A heat sink

Abstract

The utility model provides a radiator. Including first board body, flow channel board, second board body and fin, the through hole structure of upper surface and lower surface of flow channel board is equipped with in flow channel board, and the lower surface of flow channel board is connected with first board body laminating, second board body and the upper surface of flow channel board are connected with laminating, second board body and the upper surface of flow channel board are connected with laminating, and second board body, first board body and through hole structure form liquid cooling flow channel closed, the fin is thin and continuous sheet structure, and the fin is equipped with the upper surface of second board body. The utility model discloses one aspect through with first board body, flow channel board and second board body laminating form cold plate structure, and the processing mode is simpler, and more easily realizes, and the heat end heat transfer effect is better, on the other hand through setting up fin structure on second board body, can according to environmental temperature alternatively select liquid cooling or air cooling, and the cooling form is more plural, reduces the energy consumption of whole vehicle.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat sink. Background Technology

[0002] Currently, the main technologies for in-vehicle refrigerators include thermoelectric semiconductor refrigeration and compression refrigeration. Semiconductor refrigeration utilizes the Peltier effect of thermoelectric semiconductors for cooling, eliminating the need for refrigerants and mechanical moving parts to transfer heat. Once powered on, the semiconductor refrigeration element transfers heat from the cold end to the hot end. In existing technologies, the hot end heat sink of the semiconductor refrigeration element uses direct cooling, meaning that refrigerant is directly passed through the flow channel to cool the hot end. This single cooling method leads to resource waste and increased vehicle energy consumption. Therefore, it is necessary to provide a heat sink that overcomes the aforementioned shortcomings. Utility Model Content

[0003] The purpose of this invention is to provide a radiator.

[0004] According to the present invention, a heat sink is provided, comprising: a first plate, the first plate being connected to a semiconductor cooling element to receive heat transferred by the semiconductor cooling element; a flow channel plate, the flow channel plate having a through-hole structure penetrating the upper and lower surfaces of the flow channel plate, the lower surface of the flow channel plate being stacked and connected to the first plate; a second plate, the second plate being stacked and connected to the upper surface of the flow channel plate, the second plate, the first plate, and the through-hole structure being sealed to form a liquid cooling flow channel; and fins, the fins being thin and continuous sheet-like structures, the fins being disposed on the upper surface of the second plate.

[0005] Preferably, the fin is one or a combination of rectangular fin, straight fin, louvered fin, and corrugated fin.

[0006] Preferably, the fin thickness is 0.2-0.5 mm and the fin pitch is 3-5 mm.

[0007] Preferably, it further includes: a third plate body, the third plate body being disposed on the upper surface of the second plate body, the two ends of the third plate body being stacked with the upper surface of the second plate body, the third plate body being bent upward in the middle region to form an accommodating space, and the fins being covered within the accommodating space.

[0008] Preferably, a first mounting portion is provided on the side of the first plate, and a first notch is provided on the side of the flow channel plate, the second plate and the third plate. The first mounting portion is fitted into the first notch and extends to the upper surface of the third plate to form a first bend.

[0009] Preferably, a second mounting portion is provided at the corner of the first plate, a second notch is provided on the side of the flow channel plate, the second plate and the third plate, and a third notch is provided on the other adjacent side of the flow channel plate and the second plate. The second mounting portion is fitted into the second notch and extends to the upper surface of the third plate to form a second bend. The second mounting portion bends and extends horizontally into the third notch to form a third bend.

[0010] Preferably, the first plate is provided with a third mounting part, and the flow channel plate, the second plate and the third plate are provided with through holes on their sides. The third mounting part passes through the through holes to the upper surface of the third plate to form a fourth bending part.

[0011] Preferably, the accommodating space has open surfaces at both ends of the air-cooling channel formed by the fins, and a fourth mounting part connected to the third plate is provided on the open surface. The fourth mounting part is used to install a fan device.

[0012] Preferably, it further includes: an inlet pipe and an outlet pipe, the inlet pipe and the outlet pipe passing through the second plate and the third plate and connected to the liquid cooling channel, and the inlet pipe is provided with an electromagnetic expansion valve.

[0013] Preferably, the first plate, the flow channel plate, the second plate, and the third plate are provided with through mounting holes.

[0014] Compared with the prior art, the radiator provided by this utility model has the following beneficial effects: On the one hand, by stacking the first plate, the flow channel plate and the second plate to form a cold plate structure, the processing method is simpler and easier to realize, and the heat exchange effect at the hot end is better; on the other hand, by setting a fin structure on the second plate, liquid cooling or air cooling can be selected according to the ambient temperature, making the cooling method more diverse and reducing the energy consumption of the whole vehicle. Attached Figure Description

[0015] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0016] Figure 1 This is a schematic diagram of the radiator structure in this utility model;

[0017] Figure 2 The first mounting part and the second mounting part in this utility model (i.e. Figure 1 Schematic diagram of the structure of region A in the middle;

[0018] Figure 3 This is an exploded view of the radiator in this utility model;

[0019] Figure 4This is a schematic diagram of the structure of the first plate in this utility model.

[0020] Explanation of reference numerals in the attached drawings: 1. First plate; 11. First mounting part; 111. First bending part; 12. Second mounting part; 121. Second bending part; 122. Third bending part; 13. Third mounting part; 131. Fourth bending part; 2. Flow channel plate; 21. Through hole structure; 3. Second plate; 4. Fin; 5. Third plate; 51. Fourth mounting part; 6. Liquid inlet pipe; 7. Liquid outlet pipe; 8. Electromagnetic expansion valve; 91. First notch; 92. Second notch; 93. Third notch; 94. Through hole; 95. Mounting through hole. Detailed Implementation

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] To keep the drawings concise, only the parts relevant to this invention are shown schematically in each figure, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some figures, only one of the components with the same structure or function is schematically depicted, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0023] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0024] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the specific implementation methods of this utility model will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0027] See appendix Figures 1 to 4 This embodiment discloses a heat sink, mainly used in a car refrigerator using thermoelectric semiconductor refrigeration technology. After power is connected, the semiconductor refrigeration element can transfer heat from the cold end to the hot end. The heat sink in this embodiment dissipates heat and cools the hot end of the semiconductor refrigeration element. The heat sink includes: a first plate 1, a flow channel plate 2, a second plate 3, fins 4, and a third plate 5.

[0028] The first plate 1 is connected to the semiconductor cooling element to receive the heat transferred by the semiconductor cooling element; the flow channel plate 2 is provided with a through hole structure 21 that penetrates the upper and lower surfaces of the flow channel plate 2, and the lower surface of the flow channel plate 2 is stacked and connected to the first plate 1; the second plate 3 is stacked and connected to the upper surface of the flow channel plate 2, and the second plate 3, the first plate 1 and the through hole structure 21 are closed to form a liquid cooling flow channel; the fin 4 is a thin and continuous sheet structure, and the fin 4 is provided on the upper surface of the second plate 3.

[0029] The radiator in this embodiment has the following two usage scenarios: First, when the ambient temperature is high, the airflow temperature passing through the heat dissipation fins 4 is high, and the heat dissipation effect at the hot end is poor. At this time, the temperature sensor transmits a signal to open the electromagnetic expansion valve 8 and introduce refrigerant to achieve direct cooling. Second, when the ambient temperature is low, the airflow temperature passing through the heat dissipation fins 4 is low. The heat at the hot end can be directly removed through the convection heat exchanger, thereby achieving air cooling and lower overall energy consumption.

[0030] The fin 4 is one or a combination of rectangular fin 4, straight fin 4, louvered fin 4, and corrugated fin 4. Compared with the toothed structure in the prior art, the fin 4 in this embodiment has the characteristics of being lightweight and easy to process and form. In this embodiment, the thickness of the fin 4 is 0.2-0.5mm, and the wave pitch of the fin 4 is 3-5mm, so the heat conduction speed of the fin 4 is faster and the heat exchange capacity is stronger.

[0031] In this embodiment, the fin type 4 is preferably a rectangular fin 4. Rectangular fins 4 have more welding planes, a higher welding rate, and higher structural stability. Furthermore, the wave pitch of the rectangular fins 4 is selected to be relatively small, generally set at 3-5mm. For the sealed area inside the product, with the air volume remaining constant, the smaller the wave pitch of the fins 4, the larger the heat exchange area and the greater the heat exchange capacity for the same volume.

[0032] Due to the lightweight design of fin 4, the structure of fin 4 is prone to deformation. Therefore, a third plate 5 is provided on the second plate 3. The third plate 5 is located on the upper surface of the second plate 3, and the two ends of the third plate 5 are stacked with the upper surface of the second plate 3. The middle area of ​​the third plate 5 is bent upward to form an accommodating space, and the fin 4 is covered in the accommodating space to protect the fin 4.

[0033] On the one hand, the first plate 1, the flow channel plate 2, the second plate 3, and the third plate 5 are sealed together by means of adhesive layer or welding. On the other hand, the first plate 1 is provided with a first mounting part 11, a second mounting part 12, and a third mounting part 13 to further strengthen the connection between the first plate 1, the flow channel plate 2, the second plate 3, and the third plate 5.

[0034] Participation Figures 2 to 4 A first mounting portion 11 is provided on the side of the first plate 1. A first notch portion 91 is provided on the side of the flow channel plate 2, the second plate 3, and the third plate 5. The first mounting portion 11 fits into the first notch portion 91 and extends to the upper surface of the third plate 5 to form a first bend portion 111. A third mounting portion 13 is provided on the first plate 1. A through hole portion 94 is provided on the side of the flow channel plate 2, the second plate 3, and the third plate 5. The third mounting portion 13 passes through the through hole portion 94 to the upper surface of the third plate 5 to form a fourth bend portion 131.

[0035] A second mounting portion 12 is provided at the corner of the first plate 1. A second notch 92 is provided on the side of the flow channel plate 2, the second plate 3 and the third plate 5. A third notch 93 is provided on the other adjacent side of the flow channel plate 2 and the second plate 3. The second mounting portion 12 is fitted into the second notch 92 and extends to the upper surface of the third plate 5 to form a second bending portion 121. The second mounting portion 12 bends and extends horizontally into the third notch 93 to form a third bending portion 122.

[0036] Meanwhile, mounting through holes 95 are provided through the first plate 1, the flow channel plate 2, the second plate 3 and the third plate 5. The mounting through holes 95 are provided through the first plate 1, the flow channel plate 2 and the second plate 3. On the one hand, the semiconductor cooling element is fixed on the heat sink through the mounting through holes 95. On the other hand, the heat sink is fixedly installed on the vehicle refrigerator through the mounting through holes 95.

[0037] The accommodating space has open surfaces at both ends of the air-cooling channel formed by the fins 4. A fourth mounting part 51 connected to the third plate 5 is provided on the open surface. The fourth mounting part 51 is used to install a fan device. When the ambient temperature is low, the fan device drives the airflow through the air-cooling channel and achieves air cooling through the radiator, resulting in lower overall energy consumption.

[0038] The radiator also includes an inlet pipe 6 and an outlet pipe 7, which pass through the second plate 3 and the third plate 5 and connect to the liquid cooling channel. An electromagnetic expansion valve 8 is installed on the inlet pipe 6, which is connected to the compressor to achieve refrigerant circulation. Simultaneously, the electromagnetic expansion valve 8 is connected to a temperature sensor; when the ambient temperature is too high, the electromagnetic expansion valve 8 opens, allowing refrigerant to flow in for direct cooling.

[0039] It will be apparent to those skilled in the art that various modifications and variations can be made to the exemplary embodiments of the present invention without departing from the spirit and scope of the present invention. Therefore, it is intended that the present invention cover modifications and variations falling within the scope of the appended claims and their equivalents.

Claims

1. A radiator, characterized in that, include: A first plate is connected to a semiconductor cooling element to receive heat transferred by the semiconductor cooling element; A flow channel plate, wherein the flow channel plate has a through hole structure that penetrates the upper and lower surfaces of the flow channel plate, and the lower surface of the flow channel plate is stacked and connected to the first plate body. The second plate is stacked and connected to the upper surface of the flow channel plate. The second plate and the upper surface of the flow channel plate are stacked and connected. The second plate, the first plate, and the through hole structure are closed to form a liquid cooling flow channel. The fins are thin and continuous sheet-like structures and are disposed on the upper surface of the second plate.

2. The radiator as described in claim 1, characterized in that, The fins are one or a combination of rectangular fins, straight fins, louvered fins, and corrugated fins.

3. The radiator as described in claim 2, characterized in that, The fin thickness is 0.2-0.5 mm, and the fin pitch is 3-5 mm.

4. The radiator as described in claim 1, characterized in that, Also includes: The third plate is disposed on the upper surface of the second plate. The two ends of the third plate are stacked with the upper surface of the second plate. The middle region of the third plate is bent upward to form a receiving space, and the fins are covered in the receiving space.

5. The radiator as described in claim 4, characterized in that, The first plate has a first mounting part on its side, and the flow channel plate, the second plate and the third plate have a first notch on their sides. The first mounting part fits into the first notch and extends to the upper surface of the third plate to form a first bend.

6. The radiator as described in claim 5, characterized in that, A second mounting portion is provided at the corner of the first plate, and a second notch is provided on the side of the flow channel plate, the second plate and the third plate. A third notch is provided on the other adjacent side of the flow channel plate and the second plate. The second mounting portion is fitted into the second notch and extends to the upper surface of the third plate to form a second bend. The second mounting portion bends and extends horizontally into the third notch to form a third bend.

7. The radiator as described in claim 6, characterized in that, The first plate is provided with a third mounting part, and the flow channel plate, the second plate and the third plate are provided with through holes on their sides. The third mounting part passes through the through holes to the upper surface of the third plate to form a fourth bending part.

8. The radiator as described in claim 4, characterized in that, The accommodating space is open at both ends of the air-cooled flow channel formed by the fins, and a fourth mounting part connected to the third plate is provided on the open surface. The fourth mounting part is used to install a fan device.

9. The radiator as described in claim 4, characterized in that, Also includes: The liquid inlet pipe and the liquid outlet pipe pass through the second plate and the third plate and are connected to the liquid cooling channel. The liquid inlet pipe is equipped with an electromagnetic expansion valve.

10. The radiator as claimed in claim 4, characterized in that, The first plate, the flow channel plate, the second plate, and the third plate are provided with through mounting holes.

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