to at least another cover body sub-component in a relatively movable manner, allowing the relative position of the pressure surfaces of the two sub-components to be adjustable. This enables fine-tuning of the overall shape of the pressure surfaces to accommodate the warpage of semiconductor devices. Consequently, the cover body is suitable for pressing semiconductor devices of varying thicknesses, applying a uniform force to the semiconductor devices, reducing the risk of breakage, improving the product yield of electroplating equipment, expanding the applicability of electroplating tank covers, and enhancing operability and stability. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of an adjustable electroplating tank cover according to an embodiment of the present invention;

[0025] Figure 2 This is a bottom view of the cover structure according to an embodiment of the present invention;

[0026] Figure 3 This is a cross-sectional view of an adjustable electroplating tank cover according to an embodiment of the present invention.

[0027] Figure 4 This is a partial cross-sectional view of an adjustable electroplating tank cover according to an embodiment of the present invention.

[0028] Figure 5 This is a bottom view of the cover structure according to another embodiment of the present invention.

[0029] In the attached diagram:

[0030] 10-Cover body; 101-Pressing surface; 11-Cover body component; 111-Pressing surface; 112-Sliding block; 12-Hinge; 13-Notch;

[0031] 20 - Downward drive component; 21 - Output terminal;

[0032] 30 - Pairs of semiconductor devices;

[0033] 40 - Bearing ring;

[0034] 50-Standard;

[0035] 60 - Intermediate layer;

[0036] 70 - Elastic sealing ring;

[0037] 80-Elastic element; 81-Connecting sleeve; 82-Pressure block; 83-Mounting hole; 84-Seal;

[0038] 90 - Pressure detection unit; 91 - Pressure sensor;

[0039] 100 - Pressure detection device. Detailed Implementation

[0040] The adjustable electroplating tank cover and electroplating equipment proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.

[0041] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the terms “at least two” or “more than” are generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. Furthermore, the terms "installed," "connected," and "attached," as used in this utility model, and the term "set" on one element from another, should be interpreted broadly. They generally only indicate a connection, coupling, cooperation, or transmission relationship between the two elements, which can be direct or indirect through an intermediate element. They should not be construed as indicating or implying a spatial positional relationship between the two elements, meaning one element can be located inside, outside, above, below, or to one side of the other element, unless otherwise explicitly stated. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances. Additionally, directional terms such as above, below, up, down, upward, downward, left, and right are used relative to exemplary embodiments as shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.

[0042] This embodiment provides an adjustable electroplating tank cover, including: a cover body 10 and a pressing drive component 20.

[0043] During the electroplating process, a semiconductor device (e.g., a wafer) is supported on a support ring 40. A downward-pressing drive 20 drives a cover 10 downward to press against the semiconductor device 30, fixing it onto the support ring 40. At this time, the lower surface of the semiconductor device 30 is exposed within the support ring 40. Electroplating solution is introduced into and discharged from the bottom of the support ring 40, creating a circulation. The electroplating solution contacts the lower surface of the semiconductor device 30, and metal ions (e.g., copper ions, silver ions, etc.) in the electroplating solution are reduced to metal atoms on the lower surface of the semiconductor device 30 and deposited to form a metal layer. The electroplating process also includes a cathode and an anode; the electroplating principle is existing technology and will not be elaborated here.

[0044] Combination Figures 1 to 3 As shown, the cover 10 in this embodiment includes three interconnected cover sub-components 11. The cover 10 may be made of soluble polytetrafluoroethylene (PFA) material and should have superior hardness.

[0045] The cover component 11 has a pressing surface 111 ( Figure 1 and Figure 3 The lower surface of each cover sub-component 11 and the sub-pressing surface 111 of each cover sub-component 11 constitute the pressing surface 101 of the cover 10. The pressing surface 101 is used to apply pressure to the semiconductor device 30 to fix it on the support ring 40.

[0046] One cover sub-component 11 is connected to at least another cover sub-component 11 in a relatively movable manner, so that the relative position of the sub-pressing surfaces 111 of the two cover sub-components 11 is adjustable. This allows for fine adjustment of the overall shape of the pressing surface 101 to adapt to the warping of the semiconductor device 30, enabling the cover 10 to adapt to the pressing of semiconductor devices 30 of different thicknesses. This allows for the application of a uniform force to the semiconductor device 30, reducing the risk of breakage, increasing the applicability of the electroplating tank cover, and improving operability and stability.

[0047] Combination Figure 2 As shown, in this embodiment, the cover 10 is disc-shaped, and the three cover sub-components 11 are fan-shaped, with each cover sub-component 11 connected end to end in sequence along its circumferential direction.

[0048] The above-mentioned cover body 10 is adapted to a circular semiconductor device 30 (such as a wafer), so as to apply a circumferentially uniform force to the edge of the upper surface of the semiconductor device 30. In other alternative embodiments, the shape of the cover body 10 can be adjusted based on the actual shape of the semiconductor device 30. For example, the cover body 10 can be arranged in a rectangular structure, and each cover sub-member 11 can also be adaptively arranged in a rectangular structure. Each cover sub-member 11 can be distributed at four corners to form an approximately "field" shaped structure, or each cover sub-member 11 can be distributed in a straight line to form an approximately "mu" shaped structure. The distribution mode and connection mode of each cover sub-member 11 can be adjusted based on actual requirements.

[0049] Please continue to refer to Figure 2 as shown in the figure, one cover sub-member 11 is rotationally connected to an adjacent cover sub-member 11 through a hinge 12, and the rotation central axis thereof extends along the radial direction of the cover body 10. Therefore, during the rotation of adjacent cover sub-members 11, the adjustment of the relative angle between adjacent lower pressing surfaces 111 can be realized, so as to adapt to the warpage of the semiconductor device 30.

[0050] It should be noted that the warpage of the semiconductor device 30 is small, usually at the millimeter level or even less than millimeter level, while the size of the semiconductor device 30 is relatively large. For example, existing wafers have specifications such as 6-inch, 8-inch, and 12-inch, and the size of the wafer is much larger than the value of its warpage. Therefore, only fine adjustment between adjacent cover sub-members 11 is needed to realize adaptation to warpage. In this embodiment, the required rotation angle between the three fan-shaped cover sub-members 11 is small. During actual assembly, although the three fan-shaped cover sub-members 11 are connected to each other through hinges 12, the hinges 12 do not form an absolute constraint on the three fan-shaped cover sub-members 11, and fine movement (millimeter-level movement) can be realized between adjacent cover sub-members 11, so the fine adjustment requirement can be satisfied. During assembly, an appropriate gap can also be maintained between the circumferences of adjacent cover sub-members 11 to meet the requirement of relative fine rotation therebetween.

[0051] Please continue to refer to Figure 2 as shown in the figure, in this embodiment, the central angles of each of the cover sub-members 11 are the same, and the radial inner side of the cover sub-member 11 is provided with an arc-shaped notch 13, and the three notches 13 together enclose to form a circular hole structure. The arrangement of the notch plays a role in clearance, preventing mutual interference during the rotation of the cover sub-members 11. In other alternative embodiments, the number of the cover sub-members 11 can be two, four or more, the central angles of the cover sub-members 11 can be partially the same or different from each other, and the number of the cover sub-members 11, the central angle of each cover sub-member 11 and the shape of the notch 13 can be adjusted based on actual requirements.

[0052] Please continue to refer to Figure 1As shown, a cover sub-component 11 is equipped with one of the aforementioned pressing drive members 20, and a total of three drive members 20 are configured. The output end of the pressing drive member 20 is connected to the cover sub-component 11 to drive the cover sub-component 11 to move downward (perpendicular to the pressing surface 111). All three drive members 20 are mounted on a bracket 50, which can be mounted on the housing of the electroplating equipment. The drive member 20 can be a linear motor, a hydraulic cylinder, or other drive structure capable of linear drive. The housing of the drive member 20 is mounted on the bracket 50, and the output end 21 of the drive member 20 is connected to the upper surface of the cover sub-component 11 to drive the cover sub-component 11 downward, so that the lower surface (pressing surface 101) of the cover sub-component 11 presses against the semiconductor device 30.

[0053] Combination Figure 1 and Figure 3 As shown, the adjustable electroplating tank cover also includes an intermediate layer 60, which is attached to the lower pressing surface 101. Figure 1 and Figure 3 The lower surface of the middle cover 10), and the middle layer 60 is connected to each of the sub-pressing surfaces 111.

[0054] The intermediate layer 60 has a shape similar to the cover 10. The intermediate layer 60 is integrally laid on the lower surface of the cover 10 and connected to the sub-pressing surfaces 111 of each cover sub-component 11. This seals the gaps between adjacent cover sub-components 11, thereby creating a continuous and uninterrupted downward pressure on the semiconductor device 30. Furthermore, the intermediate layer 60 can be a flexible layer, for example, made of polytetrafluoroethylene (PTFE). By controlling the thickness of the intermediate layer 60 to maintain a certain degree of flexibility, it can deform with slight movements of adjacent cover sub-components 11. In other alternative embodiments, the intermediate layer 60 can be made of other known high-temperature resistant and corrosion-resistant flexible materials.

[0055] Furthermore, in combination Figure 3 As shown, the adjustable electroplating tank cover also includes an elastic sealing ring 70, which can be made of materials such as silicone or rubber.

[0056] The elastic sealing ring 70 is disposed on the intermediate layer 60. In this embodiment, the elastic sealing ring 70 has a circular structure, which is adapted to the circular semiconductor device 30 so that the lower surface of the elastic sealing ring 70 can be circumferentially and uniformly pressed against the edge of the upper surface of the semiconductor device 30, and a seal is formed on the upper surface of the semiconductor device 30.

[0057] The lower surface of the intermediate layer 60 has a circular groove, a portion of which is embedded in the elastic sealing ring 70, and the lower surface of the elastic sealing ring 70 protrudes from the side of the intermediate layer 60 away from the lower pressure surface 101. Figure 3(The lower surface of the intermediate layer 60 in the middle).

[0058] The intermediate layer 60 can deform with the slight movement of the adjacent cover component 11, thereby causing the elastic sealing ring 70 to deform slightly, thus adapting to the warping of the semiconductor device 30, so that the elastic sealing ring 70 can be pressed evenly on the semiconductor device 30, and can form an effective seal on the upper surface of the semiconductor device 30.

[0059] To ensure that the elastic sealing ring 70 deforms with the slight movement of each cover component 11, it should be positioned directly opposite each of the sub-pressing surfaces 111 in a direction perpendicular to the intermediate layer 60. That is, along the circumferential direction of the elastic sealing ring 70, it should sequentially pass under each of the sub-pressing surfaces 111. In other words, the elastic sealing ring 70 should not correspond to only one or a portion of the cover components 11; it should correspond to all cover components 11 to deform in response to the slight movement of all cover components 11.

[0060] In this embodiment, the elastic sealing ring 70 is configured as an annular ring and coaxially arranged with the cover 10. Therefore, the cover 10 applies a uniform force to the elastic sealing ring 70, which in turn applies a uniform force to the semiconductor device 30. In other alternative embodiments, the shape of the elastic sealing ring 70 can be adapted to the shape of the semiconductor device 30.

[0061] Furthermore, the adjustable electroplating tank cover also includes an elastic element 80, and the output end of the pressing drive element 20 is connected to the cover body sub-part 11 through the elastic element 80.

[0062] Combination Figure 4 As shown, in this embodiment, the output end 21 of the downward driving member 20 is connected to the elastic member 80. The elastic member 80 is built into the connecting sleeve 81. The lower end of the elastic member 80 is connected to the bottom of the sleeve 81. The output end 21 extends vertically into the sleeve 81 and is connected to the upper end of the elastic member 80. The outer diameter of the output end 21 is the same as the inner diameter of the sleeve 81. A pressure block 82 is connected to the bottom of the sleeve 81. The outer diameter of the pressure block 82 is larger than the outer diameter of the sleeve 81. A mounting hole 83 is provided at the upper end of the cover sub-part 11, in which the pressure block 82 is located in the mounting hole 83. The inner diameter of the mounting hole 83 is larger than the outer diameter of the pressure block 82. A plug 84 is threadedly connected to the opening of the mounting hole 83. The plug 84 has an opening for the sleeve 81 to extend into the mounting hole 83. The inner diameter of the opening is larger than the outer diameter of the sleeve 81 and smaller than the outer diameter of the pressure block 82.

[0063] In addition, the adjustable electroplating tank cover also includes a pressure detection unit 90, which is disposed on the cover body 10 and is used to detect the force applied by the downward driving member 20 to the cover body sub-component 11.

[0064] Specifically, such as Figure 4 As shown, the pressure detection unit 90 includes, for example, three pressure sensors 91, with each cover sub-component 11 equipped with one pressure sensor 91. The pressure sensor 91 is located at the bottom of the mounting hole 83. When the output end 21 of the pressure drive member 20 drives the cover sub-component 11 downward, the output end 21 applies an elastic force to the bottom of the sleeve 81 through the elastic member 80. The sleeve 81 applies a force to the pressure detection unit 90 through the pressure block 82, thereby driving the cover sub-component 11 to press down onto the upper surface of the semiconductor device.

[0065] The pressure detection unit 90 can detect the force applied by the pressure driving member 20 to the cover sub-component 11, which is conducive to adjusting the pressure of the pressure driving member 20 on the corresponding cover sub-component 11, so that the cover sub-components 11 can move slightly relative to each other to adapt to the warping of the semiconductor device 30, and ensure that the elastic sealing ring 70 is in close contact with the semiconductor device 30 and seals it.

[0066] The aforementioned adjustable electroplating tank cover can effectively solve defects such as low automation, poor sealing, unstable electroplating solution concentration, and easy breakage during the electroplating process.

[0067] In this embodiment, the pressure block 82 is constrained within the mounting hole 83 by the sealing block 84. Due to the slight rotation between adjacent cover components 11, the angle between the cover component 11 and the output end 21 changes slightly. Therefore, the height of the mounting hole 83 is set higher than the height of the pressure block 82. When the bottom of the pressure block 82 presses against the pressure sensor 91, there is a set distance between the top of the pressure block 82 and the top of the sealing block 84. Thus, when the pressure block 82 is constrained within the mounting hole 83, it has a certain deflection space, allowing the angle of the entire structure consisting of the sleeve 81, the pressure block 82, and the output end 21 relative to the cover component 11 to be finely adjusted.

[0068] like Figure 4 As shown, in this embodiment, the bottom of the pressure block 82 is flat, and the outer periphery of the pressure block 82 is arc-shaped. In other alternative embodiments, the lower surface of the pressure block 82 can be set as a spherical structure, which facilitates the slight rotation of the pressure block 82 within the mounting hole 83, so as to facilitate the fine adjustment of the angle between the output end 21 and the cover sub-component 11.

[0069] In this embodiment, the elastic element 80 is a cylindrical helical spring, which is built into the sleeve 81. In other alternative embodiments, the elastic element 80 can be directly connected between the output end 21 of the pressing drive 20 and the upper surface of the cover sub-part 11. The elastic element 80 can also be a disc spring, a leaf spring, or other elastic structure.

[0070] In this embodiment, the pressure detection unit 90 includes three pressure sensors 91, the pressure sensors 91 are in communication connection with the pressure detection device 100, and the pressure sensors 91 are configured to transmit the detected pressure data to the pressure detection device 100. The pressure detection device 100 is, for example, a display or a controller. The pressure sensor 91 may be a resistive pressure sensor, a capacitive pressure sensor, an electromagnetic pressure sensor or other known pressure sensors. For example, an MPS type pressure sensor may be used as the pressure sensor, and the pressure detection unit 90 may be a display unit matched with an existing pressure sensor for displaying the detected pressure data, for example, a display head. The structure, operation principle and data transmission of the pressure sensor are all in the prior art, and will not be repeated here.

[0071] In this embodiment, the pressure sensor 91 is built into the mounting hole 83. In other alternative embodiments, the elastic member 80 may be directly connected between the output end 21 of the downward driving member 20 and the upper surface of the cover sub-component 11, and then the pressure sensor 91 may be disposed between the elastic member 80 and the output end 21 or between the elastic member 80 and the cover sub-component 11. The arrangement position of the pressure sensor 91 can be adjusted adaptively based on the actual structure of the plating tank cover.

[0072] In the above adjustable electroplating tank cover, the output ends of the three downward driving members 20 keep synchronous operation when not in contact with the semiconductor device. When contacting the semiconductor device, based on the detected pressure of each cover sub-component 11, each downward driving member 20 independently controls the corresponding cover sub-component 11 to move, so as to realize independent fine adjustment of the cover sub-components 11, and adjacent cover sub-components 11 slightly move to adapt to the warpage of the semiconductor device and ensure that a uniform force is applied to the semiconductor device. During the independent fine adjustment of each downward driving member 20, it should be ensured that the pressure applied to each cover sub-component 11 is within a threshold range, so as to prevent damage to the semiconductor device caused by excessive pressure.

[0073] With reference to Figure 5 , another embodiment of the cover body 10 is shown. Figure 5 The cover body 10 in Figure 2 differs from the cover body 10 in Figure 5 only in the connection mode between adjacent cover sub-components 11. In , the sub-pressing surfaces 111 of each of the cover sub-components 11 are arranged in parallel, and one cover sub-component 11 is connected to another cover sub-component 11 for linear movement along a first direction, so that the relative position of the sub-pressing surfaces 111 of the two cover sub-components 11 along the perpendicular direction thereof is adjustable.

[0074] With reference to Figure 5As shown, a cover sub-component 11 has a trapezoidal sliding block 112 with a larger outer diameter and a smaller inner diameter on one side of its circumferential direction. The adjacent cover sub-component 11 has a sliding groove adapted to the sliding block 112 on its side. The sliding groove extends in a direction perpendicular to the sub-pressing surface 111. The sliding block 112 and the sliding groove conformally slide and engage, so that the adjacent cover sub-component 11 can move relative to each other in a direction perpendicular to the sub-pressing surface 111 to accommodate the warping of the semiconductor device.

[0075] Figure 5 The cover 10 includes three cover sub-components 11. In other alternative embodiments, the cover 10 may include four, five, six or more cover sub-components 11 to more finely adjust the shape of the sub-pressing surface 111 of the cover 10 to precisely adapt to the warpage of the semiconductor device.

[0076] This embodiment also provides an electroplating apparatus, including the adjustable electroplating tank cover described above. Furthermore, the electroplating apparatus also includes an electroplating container, a support ring, an anode electrode, a cathode ring, and other structures. The difference between this electroplating apparatus and existing structures lies in the different structure of the adjustable electroplating tank cover; other structures remain consistent with existing structures.

[0077] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0078] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. An adjustable electroplating tank cover, characterized in that, include: Cover and downward drive mechanism; The cover body includes a plurality of interconnected cover body sub-components, each cover body sub-component having a sub-pressing surface, and the sub-pressing surface of each cover body sub-component constitutes the pressing surface of the cover body; One cover component is connected to at least another cover component in a manner of relative movement, such that the relative position of the sub-pressing surfaces of the two cover components is adjustable; The cover sub-component is equipped with a pressing drive, the output end of which is connected to the cover sub-component for driving the cover sub-component to move.

2. The adjustable electroplating tank cover as described in claim 1, characterized in that, One cover component is rotatably connected to another cover component so that the relative angle between the lower pressing surfaces of the two cover components is adjustable. Alternatively, the sub-pressing surfaces of each of the cover sub-components are arranged in parallel, and one cover sub-component is connected to another cover sub-component in a first direction, so that the relative position of the sub-pressing surfaces of the two cover sub-components in the first direction is adjustable, and the first direction is perpendicular to the sub-pressing surfaces.

3. The adjustable electroplating tank cover as described in claim 1, characterized in that, The cover body is disc-shaped, and the cover body sub-components are fan-shaped, with each cover body sub-component connected end to end along its circumferential direction.

4. The adjustable electroplating tank cover as described in claim 3, characterized in that, The center angles of all the described cover components are the same.

5. The adjustable electroplating tank cover as described in claim 1, characterized in that, The adjustable electroplating tank cover also includes an elastic element, and the output end of the pressing drive is connected to the cover body sub-component through the elastic element.

6. The adjustable electroplating tank cover as described in any one of claims 1 to 5, characterized in that, The adjustable electroplating tank cover also includes an intermediate layer, which is attached to the lower pressure surface and connected to each of the sub-lower pressure surfaces.

7. The adjustable electroplating tank cover as described in claim 6, characterized in that, The adjustable electroplating tank cover also includes an elastic sealing ring, which is disposed in the intermediate layer and protrudes from the side of the intermediate layer away from the lower pressure surface. Along a direction perpendicular to the intermediate layer, the elastic sealing ring is positioned directly opposite each of the sub-pressure surfaces.

8. The adjustable electroplating tank cover as described in claim 7, characterized in that, When the cover is disc-shaped, the elastic sealing ring is coaxially arranged with the cover.

9. The adjustable electroplating tank cover as described in claim 1, characterized in that, The adjustable electroplating tank cover also includes a pressure detection unit, which is disposed on the cover body and is used to detect the force applied by the downward driving component to the cover body component.

10. An electroplating device, characterized in that, Includes the adjustable electroplating tank cover as described in any one of claims 1 to 9.

Images