A thermal interface material volatility testing apparatus

Abstract

The utility model discloses a kind of thermal interface material volatility testing devices, including box and the heating platform for placing the measured member, the heating platform is located in the box, still include the condensation piece for volatile condensation in the box, the condensation piece is directly opposite the heating platform layout, the detection light path for detecting the light transmittance of the condensation piece is further provided in the box, the condensation piece is located on detection light path and its sheet face is perpendicular to the optical axis of detection light path.The utility model detects the light transmittance of condensation piece by detection light path in box while detecting volatile volatility, can realize the detection of optical performance attenuation caused by volatile, provides data support for the thermal interface material screening and reliability evaluation of optical module industry.

Description

Technical Field

[0001] This utility model relates to the technical field of optoelectronic communication industry, and in particular to a device for testing the volatility of thermal interface materials. Background Technology

[0002] Thermal interface materials play a crucial role in optical modules, ensuring timely heat dissipation, preventing component overheating, and maintaining optical stability. Thermal interface materials have evolved from silicon-based thermal pads to various types, including thermally conductive gels, non-silicon thermally conductive materials, carbon fiber heat dissipation materials, and graphene heat dissipation materials. The heat dissipation coefficient of silicon-based thermal interface materials has also increased from the initial 1.5 W / m·K to 20 W / m·K. However, small-molecule volatiles in these thermal interface materials may form thin films or deposits on the surface of optical components in optical modules, leading to reduced light transmittance. In severe cases, this can corrode the light-transmitting substrate, affecting the transmission quality and intensity of optical signals, and consequently reducing the sensitivity and clarity of the optical module. Therefore, it is necessary to test the volatility of thermal interface materials and the impact of these volatiles on the optical performance of optical components.

[0003] The currently accepted testing method in the industry involves placing the sample in a vacuum environment, heating it to a constant temperature, calculating the total mass loss (TML) by measuring the difference between the initial and remaining mass of the sample, and simultaneously collecting condensable volatiles on the condensation plate to calculate their proportion (CVCM). However, the above test has the following problem: it can only detect the amount of volatiles in the sample and lacks the ability to detect the impact of volatiles on optical properties (such as light transmittance). Therefore, there is an urgent need for a testing device for the volatility of thermal interface materials to solve the above problems. Utility Model Content

[0004] To address the aforementioned issues, this invention provides a device for testing the volatility of thermal interface materials, comprising a housing and a heating stage for placing the test piece. The heating stage is located within the housing. The device also includes a condenser plate disposed within the housing for condensing volatiles. The condenser plate is positioned directly opposite the heating stage. The housing further includes a detection optical path for detecting the transmittance of the condenser plate. The condenser plate is located on the detection optical path, and its surface is perpendicular to the optical axis of the detection optical path.

[0005] Furthermore, the condenser plate is also connected to a first adjustment mechanism for driving it to switch between a condensation position and a light transmission detection position. In the condensation position, the condenser plate is located directly above the heating stage and its surface is perpendicular to the vertical direction. In the light transmission detection position, the condenser plate is located on the detection light path and its surface is perpendicular to the optical axis of the detection light path.

[0006] Furthermore, the first adjustment mechanism includes a rotary drive unit, and the condenser plate is disposed at the output end of the rotary drive unit.

[0007] Furthermore, the output end of the first adjustment mechanism is provided with a suction cup, and the condenser plate is adsorbed onto the suction cup.

[0008] Furthermore, the condenser plate is also connected to a second adjustment mechanism for driving it closer to or further away from the heating platform, and the first adjustment mechanism is located at the output end of the second adjustment mechanism.

[0009] Furthermore, the second adjustment mechanism includes a horizontal slide rail, a slider, and a telescopic rod. The horizontal slide rail is connected to the housing, the slider is movably mounted on the horizontal slide rail, the telescopic rod is mounted on the slider, the axis of the telescopic rod is parallel to the vertical direction, and the first adjustment mechanism is located at the bottom of the telescopic rod.

[0010] Furthermore, a first optical window and a second optical window are respectively provided on two opposite side walls of the housing. The first optical window is equipped with a detection light source, and the second optical window is equipped with a transmittance detection unit. A detection optical path is formed between the detection light source and the transmittance detection unit.

[0011] Furthermore, the inner sides of the first optical window and the second optical window are respectively provided with a shielding plate, and each shielding plate is connected to a lifting mechanism for driving it to shield or move away from the corresponding optical window.

[0012] Furthermore, the box body is provided with a gas inlet / outlet channel that communicates with the inner cavity of the box body.

[0013] Furthermore, a temperature sensor is provided on the heating platform.

[0014] By adopting the above technical solution, this utility model has the following beneficial effects compared with the prior art:

[0015] 1) The thermal interface material volatility testing device provided by this utility model can detect the transmittance of the condenser plate through the detection optical path inside the chamber while detecting the volatility of the volatiles. It can detect the optical performance degradation caused by the volatiles, and provide data support for the screening and reliability assessment of thermal interface materials in the optical module industry.

[0016] 2) The thermal interface material volatility testing device provided by this utility model has a gas inlet and outlet channel on the chamber that is connected to the inner cavity of the chamber. By adjusting the gas introduced, the normal pressure working environment of the optical module can be simulated, and the temperature application environment of the optical module can be simulated by the heating table, thereby improving the testing accuracy of thermal interface materials in the field of optical module application. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 Schematic diagram of the testing device provided by this utility model Figure 1 ;

[0019] Figure 2 Schematic diagram of the testing device provided by this utility model Figure 2 ;

[0020] Figure 3 A schematic diagram of the usage status of the testing device provided by this utility model. Figure 1 (The condensing silicon wafer is located at the condensation position);

[0021] Figure 4 A schematic diagram of the usage status of the testing device provided by this utility model. Figure 2 (The condensed silicon wafer is located at the light transmission detection position).

[0022] 1-Box body; 11-Observation window; 12-Control panel; 13-First optical window; 14-Second optical window; 15-Gas interface; 2-Test piece; 3-Heating stage; 31-Temperature control module; 32-Sample placement stage; 4-Cooling silicon wafer; 5-Detection optical path; 6-First adjustment mechanism; 61-Suction cup; 7-Second adjustment mechanism; 71-Horizontal slide rail; 72-Slider; 73-Telescopic rod; 8-Inlet pipe; 81-Gas control valve. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model. In the accompanying drawings, the dimensions and relative dimensions of certain parts may be enlarged for clarity.

[0024] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connection" and "connected" should be interpreted broadly. For example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0025] In the description of this utility model, the terms "upper", "lower", "left", "right", "front", "back", "center", "horizontal", "vertical", "top", "bottom", "inner", and "outer" are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0026] Furthermore, in the description of this utility model, the terms "first" and "second" are used merely for descriptive distinction and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Additionally, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0027] As per the instruction manual Figure 1-2 As shown, this utility model provides a testing device for the volatility of thermal interface materials, including a housing 1 and a heating stage 3 for placing the test piece 2. The heating stage 3 is located inside the housing 1. It also includes a condenser plate disposed inside the housing 1 for condensing volatiles. The condenser plate is positioned directly opposite the heating stage 3. The housing 1 also includes a detection optical path 5 for detecting the transmittance of the condenser plate. The condenser plate is located on the detection optical path 5, and its surface is perpendicular to the optical axis of the detection optical path 5. In this embodiment, to simulate the deposition of volatiles on the optical elements of an optical module, the condenser plate is preferably a silicon wafer 4.

[0028] Specifically, the test piece 2 refers to a sample made of a thermal interface material. It is placed on a heating stage 3 for evaporation and condensation testing. The heating stage 3 can heat the test piece 2 as needed, with the condensation silicon wafer 4 facing the heating stage 3. The gas volatilized from the test piece condenses on the condensation silicon wafer 4. Weighing the condensation silicon wafer 4 before and after condensation allows for the calculation of the condensation amount. Simultaneously, weighing the test piece 2 before and after condensation allows for the calculation of the evaporation amount. Once the evaporation test has progressed to a certain point or is completed, the transmittance of the condensation silicon wafer 4 can be detected through the detection optical path 5, providing data guidance for understanding the impact of thermal interface material volatilization on optical module applications.

[0029] The condensed silicon wafer 4 is positioned directly opposite the heating platform 3. During use, the heating platform 3 can be positioned at the bottom or side wall of the housing 1 as needed, with the condensed silicon wafer 4 facing the heating platform and its surface parallel or perpendicular to the surface of the heating platform 3. In this embodiment, the heating platform 3 is positioned at the bottom of the housing 1. When the test piece evaporates and condenses, the condensed silicon wafer 4 is located directly above the heating platform 3 with its surface parallel to the surface of the heating platform 3.

[0030] In an optimized implementation, the condensed silicon wafer 4 is also connected to a first adjustment mechanism 6 for driving it to switch between a condensation position and a light transmission detection position. In the condensation position, the condensed silicon wafer 4 is located directly above the heating stage 3 and its surface is perpendicular to the vertical direction. In the light transmission detection position, the condensed silicon wafer 4 is located on the detection optical path 5 and its surface is perpendicular to the optical axis of the detection optical path 5.

[0031] Preferably, the size of the condensed silicon wafer 4 is larger than the size of the test piece 2.

[0032] Preferably, the condensed silicon wafer 4 is monocrystalline silicon.

[0033] In some embodiments, the housing 1 is a sealed housing with a sealed test chamber, in which the heating platform 3, the condenser silicon wafer 4, and the first adjustment mechanism 6 are all located. The housing 1 is preferably made of stainless steel with a wall thickness of 2-5 mm.

[0034] Preferably, the front of the chamber 1 is provided with an observation window 11, which is made of tempered glass, is heat-resistant, and can meet the testing requirements. It is used to observe the sample volatilization state and the state of the condensed silicon wafer in real time, and to adjust the setting parameters in a timely manner. The chamber 1 is also provided with a control panel 12, and the heating stage 3 is electrically connected to the control panel 12 for controlling the heating stage 3 and displaying parameters such as temperature.

[0035] In an optimized implementation, a first optical window 13 and a second optical window 14 are respectively provided on two side walls of the housing 1. The two side walls are arranged opposite each other. Light-transmitting holes are respectively opened on the left and right side walls of the housing 1, and the first optical window 13 and the second optical window 14 are respectively installed by a metal pressure flange sealing method. The optical windows are made of high-temperature resistant and high-transmittance quartz glass, which can meet the testing requirements, allow the detection beam to pass through, and reduce the influence on the detection beam. The first optical window 13 is equipped with a detection light source (not shown in the figure), and the second optical window 14 is equipped with a transmittance detection unit (not shown in the figure). A detection optical path 5 is formed between the detection light source and the transmittance detection unit. To prevent volatiles from adhering to the detection light source and the transmittance detection unit, the detection light source and the transmittance detection unit are respectively set on the outside of the housing 1. The detection light source emits a detection beam that passes through the first optical window 13, the condensed silicon wafer 4, and the second optical window 14 in sequence before being received by the transmittance detection unit to obtain the transmittance data of the condensed silicon wafer, as shown in the appendix to the specification. Figure 4 As shown in the instruction manual. Figure 3-4 As shown, during the condensation process of volatiles, the condensing silicon wafer 4 is placed horizontally. During transmittance detection, the condensing silicon wafer 4 is rotated to a vertical position under the action of the first adjustment mechanism 6. After the first adjustment mechanism 6 rotates the condensing silicon wafer 4 by 90°, the surface of the condensing silicon wafer 4 is parallel to the vertical and perpendicular to the detection optical path, so that the detection optical path passes horizontally through the vertically set condensing silicon wafer 4 to perform offline optical measurements before and after the test.

[0036] As one specific implementation, the detection light source is an infrared light source with a wavelength of 1310nm or 1550nm, and the transmittance detection unit is an infrared spectrometer.

[0037] As one specific implementation, the detection light source is a laser with a specific wavelength, and the transmittance detection unit is an optical power meter.

[0038] Preferably, to ensure the detection optical path 5 passes horizontally through the condensed silicon wafer 4 and simplify the movement path of the first adjustment mechanism 6, the first optical window 13 and the second optical window 14 are coaxially arranged. Under the action of the first adjustment mechanism 6, the condensed silicon wafer 4 can be rotated 90° from a horizontal position to a vertical position for transmittance detection. Under the action of the first adjustment mechanism 6, the condensed silicon wafer 4 can be rotated 90° in the opposite direction to reset and continue the condensation operation. The transmittance of the condensed silicon wafer 4 can be detected periodically to obtain the relationship between evaporation time and transmittance. The first optical window 13 and the second optical window 14 are set at equal heights, and their height positions are aligned with the detection optical path to the center area of ​​the vertically positioned condensed silicon wafer 4 to ensure the accuracy of the detection data.

[0039] In an optimized implementation, to prevent volatiles from adhering to the first optical window 13 and the second optical window 14 and affecting optical detection, a shielding plate is provided on the inner side of each of the first optical window 13 and the second optical window 14, where "inner side" refers to the side located inside the housing 1. Each shielding plate is connected to a lifting mechanism for driving it to shield or move away from the corresponding optical window. The lifting mechanism can drive the shielding plate to rise and fall. During the condensation process of volatiles, the shielding plate moves to the same height as the optical window under the drive of the lifting mechanism to shield the corresponding optical window and prevent volatiles from adhering to the optical window and affecting the accuracy of detection. During the light transmission detection process, the shielding plate moves away from the optical window under the drive of the lifting mechanism, allowing the detection light path to pass through the optical window for optical detection.

[0040] In an optimized implementation, the first adjustment mechanism 6 includes a rotary drive unit, and the condensed silicon wafer 4 is disposed at the output end of the rotary drive unit, which drives the condensed silicon wafer 4 to rotate.

[0041] As one specific embodiment, the rotary drive unit has a rotating shaft, and the condensed silicon wafer 4 is connected to the rotating shaft. The rotating shaft rotates, causing the condensed silicon wafer 4 to rotate. To achieve intelligent control of the condensed silicon wafer 4, the rotating shaft can be driven by a motor. Alternatively, other rotary drive units can be used to rotate the condensed silicon wafer 4, allowing it to switch between a condensation position and a light transmission detection position.

[0042] In an optimized implementation, the output end of the first adjustment mechanism 6 is equipped with a suction cup 61, onto which the condensed silicon wafer 4 is adsorbed. The condensed silicon wafer 4 is adsorbed onto the suction cup 61 by vacuum adsorption, facilitating the placement and removal of the condensed silicon wafer 4, and the suction cup 61 will not damage the condensed silicon wafer 4. The back of the condensed silicon wafer 4 is provided with a vacuum adsorption groove with a depth of 2mm for adsorption by the suction cup 61.

[0043] In an optimized implementation, the condensed silicon wafer 4 is further connected to a second adjustment mechanism 7 for driving it closer to or further away from the heating stage 3. The first adjustment mechanism 6 is located at the output end of the second adjustment mechanism 7. The second adjustment mechanism 7 is located at the upper part of the sealed test chamber, and can adjust the spatial position of the condensed silicon wafer 4 so that the distance between the condensed silicon wafer 4 and the heating stage 3 is within a set range.

[0044] In an optimized implementation, the second adjustment mechanism 7 includes a horizontal slide rail 71, a slider 72, and a telescopic rod 73. The horizontal slide rail 71 is connected to the housing 1. The slider 72 is movably mounted on the horizontal slide rail 71 and can move along the horizontal slide rail 71 to adjust the horizontal position of the condensing silicon wafer 4. The telescopic rod 73 is mounted on the slider 72, and the axis of the telescopic rod 73 is parallel to the vertical. The first adjustment mechanism 6 is located at the bottom of the telescopic rod 73. The telescopic rod 73 can extend and retract axially to adjust the height of the condensing silicon wafer 4, thereby adjusting the distance between the condensing silicon wafer 4 and the heating platform 3 to meet various testing requirements and improve testing flexibility.

[0045] As one specific implementation, the telescopic rod 73 can be a hydraulic rod. After the condensation process is completed, when the condensed silicon wafer rotates to a vertical position, the condensed silicon wafer is not in the optimal optical detection position. The height of the condensed silicon wafer can be adjusted by the telescopic rod to the optical test setting position for optical detection.

[0046] As one specific implementation, the telescopic rod 73 can be made of two threaded screws, and the length of the telescopic rod 73 can be adjusted by screwing the screws in and out.

[0047] In an optimized implementation, the housing 1 is provided with a gas inlet / outlet channel communicating with the inner cavity of the housing 1. The gas inlet / outlet channel includes an inlet pipe and an outlet pipe. A gas interface 15 is provided on the housing 1, and an inlet pipe 8 is connected to the gas interface 15. The gas interface 15 is equipped with a quick-connect connector. The inlet pipe 8 is used to connect a vacuum pump or a nitrogen cylinder, allowing for the setting of different atmospheres and pressure environments according to testing requirements, simulating the operating environment of the optical module. A gas control valve 81 is provided on the inlet pipe 8 for adjusting the gas flow rate. The gas flow rate adjustment range is 0.1L / min to 5L / min.

[0048] Preferably, the housing 1 is equipped with two gas inlets 15 to facilitate the uniform distribution of gas within the housing 1.

[0049] Preferably, the heating stage 3 is located at the bottom of the housing 4. The heating stage 3 includes a temperature control module 31 and a sample placement stage 32. The sample placement stage 32 is positioned above the temperature control module, and the sample to be tested 2 is placed on the sample placement stage 32. The temperature control module can regulate the temperature to simulate operating temperature conditions. The sample placement stage 32 is preferably made of a material with high thermal conductivity for heat conduction. The temperature control module 31 is equipped with a temperature sensor for monitoring the temperature. The temperature sensor is connected to the control panel 12 and can display the real-time temperature.

[0050] As one specific real-time method, the control panel 12 can adjust the temperature of the heating platform 3, the constant temperature time, the heating time, and the cooling time. The heating rate can be programmably set to 1-10℃ / min, precisely controlling the temperature range. The control panel 12 has a built-in data storage module that can record temperature-time curve data.

[0051] Preferably, the temperature control module 31 has a built-in heating wire for heating, and in conjunction with a temperature sensor, the temperature control range is -40℃ to 180℃. The outer shell of the temperature control module 31 is made of ceramic material.

[0052] Preferably, the sample placement stage 32 is made of aluminum, and its size is adapted to the temperature control module 31 and larger than the size of the sample to be tested 2. The sample placement stage 32 has an anodized surface and is detachably connected to the temperature control module 31 by magnetic attraction, making it easy to remove as a whole for weighing the sample to be tested 2.

[0053] During the testing process, the temperature can be gradually increased and held for a certain period of time to test the volatility of the sample 2. By cycling the temperature, the aging environment of the thermal interface material in the optical module can be simulated. The magnetic sample placement stage 32 is easy to disassemble, and the total mass loss due to evaporation (TML) can be weighed and calculated.

[0054] The specific test procedures are as follows:

[0055] I. Weight-based evaluation process:

[0056] 1. Initial weighing: Place the weighed (M1) thermal interface material sample in the center of the sample placement stage 32; weigh the clean condensed silicon wafer 4 (M... s1 After that, it is horizontally fixed to the first adjustment mechanism 6 by suction cup.

[0057] 2. Test setup: Adjust the condenser silicon wafer 4 to the target position via the second adjustment mechanism 7; set the temperature program via the control panel (e.g., -40℃ to 85℃ cycle, heating / cooling rate 10℃ / min, high / low temperature held for 30min each, cycle 500 times); open the gas control valve to maintain normal pressure air environment or other set atmosphere.

[0058] 3. Perform the test: Start the test program and monitor the condensation and deposition of volatiles on the silicon wafer through the observation window.

[0059] 4. Final weighing: After the test, remove the sample and weigh it (M2). Calculate the total mass loss TML = (M1-M2) / M1×100%; remove the condensed silicon wafer and weigh it (M... s2 ), calculate the condensable volatile content CVCM=(M s2 -M s1 ) / M1×100%.

[0060] II. Optical performance evaluation process:

[0061] 1. Pre-test baseline measurement (initial optical value T0): After completing the initial weighing as described above, rotate the clean condensed silicon wafer 4 to a vertical position, and precisely align the external infrared light source and external infrared spectrometer with the first optical window 13 and the second optical window 14, respectively, to measure and record the initial transmittance baseline value T0 of the condensed silicon wafer 4 at a specific wavelength.

[0062] 2. Perform a volatility test: Restore the condensed silicon wafer 4 to a horizontal position and fix it, and then perform the complete gravimetric evaluation process described above.

[0063] 3. Post-test comparative measurement (final optical value T): After the gravimetric test, the condensed silicon wafer 4 with condensate attached was turned into a vertical position again, and its transmittance T was measured again under the same conditions (same equipment, same position, same wavelength).

[0064] 4. Data Analysis: The transmittance change ΔT = (T / T0) × 100% is calculated. This value directly quantifies the degree of attenuation of optical performance caused by the condensation and deposition of volatiles in the thermal interface material, providing key data for the reliability design of optical modules.

[0065] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0066] Those skilled in the art will understand that this invention can be implemented in many other specific forms without departing from the spirit and scope of this invention. Although embodiments of this invention have been described, it should be understood that this invention is not limited to these embodiments, and those skilled in the art can make changes and modifications within the spirit and scope of this invention as defined in the appended claims.

Claims

1. A testing device for the volatility of thermal interface materials, comprising a housing and a heating stage for placing the test piece, wherein the heating stage is located within the housing, characterized in that, It also includes a condenser plate for condensing volatiles, which is installed inside the chamber and is positioned facing the heating stage. The chamber is also equipped with a detection optical path for detecting the light transmittance of the condenser plate, and the condenser plate is located on the detection optical path with its surface perpendicular to the optical axis of the detection optical path.

2. The thermal interface material volatility testing device according to claim 1, characterized in that, The condenser plate is also connected to a first adjustment mechanism for driving it to switch between a condensation position and a light transmission detection position. In the condensation position, the condenser plate is located directly above the heating stage and its surface is perpendicular to the vertical direction.

3. The thermal interface material volatility testing device according to claim 2, characterized in that, The first adjustment mechanism includes a rotary drive unit, and the condenser plate is disposed at the output end of the rotary drive unit.

4. The thermal interface material volatility testing device according to claim 2, characterized in that, The output end of the first adjustment mechanism is equipped with a suction cup, and the condenser plate is adsorbed onto the suction cup.

5. The thermal interface material volatility testing device according to claim 2, characterized in that, The condenser plate is also connected to a second adjustment mechanism for driving it closer to or further away from the heating platform, and the first adjustment mechanism is located at the output end of the second adjustment mechanism.

6. The thermal interface material volatility testing device according to claim 5, characterized in that, The second adjustment mechanism includes a horizontal slide rail, a slider, and a telescopic rod. The horizontal slide rail is connected to the housing, the slider is movably mounted on the horizontal slide rail, and the telescopic rod is mounted on the slider. The axis of the telescopic rod is parallel to the vertical direction, and the first adjustment mechanism is located at the bottom of the telescopic rod.

7. The thermal interface material volatility testing device according to claim 1, characterized in that, The housing has a first optical window and a second optical window on two opposite side walls, respectively. The first optical window is equipped with a detection light source, and the second optical window is equipped with a transmittance detection unit. A detection optical path is formed between the detection light source and the transmittance detection unit.

8. The thermal interface material volatility testing device according to claim 7, characterized in that, The inner sides of the first optical window and the second optical window are respectively provided with a shielding plate, and each shielding plate is connected to a lifting mechanism for driving it to shield or move away from the corresponding optical window.

9. The thermal interface material volatility testing device according to claim 1, characterized in that, The box is equipped with a gas inlet / outlet channel that communicates with the inner cavity of the box.

10. The thermal interface material volatility testing device according to claim 1, characterized in that, The heating platform is equipped with a temperature sensor.

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