Single-pass memory alloy driving wire deformation testing device and memory alloy production equipment

CN224787991UActive Publication Date: 2026-09-22BEIJING SHIDAI MULIAN TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202522568974.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-03
Publication Date
2026-09-22
Estimated Expiration
2035-12-03

AI Technical Summary

Technical Problem

该方法需操作人员手动调节油温、读取温度计示数,并使用卡尺等工具测量位移,存在加热效率低、温控精度差、人为误差大以及高温油浴安全隐患等问题

Benefits of technology

在本申请的单程记忆合金驱动丝形变测试装置中,试样固定件用于对单程记忆合金驱动丝(以下简称试样)沿试样长度方向的一端进行固定,当加热件朝向靠近试样固定组件的方向移动时,能够使得试样被容纳于加热腔内,从而通过加热件对试样进行加热,以此来对试样的形变特性进行测试。在对试样的形变特性进行测试的过程中,由于位移传递件用于与试样沿试样的长度方向的另一端连接,因此,当试样在加热过程中发生形变时,位移传递件会随着试样的形变而产生位移,又由于位移监测件与位移传递件连接,因此,当位移传递件在试样形变的影响下发生位移时,位移监测件能够对位置传递件的移动进行实时监测,以此来对试样的形变进行实时监测。同时,当试样开始形变以及形变结束时,均能够通过加热件的温度得到试样的动作起始温度以及动作结束温度。如此,本申请的单程记忆合金驱动丝形变测试装置能够实现对试样形变特性的实时监测,以提高对试样形变特性测试的准确度,同时,该过程无需人工操作,安全隐患少。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224787991U_ABST
    Figure CN224787991U_ABST
Patent Text Reader

Abstract

The application discloses a one-way memory alloy driving wire shape deformation testing device and a memory alloy production equipment, and relates to the technical field of memory alloy testing. The one-way memory alloy driving wire shape deformation testing device comprises a base, a sample fixing assembly and a heating piece. The sample fixing assembly comprises a sample fixing piece, a displacement transmission piece and a displacement monitoring piece. The sample fixing piece is connected with the base and is used for fixing one end of the sample in the length direction. The displacement transmission piece is used for being connected with the other end of the sample in the length direction. The displacement monitoring piece is connected with the displacement transmission piece. The heating piece is connected with the base and is arranged in a spaced mode with the sample fixing assembly. The heating piece moves towards the sample fixing assembly or moves away from the sample fixing assembly relative to the base. The heating piece is provided with a heating cavity. When the heating piece moves towards the sample fixing assembly, the heating cavity is used for accommodating the sample. The one-way memory alloy driving wire shape deformation testing device can optimize the deformation characteristic test of the sample.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of memory alloy testing technology, specifically to a single-pass memory alloy driven wire deformation testing device and memory alloy production equipment. Background Technology

[0002] Shape memory alloys are functional materials with a shape memory effect. Their core characteristic is the ability to recover a predetermined shape at a specific temperature, known as the shape memory effect. Performance parameters such as the onset temperature, end temperature, and axial shrinkage rate are crucial for their engineering applications. Currently, the shape recovery performance testing of single-pass shape memory alloy drive wires mainly employs the traditional oil bath heating method: the alloy wire is immersed in a heated oil bath, and its deformation is observed by changing the oil temperature, relying on manual measurement and data recording. This method requires operators to manually adjust the oil temperature, read thermometer readings, and use calipers and other tools to measure displacement, resulting in low heating efficiency, poor temperature control accuracy, large human error, and safety hazards associated with high-temperature oil baths. Utility Model Content

[0003] In view of this, the purpose of this application is to overcome the shortcomings of the prior art and provide a single-pass shape memory alloy driven wire deformation testing device that can optimize the testing of the deformation characteristics of the sample.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: In a first aspect, this application provides a single-pass shape memory alloy driven wire deformation testing device, comprising: a base; a sample fixing assembly, including a sample fixing member, a displacement transmitting member, and a displacement monitoring member, wherein the sample fixing member is connected to the base, the sample fixing member is used to fix one end of the sample along the length direction of the sample, the displacement transmitting member is used to connect to the other end of the sample along the length direction of the sample, and the displacement monitoring member is connected to the displacement transmitting member; a heating member, connected to the base and spaced apart from the sample fixing assembly, wherein the heating member moves relative to the base toward or away from the sample fixing assembly, and the heating member is provided with a heating cavity, wherein when the heating member moves toward the sample fixing assembly, the heating cavity is used to accommodate the sample.

[0005] In an optional embodiment, the single-pass memory alloy driven wire deformation testing device has a preset direction, the sample fixing member is provided with a moving cavity, one end of the moving cavity along the preset direction has a cavity wall, the other end of the moving cavity along the preset direction has an opening, the cavity wall is used to fix and connect to one end of the sample along the length direction of the sample, the displacement transmission member passes through the moving cavity and is connected to the displacement monitoring member through the opening.

[0006] In an optional embodiment, the sample holder has a first through hole at one end of the cavity wall, and the displacement transmitter has a second through hole at the end away from the displacement monitoring device. Both the first through hole and the second through hole are connected to the moving cavity. The first through hole is used for one end of the sample to pass through along the length direction of the sample, and the second through hole is used for the other end of the sample to pass through along the length direction of the sample.

[0007] In an optional embodiment, the second through hole is formed on the central axis of the displacement transmission member, and the first through hole, the second through hole, and the moving cavity are coaxially arranged.

[0008] In an optional embodiment, the sample fixing assembly further includes a first fastener, and the sample fixing member is provided with a third through hole at one end of the cavity wall. The third through hole communicates with the first through hole and is set at an angle to the first through hole. The first fastener passes through the third through hole and is used to abut against the sample.

[0009] In an optional embodiment, the sample fixing assembly further includes a second fastener, and the end of the displacement transmitting member away from the displacement monitoring member is provided with a fourth through hole. The fourth through hole communicates with the second through hole and is set at an angle to the second through hole. The second fastener passes through the fourth through hole and is used to abut against the sample.

[0010] In an optional embodiment, the sample holder is further provided with a clearance window, which communicates with the moving cavity, and the second fastener is exposed within the clearance window.

[0011] In an optional embodiment, the sample fixing assembly further includes a third fastener. The sample fixing member has a fifth through hole at one end near the displacement monitoring member along the preset direction. The fifth through hole communicates with the moving cavity and is set at an angle to the moving cavity. The displacement monitoring member passes through the opening into the moving cavity and abuts against the displacement transmission member. The third fastener passes through the fifth through hole and abuts against the displacement monitoring member.

[0012] In an optional embodiment, the single-pass shape memory alloy driven wire deformation testing device further includes a controller, and the displacement monitoring element and the heating element are both electrically connected to the controller.

[0013] Secondly, this application provides a shape memory alloy production equipment, including: a single-pass shape memory alloy drive wire deformation testing device as described in any of the foregoing embodiments.

[0014] The single-pass shape memory alloy driven wire deformation testing device of this application has the following advantages: In the single-pass shape memory alloy drive wire deformation testing device of this application, the sample holder is used to fix one end of the single-pass shape memory alloy drive wire (hereinafter referred to as the sample) along the sample length direction. When the heating element moves towards the sample fixing assembly, the sample can be accommodated in the heating chamber, thereby heating the sample to test its deformation characteristics. During the test of the sample's deformation characteristics, since the displacement transfer element is connected to the other end of the sample along the sample length direction, when the sample deforms during heating, the displacement transfer element will be displaced along with the sample's deformation. Since the displacement monitoring element is connected to the displacement transfer element, when the displacement transfer element is displaced under the influence of the sample deformation, the displacement monitoring element can monitor the movement of the displacement transfer element in real time, thereby monitoring the sample's deformation in real time. At the same time, when the sample begins to deform and when the deformation ends, the starting temperature and ending temperature of the sample can be obtained from the temperature of the heating element. Thus, the single-pass shape memory alloy driven wire deformation testing device of this application can realize real-time monitoring of the deformation characteristics of the sample, thereby improving the accuracy of the sample deformation characteristic test. At the same time, the process does not require manual operation and has few safety hazards. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A three-dimensional structural schematic diagram of the single-pass shape memory alloy driven wire deformation testing device of this application is shown; Figure 2 A cross-sectional structural schematic diagram of the single-pass shape memory alloy driven wire deformation testing device of this application is shown; Figure 3 It shows Figure 2 Enlarged structural diagram at point A; Figure 4 It shows Figure 2 A magnified structural diagram at point B in the middle.

[0017] Explanation of key component symbols: 100 - Base; 200 - Sample fixing assembly; 210 - Sample fixing component; 211 - Moving cavity; 2111 - Cavity wall; 2112 - Opening; 212 - First through hole; 213 - Third through hole; 214 - Clearance window; 215 - Fifth through hole; 220 - Displacement transmission component; 221 - Second through hole; 222 - Fourth through hole; 230 - Displacement monitoring component; 240 - First fastener; 250 - Second fastener; 260 - Third fastener; 300 - Heating element; 310 - Heating chamber; 20-sample; x - Preset direction. Detailed Implementation

[0018] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0019] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0021] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0022] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0023] Reference Figure 1 as well as Figure 2 As shown, the single-pass shape memory alloy driven wire deformation testing device involved in the embodiments of this application includes: a base 100, a sample fixing assembly 200, and a heating element 300.

[0024] Specifically, the sample fixing assembly 200 includes a sample fixing member 210, a displacement transmitting member 220, and a displacement monitoring member 230. The sample fixing member 210 is connected to the base 100 and is used to fix one end of the sample 20 along the length direction of the sample 20. The displacement transmitting member 220 is used to connect to the other end of the sample 20 along the length direction of the sample 20. The displacement monitoring member 230 is connected to the displacement transmitting member 220. The heating member 300 is connected to the base 100 and is spaced apart from the sample fixing assembly 200. The heating member 300 moves relative to the base 100 in a direction closer to or away from the sample fixing assembly 200. The heating member 300 is provided with a heating cavity 310. When the heating member 300 moves in a direction closer to the sample fixing assembly 200, the heating cavity 310 is used to accommodate the sample 20.

[0025] In the single-pass shape memory alloy drive wire deformation testing device of this application, the sample holder 210 is used to fix one end of the single-pass shape memory alloy drive wire (hereinafter referred to as sample 20) along the length direction of sample 20. When the heating element 300 moves toward the sample holder 200, the sample 20 can be accommodated in the heating chamber 310, thereby heating the sample 20 to test the deformation characteristics of sample 20. During the testing of the deformation characteristics of sample 20, since the displacement transfer element 220 is connected to the other end of sample 20 along the length direction of sample 20, when sample 20 deforms during heating, the displacement transfer element 220 will be displaced along with the deformation of sample 20. Since the displacement monitoring element 230 is connected to the displacement transfer element 220, when the displacement transfer element 220 is displaced under the influence of the deformation of sample 20, the displacement monitoring element 230 can monitor the movement of the displacement transfer element in real time, thereby monitoring the deformation of sample 20 in real time. Meanwhile, the starting and ending temperatures of the sample 20 can be obtained from the temperature of the heating element 300 when the sample 20 begins to deform and when the deformation ends. Thus, the single-pass shape memory alloy driven wire deformation testing device of this application can achieve real-time monitoring of the deformation characteristics of the sample 20, thereby improving the accuracy of the deformation characteristic test. Furthermore, this process requires no manual operation and has fewer safety hazards.

[0026] It should be noted that single-pass memory alloy drive wire is a type of shape memory alloy wire. Its core characteristic is that it can be stretched or deformed at low temperatures, and can recover its original preset shape when heated to high temperatures. However, it cannot automatically recover its low-temperature deformation state after cooling and needs to be reheated to trigger recovery.

[0027] Reference Figure 1 , Figure 3 as well as Figure 4 As shown, the single-pass memory alloy driven wire deformation testing device has a preset direction x. The sample fixing member 210 is provided with a moving cavity 211. One end of the moving cavity 211 along the preset direction x has a cavity wall 2111, and the other end of the moving cavity 211 along the preset direction x has an opening 2112. The cavity wall 2111 is used to fix and connect with one end of the sample 20 along the length direction of the sample 20. The displacement transmission member 220 passes through the moving cavity 211 and is connected to the displacement monitoring member 230 through the opening 2112.

[0028] It should be noted that the preset direction x is Figure 1 The direction indicated by x in the middle.

[0029] Specifically, in this embodiment, the sample 20 is extended along a preset direction x, that is, the length direction of the sample 20 is the preset direction x.

[0030] In this embodiment, one end of the sample 20 along its length can be fixed to the cavity wall 2111 of the moving cavity 211, while the displacement transmitter 220 is connected to one end of the sample 20 along its length. Thus, when the sample 20 deforms, the displacement transmitter 220 can move within the moving cavity 211, thereby achieving real-time transmission of the deformation of the sample 20. Furthermore, the end of the displacement transmitter 220 away from the sample 20 can be connected to the displacement monitoring device 230 through the opening 2112 of the moving cavity 211, so that the displacement of the displacement transmitter 220 can be monitored in real time by the displacement monitoring device 230.

[0031] Reference Figure 3 As shown, the sample holder 210 has a first through hole 212 at one end of the cavity wall 2111, and the displacement transmitter 220 has a second through hole 221 at the end away from the displacement monitor 230. Both the first through hole 212 and the second through hole 221 are connected to the moving cavity 211. The first through hole 212 is used for one end of the sample 20 to pass through along the length direction of the sample 20, and the second through hole 221 is used for the other end of the sample 20 to pass through along the length direction of the sample 20.

[0032] In this embodiment, one end of the sample 20 along its length direction is inserted through the first through hole 212, and the other end of the sample 20 along its length direction is arranged around the second through hole 221, so that both ends of the sample 20 along its length direction are connected to the sample fixing member 210 and the displacement transmission member 220 respectively, thereby realizing the fixing of the sample 20 and the real-time monitoring of the deformation of the sample 20.

[0033] Reference Figure 2 As shown, the second through hole 221 is opened on the central axis of the displacement transmission member 220, and the first through hole 212, the second through hole 221 and the moving cavity 211 are coaxially arranged.

[0034] Specifically, since the second through hole 221 is opened on the central axis of the displacement transmitter 220, and the first through hole 212, the second through hole 221, and the moving cavity 211 are coaxially arranged, the first through hole 212, the second through hole 221, and the moving cavity 211 are all coaxially arranged with the displacement transmitter 220. Thus, when the sample 20 deforms, the displacement transmitter 220 can be guaranteed to move within the moving cavity 211, ensuring the consistency between the movement of the displacement transmitter 220 and the deformation of the sample 20, improving the test accuracy, and at the same time reducing the interference of the cavity wall 2111 of the moving cavity 211 on the movement of the displacement transmitter 220.

[0035] Reference Figure 3As shown, the sample fixing assembly 200 also includes a first fastener 240. The sample fixing member 210 is provided with a third through hole 213 at one end of the cavity wall 2111. The third through hole 213 communicates with the first through hole 212, and the third through hole 213 and the first through hole 212 are set at an angle. The first fastener 240 passes through the third through hole 213 and is used to abut against the sample 20.

[0036] In this embodiment, since the third through hole 213 and the first through hole 212 are set at an angle, when the first fastener 240 passes through the third through hole 213, the first fastener 240 can abut against the sample 20 passing through the first through hole 212, thereby fixing one end of the sample 20 passing through the first through hole 212.

[0037] Continue to refer to Figure 3 As shown, the sample fixing assembly 200 also includes a second fastener 250. The end of the displacement transmission member 220 away from the displacement monitoring member 230 is also provided with a fourth through hole 222. The fourth through hole 222 communicates with the second through hole 221, and the fourth through hole 222 and the second through hole 221 are set at an angle. The second fastener 250 passes through the fourth through hole 222 and is used to abut against the sample 20.

[0038] In this embodiment, since the fourth through hole 222 and the second through hole 221 are set at an angle, when the second fastener 250 passes through the fourth through hole 222, the second fastener 250 can abut against the sample 20 passing through the second through hole 221, thereby fixing one end of the sample 20 passing through the second through hole 221. In this way, the two ends of the sample 20 can be fixed by the first fastener 240 and the second fastener 250, so that the sample 20 can be connected to the sample fixing member 210 and the displacement transmission member 220 respectively.

[0039] Continue to refer to Figure 3 As shown, the sample fixing member 210 is also provided with a clearance window 214, which is connected to the moving cavity 211, and the second fastener 250 is exposed inside the clearance window 214.

[0040] In this embodiment, the second fastener 250 can be avoided by the avoidance window 214 to reserve installation space for the second fastener 250, so as to connect the sample 20 and the displacement transmitter 220 through the second fastener 250.

[0041] Reference Figure 4As shown, the sample fixing assembly 200 also includes a third fastener 260. The sample fixing member 210 has a fifth through hole 215 at one end near the displacement monitoring member 230 along the preset direction x. The fifth through hole 215 communicates with the moving cavity 211 and is set at an angle to the moving cavity 211. The displacement monitoring member 230 passes through the moving cavity 211 through the opening 2112 and abuts against the displacement transmission member 220. The third fastener 260 passes through the fifth through hole 215 and abuts against the displacement monitoring member 230.

[0042] In this embodiment, since the displacement monitoring member 230 passes through the opening 2112 into the moving cavity 211 and abuts against the displacement transmitting member 220, the displacement monitoring member 230 can monitor the movement of the displacement transmitting member 220 in real time, thereby monitoring the deformation of the sample 20 in real time. Furthermore, since the fifth through hole 215 is angled to the moving cavity 211, when the third fastener 260 passes through the fifth through hole 215, it abuts against the displacement monitoring member 230 passing through the moving cavity 211, thus fixing the displacement monitoring member 230.

[0043] Specifically, in this embodiment, the displacement monitoring device 230 is a displacement dial gauge, which has the advantages of high-precision measurement, rapid response and intuitive operation, and can realize real-time monitoring of the deformation of the sample 20.

[0044] Specifically, in this embodiment, the single-pass shape memory alloy driven wire deformation testing device also includes a controller (not shown), and the displacement monitoring element 230 and the heating element 300 are all electrically connected to the controller.

[0045] In this embodiment, the movement of the heating element 300 can be controlled by the controller, and the temperature of the heating element 300 can be read by the controller to accurately measure the start and end temperatures of the sample 20. Furthermore, the real-time data of the displacement monitoring element 230 can be read by the controller to achieve real-time monitoring of the deformation of the sample 20.

[0046] The memory alloy production equipment involved in the embodiments of this application includes the above-mentioned single-pass memory alloy drive wire deformation testing device.

[0047] Since the aforementioned single-pass shape memory alloy drive wire deformation testing device can optimize the deformation characteristic testing of single-pass shape memory alloy drive wire, the shape memory alloy production equipment of this application can have high production quality.

[0048] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0049] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A device for testing the deformation of a single-pass shape memory alloy driven wire, characterized in that, include: Base; The sample fixing assembly includes a sample fixing component, a displacement transmitting component, and a displacement monitoring component. The sample fixing component is connected to the base and is used to fix one end of the sample along the length direction of the sample. The displacement transmitting component is used to connect to the other end of the sample along the length direction of the sample, and the displacement monitoring component is connected to the displacement transmitting component. A heating element is connected to the base and spaced apart from the sample fixing assembly. The heating element moves relative to the base toward or away from the sample fixing assembly. The heating element has a heating cavity, which is used to accommodate the sample when the heating element moves toward the sample fixing assembly.

2. The single-pass shape memory alloy driven wire deformation testing device according to claim 1, characterized in that, The single-pass memory alloy driven wire deformation testing device has a preset direction. The sample fixing component is provided with a moving cavity. One end of the moving cavity along the preset direction has a cavity wall, and the other end of the moving cavity along the preset direction has an opening. The cavity wall is used to fix and connect to one end of the sample along the length direction of the sample. The displacement transmission component passes through the moving cavity and is connected to the displacement monitoring component through the opening.

3. The single-pass shape memory alloy driven wire deformation testing device according to claim 2, characterized in that, The sample holder has a first through hole at one end of the cavity wall, and the displacement transmitter has a second through hole at the end away from the displacement monitoring device. Both the first through hole and the second through hole are connected to the moving cavity. The first through hole is used for one end of the sample to pass through along the length direction of the sample, and the second through hole is used for the other end of the sample to pass through along the length direction of the sample.

4. The single-pass shape memory alloy driven wire deformation testing device according to claim 3, characterized in that, The second through hole is opened on the central axis of the displacement transmission component, and the first through hole, the second through hole and the moving cavity are coaxially arranged.

5. The single-pass shape memory alloy driven wire deformation testing device according to claim 3, characterized in that, The sample fixing assembly further includes a first fastener. The sample fixing member is provided with a third through hole at one end of the cavity wall. The third through hole communicates with the first through hole and is set at an angle to the first through hole. The first fastener passes through the third through hole and is used to abut against the sample.

6. The single-pass shape memory alloy driven wire deformation testing device according to claim 3, characterized in that, The sample fixing assembly further includes a second fastener. The end of the displacement transmitting member away from the displacement monitoring member is provided with a fourth through hole. The fourth through hole communicates with the second through hole and is set at an angle to the second through hole. The second fastener passes through the fourth through hole and is used to abut against the sample.

7. The single-pass shape memory alloy driven wire deformation testing device according to claim 6, characterized in that, The sample fixing component is also provided with a clearance window, which is connected to the moving cavity, and the second fastener is exposed inside the clearance window.

8. The single-pass shape memory alloy driven wire deformation testing device according to claim 2, characterized in that, The sample fixing assembly further includes a third fastener. The sample fixing member has a fifth through hole at one end near the displacement monitoring member along the preset direction. The fifth through hole communicates with the moving cavity and is set at an angle to the moving cavity. The displacement monitoring member passes through the opening into the moving cavity and abuts against the displacement transmission member. The third fastener passes through the fifth through hole and abuts against the displacement monitoring member.

9. The single-pass shape memory alloy driven wire deformation testing device according to claim 1, characterized in that, The single-pass shape memory alloy driven wire deformation testing device also includes a controller, and the displacement monitoring element and the heating element are both electrically connected to the controller.

10. A shape memory alloy production equipment, characterized in that, Includes: the single-pass shape memory alloy driven wire deformation testing device as described in any one of claims 1-9.