A reflective collimated LED luminaire and lighting device

Abstract

The utility model discloses a kind of reflective parallel light LED lamps and lighting equipment, including PCB board, light-emitting chip and encapsulation lens, printed circuit on light-transmitting substrate is electrically connected with light-emitting chip, encapsulation lens main body is wrapped chip and is plated with arc reflecting film, chip light is converted into parallel light beam by optical reflection and penetrates substrate. The utility model is formed parallel light path by the light emitted by light-emitting chip directional reflection after reflecting film, light keeps parallel when penetrating substrate, avoid the light scattering loss of traditional direct reflection structure, chip light is efficiently converted into parallel light beam and penetrates substrate, both eliminate the traditional lens spacing limit, and overall thickness is compressed significantly by light path folding, lens main body full wrapping type encapsulation simplifies assembly process, by the synergistic effect of reflecting film and light-transmitting substrate, while improving structural reliability, optical performance can be met the demand of miniaturization electronic equipment.

Description

Technical Field

[0001] This utility model relates to the field of lighting device technology, specifically to a reflective parallel light LED lamp and lighting equipment. Background Technology

[0002] Current parallel light emission products mainly consist of a light-emitting chip and a front lens. Due to inherent structural limitations, they are too large in size. The chip and lens must maintain a certain distance. The base or PCB on which the chip is located and the lens itself have incompressible physical thickness. Traditional manufacturing processes require complex lens mounting structures, resulting in a large overall product thickness and high production costs. This makes it difficult to meet the miniaturization and integration requirements of modern electronic devices. In particular, with the miniaturization of semiconductor technology, the existing structure has become a key bottleneck restricting the application of parallel light LEDs in compact application scenarios. This utility model proposes a new solution to the above problems. Utility Model Content

[0003] To overcome at least one of the aforementioned drawbacks, this utility model provides a reflective parallel light LED lamp and lighting device. The objective of this utility model can be achieved by adopting the following technical solution: A first aspect of this application provides a reflective parallel light LED luminaire, comprising: A PCB board, the PCB board including a light-transmitting substrate, a first printed circuit and a second printed circuit, the first printed circuit and the second printed circuit being disposed on the light-transmitting substrate; A light-emitting chip is disposed on the light-transmitting substrate and is electrically connected to the first printed circuit and the second printed circuit, respectively. An encapsulated lens is disposed on the PCB board. The encapsulated lens includes a lens body and a reflective film. The lens body is wrapped around the light-emitting chip, and the reflective film is disposed on the outer surface of the lens body to form an arc-shaped optical surface for reflecting the light emitted by the light-emitting chip to form a parallel light path and pass through the light-transmitting substrate.

[0004] In one possible implementation, the reflective film is either an aspherical structure or a parabolic structure.

[0005] In one possible implementation, the reflective film includes a reflective metal coating.

[0006] In one possible implementation, the light-transmitting substrate comprises plastic or glass.

[0007] In one possible implementation, the light-emitting chip is capable of emitting visible light or infrared light, and the light-emitting chip is a surface light source chip or a volume light source chip.

[0008] In one possible implementation, the first end of the light-emitting chip is electrically connected to the first printed circuit via a conductive material, and the second end of the light-emitting chip is electrically connected to the second printed circuit via bonding wires.

[0009] In one possible implementation, there is no gap between the encapsulation lens and the PCB board. The light-emitting chip, the conductive material, and the bonding wire are wrapped by an encapsulation colloid. The outer surface of the encapsulation colloid forms a convex arc surface and is coated with the reflective film to form the encapsulation lens. The light emitted by the light-emitting chip passes through the lens body and is reflected by the reflective film to form a parallel light path.

[0010] In one possible implementation, the system further includes a main circuit board with a slot, the PCB board covering the slot, and the encapsulation lens embedded in the slot.

[0011] A second aspect of this application provides a lighting device, including any of the reflective parallel light LED luminaires of the first aspect.

[0012] The beneficial technical effects of this utility model are as follows: According to the present disclosure, the reflective parallel light LED lamp and lighting device includes a PCB board, a light-emitting chip, and a packaged lens. The light emitted by the light-emitting chip is directionally reflected by the reflective film to form a parallel light path. The light maintains parallelism when passing through the substrate, avoiding the light scattering loss of the traditional direct-light structure. The chip light is efficiently converted into a parallel beam that passes through the substrate. This not only eliminates the limitations of the traditional lens spacing, but also significantly compresses the overall thickness through light path folding. The fully encapsulated lens body simplifies the assembly process. Through the synergistic effect of the reflective film and the light-transmitting substrate, the structural reliability is improved while maintaining optical performance, which can meet the needs of miniaturized electronic devices. Attached Figure Description

[0013] The following are given by way of example and without limitation in the accompanying drawings: Figure 1 This is a perspective view of the overall structure of an embodiment of the present invention from one angle; Figure 2 This shows a perspective view of the overall structure of an embodiment of the present invention from another angle; Figure 3 This shows a front view of the overall structure of an embodiment of the present invention from another angle; Figure 4 This shows an overall structural perspective view of another embodiment of the present invention.

[0014] In the diagram: 1. PCB board; 11. Transparent substrate; 12. First printed circuit; 13. Second printed circuit; 2. Light-emitting chip; 3. Bonding wire; 4. Encapsulated lens; 41. Lens body; 42. Reflective film; 5. Main circuit board. Detailed Implementation

[0015] In the following detailed disclosure, these embodiments are fully described with reference to the accompanying drawings. In order to enable those skilled in the art to understand and clarify the technical solution of this utility model more clearly, the embodiments described below are not limited thereto. The present utility model will be further described in detail below with reference to the embodiments and the accompanying drawings.

[0016] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0017] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0018] The first aspect of this application, as Figures 1-4 As shown, a reflective parallel light LED lamp is provided, including a PCB board 1, a light-emitting chip 2, and an encapsulated lens 4. The PCB board 1 includes a light-transmitting substrate 11, a first printed circuit 12, and a second printed circuit 13. The first printed circuit 12 and the second printed circuit 13 are disposed on the light-transmitting substrate 11. The light-emitting chip 2 is disposed on the light-transmitting substrate 11 and is electrically connected to the first printed circuit 12 and the second printed circuit 13 respectively. The encapsulated lens 4 is disposed on the PCB board 1 and includes a lens body 41 and a reflective film 42. The lens body 41 is wrapped around the light-emitting chip 2. The reflective film 42 is disposed on the outer surface of the lens body 41 to form an arc-shaped optical surface, which is used to reflect the light emitted by the light-emitting chip 2 to form a parallel light path and pass through the light-transmitting substrate 11.

[0019] The reflective parallel light LED lamp provided in this embodiment forms a parallel light path after the light emitted by the light-emitting chip 2 is directionally reflected by the reflective film 42. The light maintains parallelism when passing through the substrate, avoiding the light scattering loss of the traditional direct-light structure. The chip light is efficiently converted into a parallel beam that passes through the substrate after reflection. This not only eliminates the limitations of traditional lens spacing, but also significantly compresses the overall thickness through light path folding. The fully encapsulated lens body 41 simplifies the assembly process, improves production efficiency, and reduces production costs. Through the synergistic effect of the reflective film 42 and the light-transmitting substrate 11, the structural reliability is improved while maintaining optical performance, which can meet the needs of miniaturized electronic devices.

[0020] In one possible implementation, such as Figures 1-4 As shown, the reflective film 42 is one of an aspherical structure or a parabolic structure.

[0021] Among them, the aspherical / parabolic reflective film 42 structure design, the special curved surface structure of the reflective film 42 can precisely control the light reflection angle, so that the light emitted by the light-emitting chip 2 forms a highly parallel beam after reflection, effectively reducing light scattering loss, breaking through the optical limitations of the traditional planar reflective film 42, and significantly improving the light energy utilization rate through the focusing effect of curved surface reflection, ensuring the uniformity and directionality of light output.

[0022] Understandably, the synergistic effect of the aspherical / parabolic reflective film 42 and the lens body 41 further optimizes the optical path structure, reducing the overall system thickness while maintaining parallel light characteristics, thus providing a more compact and efficient structure for miniaturized electronic devices.

[0023] In one possible implementation, the reflective film 42 includes a reflective metal coating, which achieves efficient reflection of incident light through a high-reflectivity metal material (such as aluminum, silver, etc.). The synergistic effect of the metal coating and the curved optical surface makes the light emitted by the light-emitting chip 2 form a highly parallel beam after reflection, effectively reducing light scattering loss. While maintaining optical performance, the reflectivity and durability are further optimized through optional combinations of metal layers and dielectric layers (such as adding a protective layer or a dielectric layer).

[0024] In one possible implementation, the light-transmitting substrate 11 includes plastic or glass. Through the synergistic optical design of material properties and optical structure, while maintaining light transmittance, it forms an efficient optical path system with the reflective film 42, which not only meets the mechanical strength requirements of different application scenarios, but also provides a reliable optical medium foundation for the parallel light effect.

[0025] Among them, the plastic substrate has the characteristics of being lightweight, impact-resistant and easy to process, which significantly improves the product's vibration resistance and assembly efficiency.

[0026] Among them, the glass substrate has the advantages of high light transmittance, high temperature resistance and chemical stability, ensuring consistent optical performance over long-term use.

[0027] In one possible implementation, the light-emitting chip 2 is capable of emitting visible light or infrared light, and the light-emitting chip 2 is a surface light source chip or a volume light source chip.

[0028] Among them, the light-emitting chip 2 adopts a surface light source / volume light source chip design with visible light or infrared light. The uniform light emission characteristics of the surface light source chip ensure the consistency of the brightness of the light-emitting surface, while the three-dimensional light emission structure of the volume light source chip enhances the control of light divergence. Both types of chips can efficiently convert light of different wavelengths into parallel beams through optical control of the reflective film 42, which not only meets the needs of visible light illumination, but also adapts to special scenarios such as infrared sensing, thus improving flexibility and adaptability.

[0029] In one possible implementation, such as Figures 1-3 As shown, the first end of the light-emitting chip 2 is electrically connected to the first printed circuit 12 through a conductive material, and the second end of the light-emitting chip 2 is electrically connected to the second printed circuit 13 through a bonding wire 3.

[0030] The dual-terminal electrical connection structure between the light-emitting chip 2 and the printed circuit ensures the reliability of the electrical connection. Conductive material directly connects the first end of the chip to the first printed circuit 12, forming a low-impedance surface-contact conductive path. The bonding wire 3 connects the second end of the chip to the second printed circuit 13 via a flexible connection, effectively absorbing thermal stress deformation. This ensures stable current transmission and improves vibration resistance through mechanical flexibility, avoiding stress concentration problems that may exist with a single connection method.

[0031] In one possible implementation, such as Figures 1-4 As shown, there is no gap between the encapsulated lens 4 and the PCB board 1. The light-emitting chip 2, conductive material and bonding wire are wrapped by the encapsulating colloid. The outer surface of the encapsulating colloid forms a convex arc surface and is coated with a reflective film 42 to form the encapsulated lens 4. The light emitted by the light-emitting chip 2 passes through the lens body 41 and is reflected by the reflective film 42 to form a parallel light path.

[0032] Among them, the encapsulating colloid completely wraps the light-emitting chip 2, conductive material and bonding wire 3 to form a gapless sealed structure, eliminating the influence of traditional assembly tolerances on the optical path. The full-wrap packaging effectively isolates environmental pollutants, improves the reliability of components, and the integrated packaging reduces the installation and positioning structure, improves production efficiency and greatly reduces the cost of products.

[0033] In this system, the colloidal convex surface and the reflective film 42 work synergistically. The colloidal convex surface acts as an optical interface, forming a composite optical system with the reflective film 42. This optimizes the consistency of light reflection angles and converts the reflected light from the chip into a parallel beam.

[0034] In one possible implementation, such as Figure 4 As shown, the reflective parallel light LED lamp also includes a main circuit board 5, which has a slot. The PCB board 1 is placed on the slot, and the encapsulated lens 4 is embedded in the slot.

[0035] When applied, the encapsulated lens 4 is reverse-coupled with the main circuit board 5. The slotted and embedded structure of the encapsulated lens 4 further compresses the vertical space, reduces the overall thickness, reduces stray light in the optical path, and improves the light energy utilization rate. The embedded structure enhances the overall mechanical strength and reduces the risk of damage during transportation or installation. The standardized slotted design simplifies the positioning process of the encapsulated lens 4 and reduces the assembly accuracy requirements.

[0036] A second aspect of this application provides a lighting device, including any of the reflective parallel light LED luminaires of the first aspect.

[0037] The lighting device provided in this embodiment features an embedded encapsulated lens 4 design that highly integrates the optical system with the circuit board, significantly reducing the overall thickness of the device. The reflective structure, combined with a precise optical path design, achieves uniform parallel light output, reduces stray light interference, and improves lighting quality. The non-exposed encapsulated lens 4 design reduces the risk of mechanical damage, while the stress-dispersing structure enhances vibration resistance and extends the lifespan of the lamp. The light path of the product is a turning point in the visible light path. When the product is used, it works in reverse with the main circuit board 5, achieving miniaturization of the product and its applications. It is especially suitable for installation scenarios with limited space and can meet the lighting needs of ultra-thin panel lights, recessed downlights, etc., with higher adaptability.

[0038] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0039] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

[0040] In view of the detailed description above, these and other changes can be made to these embodiments. This written description includes embodiments of the best mode disclosed in this utility model. The patent scope of this utility model is defined by the claims, which are not limited by this disclosure. The protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope disclosed in this utility model, based on the technical solution and concept of this utility model, are within the protection scope of this utility model.

Claims

1. A reflective parallel light LED lamp, characterized in that, include: A PCB board, the PCB board including a light-transmitting substrate, a first printed circuit and a second printed circuit, the first printed circuit and the second printed circuit being disposed on the light-transmitting substrate; A light-emitting chip is disposed on the light-transmitting substrate and is electrically connected to the first printed circuit and the second printed circuit, respectively. An encapsulated lens is disposed on the PCB board. The encapsulated lens includes a lens body and a reflective film. The lens body is wrapped around the light-emitting chip, and the reflective film is disposed on the outer surface of the lens body to form an arc-shaped optical surface for reflecting the light emitted by the light-emitting chip to form a parallel light path and pass through the light-transmitting substrate.

2. The reflective parallel light LED lamp according to claim 1, characterized in that, The reflective film is either an aspherical structure or a parabolic structure.

3. The reflective parallel light LED lamp according to claim 2, characterized in that, The reflective film includes a reflective metal coating.

4. The reflective parallel light LED lamp according to claim 1, characterized in that, The light-transmitting substrate may be made of plastic or glass.

5. The reflective parallel light LED lamp according to claim 1, characterized in that, The light-emitting chip can emit visible light or infrared light, and the light-emitting chip is a surface light source chip or a volume light source chip.

6. The reflective parallel light LED lamp according to claim 1, characterized in that, The first end of the light-emitting chip is electrically connected to the first printed circuit through a conductive material, and the second end of the light-emitting chip is electrically connected to the second printed circuit through bonding wires.

7. The reflective parallel light LED lamp according to claim 6, characterized in that, There is no gap between the encapsulation lens and the PCB board. The light-emitting chip, the conductive material and the bonding wire are wrapped by the encapsulation colloid. The outer surface of the encapsulation colloid forms a convex arc surface and is coated with the reflective film to form the encapsulation lens. The light emitted by the light-emitting chip passes through the lens body and is reflected by the reflective film to form a parallel light path.

8. The reflective parallel light LED luminaire according to any one of claims 1-7, characterized in that, It also includes a main circuit board, which has a slot, and the PCB board is placed on the slot, with the encapsulation lens embedded in the slot.

9. A lighting device, characterized in that, Including the reflective parallel light LED luminaire as described in any one of claims 1-8.

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