A sensor packaging structure based on multilayer sound absorption and vibration isolation

Abstract

The utility model relates to the technical field of flexible electronics, concretely is a kind of sensor packaging structure based on multilayer sound absorption vibration isolation, comprising: from inside to outside upper cover, sound absorption pad, sensor body and base are sequentially arranged;The upper cover with the base is connected by screw, forms the closed sound deadening cavity structure;The sound absorption pad is installed in the sound deadening cavity structure, the sensor body is wrapped and clamped fixed by the sound absorption pad;The base is equipped with the annular groove for accommodating the sound absorption pad and sensor body.The utility model is through the synergistic effect of multilayer sound absorption material and mechanical vibration isolation design, external high frequency and impact vibration energy can be classified dissipation, to significantly weaken the transmission of acoustic energy and structural stress to sensing element.This design effectively suppresses false signal caused by mechanical impact or resonance, improves the signal stability and measurement accuracy of sensing system under strong vibration working condition, has the advantages of compact structure, reliable assembly and adapt to extreme vibration environment.

Description

Technical Field

[0001] This utility model relates to the field of flexible electronics technology, specifically a sensor packaging structure based on multilayer sound absorption and vibration isolation. Background Technology

[0002] The rapid development of flexible electronics technology is driving sensors towards higher sensitivity and measurement accuracy. In complex vibration environments, sensors need excellent anti-interference capabilities to ensure the accuracy of signal acquisition. Currently, active vibration reduction technology has become the mainstream solution. This type of method typically uses sensors to monitor vibration signals in real time, calculates the required reverse control force through control algorithms, and then uses a controller to drive actuators to generate a reverse force to counteract external vibration energy.

[0003] However, such active vibration reduction systems typically involve the integration of multiple components, including sensors, controllers, actuators, and power supplies. This results in complex system structures, high costs, strong dependence on control algorithm models, and poor environmental adaptability. Especially in high-frequency or high-impact vibration environments, their noise reduction effect significantly diminishes, making it difficult to simultaneously meet the requirements for high sensitivity and high precision signal acquisition. Utility Model Content

[0004] The purpose of this invention is to propose a sensor packaging structure based on multi-layer sound absorption and vibration isolation, which aims to solve the technical problem that existing sensors cannot simultaneously meet the requirements of high sensitivity and high precision measurement in high-frequency vibration environments.

[0005] To achieve the above objectives, the specific technical solution adopted by this utility model is as follows: A sensor packaging structure based on multilayer sound absorption and vibration isolation includes: The components arranged from the inside out are: top cover, sound-absorbing pad, sensor body, and base. The upper cover and the base are connected by screws to form a closed sound-absorbing cavity structure; The sound-absorbing pad is installed inside the sound-absorbing cavity structure, and the sensor body is wrapped and clamped by the sound-absorbing pad; The base is provided with an annular groove for accommodating the sound-absorbing pad and the sensor body.

[0006] In one alternative embodiment, the upper cover snaps onto the base and covers the outer surface of the base, and is fixed by screws to achieve overall locking and sealing.

[0007] In one optional embodiment, the sound-absorbing pad is an overall ring structure with circumferentially distributed embedded grooves inside for embedding the sensor body, thereby structurally limiting and buffering the sensor.

[0008] In one optional embodiment, the sound-absorbing pad is 3mm thick and is divided into an upper layer and a lower layer by the embedded groove. The thickness of the upper layer is less than that of the lower layer, so that the sound-absorbing pad in the base is thicker and the sound-absorbing pad in the top cover is thinner, so as to achieve graded sound absorption and vibration isolation effects. In one alternative embodiment, the sound-absorbing pad has several spaced-apart block areas, with gaps between the blocks.

[0009] In one optional embodiment, the sound-absorbing pad is provided with a hollow structure, and the base surface is uniformly distributed with protrusions corresponding to the hollow structure. The protrusions cooperate with and fit tightly with the hollow structure to provide radial limiting and support.

[0010] In one optional embodiment, the sensor body surface is coated with a 20 μm thick Gr / Au composite coating. This Gr / Au composite coating, composed of a graphene layer and a gold layer, possesses high conductivity, excellent surface stability, and energy dissipation performance, reducing surface charge accumulation and improving signal transmission stability under high-frequency vibration conditions. Through this Gr / Au composite coating, the sensor body can maintain stable response performance during thermal cycling within a temperature range of -200 °C to 115 °C, while also exhibiting oxidation resistance, anti-reflection properties, and high infrared emissivity.

[0011] In one alternative embodiment, the sound-absorbing pad is made of a viscoelastic material that has a high energy dissipation capacity for mid-to-high frequency vibrations and impacts. Its internal molecular chains undergo hysteretic deformation under vibration to absorb and attenuate externally conducted energy.

[0012] In one optional embodiment, the sound-absorbing pad has a recessed portion on its front side, which aligns with the PCB cover fixing area of ​​the sensor body. Furthermore, one edge of the protruding structure has an opening for engaging with a protruding portion of the PCB cover of the sensor body.

[0013] In summary, this invention, through the synergistic effect of a multi-layered sound-absorbing structure and mechanical vibration isolation design, achieves graded dissipation of high-frequency vibration energy and decoupling of the signal path. This effectively suppresses spurious signals caused by mechanical impact and structural resonance, reduces the sensor's secondary response, and improves the stability and measurement accuracy of the signal output. Consequently, the sensor possesses the advantages of compact structure, reliable assembly, and adaptability to extreme vibration environments. The sensor body has a detection speed greater than 1 km / s, and its mass sensitivity range under high impact conditions is approximately 8 × 10⁻⁶. -13 ~8×10 -8 g has an operating temperature range of -50~80°C and is suitable for signal acquisition in high-frequency vibration environments. Attached Figure Description

[0014] Figure 1 A schematic diagram of a sensor packaging structure based on multilayer sound absorption and vibration isolation provided for an embodiment of this utility model; Figure 2 This is an assembly diagram of a sensor packaging structure based on multilayer sound absorption and vibration isolation, provided by an embodiment of the present invention.

[0015] Figure 3 A schematic diagram of the upper cover structure provided for an embodiment of this utility model; Figure 4 A schematic diagram of the sound-absorbing pad provided in an embodiment of this utility model; Figure 5 A schematic diagram of the base structure provided for an embodiment of this utility model.

[0016] Figure 6 This is a schematic diagram of the sensor body structure provided for an embodiment of the present utility model.

[0017] In the diagram: 1-Top cover; 2-Sound-absorbing pad 2; 3-Sensor body; 4-Base; 5-Protruding structure; 6-Recessed part. Detailed Implementation

[0018] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any way. It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of the present invention can be combined with each other.

[0019] Figure 1 This is a schematic diagram of a sensor packaging structure based on multi-layer sound absorption and vibration isolation provided by an embodiment of the present invention; in one embodiment, the sensor packaging structure based on multi-layer sound absorption and vibration isolation is provided with a top cover 1, a sound-absorbing pad 2, a sensor body 3, and a base 4 from the inside out, wherein, The upper cover 1 is 13 mm thick. It is installed above the sound-absorbing pad 2, fastened to the base 4, and covers the outer surface of the base 4. The top of the upper cover 1 has 6 through holes. Screws are tightened and locked to the base 4 through the 6 through holes, thereby forming a closed sound-absorbing cavity structure.

[0020] The sensor body 3 has a diameter of 36 mm. After the sound-absorbing pad 2 is installed, the edges of its upper and lower surfaces are wrapped and clamped by the sound-absorbing pad 2 to ensure the positioning accuracy and uniform force of the sensor.

[0021] The sound-absorbing pad 2 is 3mm thick and is installed inside the sound-absorbing cavity structure. It is fixed to the inner surface of the base 4 by bonding to form a continuous vibration isolation and buffer interface, which is used to isolate external vibration energy and buffer impact to reduce the impact of high-frequency vibration on the sensor body.

[0022] The base 4 is provided with an annular groove for accommodating the sound-absorbing pad 2 and the sensor body 3, and the base 4 is provided with a protruding structure that cooperates with and fits tightly against the outer edge of the sound-absorbing pad to provide radial limiting and support.

[0023] Please see Figure 2 , Figure 2 This is an assembly diagram of a sensor packaging structure based on multilayer sound absorption and vibration isolation provided in this embodiment.

[0024] Specifically, the sensor packaging structure based on multi-layer sound absorption and vibration isolation is provided from the inside out as follows: a top cover 1, a sound-absorbing pad 2, a sensor body 3, and a base 4. The sensor body 3 has a diameter of 36 mm and a special clamp is attached to its surface, such as... Figure 6 As shown, its structure, from the inside out, consists of a cover plate, a PCB cover plate, and an FPC auxiliary board. Each layer is connected by screws to ensure the mechanical stability and conductivity reliability of the signal path. The upper and lower surface edges of the sensor body 3 are fitted with sound-absorbing pads 2 and then clamped and fixed by the cover plate to ensure the sensor's positioning accuracy and uniform force distribution.

[0025] The sound-absorbing pad 2 has eight hollow structures, which correspond one-to-one with eight raised structures 5 on the base 4 to achieve precise positioning and tight fit. The eight raised structures are locked to the top cover with screws to form a sealed package.

[0026] The base 4 is provided with an annular groove for accommodating the sound-absorbing pad 2 and the sensor body 3. The sound-absorbing pad 2 is fixed to the outer annular groove by adhesive bonding to form a continuous vibration isolation and buffer interface.

[0027] The front of the sound-absorbing pad 2 is provided with a recessed part 6, which is aligned with the PCB cover plate fixing area of ​​the sensor body 3; there are 6 mounting holes on the PCB cover plate, and screws can pass through the hollow structure of the sound-absorbing pad and the mounting holes in sequence and then be tightened with the base 4, thereby achieving a stable fixation of the sensor body.

[0028] like Figure 3 As shown, the thickness of the upper cover 1 is 13 mm. It is installed above the sound-absorbing pad 2, fastened to the base 4, and covers the outer surface of the base 4. The top of the upper cover 1 has 6 through holes. Screws are tightened and locked to the base 4 through the 6 through holes, thereby achieving a sealed and stable integrated assembly structure.

[0029] Through the above structural design, the upper and lower surface edges of the sensor body 3 are covered by sound-absorbing pads 2. The externally transmitted vibration and acoustic energy are dissipated step by step in the multi-layer structure, which significantly reduces the transmission of mid-to-high frequency vibration and impact.

[0030] This design effectively suppresses false signals caused by mechanical shock or structural resonance, reduces the piezoelectric pair response, and thus improves the stability and measurement accuracy of the sensor signal output.

[0031] Therefore, the sensor packaging structure of this embodiment can simultaneously meet the application requirements of high sensitivity and high precision in high-frequency vibration environments.

[0032] Please see Figure 4 , Figure 4 This is a schematic diagram of a sound-absorbing pad structure based on a multi-layer sound-absorbing and vibration-isolating sensor packaging structure provided in this embodiment.

[0033] Specifically, the sound-absorbing pad 2 has an overall annular structure with circumferentially distributed embedded grooves inside for embedding the sensor body, thereby structurally limiting and buffering the sensor. Through this embedded design, the sensor can be stably positioned inside the sound-absorbing pad, reducing the vibration coupling effect caused by assembly gaps, thus reducing the impact of high-frequency vibration on the sensor.

[0034] The sound-absorbing pad 2 has eight spaced-apart sections, with gaps between them to allow for slight deformation under external vibration, absorbing and dissipating some of the vibration energy. This segmented design effectively improves the energy dissipation efficiency of the sound-absorbing pad under mid-to-high frequency vibrations while maintaining structural stability.

[0035] Furthermore, a recessed portion 6 is provided on one side of the sound-absorbing pad 2, corresponding to the protruding portion of the PCB cover plate of the sensor body 3, ensuring the spatial arrangement and structural compatibility of the sensor signal leads. The sound-absorbing pad 2 can be made of a material with viscoelastic properties, whose internal molecular chains will undergo hysteretic deformation when subjected to vibration excitation, thereby achieving the dissipation and attenuation of mechanical vibration energy.

[0036] In summary, Figure 3 The sound-absorbing pad structure shown achieves effective isolation and energy dissipation of the sensor in a high-vibration environment through a comprehensive design of embedded support, segmented energy absorption and viscoelastic buffer, significantly improving the vibration resistance and signal stability of the assembly system.

[0037] Please see Figure 5 , Figure 5 This embodiment provides a schematic diagram of a base structure for a sensor packaging structure based on a multi-layer sound-absorbing and vibration-isolating layer.

[0038] Specifically, the base 4 has an overall ring-shaped structure with eight raised structures evenly distributed on its inner surface. These raised structures correspond to the hollowed-out areas on the sound-absorbing pad 2, thereby achieving stable limiting fit and positioning support. This structural design ensures the coaxiality and tight fit between the sound-absorbing pad and the base during assembly, improving the overall structural stability.

[0039] Among the eight protruding structures, one of the edges has an opening to cooperate with the protruding part of the PCB cover plate of the sensor body, thereby reserving space for the arrangement and output direction of signal leads and avoiding structural interference.

[0040] The outer ring area of ​​the base 4 is used to install the sound-absorbing pad 2. When the sound-absorbing pad is assembled with the raised structure of the base, it can form a multi-layered mechanical buffer and acoustic energy dissipation interface. This design can effectively disperse the stress concentration area generated by external excitation, so that the vibration energy is gradually attenuated at the contact interface, thereby improving the vibration resistance stability and signal reliability of the sensor system.

[0041] In summary, Figure 4 The base structure shown achieves precise installation and acoustic coupling support of the sound-absorbing pad through the design of annular limiting, boss support and functional opening, providing a basic mechanical stability and energy dissipation path for the entire sensor silencing structure.

[0042] In one embodiment, the sensor packaging structure is suitable for sensing elements sensitive to high-frequency vibrations, and its core consists of multiple layers of sound-absorbing, vibration-isolating, and heat-conducting components. The surface of the sensor body can be covered with a Gr / Au (graphene / gold) composite coating with a thickness of approximately 20 μm to enhance its conductivity and thermal stability, and to provide additional electromagnetic shielding and environmental protection functions.

[0043] In one embodiment, the Gr / Au composite coating employs a layered deposition structure, consisting of a graphene layer and a gold layer. The graphene layer possesses a high specific surface area and excellent thermal diffusivity, enabling rapid dispersion of localized stress and heat. The gold layer provides high conductivity and chemical inertness, preventing surface oxidation and improving signal transmission stability. Through this composite coating design, the sensing element can maintain stable operating performance within a temperature range of -200 °C to 115 °C, significantly improving the reliability of the structure in complex environments.

[0044] In one embodiment, during the assembly of the sensor silencing structure, two layers of clamps are used to position and pre-fix the sensor body. Specifically, the sensor body is first embedded into the recessed groove of the sound-absorbing pad, forming a tight covering structure with the pad. Then, the top cover and base are installed sequentially, and the assembly is sealed and secure by screws. This assembly method ensures the coaxiality and uniform force distribution of the sensor body, avoiding sensitivity drift caused by assembly stress.

[0045] In one embodiment, the sound-absorbing pad installed at the base is thicker and is mainly used to bear and absorb external mechanical impacts; the sound-absorbing pad installed at the top cover is thinner and adopts a segmented design so as to achieve flexible deformation and energy dispersion under medium and high frequency vibration conditions, thereby improving the acoustic impedance matching and vibration isolation efficiency of the structure.

[0046] In one embodiment, the sound-absorbing pad is made of a viscoelastic material, which exhibits high energy response characteristics to mid-to-high frequency vibrations and impact loads. Its internal molecular chains undergo hysteretic deformation under external excitation, thereby converting some mechanical energy into heat energy, achieving dissipation and attenuation of conducted vibrations. Through this viscoelastic energy dissipation mechanism, the sound-absorbing structure can effectively block the energy transfer path of external excitation between multi-layered structures, significantly reducing high-frequency interference and improving signal stability. In the above embodiments, the descriptions of each embodiment have different focuses; for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0047] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A sensor packaging structure based on multilayer sound absorption and vibration isolation, characterized in that, include: The components arranged from the inside out are: top cover, sound-absorbing pad, sensor body, and base. The upper cover and the base are connected by screws to form a closed sound-absorbing cavity structure; The sound-absorbing pad is installed inside the sound-absorbing cavity structure, and the sensor body is wrapped and clamped by the sound-absorbing pad; The base is provided with an annular groove for accommodating the sound-absorbing pad and the sensor body.

2. The sensor packaging structure based on multi-layer sound absorption and vibration isolation as described in claim 1, characterized in that, The top cover snaps into and covers the outer surface of the base, and is fixed with screws to achieve overall locking and sealing.

3. The sensor packaging structure based on multi-layer sound absorption and vibration isolation as described in claim 1, characterized in that, The sound-absorbing pad has an overall ring structure with circumferentially distributed embedded grooves inside for embedding the sensor body.

4. The sensor packaging structure based on multi-layer sound absorption and vibration isolation as described in claim 3, characterized in that, The sound-absorbing pad is 3mm thick and is divided into an upper layer and a lower layer by the embedded groove, with the upper layer being thinner than the lower layer.

5. The sensor packaging structure based on multi-layer sound absorption and vibration isolation as described in claim 1, characterized in that, The sound-absorbing pad has several spaced-apart block areas, with gaps between the blocks.

6. The sensor packaging structure based on multi-layer sound absorption and vibration isolation as described in claim 1, characterized in that, The sound-absorbing pad has a hollow structure, and the base surface has evenly distributed raised structures corresponding to the hollow structure. The raised structures cooperate with and fit tightly with the hollow structure to provide radial limiting and support.

7. The sensor packaging structure based on multi-layer sound absorption and vibration isolation as described in claim 1, characterized in that, The sensor body surface is coated with a Gr / Au composite coating with a thickness of 20 μm.

8. The sensor packaging structure based on multilayer sound absorption and vibration isolation as described in claim 1, characterized in that, The sound-absorbing pad is made of a viscoelastic material.

9. The sensor packaging structure based on multilayer sound absorption and vibration isolation as described in claim 1, characterized in that, The sound-absorbing pad has a recessed area on its front side, which is aligned with the PCB cover fixing area of ​​the sensor body.

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