A solderability tester

Abstract

The utility model discloses a weldability tester relates to weldability tester technical field, include: workstation, the top of workstation installs drive structure, the execution end of drive structure installs test fixture, the top of workstation installs solder ball seat. The utility model discloses a gathering unit is set up, when trapezoidal abutment block is separated with spherical rod, the inside of solder ball seat is beaten to the beating plate under the action of rebound spring, make solder ball seat produce vibration, and the scattered solder tin is gathered together again, since the old solder ball of residual will melt with new solder ball after testing a test workpiece and need replacing solder ball, cause new solder ball to have impurity, thereby lead to the test result to be wrong, and vibration promotes old solder granule to fall off from the surface of solder ball seat and gather through mechanical force, reduce its contact area with new solder, thereby reduce the risk of component pollution, and further improve the accuracy of equipment detection result.

Description

Technical Field

[0001] This utility model relates to the technical field of solderability testers, specifically a solderability tester. Background Technology

[0002] Solderability testers are specialized equipment used to evaluate the solderability of electronic components, PCBs, solders, and other materials. They are mainly used in laboratory research and development and incoming material quality inspection in the electronics manufacturing field.

[0003] When performing solder ball method tests on a solderability tester, if there are impurities such as oil or oxides on the soldering end of some test workpieces, it will directly cause solder to drip. The dripped solder will adhere to the solder ball base. After each workpiece is tested, a new solder ball needs to be replaced. If the solder ball base is not thoroughly cleaned, the residual old solder ball will fuse with the new solder ball, resulting in incorrect test results. To address this issue, we provide a solderability tester to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide a solderability tester to address the problem that in solder ball testing, oil or oxides on the workpiece's soldering end can cause solder to drip and adhere to the base. If the old solder balls remaining on the base are not thoroughly cleaned, they can fuse with the new solder balls, leading to incorrect test results.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a solderability tester, comprising: a worktable, a drive structure mounted on the top of the worktable, a test fixture mounted on the execution end of the drive structure, and a solder ball holder mounted on the top of the worktable; a gathering unit located inside the solder ball holder for gathering solder dripping onto the top of the solder ball holder; and a blocking mechanism located inside the worktable for blocking splashed solder.

[0006] As a further embodiment of this utility model: the aggregation unit includes a plurality of trapezoidal sliders slidably connected inside the solder ball holder, each trapezoidal slider being fitted with a rebound spring between it and the solder ball holder, a connecting rod being fixedly connected to one side of the trapezoidal slider, a striking plate being fixedly connected to one side of the connecting rod, an extension rod being fixedly connected to the bottom of the connecting rod, and a ball rod being fixedly connected to one end of the extension rod.

[0007] As a further embodiment of this utility model: the gathering unit further includes an annular rotating frame rotatably connected inside the workbench, and a plurality of trapezoidal abutment blocks that abut against the spherical rod are fixedly connected to the inner side of the annular rotating frame. The workbench is provided with a driving component for driving the annular rotating frame to rotate.

[0008] As a further embodiment of this utility model: the driving component includes a servo motor fixedly connected inside the workbench, a spur gear fixedly connected to the actuating end of the servo motor, and a spur gear ring meshing with the spur gear fixedly connected to the inner side of the annular rotating frame.

[0009] As a further embodiment of this utility model: the blocking mechanism includes an annular baffle disposed inside the workbench and located on the outer wall of the solder ball holder. The top of the annular baffle is provided with an inclined surface, which slopes from the inside to the outside. The outer wall of the annular baffle is provided with a reciprocating thread, and the annular baffle is threadedly connected to the workbench.

[0010] As a further embodiment of this utility model: the blocking mechanism further includes two limiting plates fixedly connected to the outer wall of the annular rotating frame, and the inner side of the annular baffle is provided with a limiting slide that matches the limiting plate, and the annular baffle is slidably connected to the limiting plate through the limiting slide.

[0011] Compared with the prior art, the beneficial effects of this utility model are: 1. By setting up an aggregation unit, when the trapezoidal abutment block separates from the ball rod, the impact plate is driven by the rebound spring to strike the inside of the solder ball holder, causing the solder ball holder to vibrate and re-aggregate the scattered solder. Since the solder balls need to be replaced after testing a test workpiece, the residual old solder balls will fuse with the new solder balls, resulting in impurities in the new solder balls, which will lead to incorrect test results. Vibration, through mechanical force, causes the old solder particles to fall off from the surface of the solder ball holder and aggregate, reducing the contact area with the new solder, thereby reducing the risk of component contamination and improving the accuracy of the equipment test results. 2. By setting up a blocking mechanism, while the annular rotating frame rotates, the annular baffle rotates through the limiting plate. At this time, the annular baffle is connected to the worktable by threads and will rise synchronously with the workpiece inside the worktable. If the workpiece is high above the solder ball holder, the solder dripping will cause splattering. The rising of the annular baffle blocks the splattered solder, directly blocking the path of the solder to the outside and confining it within the closed space enclosed by the baffle and the solder ball holder. This prevents the splattered solder from falling into the equipment monitoring area and causing incorrect test results, thereby improving the accuracy of the equipment test results. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the internal structure of the workbench of this utility model; Figure 3 This is a schematic diagram of the inner structure of the annular rotating frame of this utility model; Figure 4This is a cross-sectional view of the annular baffle of this utility model.

[0013] In the diagram: 1. Workbench; 2. Drive structure; 3. Test fixture; 4. Welding ball holder; 5. Annular baffle; 6. Servo motor; 7. Spur gear; 8. Spur gear ring; 9. Annular rotating frame; 10. Limiting plate; 11. Impact plate; 12. Connecting rod; 13. Trapezoidal slider; 14. Rebound spring; 15. Extension rod; 16. Ball rod; 17. Trapezoidal abutment block; 18. Limiting slide. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, it should be noted that unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. The embodiments of this utility model will be described below based on its overall structure.

[0016] Please see Figures 1-4This embodiment provides a solderability tester, including: a workbench 1, a drive structure 2 mounted on the top of the workbench 1, a test fixture 3 mounted on the execution end of the drive structure 2, and a solder ball holder 4 mounted on the top of the workbench 1; a gathering unit located inside the solder ball holder 4, used to gather solder dripping onto the top of the solder ball holder 4, the gathering unit including multiple trapezoidal sliders 13 slidably connected inside the solder ball holder 4, each trapezoidal slider 13 having a rebound spring 14 installed between it and the solder ball holder 4, a connecting rod 12 fixedly connected to one side of each trapezoidal slider 13, and an impact plate 1 fixedly connected to one side of the connecting rod 12. 1. An extension rod 15 is fixedly connected to the bottom of the connecting rod 12. A ball rod 16 is fixedly connected to one end of the extension rod 15. The gathering unit also includes an annular rotating frame 9 rotatably connected inside the worktable 1. Multiple trapezoidal abutment blocks 17 that abut against the ball rod 16 are fixedly connected to the inner side of the annular rotating frame 9. The worktable 1 is provided with a driving component for driving the annular rotating frame 9 to rotate. The driving component includes a servo motor 6 fixedly connected inside the worktable 1. A spur gear 7 is fixedly connected to the execution end of the servo motor 6. A spur gear ring 8 that meshes with the spur gear 7 is fixedly connected to the inner side of the annular rotating frame 9. The drive structure 2 consists of a linear module, an electrical box, an electric actuator, and multiple transmission structures. The electrical box is installed at the actuator end of the linear module, and the test fixture 3 is installed at the actuator end of the electric actuator. Since the drive structure 2 is existing technology, it is not described in detail in this solution. When a workpiece needs to undergo solderability testing, it is clamped in test fixture 3 and then immersed in solder balls for testing. After the test, when the workpiece is lifted up, solder may drip due to impurities such as oil and oxides at the solder ends of some workpieces. The dripping solder will spread on the solder ball holder 4. At this time, the PLC controller starts the servo motor 6 to drive the spur gear 7, which in turn drives the spur gear ring 8 to rotate and cause the ring rotating frame 9 to rotate in a circle. At this time, multiple trapezoidal abutment blocks 17 abut against the ball rod 16, causing the striking plate 11 to move downward. When the trapezoidal contact block 17 separates from the ball rod 16, the impact plate 11, driven by the spring spring 14, strikes the inside of the solder ball holder 4, causing the solder ball holder 4 to vibrate and reassemble the scattered solder. Since the solder balls need to be replaced after testing a test workpiece, the residual old solder balls will fuse with the new solder balls, resulting in impurities in the new solder balls and thus causing incorrect test results. The vibration, through mechanical force, causes the old solder particles to fall off from the surface of the solder ball holder 4 and gather, reducing the contact area with the new solder, thereby reducing the risk of component contamination and improving the accuracy of the equipment test results.

[0017] Please see Figures 2-4The blocking mechanism is located inside the workbench 1 and is used to block the splashing solder. The blocking mechanism includes an annular baffle 5 located inside the workbench 1 and on the outer wall of the solder ball holder 4. The top of the annular baffle 5 is provided with an inclined surface, which is inclined from the inside to the outside. The outer wall of the annular baffle 5 is provided with reciprocating threads, and the annular baffle 5 is threadedly connected to the workbench 1. The blocking mechanism also includes two limiting plates 10 fixedly connected to the outer wall of the annular rotating frame 9. The inner side of the annular baffle 5 is provided with a limiting slide 18 that matches the limiting plate 10. The annular baffle 5 is slidably connected to the limiting plate 10 through the limiting slide 18. While the annular rotating frame 9 rotates, the annular baffle 5 is driven to rotate by the limiting plate 10. At this time, the annular baffle 5 is threadedly connected to the worktable 1 and will rise synchronously with the workpiece inside the worktable 1. If the workpiece is at a high height from the solder ball seat 4, the solder dripping will cause splattering. The rising of the annular baffle 5 blocks the splattered solder, directly blocking the path of the solder to the outside and confining it within the closed space enclosed by the baffle and the solder ball seat 4. This prevents the splattered solder from falling into the equipment monitoring area and causing incorrect test results, thereby improving the accuracy of the equipment test results.

[0018] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A solderability tester, characterized in that, include: A workbench (1) is provided with a drive structure (2) installed on the top of the workbench (1), a test fixture (3) is installed on the execution end of the drive structure (2), and a solder ball holder (4) is installed on the top of the workbench (1). The gathering unit, located inside the solder ball holder (4), is used to gather the solder that drips onto the top of the solder ball holder (4); A blocking mechanism, located inside the worktable (1), is used to block splashed solder.

2. The solderability tester according to claim 1, characterized in that, The aggregation unit includes a plurality of trapezoidal sliders (13) slidably connected inside the solder ball seat (4). Each trapezoidal slider (13) is connected to a rebound spring (14) between it and the solder ball seat (4). A connecting rod (12) is fixedly connected to one side of the trapezoidal slider (13). A striking plate (11) is fixedly connected to one side of the connecting rod (12). An extension rod (15) is fixedly connected to the bottom of the connecting rod (12). A ball rod (16) is fixedly connected to one end of the extension rod (15).

3. The solderability tester according to claim 2, characterized in that, The gathering unit also includes an annular rotating frame (9) rotatably connected inside the workbench (1). The inner side of the annular rotating frame (9) is fixedly connected with a plurality of trapezoidal abutment blocks (17) that abut against the spherical rod (16). The workbench (1) is provided with a driving component for driving the annular rotating frame (9) to rotate.

4. The solderability tester according to claim 3, characterized in that, The driving component includes a servo motor (6) fixedly connected inside the workbench (1), and a spur gear (7) fixedly connected to the execution end of the servo motor (6). A spur gear ring (8) meshing with the spur gear (7) is fixedly connected to the inner side of the annular rotating frame (9).

5. The solderability tester according to claim 4, characterized in that, The blocking mechanism includes an annular baffle (5) disposed inside the workbench (1) and located on the outer wall of the welding ball seat (4). The top of the annular baffle (5) is provided with an inclined surface, which is inclined from the inside to the outside. The outer wall of the annular baffle (5) is provided with a reciprocating thread, and the annular baffle (5) is threadedly connected to the workbench (1).

6. The solderability tester according to claim 5, characterized in that, The blocking mechanism also includes two limiting plates (10) fixedly connected to the outer wall of the annular rotating frame (9). The inner side of the annular baffle (5) is provided with a limiting slide (18) that matches the limiting plate (10). The annular baffle (5) is slidably connected to the limiting plate (10) through the limiting slide (18).

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