A multi-point distributed on-wafer wireless temperature measurement wafer

Abstract

The utility model relates to wireless temperature measurement wafer technical field especially, it is a kind of multipoint distribution's On Wafer wireless temperature measurement wafer, solve the multipoint distribution On Wafer wireless temperature measurement wafer in prior art, because the core electronic module such as acquisition circuit, energy storage element adopts embedded integrated design, there is the problem that disassembly process is complicated, maintenance operation is difficult and wafer body or temperature measurement unit is easily damaged, including protective assembly, the protective assembly includes protective cover, the thread groove is set in protective cover bottom inner wall, detection assembly is set in protective cover below, the thread groove inner wall is screwed in the thread cylinder, the utility model is through the detachable connection structure of the thread pile of circular mounting hole and circular chassis of circular circuit board, screw and the buffer design of rubber anticollision ring, make the disassembly of core circuit and sensor more operability, avoid the damage to wafer body and temperature measurement unit when maintaining, realize the convenience of device maintenance and structural integrity protection.

Description

Technical Field

[0001] This utility model relates to the field of wireless temperature measurement wafer technology, and in particular to an on-wafer wireless temperature measurement wafer with multi-point distribution. Background Technology

[0002] Multi-point distributed on-wafer wireless temperature measurement wafers are dedicated temperature measurement devices for semiconductor wafer-level manufacturing and testing scenarios. They integrate multiple miniature, high-temperature resistant wireless sensing units within the wafer body, evenly covering the core, edge, and critical interconnect areas of the wafer, enabling in-situ deployment without packaging. Utilizing wireless transmission technology, these wafers eliminate the need for leads, simultaneously collecting temperature data from each point to accurately reconstruct the wafer surface temperature gradient and local hotspot distribution, effectively avoiding the interference and structural damage caused by contact temperature measurement. Adaptable to various processes such as semiconductor lithography, etching, and high-temperature aging, they provide real-time, interference-free temperature monitoring support for advanced process optimization and reliability verification. Their core advantage lies in balancing point density, testing accuracy, and scenario adaptability, meeting the refined temperature measurement needs of 5nm and below advanced processes.

[0003] Existing technologies can collect temperature data from multiple regions simultaneously and without contact in wafer-level in-situ testing scenarios, accurately capturing temperature gradients and local hot spots, while taking into account testing convenience, data integrity, and process environment compatibility.

[0004] While existing multi-point distributed on-wafer wireless temperature measurement wafers achieve wafer-level in-situ non-contact synchronous temperature measurement and accurate capture of temperature distribution differences through the integration of multi-region micro wireless sensing units, they face numerous prominent problems in practical applications. In terms of specific operation, multi-point distributed on-wafer wireless temperature measurement wafers suffer from drawbacks such as cumbersome disassembly processes, difficult maintenance operations, and the potential for damage to the wafer itself or the temperature measurement unit due to the embedded integrated design of core electronic modules such as the acquisition circuit and energy storage components. Therefore, to address these shortcomings of existing technologies, we urgently need an innovative multi-point distributed on-wafer wireless temperature measurement wafer to solve these problems. Utility Model Content

[0005] To achieve the above objectives, this utility model provides a multi-point distributed On Wafer wireless temperature measurement wafer, which solves the problem that current multi-point distributed On Wafer wireless temperature measurement wafers have cumbersome disassembly processes, difficult maintenance operations, and are prone to damage to the wafer body or temperature measurement unit due to the embedded integrated design of core electronic modules such as acquisition circuits and energy storage components.

[0006] The system includes a protective component, which includes a protective cover. The inner wall of the bottom of the protective cover has a threaded groove. A detection component is located below the protective cover. The detection component includes a circular base. A threaded cylinder is fixedly connected to the top of the circular base. A circular circuit board is movably connected to the upper surface of the inner wall of the circular base. The threaded cylinder is screwed into the inner wall of the threaded groove.

[0007] The circular circuit board has three circular mounting holes on its upper surface, and the circular mounting holes are in corresponding positions. The upper surface of the inner wall of the circular chassis is fixedly connected with three threaded posts, and the threaded posts are in corresponding positions.

[0008] The three circular mounting holes correspond to the three threaded piles, and screws are installed on the inner walls of the three threaded piles. A rubber anti-collision ring is fixedly connected to the outer surface of the circular chassis, and a strip-shaped friction groove is opened on the outer surface of the rubber anti-collision ring.

[0009] The circular circuit board has a battery compartment fixedly connected to the center of its upper surface. The inner wall of the battery compartment is fixedly connected to a strip partition, and a battery is movably connected to the inner wall of the battery compartment.

[0010] Thermocouple sensors are fixedly connected to the upper surface of the circular circuit board, and the number of thermocouple sensors is evenly distributed on the upper surface of the circular circuit board.

[0011] The protective cover has a placement hole on its bottom inner wall. The number of placement holes is the same as the number of thermocouple sensors and their positions correspond. A sealing gasket is movably connected to the bottom inner wall of the protective cover, and a rubber protective ring is fixedly connected to the lower surface of the sealing gasket.

[0012] The lower surface of the sealing gasket is movably connected to the top of the threaded cylinder, and the outer surface of the rubber protective ring is movably connected to the inner wall of the threaded cylinder.

[0013] Beneficial effects Compared with existing technologies, it has the following advantages: 1. In this utility model, the detachable connection structure of the circular mounting hole of the circular circuit board and the threaded post and screw of the circular chassis, as well as the buffer design of the rubber anti-collision ring, makes the disassembly and assembly of the core circuit and sensor more operable, avoids damage to the wafer body and temperature measurement unit during maintenance, and realizes the convenience of device maintenance and protection of structural integrity.

[0014] 2. In this utility model, the protective cover is screwed into the threaded cylinder and threaded groove of the detection component, and a sealing structure consisting of a sealing gasket and a rubber protective ring is used to make the device have good sealing and protection performance. This prevents dust and moisture in the process environment from corroding the internal electronic modules, and achieves stable protection and working condition adaptation of the core components. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0016] Figure 1 This is an exploded structural diagram of an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the overall structure of an embodiment of the present utility model.

[0018] Figure 3 This is a schematic diagram of the main structure of an embodiment of this utility model.

[0019] Figure 4 This is a top view schematic diagram of a partial structure of an embodiment of this utility model.

[0020] Figure 5 This is an embodiment of the present utility model. Figure 1 A magnified schematic diagram of the structure at point A in the diagram.

[0021] In the diagram: 1. Protective component; 101. Protective cover; 102. Placement hole; 103. Threaded groove; 104. Sealing gasket; 105. Rubber protective ring; 2. Detection component; 201. Circular chassis; 202. Rubber anti-collision ring; 203. Strip friction groove; 204. Threaded cylinder; 205. Circular circuit board; 206. Circular mounting hole; 207. Thermocouple sensor; 208. Battery placement compartment; 209. Strip partition; 210. Battery; 211. Threaded post. Detailed Implementation

[0022] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0023] Please see Figures 1-5A multi-point distributed on-wafer wireless temperature measurement wafer includes a protective component 1. The protective component 1 includes a protective cover 101, with a threaded groove 103 formed on the inner wall of the bottom of the protective cover 101. A detection component 2 is disposed below the protective cover 101. The detection component 2 includes a circular base 201, with a threaded cylinder 204 fixedly connected to the top of the circular base 201. A circular circuit board 205 is movably connected to the upper surface of the inner wall of the circular base 201. The threaded cylinder 204 is screwed into the inner wall of the threaded groove 103. The upper surface of the circular circuit board 205 has three circular mounting holes 206, which are correspondingly positioned. Threaded posts 211 are fixedly connected to the upper surface of the inner wall of the circular base 201, with three correspondingly positioned posts. Three circular mounting holes 206 correspond to three threaded posts 211. Screws are installed on the inner walls of the three threaded posts 211. A rubber anti-collision ring 202 is fixedly connected to the outer surface of the circular base 201. A strip-shaped friction groove 203 is formed on the outer surface of the rubber anti-collision ring 202. A battery storage compartment 208 is fixedly connected to the center of the upper surface of the circular circuit board 205. A strip-shaped partition 209 is fixedly connected to the inner wall of the battery storage compartment 208. A battery 210 is movably connected to the inner wall of the battery storage compartment 208. A number of thermocouple sensors 207 are fixedly connected to the upper surface of the circular circuit board 205 and are evenly distributed on the upper surface of the circular circuit board 205. The circular circuit board 205 of the detection component 2 serves as the core carrier component, with several thermocouple sensors 207 evenly distributed on its surface, which can simultaneously capture temperature signals from different areas of the wafer. The battery placement compartment 208 fixed at the center of the circular circuit board 205 is equipped with a strip partition 209, which can limit and fix the battery 210, ensure power supply stability, provide continuous power support for the thermocouple sensors 207 and related electronic components, and realize the synchronous acquisition and output of multi-area temperature at the wafer level. Meanwhile, the circular circuit board 205, through its three circular mounting holes 206, is aligned with three corresponding threaded posts 211 fixed on the inner wall of the circular chassis 201, and then detachably connected with screws. This facilitates subsequent maintenance or replacement of core components such as the circular circuit board 205 and the thermocouple sensor 207. The rubber anti-collision ring 202 fixed on the outer surface of the circular chassis 201 provides buffer protection, and the strip-shaped friction groove 203 on its outer side increases grip friction. This not only prevents collision damage during transportation or installation, but also improves the ease of assembly and disassembly, effectively reducing the risk of damage to the wafer body or temperature measurement unit during maintenance.

[0024] Please see Figures 1-5Based on the first embodiment, the bottom inner wall of the protective cover 101 has a placement hole 102. The number of placement holes 102 is the same as the number of thermocouple sensors 207 and their positions correspond. A sealing gasket 104 is movably connected to the bottom inner wall of the protective cover 101, and a rubber protective ring 105 is fixedly connected to the lower surface of the sealing gasket 104. The lower surface of the sealing gasket 104 is movably connected to the top of the threaded cylinder 204, and the outer surface of the rubber protective ring 105 is movably connected to the inner wall of the threaded cylinder 204. The protective cover 101, through the threaded groove 103 opened on its bottom inner wall, is screwed into the threaded cylinder 204 fixed to the top of the circular base 201 of the detection assembly 2, forming a closed protective cavity, which provides basic protection for the core components such as the internal circular circuit board 205 and the thermocouple sensor 207. Meanwhile, the placement holes 102 opened on the bottom inner wall of the protective cover 101 are the same in number and position as the thermocouple sensors 207, providing clearance for the thermocouple sensors 207 and preventing the protective cover 101 from squeezing or damaging the sensors after installation. The sealing gasket 104 movably connected to the bottom inner wall of the protective cover 101 has a rubber protective ring 105 fixed on its lower surface that can tightly fit the top end face and inner wall of the threaded cylinder 204, forming a double sealing structure. This effectively blocks impurities such as dust, moisture, and corrosive gases in the semiconductor manufacturing process environment from entering the device, preventing short circuits or performance degradation of the internal electronic modules. In addition, the threaded connection structure between the protective cover 101 and the threaded cylinder 204 ensures the stability of the protective structure and facilitates quick disassembly, providing convenient conditions for subsequent maintenance of internal components and ensuring stable operation of the device under complex process conditions such as high temperature and high cleanliness.

[0025] Working Principle: During operation, the core components are precisely assembled and power supply is deployed first. Then, through structured protection and stable signal acquisition, interference-free, high-precision monitoring of multi-region temperature at the wafer level is achieved. The specific process is as follows: First, the circular chassis 201 of the detection component 2 serves as the basic load-bearing structure. Three threaded posts 211 are pre-fixed on the upper surface of its inner wall. Workers use the strip friction grooves 203 on the surface of the rubber anti-collision ring 202 on the outer side of the circular chassis 201 to grip the device. This increases the friction between the hand and the device, preventing slippage and detachment during assembly. It also utilizes the elastic buffering performance of the rubber anti-collision ring 202 to prevent damage to the components caused by collisions during handling. Subsequently, the circular circuit board 205 integrating the core functions is precisely placed on the upper surface of the inner wall of the circular chassis 201, aligning the three circular mounting holes 206 on the circuit board with the three threaded posts 211 one by one. Screws are then inserted into the mounting holes and screwed into the threaded posts 211 to fix the circuit board 205, enabling detachable assembly and reserving convenient operating space for subsequent inspection and maintenance. In terms of power supply, a strip partition 209 is installed inside the battery placement compartment 208 fixed at the center of the upper surface of the circular circuit board 205. This partition divides the compartment into independent storage spaces, allowing operators to smoothly place the batteries 210 into their respective spaces. The partition 209's limiting effect prevents the batteries 210 from shifting or colliding during operation or handling, ensuring a stable power supply circuit connection and providing continuous and stable power support to the electronic components and temperature measurement unit on the circular circuit board 205. Simultaneously, several thermocouple sensors 207, evenly distributed on the upper surface of the circular circuit board 205, serve as core temperature measurement components. Their distribution covers the critical areas required for wafer testing, simultaneously capturing temperature changes at different points, providing a foundation for subsequent temperature data acquisition and analysis. After assembling the core functional modules, the protective structure is closed and installed. Align the protective cover 101 of the protective assembly 1 with the threaded cylinder 204 fixed to the top of the circular base 201. Connect the protective cover 101 to the threaded cylinder 204 via the threaded groove 103 on the inner wall of its bottom. Tighten gradually until the protective cover 101 and the threaded cylinder 204 are tightly fitted, forming a closed protective cavity that provides physical protection for the internal core components such as the circular circuit board 205, thermocouple sensor 207, and battery 210. During this process, the number and position of the placement holes 102 on the inner wall of the bottom of the protective cover 101 correspond to the thermocouple sensors 207, precisely providing clearance for the sensors and effectively preventing mechanical damage such as squeezing or scratching during installation. This ensures the structural integrity and operational reliability of the temperature measurement unit. Meanwhile, as the protective cover 101 is tightened, the sealing gasket 104, which is movably connected to the bottom inner wall of the protective cover 101, has its lower surface tightly fitted to the top end face of the threaded cylinder 204, while the rubber protective ring 105 fixed to the lower surface of the sealing gasket 104 is embedded in the inner wall of the threaded cylinder 204 and fits tightly, forming a double sealing structure.This sealed design effectively prevents impurities such as dust, moisture, and corrosive gases from entering the device from the semiconductor manufacturing environment. This prevents short circuits, oxidation, or performance degradation of internal electronic modules due to foreign matter adhesion, ensuring stable operation under complex conditions such as high temperature and high cleanliness. After startup, the battery 210 continuously supplies power, and several thermocouple sensors 207 simultaneously collect temperature signals from different areas of the wafer. These signals are transmitted to the processing module on the circular circuit board 205 for conversion and processing, and finally output to the outside via a wireless transmission component. Throughout the entire workflow, threaded connections and a detachable structure design are consistently used. This ensures the stability of the assembly of each component and facilitates subsequent maintenance, calibration, or replacement of core components such as the thermocouple sensors 207 and the battery 210 as needed. This significantly reduces maintenance costs and operational complexity, comprehensively ensuring the accuracy, continuity, and convenience of wafer-level temperature measurement.

[0026] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A multi-point distributed on-wafer wireless temperature measurement wafer, comprising a protective component (1), characterized in that, The protective component (1) includes a protective cover (101), the inner wall of the bottom of the protective cover (101) is provided with a threaded groove (103), a detection component (2) is provided below the protective cover (101), the detection component (2) includes a circular base (201), a threaded cylinder (204) is fixedly connected to the top of the circular base (201), a circular circuit board (205) is movably connected to the upper surface of the inner wall of the circular base (201), and the threaded cylinder (204) is screwed into the inner wall of the threaded groove (103).

2. The multi-point distributed on-wafer wireless temperature measurement wafer according to claim 1, characterized in that, The upper surface of the circular circuit board (205) is provided with a circular mounting hole (206), the number of the circular mounting holes (206) is three and the positions are corresponding. The upper surface of the inner wall of the circular chassis (201) is fixedly connected with a threaded post (211), the number of the threaded post (211) is three and the positions are corresponding.

3. The multi-point distributed on-wafer wireless temperature measurement wafer according to claim 2, characterized in that, The three circular mounting holes (206) are positioned corresponding to the three threaded piles (211). Screws are provided on the inner walls of the three threaded piles (211). A rubber anti-collision ring (202) is fixedly connected to the outer surface of the circular chassis (201). A strip-shaped friction groove (203) is provided on the outer surface of the rubber anti-collision ring (202).

4. The multi-point distributed on-wafer wireless temperature measurement wafer according to claim 1, characterized in that, A battery compartment (208) is fixedly connected to the center of the upper surface of the circular circuit board (205). A strip partition (209) is fixedly connected to the inner wall of the battery compartment (208). A storage battery (210) is movably connected to the inner wall of the battery compartment (208).

5. The multi-point distributed on-wafer wireless temperature measurement wafer according to claim 1, characterized in that, Thermocouple sensors (207) are fixedly connected to the upper surface of the circular circuit board (205). The number of thermocouple sensors (207) is several and they are evenly distributed on the upper surface of the circular circuit board (205).

6. The multi-point distributed on-wafer wireless temperature measurement wafer according to claim 5, characterized in that, The bottom inner wall of the protective cover (101) has a placement hole (102). The number of placement holes (102) is the same as the number of thermocouple sensors (207) and their positions correspond. A sealing gasket (104) is movably connected to the bottom inner wall of the protective cover (101). A rubber protective ring (105) is fixedly connected to the lower surface of the sealing gasket (104).

7. A multi-point distributed on-wafer wireless temperature measurement wafer according to claim 6, characterized in that, The lower surface of the sealing gasket (104) is movably connected to the top of the threaded cylinder (204), and the outer surface of the rubber protective ring (105) is movably connected to the inner wall of the threaded cylinder (204).

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