An optical path coupling adjustment device

Abstract

The utility model belongs to chip light amplification performance test optical path coupling adjustment technical field discloses a kind of optical path coupling adjustment device, and the adjustment device includes coaxial fixing frame, coaxial fixing frame includes the coaxial linear arrangement of several coaxial mounting plates, and the edge of coaxial mounting plate is equipped with several fixed holes, and coaxial connecting rod is inserted in fixed hole, to connect the coaxial mounting plate, the mounting plate in coaxial fixing frame is detachably fixed with laser of optical fiber connection, collimator, polaroid or wave plate, lens in order, to chip end optical path coupling;Coaxial fixing frame is fixed on optical platform top surface by five-dimensional adjustment frame, and the side of five-dimensional adjustment frame is equipped with support column, and support column top is fixed with test stage. Advantageous effects are: five-dimensional precision adjustment frame is formed by three-dimensional adjustment frame and pitch angle adjustment frame, and it is matched with coaxial system, the complexity of double-lens coupling is reduced, the coupling effect is better improved, and it is applicable to SOA chip end light amplification characteristic test.

Description

Technical Field

[0001] This invention belongs to the field of optical path coupling adjustment technology for SOA chip optical amplification performance testing, and particularly relates to an optical path coupling adjustment device. Background Technology

[0002] As a core optical amplification device for compensating optical loss in long-distance optical transmission systems, the accurate testing of optical amplification characteristics such as optical gain, noise figure, and polarization-dependent gain of SOA is crucial for device qualification screening and practical application. Traditional testing methods often involve testing after chip packaging, which not only suffers from complex packaging structures, difficult lens coupling, and high losses, but also easily leads to ineffective waste of materials and labor costs due to unqualified chips. On the other hand, the few devices that can directly test SOA chips have drawbacks such as scattered optical components, the need for multiple adjustment frames leading to insufficient coupling accuracy, and the inability to meet the polarization characteristic testing requirements of ordinary laser chips and the needs of different temperature control scenarios. These shortcomings severely limit the flexibility, accuracy, and adaptability of chip-level testing. Summary of the Invention

[0003] The purpose of this utility model embodiment is to provide an optical path coupling adjustment device, which aims to solve the problems of high coupling loss and cost waste in the existing SOA chip optical amplification characteristic testing devices after packaging, while chip-level testing devices face the technical problems of poor integration of optical components, insufficient coupling accuracy, and difficulty in simultaneously achieving polarization modulation and low-loss coupling.

[0004] The present invention is implemented as follows: An optical path coupling adjustment device includes a coaxial mounting frame, which comprises several coaxial mounting plates arranged linearly on the same axis. The edges of the coaxial mounting plates are provided with several fixing holes, into which coaxial connecting rods are inserted for connecting the coaxial mounting plates. The mounting plates within the coaxial mounting frame are sequentially and detachably fixed with a laser connected to an optical fiber, a collimator, a polarizer or waveplate, and a lens for chip-side optical path coupling. The coaxial mounting frame is fixed to the top surface of an optical platform via a five-dimensional adjustment frame. A support column is provided on the side of the five-dimensional adjustment frame, and a test stage is fixed to the top of the support column.

[0005] Furthermore, the coaxial mounting bracket includes several coaxial mounting plates arranged linearly on the same axis. The coaxial mounting plates are circular or rectangular, and the edges of the coaxial mounting plates are symmetrically provided with fixing holes. Coaxial connecting rods are inserted into the fixing holes to connect the coaxial mounting plates.

[0006] Furthermore, the laser, collimator, polarizer or waveplate, and lens connected to the optical fiber are sequentially mounted in the center of the coaxial mounting plate.

[0007] Furthermore, the test stage includes two grooves for corresponding to the test areas of SOA and ordinary laser chips. The front end of the groove is provided with a baffle, and there is a notch between the baffles to position the chip.

[0008] Furthermore, the test stage has a small hole on its top for thermocouple temperature measurement while the TEC is supplying power for heating, ensuring the accuracy of temperature control.

[0009] Furthermore, the test stage has a ramp on the side of the groove to prevent the test stage from blocking light.

[0010] Furthermore, the five-dimensional adjustment frame is characterized by comprising a three-dimensional adjustment frame and a pitch angle adjustment frame, wherein the pitch angle adjustment frame is fixed to the top surface of the three-dimensional adjustment frame, and a coaxial fixing frame is provided on the top of the pitch angle adjustment frame.

[0011] Furthermore, the three-dimensional adjustment frame includes a base connected to the three-dimensional adjustment frame, and a rotating frame is provided on the top of the base. The rotating frame is mounted on the base through a pair of parallel rotating shafts and can rotate around a horizontal axis, driving the coaxial fixed frame to rotate. The rotating frame is connected to an angle adjustment screw for controlling the rotation angle in the horizontal and vertical directions. The angle adjustment screw is also provided with a locking nut for fixing the adjusted angle position.

[0012] Furthermore, the three-dimensional adjustment frame includes a base, an X-axis moving component is fixed to the top of the base, a Y-axis moving component is fixed to the top of the X-axis moving component, and a Z-axis moving component is fixed to the top of the Y-axis moving component.

[0013] Furthermore, the top of the pitch angle adjustment frame is equipped with a coaxial fixing frame via an adapter plate.

[0014] The optical path of this coaxial optical system is as follows: Figure 3 As shown, considering spherical aberration, the SOA chip light source, after coupling, must be positioned at the front focal plane of the lens. After being converted into parallel light, it exits through the aspherical side of the lens, then passes through a polarizer and waveplate to achieve polarization and phase modulation. Finally, a collimator, with its fixed relative position to the fiber, focuses the collimated beam onto the fiber end face. An optical power meter receives the power, and the five-dimensional adjustment frame is adjusted based on the displayed value for coupling. After coupling, the fiber is transferred from the power meter to the laser, which powers the output light. Following the principle of optical path reversibility, the light travels backward through the collimator, polarizer, waveplate, and lens, converging onto the rear surface of the SOA chip. After SOA amplification, the corresponding amplification characteristics are obtained using an optical power meter and spectral analysis. Since the other optical components are coaxial, only the relative position and angle between the lens and the chip's light-emitting point need to be adjusted—that is, the adjustment of the five-dimensional adjustment frame.

[0015] Lasers with tunable wavelengths should be selected and paired with optical attenuators to achieve gain and NF testing for different wavelengths and input light.

[0016] The positive effects of this invention are as follows: By combining a three-dimensional adjustment frame and a pitch angle adjustment frame to form a five-dimensional precision adjustment frame, precise adjustment of the optical path in spatial translation and angle can be achieved, effectively improving the alignment accuracy of the optical path; relying on the coaxial fixing frame, the laser, collimator, polarizer or glass plate, and lens connected to the optical fiber are sequentially integrated and fixed, solving the defects of scattered optical components, reducing optical path transmission interference and loss, and at the same time, the polarizer or waveplate meets the polarization modulation requirements, achieving low-loss coupling; and the device does not require pre-packaging of SOA chips, and can be directly tested on the test stage, avoiding the high loss caused by packaging and the cost waste caused by chip defects. The support column and optical platform work together to fix the test stage, ensuring the stability of the testing process. Overall, it effectively improves the flexibility, accuracy and adaptability of chip-level testing, and solves the technical problems of high coupling loss, waste of material and labor costs caused by chip defects in traditional SOA chip packaging testing, as well as the technical problems of scattered optical components, insufficient coupling accuracy, and difficulty in balancing polarization modulation and low-loss coupling in existing chip-level testing devices. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of an optical path coupling adjustment device according to this utility model; Figure 2 yes Figure 1 The diagram shows a partial schematic of the test stage of the optical path coupling adjustment device of this utility model. Figure 3 yes Figure 1 The diagram shows the optical path of the SOA chip coupling on the test stage of the optical path coupling adjustment device of this utility model.

[0018] Legend: 1—3D adjustment frame, 2—Pitch angle adjustment frame, 3—Support column, 4—TEC cooler, 5—Test stage, 501—First stop bar, 502—First groove, 503—Small hole, 504—Second stop bar, 505—Second groove, 6—Short focal length lens, 7—Wave plate, 8—Polarizer, 9—Collimator, 10—Coaxial connecting rod, 11—Coaxial mounting plate, 12—Optical platform, 13—Threaded adapter, 14—Rotary mounting base, 15—Adapter plate. Detailed Implementation

[0019] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments: In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] like Figures 1 to 3 The diagram shown is a structural diagram of an optical path coupling adjustment device provided in an embodiment of this utility model. The adjustment device includes a three-dimensional adjustment frame and a pitch angle adjustment frame. The pitch angle adjustment frame is fixed to the top surface of the three-dimensional adjustment frame to form a five-dimensional precision adjustment frame. A coaxial fixing frame is provided on the top of the pitch angle adjustment frame. A laser connected to an optical fiber, a collimator, a polarizer or glass plate, and a lens are detachably fixed in sequence inside the coaxial fixing frame. A support column is provided on the side of the five-dimensional adjustment frame. Both the support column and the three-dimensional adjustment frame are fixed to the top surface of the optical platform. A test stage is fixed on the top of the support column.

[0022] In this embodiment of the invention, a five-dimensional precision adjustment frame is formed by combining a three-dimensional adjustment frame and a pitch angle adjustment frame, which enables precise adjustment of the optical path in spatial translation and angle, effectively improving the alignment accuracy of the optical path. The coaxial fixing frame sequentially integrates and fixes the laser, collimator, polarizer or glass plate, and lens connected to the optical fiber, solving the defects of dispersed optical components, reducing optical path transmission interference and loss. Simultaneously, the polarizer or glass plate meets the polarization modulation requirements, achieving low-loss coupling. Furthermore, the device does not require pre-packaging of the SOA chip and can be directly tested on the test stage, avoiding the high loss caused by packaging and the cost waste caused by defective chips. The support column and optical platform work together to fix the test stage, ensuring the stability of the testing process. Overall, it effectively improves the flexibility, accuracy, and adaptability of chip-level testing, solving the technical problems of high coupling loss, waste of materials and labor costs due to defective chips, and dispersed optical components, insufficient coupling accuracy, and difficulty in simultaneously achieving polarization modulation and low-loss coupling in existing chip-level testing devices.

[0023] Specifically, the coupling device consists of two parts: an optical path coupling unit and a test stage, both fixed on the optical platform 12. The optical path coupling unit includes a three-dimensional adjustment frame 1 and a pitch angle adjustment frame 2, which are assembled into a five-dimensional adjustment frame. This frame is suitable for adjusting the spatial position and angular deviation of the chip on the coaxial axis after placement, i.e., high-dimensional optical coupling. The adjustment frame is combined with the coaxial frame via an adapter plate 15. The adapter plate 15 has grooves on both sides for manual adjustment of the front-to-back distance between the coaxial frame and the five-dimensional adjustment frame, increasing the adjustable travel. Additionally, there is an indented groove in the middle, corresponding to the coaxial mounting plate 11. The screw holes are used to fix the coaxial mounting bracket. Considering the adjustable flexibility of the relative positions of the various optical elements on the coaxial connector 10, no specific screw holes are provided. The coaxial mounting bracket includes a short focal length lens 6, a half-wave plate 7, a polarizer 8, and a collimator 9. The wave plate and collimator types need to be further subdivided according to the wavelength type of the SOA chip, which is a well-known technique and will not be elaborated again. The reason for choosing the short focal length lens 6 is that the point light source from the chip will diverge in the far field and needs to be collimated into parallel light. If the focal length is too large, the SOA light source will not be able to fully propagate to the lens surface, resulting in some optical loss.

[0024] The optical path component corresponding to this coaxial optical system is as follows: Figure 3 As shown: Where M is a short focal length lens 6, N is a waveplate 7, W is a polarizer 8, and H is a collimator 9; Considering spherical aberration, the chip light source, after coupling, should be positioned at the front focal plane of the lens. After being converted into parallel light, it exits through the aspherical side of the lens. At this point, only minor material absorption losses and medium losses from air propagation occur after passing through various planar optical elements, while reflection losses are virtually nonexistent. Therefore, the distance between each optical element can be adjusted appropriately. Polarization modulation is then achieved by rotating the waveplate 7 and polarizer 8 on the rotating mounting base 14: light is transmitted in a specific direction and its phase is modulated. Finally, the collimated beam is focused onto the fiber end face by a collimator that fixes the relative position of the lens and the optical fiber. Since the other optical elements are coaxial, only the relative position and angle between the lens and the chip's light-emitting point need to be adjusted.

[0025] The test stage includes a support column 3, a TEC cooler 4, and a test stage 5. The support column 3 has two grooves at its bottom, which can be moved left and right to ensure that the chip is centered in the microscope for easy observation and contact with the probe. The upper part has two screw holes for mounting the test stage 5 and ensuring full contact with the TEC cooler 6. Considering the thermal conductivity of the stage, the test stage should preferably be made of copper block 5 with a small thickness to ensure sufficient heat conduction. The test stage has two grooves, namely the first groove 502 and the second groove 505, which correspond to the test areas of SOA and ordinary laser chips, respectively. It is suitable for SOA optical amplification and laser polarization characteristic testing. The grooves have baffles, including the first baffle 501 and the second baffle 504. There is a notch between the first baffle 501 and the second baffle 504. This notch facilitates accurate chip placement and reduces the difficulty of operation, but the principle of not blocking the light output must be followed. In addition, SOA requires optical coupling at both the front and rear. Considering the issue of light divergence angle, a slope is set to avoid light obstruction as much as possible. The width of the stage is sufficient to avoid incomplete light collection by the subsequent integrating sphere or lens. A small hole 503 is provided on the stage for use as a probe point. While the TEC power supply is heating, the small hole 503 is used for thermocouple temperature measurement to ensure the accuracy of temperature control. In the rear half of the test stage, fiber optic brackets or integrating spheres can be placed as needed to achieve corresponding spectral signal-to-noise ratio or power tests. By comparing the test optical parameters of the laser device before passing through the SOA, the corresponding NF or gain can be converted. In addition, the three-dimensional adjustment frame includes a base connected to the three-dimensional adjustment frame, and a rotating frame is provided on the top of the base. The rotating frame is mounted on the base through a pair of parallel rotating shafts and can rotate around a horizontal axis, driving the coaxial fixed frame to rotate. The rotating frame is connected to an angle adjusting screw for controlling the rotation angle. The angle adjusting screw is also provided with a locking nut for fixing the adjusted angle position.

[0026] Furthermore, the three-dimensional adjustment frame includes a base, with an X-axis moving component fixed to the top of the base, a Y-axis moving component fixed to the top of the X-axis moving component, and a Z-axis moving component fixed to the top of the Y-axis moving component. The X-axis, Y-axis, and Z-axis moving components all adopt commercially available linear module structures, moving the slide table via screws, as is well known to those skilled in the art and will not be described further here.

[0027] The foregoing has broadly outlined some aspects and features of the various embodiments and should be interpreted as merely illustrative of potential applications. Other beneficial results can be obtained by applying the disclosed information in different ways or by combining aspects of the disclosed embodiments. Further aspects and a more complete understanding can be obtained based on the detailed description of exemplary embodiments with reference to the accompanying drawings, within the scope defined by the claims.

[0028] The above embodiments provide a detailed description of the present invention. Of course, the above description is not intended to limit the present invention, nor is the present invention limited to the examples described above. Any changes, modifications, additions, reductions, or substitutions made by those skilled in the art within the scope of the present invention are also within the protection scope of the present invention.

Claims

1. An optical path coupling adjustment device, characterized in that, The adjustment device includes a coaxial mounting frame, which comprises several coaxial mounting plates arranged linearly on the same axis. The edges of the coaxial mounting plates are provided with several fixing holes, and coaxial connecting rods are inserted into the fixing holes to connect the coaxial mounting plates. The mounting plates in the coaxial mounting frame are detachably fixed with a laser connected to an optical fiber, a collimator, a polarizer or waveplate, and a lens, respectively, for optical path coupling at the chip end. The coaxial mounting frame is fixed to the top surface of the optical platform by a five-dimensional adjustment frame. The side of the five-dimensional adjustment frame is provided with a support column, and a test stage is fixed to the top of the support column.

2. The optical path coupling adjustment device according to claim 1, characterized in that, The coaxial mounting bracket includes several coaxial mounting plates arranged linearly on the same axis. The coaxial mounting plates are circular or rectangular. The edges of the coaxial mounting plates are symmetrically provided with fixing holes. Coaxial connecting rods are inserted into the fixing holes to connect the coaxial mounting plates.

3. The optical path coupling adjustment device according to claim 2, characterized in that, The laser, collimator, polarizer or waveplate, and lens connected to the optical fiber are sequentially mounted in the center of the coaxial mounting plate.

4. The optical path coupling adjustment device according to claim 3, characterized in that, The test stage includes two grooves for corresponding test areas of SOA and ordinary laser chips. The front end of the groove is provided with a baffle, and there is a notch between the baffles to position the chip.

5. The optical path coupling adjustment device according to claim 4, characterized in that, The test platform has a small hole on its top for thermocouple temperature measurement while the TEC is supplying power for heating, ensuring the accuracy of temperature control.

6. The optical path coupling adjustment device according to claim 5, characterized in that, The test stage has a slope on the side of the groove to avoid blocking light, taking into account the divergence angle characteristics.

7. The optical path coupling adjustment device according to any one of claims 1 to 6, characterized in that, The five-dimensional adjustment frame includes a three-dimensional adjustment frame and a pitch angle adjustment frame. The pitch angle adjustment frame is fixed to the top surface of the three-dimensional adjustment frame, and a coaxial fixing frame is provided on the top of the pitch angle adjustment frame.

8. The optical path coupling adjustment device according to claim 7, characterized in that, The three-dimensional adjustment frame includes a base connected to the three-dimensional adjustment frame, and a rotating frame is provided on the top of the base. The rotating frame is mounted on the base through a pair of parallel rotating shafts and can rotate around a horizontal axis, driving the coaxial fixed frame to rotate. The rotating frame is connected to an angle adjustment screw to control the rotation angle in the horizontal and vertical directions. The angle adjustment screw is also provided with a locking nut to fix the adjusted angle position.

9. The optical path coupling adjustment device according to claim 8, characterized in that, The three-dimensional adjustment frame includes a base, an X-axis moving component fixed to the top of the base, a Y-axis moving component fixed to the top of the X-axis moving component, and a Z-axis moving component fixed to the top of the Y-axis moving component.

10. The optical path coupling adjustment device according to claim 9, characterized in that, The pitch angle adjustment frame is equipped with a coaxial fixing frame on its top via an adapter plate.

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