A sealing structure of a wafer semiconductor material diffusion furnace
Patent Information
- Application Number
- CN202522319161.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-31
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-10-31
AI Technical Summary
炉体的密封性能直接影响工艺环境的稳定性，关系到晶圆的掺杂均匀性、表面质量等核心指标，对最终半导体产品的性能和良率起着决定性作用，扩散炉的炉盖密封是保证炉内工艺环境稳定的关键环节，传统扩散炉通常采用单一的驱动机构（如气缸、电动推杆）带动炉盖与炉口贴合实现密封，依赖驱动机构的持续作用力维持密封状态，但是密封可靠性依赖单一驱动机构，当驱动机构出现故障断电、压力不足等情况时，炉盖易发生位移，导致密封失效，破坏炉内工艺氛围，如果额外安装二次锁定机构，则需要额外的动力设备控制，这样会增加能源消耗
本实用新型中，通过设置套筒、翻转块和限位斜块相互配合的方式，当移动座带动炉盖移动靠近炉口一定的距离后，限位斜块便会被炉盖挤压进翻转块的凹槽中，直至炉盖完全嵌设在套环中，当炉盖与限位斜块错位后，限位斜块便会在弹簧的作用下伸出凹槽，从而移动到炉盖的前方，这样可以对炉盖进行二次限位，避免因电动推杆故障断电而使得炉盖发生移动，从而保证了炉盖关闭后的密封效果，并且在炉盖打开的时候，炉盖在跟随移动座移动的时候会向外推动限位斜块和翻转块，当炉盖与限位斜块错位后，翻转块便会在扭簧的作用下翻转回原位，使得限位斜块为下次炉盖的关闭做准备，上述方式可以对关闭的炉盖进行二次限位，从而保证炉盖关闭后的密封性，并且翻转块和限位斜块的启闭不需要额外的动力设备控制。
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Figure CN224787693U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of diffusion furnace sealing technology, and in particular to a sealing structure for a wafer semiconductor material diffusion furnace. Background Technology
[0002] In the production and processing of wafer semiconductor materials, diffusion furnaces are core equipment for achieving key processes such as impurity diffusion, oxidation, and annealing. The sealing performance of the furnace directly affects the stability of the process environment, relates to core indicators such as wafer doping uniformity and surface quality, and plays a decisive role in the performance and yield of the final semiconductor product. The sealing of the furnace lid is a critical link in ensuring the stability of the process environment inside the furnace. Traditional diffusion furnaces typically use a single drive mechanism (such as a cylinder or electric push rod) to drive the furnace lid to fit against the furnace opening to achieve a seal. The seal is maintained by the continuous force of the drive mechanism. However, the reliability of the seal depends on a single drive mechanism. When the drive mechanism malfunctions, experiences power failure, or insufficient pressure, the furnace lid is prone to displacement, leading to seal failure and disrupting the process atmosphere inside the furnace. If a secondary locking mechanism is installed, additional power equipment is required for control, which increases energy consumption. Utility Model Content
[0003] The main objective of this invention is to provide a sealing structure for a wafer semiconductor material diffusion furnace, which can effectively solve the problems in the background art.
[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: A sealing structure for a wafer semiconductor material diffusion furnace includes a diffusion furnace body. A material taking chamber is formed inside one side of the diffusion furnace body. An opening is formed on one inner surface of the material taking chamber. A lead screw is movably installed inside the material taking chamber and below the opening. A track rod is fixedly installed inside the material taking chamber and below the lead screw. A movable seat is sleeved on the lead screw and track rod. An electric push rod is fixedly installed on the movable seat. A furnace cover is fixedly installed at the telescopic end of the electric push rod. A bearing plate is fixedly installed on the rear surface of the furnace cover and below it. Sleeves are fixedly installed on one inner surface of the material taking chamber, above and below both sides of the opening. A flipping block is movably installed between the sleeves. A limiting wedge is movably installed on one inner surface of the flipping block. A collar is fixedly installed on one inner surface of the material taking chamber and around the opening.
[0005] More preferably, a rotating rod is fixedly installed on the upper and lower surfaces of the flipping block and on the rear side. A stop block is fixedly installed on one end surface of the rotating rod. The rotating rod is embedded in the sleeve. A torsion spring is sleeved on the surface of the rotating rod inside the sleeve. One end of the torsion spring is fixed to the sleeve, and the other end of the torsion spring is fixed to the stop block. A groove is formed on one side surface of the flipping block, and a pressing groove is formed inside the flipping block and behind the groove.
[0006] In a further preferred embodiment, a rod is fixedly installed on the rear surface of the limiting inclined block, the rod passes through the extrusion groove, a retaining ring is fixedly sleeved on the surface of the rod located inside the extrusion groove, and a spring is sleeved on the surface of the rod located inside the extrusion groove and behind the retaining ring.
[0007] More preferably, the rear end of the limiting inclined block is embedded in the groove, and the limiting inclined block is in contact with the front surface of the collar.
[0008] Compared with the prior art, this utility model proposes a sealing structure for a wafer semiconductor material diffusion furnace, which has the following beneficial effects: In this invention, by setting up a sleeve, a flipping block, and a limiting inclined block in cooperation, when the moving seat moves the furnace cover a certain distance closer to the furnace opening, the limiting inclined block is pressed into the groove of the flipping block by the furnace cover until the furnace cover is completely embedded in the collar. When the furnace cover and the limiting inclined block are misaligned, the limiting inclined block will extend out of the groove under the action of the spring, thus moving to the front of the furnace cover. This can provide secondary limiting for the furnace cover, preventing the furnace cover from moving due to power failure of the electric push rod, thereby ensuring the sealing effect after the furnace cover is closed. When the furnace cover is opened, the furnace cover will push the limiting inclined block and the flipping block outward as it moves with the moving seat. When the furnace cover and the limiting inclined block are misaligned, the flipping block will flip back to its original position under the action of the torsion spring, so that the limiting inclined block is ready for the next closing of the furnace cover. The above method can provide secondary limiting for the closed furnace cover, thereby ensuring the sealing performance after the furnace cover is closed. Moreover, the opening and closing of the flipping block and the limiting inclined block do not require additional power equipment control. Attached Figure Description
[0009] Figure 1 This is an overall structural diagram of the sealing structure of a wafer semiconductor material diffusion furnace according to the present invention; Figure 2 This utility model relates to a sealing structure for a diffusion furnace for wafer semiconductor materials. Figure 1 Enlarged view of point A in the middle; Figure 3 This is a partial cross-sectional view of the flipping block of the sealing structure of a wafer semiconductor material diffusion furnace according to the present invention; Figure 4 This is a diagram of the limiting inclined block structure of the sealing structure of a diffusion furnace for wafer semiconductor materials according to this utility model.
[0010] In the diagram: 1. Diffusion furnace body; 2. Feeding chamber; 3. Furnace opening; 4. Lead screw; 5. Track rod; 6. Moving seat; 7. Electric push rod; 8. Furnace cover; 9. Bearing plate; 10. Sleeve; 11. Tilting block; 1101. Rotating rod; 1102. Stop block; 1103. Torsion spring; 1104. Groove; 1105. Extrusion groove; 12. Limiting inclined block; 1201. Insert rod; 1202. Retaining ring; 1203. Spring; 13. Collar. Detailed Implementation
[0011] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.
[0012] It should be noted that all directional indicators such as up, down, left, right, front, back, etc. in the embodiments of this utility model are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicator will also change accordingly.
[0013] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can refer to a fixed connection, a detachable connection, or an integral part; it can also refer to a mechanical connection, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0014] like Figure 1-4 As shown, a sealed structure for a wafer semiconductor material diffusion furnace includes a diffusion furnace body 1. A material taking chamber 2 is provided inside one side of the diffusion furnace body 1. A furnace opening 3 is provided on one side surface of the material taking chamber 2. A lead screw 4 is movably installed inside the material taking chamber 2 and below the furnace opening 3. A track rod 5 is fixedly installed inside the material taking chamber 2 and below the lead screw 4. A movable seat 6 is sleeved on the lead screw 4 and the track rod 5. An electric push rod 7 is fixedly installed on the movable seat 6. A furnace cover 8 is fixedly installed at the telescopic end of the electric push rod 7. A bearing plate 9 is fixedly installed on the rear surface of the furnace cover 8 and below it. Sleeves 10 are fixedly installed on one side surface of the material taking chamber 2 and above and below both sides of the furnace opening 3. A flipping block 11 is movably installed between the sleeves 10. A limiting inclined block 12 is movably installed on one side surface of the flipping block 11. A collar 13 is fixedly installed on one side surface of the material taking chamber 2 and around the furnace opening 3.
[0015] In a preferred embodiment: a rotating rod 1101 is fixedly installed on the upper and lower surfaces of the flipping block 11 and on the rear side. A stop block 1102 is fixedly installed on one end surface of the rotating rod 1101. The rotating rod 1101 is embedded in the sleeve 10. A torsion spring 1103 is sleeved on the surface of the rotating rod 1101 inside the sleeve 10. One end of the torsion spring 1103 is fixed to the sleeve 10, and the other end of the torsion spring 1103 is fixed to the stop block 1102. A groove 1104 is formed on one side surface of the flipping block 11, and a pressing groove 1105 is formed inside the flipping block 11 and behind the groove 1104.
[0016] In the above structure, the torsion spring 1103 can keep the flipping block 11 in a horizontal state, and the torsion spring 1103 requires a certain amount of external force to twist, thus preventing the flipping block 11 from easily flipping and causing the limiting inclined block 12 to move, thereby affecting the limiting effect of the limiting inclined block 12 on the furnace cover 8.
[0017] In a preferred embodiment: a rod 1201 is fixedly installed on the rear surface of the limiting inclined block 12. The rod 1201 passes through the extrusion groove 1105. A retaining ring 1202 is fixedly sleeved on the surface of the rod 1201 inside the extrusion groove 1105. A spring 1203 is sleeved on the surface of the rod 1201 inside the extrusion groove 1105 and behind the retaining ring 1202.
[0018] In the above structure, the spring 1203 is in an extended state in its lower natural state, and when the furnace cover 8 is embedded in the collar 13, the limiting inclined block 12 can contact the furnace cover 8. In this way, the limiting inclined block 12 can limit the furnace cover 8, so as to avoid the furnace cover 8 from moving accidentally due to the failure of the electric push rod 7 to cut off the power and thus affecting the sealing effect.
[0019] In a preferred embodiment, the rear end of the limiting inclined block 12 is embedded in the groove 1104, and the limiting inclined block 12 contacts the front surface of the collar 13.
[0020] In use, when the movable seat 6 moves the furnace cover 8 a certain distance closer to the furnace opening 3, the limiting inclined block 12 is pressed into the groove 1104 of the flipping block 11 by the furnace cover 8. During this process, the spring 1203 is compressed until the furnace cover 8 is completely embedded in the collar 13. At this time, the electric push rod 7 is activated, which pushes the furnace cover 8, keeping it embedded in the collar 13. When the furnace cover 8 is misaligned with the limiting inclined block 12, the limiting inclined block 12 will extend out of the groove 1104 under the action of the spring 1203, thus... Move it to the front of the furnace cover 8. This will limit the furnace cover 8 a second time and prevent it from moving due to power failure of the electric push rod 7. This will ensure the sealing effect of the furnace cover 8 after it is closed. When the furnace cover 8 is opened, it will push the limiting inclined block 12 and the flipping block 11 outward as it moves with the moving seat 6. During this process, the torsion spring 1103 will be twisted. When the furnace cover 8 is misaligned with the limiting inclined block 12, the flipping block 11 will be flipped back to its original position under the action of the torsion spring 1103, so that the limiting inclined block 12 is ready for the next closing of the furnace cover 8.
[0021] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A sealing structure for a wafer semiconductor material diffusion furnace, characterized in that: The system includes a diffusion furnace body (1), with a material intake chamber (2) inside one side of the diffusion furnace body (1). A furnace opening (3) is located on one side surface of the material intake chamber (2). A lead screw (4) is movably installed inside the material intake chamber (2) and below the furnace opening (3). A track rod (5) is fixedly installed inside the material intake chamber (2) and below the lead screw (4). A movable seat (6) is fitted onto the lead screw (4) and the track rod (5). An electric push rod (7) is fixedly installed on the movable seat (6). A furnace cover (8) is fixedly installed on the telescopic end of (7). A bearing plate (9) is fixedly installed on the rear surface of the furnace cover (8) and below it. A sleeve (10) is fixedly installed on one side of the inner surface of the material taking chamber (2) and above and below both sides of the furnace opening (3). A flipping block (11) is movably installed between the sleeves (10). A limiting inclined block (12) is movably installed on one side surface of the flipping block (11). A collar (13) is fixedly installed on one side surface of the inner surface of the material taking chamber (2) and outside the furnace opening (3).
2. The sealing structure of a wafer semiconductor material diffusion furnace according to claim 1, characterized in that: A rotating rod (1101) is fixedly installed on the upper and lower surfaces of the flipping block (11) and on the rear side. A stop block (1102) is fixedly installed on one end surface of the rotating rod (1101). The rotating rod (1101) is embedded in the sleeve (10). A torsion spring (1103) is sleeved on the surface of the rotating rod (1101) inside the sleeve (10). One end of the torsion spring (1103) is fixed to the sleeve (10), and the other end of the torsion spring (1103) is fixed to the stop block (1102). A groove (1104) is opened on one side surface of the flipping block (11), and a pressing groove (1105) is opened inside the flipping block (11) and behind the groove (1104).
3. The sealing structure of a wafer semiconductor material diffusion furnace according to claim 2, characterized in that: A rod (1201) is fixedly installed on the rear surface of the limiting inclined block (12). The rod (1201) passes through the extrusion groove (1105). A retaining ring (1202) is fixedly sleeved on the surface of the rod (1201) inside the extrusion groove (1105). A spring (1203) is sleeved on the surface of the rod (1201) inside the extrusion groove (1105) and behind the retaining ring (1202).
4. The sealing structure of a wafer semiconductor material diffusion furnace according to claim 3, characterized in that: The rear end of the limiting inclined block (12) is embedded in the groove (1104), and the limiting inclined block (12) is in contact with the front surface of the collar (13).