Horizontal electroplating cleaning cavity integrated with deep hole wetting function

Abstract

The utility model discloses a horizontal electroplating cleaning cavity of integrated deep -hole wet function, including cavity, and the lateral wall of cavity has lateral wall water spray opening and nitrogen inlet, the upper cover can overturn and be set in the upper of cavity and can move up and down, and the down moving distance of upper cover can seal cavity, and clamping subassembly sets up in the lower surface of upper cover, and vacuumizing subassembly sets up on the lateral wall of cavity, and water spray subassembly sets up in the bottom of cavity, and gas injection port sets up on upper cover, and the discharge pipe sets up in the bottom of cavity, and nitrogen gas throttle valve is installed on the discharge pipe. The utility model integrates lateral wall water spray opening, nitrogen inlet and vacuumizing subassembly in the lateral wall of cavity, and the bottom of cavity integrates water spray subassembly and discharge pipe with nitrogen gas throttle valve, realizes two functions of ordinary wet and deep -hole vacuum wet in single cavity, improves the space utilization and the functional diversity of equipment, and the vacuumizing mouth in vacuumizing subassembly is through changing original lateral wall water spray opening, and the transformation cost is low.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing and electroplating equipment technology, and in particular to a horizontal electroplating cleaning chamber with integrated deep hole wetting function. Background Technology

[0002] In advanced packaging and microelectronics manufacturing, electroplating is a key process for forming metal interconnects and filling through-silicon vias (TSVs). Horizontal electroplating equipment is widely used due to its high degree of automation and production efficiency. Currently, conventional horizontal electroplating equipment is usually divided into cleaning and wetting chambers and TSV vacuum wetting chambers. The cleaning and wetting chamber is mainly used to complete the planar wetting before RDL electroplating and the cleaning after electroplating. Its core function is to treat the planar or shallow groove structure of the workpiece surface. However, if effective electroplating filling of deep hole structures such as TSVs is to be performed, a special vacuum wetting pretreatment must be performed before electroplating. The vacuum environment is used to remove residual air inside the deep hole, ensuring that the electroplating solution can completely wet the hole wall and bottom, laying the foundation for subsequent void-free filling.

[0003] Because the existing cleaning and wetting chambers lack a vacuum system, they can only rely on the surface tension of the liquid to wet the surface. For deep holes with high aspect ratios such as TSV, the internal gas cannot be discharged, resulting in fatal defects such as voids, discontinuous plating or uneven filling during subsequent electroplating, which seriously affects product yield and reliability.

[0004] Secondly, for miniaturized new equipment, if TSV filling process is required, an additional dedicated TSV vacuum wetting chamber must be added. This is not only strictly limited by the overall layout space of the equipment, making it impossible to achieve the goal of miniaturization, but also greatly increases the cost and cycle of hardware modification, thus failing to meet actual usage needs. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art by providing a horizontal electroplating cleaning chamber that integrates deep hole wetting function, which can also have deep hole vacuum wetting function to meet the wetting needs of high aspect ratio deep holes such as TSV.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is: a horizontal electroplating cleaning chamber integrating deep hole wetting function, comprising:

[0007] The cavity has several sidewall water spray nozzles and several nitrogen inlets on its sidewalls;

[0008] The top cover is foldable and movable up and down above the cavity, and the downward movement of the top cover can seal the cavity.

[0009] A clamping assembly, disposed on the lower surface of the upper cover, is configured to clamp the workpiece and follow the movement of the upper cover;

[0010] A vacuum pumping assembly is disposed on the side wall of the cavity for evacuating the cavity.

[0011] A water spray assembly is located at the bottom of the cavity to spray water upwards from the bottom of the cavity;

[0012] A gas injection port is provided on the upper cover to inject gas into the cavity after the upper cover seals the cavity;

[0013] An exhaust pipe is located at the bottom of the cavity, and a nitrogen throttle valve is installed on the exhaust pipe.

[0014] Furthermore, the clamping assembly includes two jaws driven by a driving clamping cylinder to clamp or release the workpiece.

[0015] Furthermore, a sealing ring is provided at the upper edge of the cavity.

[0016] Furthermore, the vacuum assembly includes a vacuum exhaust port disposed on the side wall of the cavity, and the vacuum exhaust port is connected to a vacuum pump outside the cavity.

[0017] Furthermore, the water spray assembly includes a drain pipe disposed at the bottom of the cavity, and the drain pipe has multiple drain outlets along its length.

[0018] Furthermore, after the top cover seals the cavity, the grippers located in the clamping assembly completely immerse the workpiece in the cavity.

[0019] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0020] This utility model features a horizontal electroplating cleaning chamber with integrated deep-hole wetting function. The chamber has a side wall spray nozzle, a nitrogen inlet, and a vacuum assembly integrated on its side wall. The bottom of the chamber has a water spray assembly and a discharge pipe with a nitrogen throttle valve integrated. This allows for both ordinary wetting and deep-hole vacuum wetting functions within a single chamber, greatly improving the space utilization and functional versatility of the equipment.

[0021] The vacuum assembly can effectively remove air from deep holes such as TSVs, and combined with a nitrogen throttle valve to achieve liquid level control, it achieves perfect wetting of the deep hole structure, fundamentally avoiding void defects in subsequent electroplating and filling, and improving product yield.

[0022] Furthermore, the vacuum port in the vacuum assembly of this cleaning chamber is obtained by modifying the original side wall water spray nozzle. This modification requires little work, is low in cost, and meets the actual usage requirements. Attached Figure Description

[0023] The technical solution of this utility model will be further described below with reference to the accompanying drawings:

[0024] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0025] Figure 2 for Figure 1 A magnified view of a portion of the image;

[0026] Figure 3 This is a schematic diagram of the water spray assembly in one embodiment of the present invention;

[0027] The components include: cavity 1, side wall water spray nozzle 10, nitrogen inlet 11, top cover 2, clamping assembly 3, vacuum assembly 4, water spray assembly 5, gas injection port 6, discharge pipe 7, gripper 30, sealing ring 8, vacuum exhaust port 40, vacuum pump 41, drain pipe 50, drain outlet 51, and nitrogen throttle valve 70. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0029] This invention provides a horizontal electroplating cleaning chamber that integrates deep hole wetting function, in order to solve the problem that the cleaning and wetting chamber in the existing horizontal electroplating cleaning chamber cannot meet the deep hole vacuum wetting function, and the process improvement cost is high.

[0030] For ease of understanding, the specific processes in the embodiments of this application are described below. Please refer to [link / reference]. Figure 1 and Figure 2 An embodiment of this application provides a horizontal electroplating cleaning chamber with integrated deep hole wetting function, comprising a chamber body 1, a top cover 2, a clamping assembly 3, a vacuum assembly 4, a water spray assembly 5, a gas injection port 6, and an exhaust pipe 7.

[0031] The cavity 1 is the core container for the process reaction. The sidewalls of the cavity 1 have several sidewall water spray nozzles 10 and several nitrogen inlets 11. The sidewall water spray nozzles 10 and nitrogen inlets 11 can be spaced apart or unevenly distributed. The sidewall water spray nozzles 10 are used to rapidly inject liquid into the cavity 1 to establish and raise the liquid level; the nitrogen inlets 11 are used to introduce nitrogen into the cavity 1 to form an inert atmosphere for protection or to participate in related process steps.

[0032] The upper cover 2 is foldable and movable up and down above the cavity. A robotic arm can be used to fold and lower the upper cover. When the upper cover 2 is lowered to the designated position, it fits tightly against the upper edge of the cavity 1, forming a sealed reaction space, which facilitates subsequent processing.

[0033] In addition, in order to increase the sealing between the top cover 2 and the cavity 1, a sealing ring 8 is provided at the upper edge of the cavity 1. In this way, when the top cover 2 and the cavity 1 are sealed from top to bottom, the sealing ring 8 can improve the sealing performance.

[0034] The clamping assembly 3 is disposed on the lower surface of the upper cover 2 and is configured to clamp the workpiece and move with the upper cover 2. Specifically, the clamping assembly 3 includes two grippers 30 driven by a driving clamping cylinder (not shown in the figure) to clamp or release the workpiece 9. When the grippers 30 carry the workpiece 9 and move with the upper cover to the reaction space formed by the upper cover and the cavity, the workpiece 9 can be located in the liquid in the cavity 1. In order to ensure that the workpiece held by the grippers 30 can be completely immersed in the liquid, the grippers 30 here are lengthened.

[0035] See Figure 2 The vacuum assembly 4 is disposed on the side wall of the cavity 1 to evacuate the interior of the cavity 1. Specifically, the vacuum assembly 4 includes multiple vacuum exhaust ports 40 disposed on the side wall 1 of the cavity, and the multiple vacuum exhaust ports 40 are connected to a vacuum pump 41 outside the cavity 1. In this way, when the upper cover 2 seals the cavity 1, the vacuum pump 41 extracts air from the interior of the cavity 1 and the deep holes of the workpiece through the vacuum exhaust ports 40, creating the necessary conditions for vacuum wetting. In actual use, the vacuum exhaust ports 40 are modified from the side wall water spray nozzles 10. This modification is low-cost and does not change the layout of the entire cleaning chamber, making it convenient and practical to operate.

[0036] See Figure 3 The water spray assembly 5 is located at the bottom of the cavity 1. It includes one or more drain pipes 50, which have multiple linearly distributed drain outlets 51 along their length. The main function of the water spray assembly 5 is to spray cleaning fluid upward from the drain outlets 51 when bottom spray cleaning is required, effectively cleaning the lower surface of the workpiece and immersing the workpiece 9 in the liquid.

[0037] The gas injection port 6 is located on the upper cover 2 and communicates with the cavity 1, used to introduce gas into the reaction space formed by the upper cover 2 and the cavity 1. In this cleaning chamber, the gas injection port 6 has two functions. First, after the vacuuming process, it injects a gas such as nitrogen into the cavity to quickly break the vacuum and restore the pressure in the reaction space to atmospheric pressure. Second, at the end of the process, it purges the workpiece surface with gas, thus drying the workpiece. This improvement method also has low cost.

[0038] The discharge pipe 7 is located at the bottom of the cavity 1, and a nitrogen throttle valve 70 is installed on it. The nitrogen throttle valve 70 is the key to controlling the liquid level in the reaction space. When it is necessary to drain the liquid, the nitrogen throttle valve 70 can be opened; when it is necessary to establish a liquid level in the reaction space, the nitrogen throttle valve 70 can be closed to prevent liquid discharge, so that the workpiece 9 held by the grippers can be completely immersed in the liquid in the reaction space.

[0039] Mode 1: Planar wetting mode, mainly used for pretreatment of planar structures such as RDL before electroplating.

[0040] First, flip the top cover 2 to a horizontal position, and clamp the workpiece 9 with the jaws 30 of the clamping assembly 3. Then, flip the top cover 2 back to a vertical position and move it down to the cavity 1 until the top cover 2 and the cavity 1 are sealed by the sealing ring 8 to form a reaction space.

[0041] Liquid is injected into the reaction space through the side wall spray nozzle 10. At the same time, the water spray assembly 5 at the bottom of the cavity 1 sprays the wetting liquid upward to wet the lower surface of the workpiece.

[0042] After wetting the workpiece 9, open the nitrogen throttle valve 70 at the bottom to discharge the waste liquid.

[0043] The top cover 2 is lifted and flipped over to complete the planar wetting process of the workpiece 9.

[0044] Mode 2: Deep hole vacuum wetting mode, mainly used for pretreatment of deep hole structures such as TSV before electroplating.

[0045] First, the upper cover 2 is flipped to a horizontal position, and the jaws of the clamping component 3 clamp the workpiece. Then, the upper cover 2 is flipped back to a vertical position and moved down to a certain position in the cavity. After the upper cover 2 and the cavity 1 are sealed by the sealing ring 8, a reaction space is formed.

[0046] Liquid is injected into the reaction space through the side wall spray nozzle 10. The nitrogen throttle valve 70 on the discharge pipe 7 is closed, and the liquid level in the reaction space rises. At the same time, the water spray assembly 5 at the bottom of the cavity sprays the wetting liquid upward, raising the liquid level in the cavity until the workpiece 9 is completely submerged.

[0047] Start the vacuum pump 41 and evacuate the reaction space through the vacuum exhaust port 40 to remove the gas from the deep hole of the workpiece 9.

[0048] Once the required vacuum level and time are reached, the vacuum pump 41 stops working, and nitrogen is injected through the gas injection port 6 of the upper cover 2 to quickly break the vacuum in the reaction space. After the pressure in the reaction space has basically recovered, the nitrogen throttle valve 70 is opened to drain the water.

[0049] The top cover 2 is lifted and flipped over, and the gripper 30 releases the workpiece 9, completing the entire deep hole vacuum wetting process.

[0050] After passing through the above two modes, the workpiece still needs to be dried. At this time, nitrogen can be injected into the reaction space through the nitrogen inlet 11 on the side and the gas injection port 6 on the top of the cover 2 to quickly dry the workpiece 9.

[0051] In summary, the horizontal electroplating cleaning chamber of this invention, which integrates deep hole wetting function, highly integrates planar wetting and deep hole vacuum wetting functions into a single chamber. Users can flexibly switch between different process modes according to production needs, greatly improving the functionality and value of the equipment. It is particularly suitable for production scenarios with limited space and requiring process flexibility.

[0052] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A horizontal electroplating cleaning chamber integrating deep hole wetting function, characterized in that, include: The cavity has several sidewall water spray nozzles and several nitrogen inlets on its sidewalls; The top cover is foldable and movable up and down above the cavity, and the downward movement of the top cover can seal the cavity. A clamping assembly, disposed on the lower surface of the upper cover, is configured to clamp the workpiece and follow the movement of the upper cover; A vacuum pumping assembly is disposed on the side wall of the cavity for evacuating the cavity. A water spray assembly is located at the bottom of the cavity to spray water upwards from the bottom of the cavity; A gas injection port is provided on the upper cover to inject gas into the cavity after the upper cover seals the cavity; An exhaust pipe is located at the bottom of the cavity, and a nitrogen throttle valve is installed on the exhaust pipe.

2. The horizontal electroplating cleaning chamber with integrated deep hole wetting function as described in claim 1, characterized in that: The clamping assembly includes two jaws that clamp or release the workpiece, driven by a drive clamping cylinder.

3. The horizontal electroplating cleaning chamber with integrated deep hole wetting function as described in claim 1, characterized in that: A sealing ring is provided at the upper edge of the cavity.

4. The horizontal electroplating cleaning chamber with integrated deep hole wetting function as described in claim 1, characterized in that: The vacuum assembly includes a vacuum exhaust port disposed on the side wall of the cavity, and the vacuum exhaust port is connected to a vacuum pump outside the cavity.

5. The horizontal electroplating cleaning chamber with integrated deep hole wetting function as described in claim 1, characterized in that: The water spray assembly includes a drain pipe disposed at the bottom of the cavity, and the drain pipe has multiple drain outlets along its length.

6. The horizontal electroplating cleaning chamber with integrated deep hole wetting function as described in claim 2, characterized in that: After the top cover seals the cavity, the jaws in the clamping assembly completely immerse the workpiece in the cavity.

Images