Anti-frosting optical module high and low temperature test device

Abstract

The utility model discloses a kind of frost-preventing optical module high-low temperature testing devices;Including shell, test PCB board, medium pipeline and cover body, the cover body cover is equipped with the test area of the test PCB board and one end extends out of shell and forms first medium port, the medium pipeline part is located in shell and with The cover body is communicated, part is worn out shell and forms second medium port, the dry cavity is enclosed between the cover body outer wall and the shell inner wall, the shell is also provided with the dry gas inlet and outlet passage of communication with the dry cavity.The utility model is equipped with the test area of cover body cover in test PCB board, forms medium passage, can effectively reduce medium flow space, improve the heating or cooling rate in test process, improve test efficiency, and dry cavity is formed between cover body and shell, dry gas can be inhaled, realize dry dehumidification, prevent medium pipeline and cover body around frost-preventing condensate, prolong the service life of test PCB board.

Description

Technical Field

[0001] This utility model relates to the field of optical module testing technology, and in particular to a high and low temperature testing device for anti-frost optical modules. Background Technology

[0002] During high and low temperature testing of optical modules, the modules need to be inserted into the test PCB board and enclosed by a heat flow meter or eddy current tube shroud for cooling via high-temperature or cold-air impact. Current testing methods typically involve placing the optical module within a test area and then cooling or heating the entire space. However, this approach suffers from several problems: the large volume of the space results in slow heating or cooling rates, and during low-temperature testing, frost and condensation easily form on the PCB board at points exposed to humid air, increasing the risk of short circuits and shortening the PCB board's lifespan. Therefore, a frost-resistant high and low temperature testing device for optical modules is urgently needed to address these issues. Utility Model Content

[0003] To address the aforementioned issues, this utility model provides a high and low temperature testing device for anti-frost optical modules, comprising a housing and a test PCB board, as well as a medium pipe and a cover. The cover encloses the test area of ​​the test PCB board and extends one end beyond the housing to form a first medium port. The medium pipe is partially located inside the housing and communicates with the cover, and partially extends beyond the housing to form a second medium port. The outer wall of the cover and the inner wall of the housing enclose a drying chamber. The housing is also provided with a drying gas inlet and outlet channel communicating with the drying chamber.

[0004] Furthermore, a first sealing structure is provided on the end face of the cover that contacts the test PCB board.

[0005] Furthermore, a second sealing structure is provided between the medium pipeline and the housing, as well as between the cover and the housing.

[0006] Furthermore, the outer surface of the medium pipeline and / or the cover is provided with a heat insulation layer.

[0007] Furthermore, the cover includes a cover section located within the housing, and the cover section is provided with a heat insulation layer; and / or, the medium pipeline includes a pipeline section located within the housing, and the pipeline section is provided with a heat insulation layer.

[0008] Furthermore, the cover is provided with an inner tube, which is inserted into the medium pipeline, and the lumen of the inner tube is connected to the lumen of the medium pipeline and the cover cavity of the cover.

[0009] Furthermore, the drying chamber is equipped with a temperature sensor and / or a humidity sensor.

[0010] Furthermore, the drying gas inlet / outlet channel includes a drying gas inlet, and a drying gas pipeline is connected to the drying gas inlet. The drying gas pipeline is equipped with a gas valve and a speed regulating valve.

[0011] Furthermore, there are two drying gas inlets, which are located on the same side wall of the housing and at both ends of the side wall.

[0012] Furthermore, the housing includes a base and a cover, which are detachably connected and enclose the cavity therebetween, with the test PCB board positioned on the base.

[0013] By adopting the above technical solution, this utility model has the following beneficial effects compared with the prior art:

[0014] 1) The anti-frost optical module high and low temperature testing device provided by this utility model forms a medium channel by covering the test area of ​​the test PCB board with a cover, which can effectively reduce the medium flow space, increase the heating or cooling rate during the test, improve the test efficiency, and form a drying cavity between the cover and the shell, which can introduce dry gas to achieve drying and dehumidification, prevent frost and condensation on the medium pipe and around the cover, and extend the service life of the test PCB board.

[0015] 2) The anti-frost optical module high and low temperature testing device provided by this utility model has multiple dry gas inlets on the shell, which can make the dry gas evenly distributed in the shell and improve the anti-frost effect.

[0016] 3) The anti-frost optical module high and low temperature testing device provided by this utility model has a housing that is detachably connected by a base and a cover, which facilitates the installation and removal of the test PCB board and makes the tooling easy to maintain. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A partial cross-sectional view of the high and low temperature testing device for optical modules provided by this utility model;

[0019] Figure 2 Schematic diagram of the high and low temperature testing device for optical modules provided by this utility model Figure 1 ;

[0020] Figure 3Schematic diagram of the high and low temperature testing device for optical modules provided by this utility model Figure 2 ;

[0021] Figure 4 Partial schematic diagram of the high and low temperature testing device for optical modules provided by this utility model Figure 1 ;

[0022] Figure 5 Partial schematic diagram of the high and low temperature testing device for optical modules provided by this utility model Figure 2 .

[0023] 1-Housing; 11-Drying gas inlet; 12-Cover; 121-Top cover; 122-Side plate; 123-Loop ring; 13-Base; 131-First limiting pin; 132-Second limiting pin; 133-Lock; 2-Test PCB board; 3-Cover; 31-Inner tube; 32-First medium port; 4-Sealing layer; 5-Medium pipe; 51-Second medium port; 6-Drying gas pipe; 61-Gas valve; 62-Speed ​​control valve; 63-Pneumatic connector. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model. In the accompanying drawings, the dimensions and relative dimensions of certain parts may be enlarged for clarity.

[0025] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connection" and "connected" should be interpreted broadly. For example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0026] In the description of this utility model, the terms "upper", "lower", "left", "right", "front", "back", "center", "horizontal", "vertical", "top", "bottom", "inner", and "outer" are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] Furthermore, in the description of this utility model, the terms "first" and "second" are used merely for descriptive distinction and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Additionally, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0028] As per the instruction manual Figure 1-3 As shown, this utility model provides a high and low temperature testing device for an anti-frost optical module, including a housing 1 and a test PCB board 2, as well as a medium pipe 5 and a cover 3. The cover 3 covers the test area of ​​the test PCB board 2 and extends one end out of the housing 1 to form a first medium port 32. The medium pipe 5 is partially located inside the housing 1 and communicates with the cover 3, and partially extends out of the housing 1 to form a second medium port 51. The outer wall of the cover 3 and the inner wall of the housing 1 enclose a drying cavity. The housing 1 is also provided with a drying gas inlet and outlet channel communicating with the drying cavity.

[0029] Specifically, the test PCB board 2 is placed inside the housing 1. The test PCB board 2 has a test area. During testing, the test area needs to be heated or cooled. The medium in this application refers to high-temperature gas or cold gas. In the low-temperature testing phase, cold gas needs to be introduced into the test area to cool it down for testing the optical module connected to the test area. A medium channel is formed within the medium pipe 5 and the housing 3 for use by the test PCB board. The medium can enter from the first medium port 32, pass through the medium channel, and exit from the second medium port 51, or vice versa. The test area of ​​the test PCB board 2 is enclosed within the housing 3, allowing the medium to directly act on the test area, enabling rapid heating or cooling of the test area and improving testing efficiency. The drying gas inlet / outlet channel can be used to introduce drying gas. During low-temperature testing, the introduction of drying gas creates a positive pressure drying gas chamber in the drying cavity, which dries and dehumidifies the gas. This isolates the low-temperature gas from the humid air as it flows through the medium channel, thus preventing low-temperature frost formation.

[0030] In this embodiment, the second medium port 51 is a medium inlet, and a medium supply device is connected to the second medium port 51 for introducing high-temperature or low-temperature media; the first medium port 32 is a medium outlet for media flow.

[0031] Optimized implementation methods, as shown in the appendix to the instruction manual. Figure 4As shown, a first sealing structure 4 is provided on the end face of the cover 3 that contacts the test PCB board 2. To ensure good sealing between the cover 3 and the test PCB board 2, the first sealing structure 4 is provided on the covering part of the cover 3 that contacts the test PCB board 2. When the cover 3 is placed on the test PCB board 2, the first sealing structure 4 is in close contact with the test PCB board 2, limiting the flow of the medium within the medium channel and preventing the medium from overflowing into the drying chamber. One end of the cover 3 extends to the outside of the housing 1 and forms a medium outlet for medium discharge.

[0032] Specifically, the cover 3 includes a cover section located inside the housing 1, and the portion of the cover section that contacts the test PCB board 2 is provided with a first sealing structure 4.

[0033] As one specific implementation, the first sealing structure 4 is a silicone sealing layer. The silicone sealing layer has a certain elasticity. On the one hand, it can play a buffering role to avoid impacting the test PCB board 2 and damaging the test PCB board 2. On the other hand, it can better fit with the test PCB board 2 to form a sealed space.

[0034] Specifically, the cover 3 has a groove on its covering part, and the silicone sealing layer is embedded in the groove. The silicone sealing layer is easy to install and remove, and can be maintained and replaced in a timely manner.

[0035] In an optimized implementation, a second sealing structure is provided between the medium pipeline 5 and the housing 1, and between the cover 3 and the housing 1. The medium pipeline 5 passes through the housing 1, and a second sealing structure is provided between the medium pipeline 5 and the housing 1. The cover 3 passes through the housing 1, and a second sealing structure is provided between the cover 3 and the housing 1. The second sealing structure can be a sealing ring to achieve sealing.

[0036] Preferably, the cover 3 is provided with an inner tube 31, which is inserted into the medium pipeline 5. The lumen of the inner tube 31 is connected to both the lumen of the medium pipeline 5 and the lumen of the cover 3. The cover 3 and the medium pipeline 5 are connected by a plug-in connection, which facilitates installation and disassembly.

[0037] As one specific implementation, the cover 3 and the medium pipe 5 are an integral structure, which facilitates the assembly of the housing 1 when the test PCB board 2 is placed or removed.

[0038] In an optimized implementation, the outer surface of the medium pipe 5 and / or the cover 3 is provided with a heat insulation layer, which can achieve a heat insulation effect and ensure that the temperature inside the medium channel is within a set range.

[0039] As one specific embodiment, the cover 3 includes a cover section located inside the housing 1, and the cover section is provided with a heat insulation layer; and / or, the medium pipeline 5 includes a pipeline section located inside the housing 1, and the pipeline section is provided with a heat insulation layer.

[0040] In an optimized implementation, a temperature sensor and / or humidity sensor are provided inside the drying chamber to monitor the temperature or humidity inside the drying chamber and adjust the flow rate of the drying gas according to the temperature or humidity.

[0041] In an optimized implementation, the drying gas inlet / outlet channel includes a drying gas inlet 11, to which a drying gas pipeline 6 is connected. The drying gas pipeline 6 is equipped with a gas valve 61 and a speed regulating valve 62. A compressor is connected to the end of the drying gas pipeline 6 furthest from the drying gas inlet 11, for supplying dry compressed gas to the housing 1. The gas valve 61 is used to open and close the compressed gas in the drying gas pipeline 6, and the speed regulating valve 62 is located between the gas valve 61 and the drying gas inlet 11 to regulate the flow rate within the drying gas pipeline 6.

[0042] In an optimized implementation, a pneumatic connector 63 is provided on the drying gas inlet 11, and the pneumatic connector 63 is connected to the drying gas pipeline 6.

[0043] In an optimized implementation, two dry gas inlets 11 are provided. The two dry gas inlets 11 are located on the same side wall of the housing 1 and at both ends of the side wall. The two dry gas inlets 11 are respectively connected to the dry gas pipe 6. Multiple dry gas inlets 11 are arranged on the housing 1 at intervals, which can make the dry gas evenly distributed in the housing 1 and improve the anti-frost effect in the housing 1.

[0044] In an optimized implementation, the speed regulating valve 62 on the drying gas pipeline 6 is interlocked with the flow regulating valve at the medium supply end. The flow rate of the medium in the medium channel is proportional to the flow rate of the drying gas in the drying chamber. Specifically, a flow regulating valve is provided on the medium pipeline 5. The flow regulating valve and the speed regulating valve 62 on the drying gas pipeline 6 are interlocked. When the flow regulating valve increases the flow rate of the medium in the medium pipeline, it sends feedback to the speed regulating valve 62, which then controls and increases the flow rate of the drying gas in the drying gas pipeline 6, and vice versa, ensuring the anti-frost effect inside the housing 1.

[0045] As one specific implementation, a temperature sensor and a humidity sensor are installed in the drying chamber. The temperature sensor and humidity sensor are interlocked with the speed control valve 62 to adjust the flow rate of the drying gas in the drying gas pipeline 6 according to the temperature and humidity in the drying chamber.

[0046] In an optimized implementation, the housing 1 includes a base 13 and a cover 12. The base 13 and the cover 12 are detachably connected and enclose the cavity between them. The mounting position is located on the base 13. Specifically, the cover 12 includes an upper cover 121 and four side plates 122. The four side plates 122 are sequentially connected to form a box structure with openings at the top and bottom. The upper cover 121 is located at the upper end of the box structure, and the upper cover 121 and the box structure are an integral structure, facilitating the placement and removal of the cover 12 on the base 13. The upper cover 121 is snapped onto the box structure, facilitating the installation and removal of the upper cover 121. (See attached instruction manual) Figure 5 As shown, the mounting position of the base 13 is provided with several first limiting pins 131, and the test PCB board 2 is provided with first limiting holes that cooperate with the first limiting pins 131 to limit the test PCB board 2, thereby enabling the test PCB board 2 to be quickly placed and removed. The base 11 is also provided with several second limiting pins 132, and the side plate 122 is provided with second limiting holes that cooperate with the second limiting pins 132 to quickly calibrate the position of the cover 12 and the base 11, enabling quick assembly and disassembly of the two, and facilitating the alignment of the cover 3 with the test area on the test PCB board 2.

[0047] In an optimized implementation, the cover 12 and the base 13 are connected by a snap fastener, the base 13 is provided with a latch 133, and the cover 12 is provided with a latching ring 123 that engages with the latch 133.

[0048] As one specific implementation, the second limiting pin 132 is provided in two sets, and is respectively disposed on the left and right sides of the base 13 to limit and cooperate with the left and right side plates 122 of the box structure. The latch 133 is disposed on the left and right sides of the base 13, and the latch ring 123 is correspondingly disposed on the left and right sides of the box structure. The dry gas inlet 13 is disposed on the back of the box structure, and the cover 3 extends out of the front of the box structure.

[0049] In an optimized implementation, the dry gas inlet 11 is equipped with a silencer for noise reduction.

[0050] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0051] Those skilled in the art will understand that this invention can be implemented in many other specific forms without departing from the spirit and scope of this invention. Although embodiments of this invention have been described, it should be understood that this invention is not limited to these embodiments, and those skilled in the art can make changes and modifications within the spirit and scope of this invention as defined in the appended claims.

Claims

1. A high and low temperature testing device for anti-frost optical modules, comprising a housing and a test PCB board, characterized in that, It also includes a medium pipe and a cover. The cover covers the test area of ​​the test PCB board and one end extends out of the housing to form a first medium port. The medium pipe is partially located inside the housing and communicates with the cover, and partially extends out of the housing to form a second medium port. The outer wall of the cover and the inner wall of the housing enclose a drying chamber. The housing is also provided with a drying gas inlet and outlet channel communicating with the drying chamber.

2. The anti-frost optical module high and low temperature testing device according to claim 1, characterized in that, The end face of the cover that contacts the test PCB board is provided with a first sealing structure.

3. The anti-frost optical module high and low temperature testing device according to claim 1, characterized in that, A second sealing structure is provided between the medium pipeline and the housing, as well as between the cover and the housing.

4. The anti-frost optical module high and low temperature testing device according to claim 1, characterized in that, The outer surface of the medium pipeline and / or the cover is provided with a heat insulation layer.

5. The anti-frost optical module high and low temperature testing device according to claim 4, characterized in that, The cover includes a cover section located within the housing, and the cover section is provided with a heat insulation layer; and / or, the medium pipeline includes a pipeline section located within the housing, and the pipeline section is provided with a heat insulation layer.

6. The anti-frost optical module high and low temperature testing device according to claim 1, characterized in that, The cover is provided with an inner tube, which is inserted into the medium pipeline. The lumen of the inner tube is connected to the lumen of the medium pipeline and the lumen of the cover.

7. The anti-frost optical module high and low temperature testing device according to claim 1, characterized in that, The drying chamber is equipped with a temperature sensor and / or a humidity sensor.

8. The anti-frost optical module high and low temperature testing device according to claim 1, characterized in that, The drying gas inlet / outlet channel includes a drying gas inlet, which is connected to a drying gas pipeline. The drying gas pipeline is equipped with a gas valve and a speed regulating valve.

9. The anti-frost optical module high and low temperature testing device according to claim 8, characterized in that, The dry gas inlet is provided in two places, which are located on the same side wall of the housing and at both ends of the side wall.

10. The anti-frost optical module high and low temperature testing device according to claim 1, characterized in that, The housing includes a base and a cover, which are detachably connected and enclose a cavity therebetween, with the test PCB board located on the base.

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