An LCOS chip optical quality detection mechanism

Abstract

The utility model relates to the chip detection field, specifically disclose a kind of LCOS chip optical quality detection mechanism, including laser transmitter;Several groups of beam expanders;Chip's backplate of being fixed, laser transmitter, several groups of beam expanders and backplate are sequentially arranged on same horizontal line, and beam expander can be with the laser of laser transmitter emission beam expansion irradiation to the chip on backplate;Projection light shield, projection light shield receives the laser after reflection by backplate;Bottom plate, laser transmitter, several groups of beam expanders, chip's backplate of being fixed and projection light shield can be detachably installed on bottom plate.This side can be quickly disassembled to chip on backplate, the projection image of chip is quickly detected and known, can effectively improve detection efficiency, and detection cost is low.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to an optical quality testing mechanism for LCOS chips. Background Technology

[0002] In the current field of LCOS chip production and testing, the industry commonly uses cell thickness measuring instruments to determine whether the die filling of the chip is sufficient. These cell thickness measuring instruments do have certain advantages in terms of data measurement accuracy, providing relatively precise measurement results.

[0003] However, its shortcomings are also quite obvious. Not only does it require a high investment in equipment purchase, making it relatively expensive, but the actual measurement operation involves a rather cumbersome and complex process, requiring operators to follow a specific procedure step by step. Based on these characteristics, the measuring instrument is feasible for measuring a small number of chips in a laboratory environment, and can meet the laboratory's requirements for measurement accuracy and operating environment.

[0004] However, applying it to large-scale chip verification work after factory production will highlight many problems. From a cost perspective, since the number of chips produced in the factory is usually large, using a box thickness measuring instrument to test each chip will lead to excessively high overall testing costs, increasing the company's production costs. From a time perspective, the cumbersome measurement steps will make the testing process too time-consuming, affecting the factory's production efficiency and product turnover speed, making it difficult to adapt to the pace and needs of large-scale factory production. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides an optical quality inspection mechanism for LCOS chips, which solves the problems of low inspection efficiency and high inspection cost when using a cell thickness measuring instrument to inspect chips.

[0006] To achieve the above objectives, the basic solution of this utility model is as follows: an LCOS chip optical quality inspection mechanism, comprising:

[0007] Laser emitter;

[0008] Several sets of beam expanders;

[0009] A backplate that can fix the chip, a laser emitter, several sets of beam expanders and the backplate are arranged in sequence on the same horizontal line. The beam expanders can expand the laser beam emitted by the laser emitter and irradiate the chip on the backplate.

[0010] A projection light-blocking plate receives the laser light reflected from the back plate.

[0011] The base plate, laser emitter, several beam expanders, back plate for fixing chips, and projection light shield can all be detached and installed on the base plate.

[0012] The technical principle of this invention is as follows: When using an LCOS chip optical quality inspection mechanism to inspect a chip, the chip to be inspected is fixed and adhered to the side of the backplate near the beam expander using a thermally conductive adhesive. At this time, the chip to be inspected, the laser emitter, the two beam expanders, and the backplate are on the same horizontal line, forming a complete optical path system. Then, the laser emitter is turned on, and the laser emitted by the laser emitter is expanded by several sets of beam expanders, so that it can fully irradiate the surface of the chip. After the laser irradiates the chip surface, a reflection phenomenon occurs on the chip surface. The reflected laser beam carries relevant information about the chip surface, such as the crystal filling status, and propagates to the projection light-blocking plate, forming an image of the crystal filling result on its surface. At this time, the operator can judge the quality status of the chip, such as whether the crystal filling is sufficient, by observing the image formed on the projection light-blocking plate. The inspection results can be fed back in time, which is convenient for adjusting the production process in a timely manner based on the results.

[0013] In the above process, the chip can be quickly installed and removed from the backplane, and the projected image of the chip can be quickly detected, which can effectively improve the detection efficiency and reduce the detection cost.

[0014] Furthermore, the number of beam expanders is two.

[0015] With the above setup, the laser emitted by the laser emitter first passes through the first set of beam expanders, which expand the beam for the first time, and then passes through the second set of beam expanders for the second time. After these two beam expansion operations, the irradiation range of the laser is significantly amplified, which can completely cover and shroud the entire surface of the chip, enabling comprehensive detection of the chip.

[0016] Furthermore, it also includes a first lifting adjustment rod, with the laser emitter mounted on the top of the first lifting adjustment rod, and the lower end of the first lifting adjustment rod detachably connected to the base plate.

[0017] By adjusting the first lifting adjustment rod according to the chip's position, the height of the laser emitter can be adjusted, thereby improving the adjustability of the entire LCOS chip optical quality inspection mechanism during use.

[0018] Furthermore, it also includes several second lifting adjustment rods, with the beam expander mounted on the top of the second lifting adjustment rods, and the lower end of the second lifting adjustment rods detachably connected to the base plate.

[0019] By adjusting the second lifting adjustment rod according to the position of the chip and the laser emitter, the height of the beam expander can be adjusted, which can improve the alignment of the chip, the laser emitter and the beam expander, making it easier to obtain accurate projected images, and further improving the adjustability of the entire LCOS chip optical quality inspection mechanism during use.

[0020] Furthermore, it also includes a slide rail, which is horizontally fixedly installed on the base plate. The lower ends of the second lifting adjustment rod and the second lifting adjustment rod are each provided with a first slider that can slide and lock with the slide rail.

[0021] By using a slide rail, the distance and horizontal position between the laser emitter and the beam expander can be adjusted by the first slider, which makes it easy for the laser irradiation range to cover the entire surface of the chip, and also makes it easy to adjust the position of the laser emitter and the beam expander in an adaptive and precise manner.

[0022] Furthermore, it also includes a second slider that can slide and lock into the slide rail, the second slider being mounted on the underside of the back plate.

[0023] With the above settings, the relative position between the backplate and the laser emitter and beam expander can be controlled, that is, the relative position between the chip under test and the laser emitter and beam expander can be adjusted, making the chip position adjustment more flexible during testing.

[0024] Furthermore, it also includes bolts. The longitudinal section of the back plate is "L"-shaped. A keyway-shaped groove runs vertically through the lower end of the back plate. The end of the bolt passes through the groove and is threadedly connected to the second slider. The bolt can abut against the upper side of the lower end of the back plate and can slide horizontally within the groove.

[0025] With the above settings, when installing the chip onto the backplate, several chips can be pasted simultaneously along the horizontal direction of the backplate; after one chip has completed the test, the backplate is pushed horizontally, and the bolts on the backplate move relative to the grooves on the backplate. At this time, the backplate drives the next chip to face the laser, which can quickly perform laser reflection detection, further improving the detection efficiency.

[0026] Furthermore, it also includes an annular anti-slip pad, which is coaxially mounted on the lower end of the bolt and located between the second slider and the lower surface of the back plate.

[0027] With the above setup, the anti-slip pads and bolts ensure the horizontal stability of the backplate, allowing the remaining chips to face the laser in sequence, thus improving detection accuracy and efficiency. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the axial side structure of an LCOS chip optical quality detection mechanism in an embodiment of this utility model.

[0029] Figure 2 for Figure 1 A schematic diagram of the structure of the backplate in the axial direction.

[0030] In the above figures: laser emitter 10, beam expander 20, back plate 30, slide rail 301, projection light blocking plate 40, base plate 50, first lifting adjustment rod 601, second lifting adjustment rod 602, slide rail 70, second slider 701, bolt 801, anti-slip pad 802. Detailed Implementation

[0031] The technical solution of this utility model will be further described below with reference to the accompanying drawings and embodiments.

[0032] This embodiment is basically as follows: Figure 1 and Figure 2 As shown in the figure, this utility model embodiment proposes an optical quality testing mechanism for an LCOS chip, including a laser emitter 10, two sets of beam expanders 20, a back plate 30 for fixing the chip, a projection light-blocking plate 40, a base plate 50, a first lifting adjustment rod 601, two sets of second lifting adjustment rods 602, a slide rail 70, a second slider 701 that can slide and lock with the slide rail 70, a bolt 801, and an annular anti-slip pad 802. The laser emitter 10, the two sets of beam expanders 20, and the back plate 30 are arranged sequentially on the same horizontal line. The beam expanders 20 can expand the laser beam emitted by the laser emitter 10 to irradiate the chip on the back plate 30. The projection light-blocking plate 40 receives the laser reflected by the back plate 30.

[0033] At the same time, such as Figure 1 As shown, the laser emitter 10 is mounted on the top of the first lifting adjustment rod 601, the beam expander 20 is mounted on the top of the second lifting adjustment rod 602, and the slide rail 70 is horizontally fixed on the base plate 50. The lower ends of the first lifting adjustment rod 601 and the second lifting adjustment rod 602 are each provided with a first slider that can slide and lock with the slide rail 70. The first lifting adjustment rod 601 and the second lifting adjustment rod 602 adopt Thorlabs' Z8 series lifting structure.

[0034] like Figure 1 and Figure 2 As shown, the longitudinal section of the back plate 30 is L-shaped. A keyway-shaped groove 301 runs vertically through the lower end of the back plate 30, and the length direction of the groove 301 is parallel to the horizontal direction of the back plate 30. The end of the bolt 801 passes through the groove 301 and is threadedly connected to the second slider 701. The bolt 801 can abut against the upper side of the lower end of the back plate 30, and the bolt 801 can slide horizontally within the groove 301. The anti-slip pad 802 is coaxially mounted on the lower end of the bolt 801, and the anti-slip pad 802 is located between the second slider 701 and the lower surface of the back plate 30.

[0035] like Figure 1As shown, the projection light blocking plates 40 are all fixedly installed on the base plate 50 by bolts 801, and the projection light blocking plates 40 are located on the right side of the back plate 30 and the side of the laser emitter 10.

[0036] In addition, both beam expanders 20 are 532nm10x laser beam expanders 20.

[0037] In this embodiment, an LCOS chip optical quality inspection mechanism is used to first fix and adhere several chips to be inspected to the right side of the back plate 30 using thermal conductive adhesive. Several chips can be pasted simultaneously along the horizontal direction of the back plate 30 to achieve batch pasting of chips, preparing for subsequent batch inspection.

[0038] Before testing, the height of the first lifting adjustment rod 601 and the second lifting adjustment rod 602 are adjusted according to the position of the chip to adjust the height of the laser emitter 10 and the beam expander 20 so that the chip under test is on the same horizontal line as the laser emitter 10 and the beam expander 20.

[0039] Then, the laser emitter 10 is turned on. The laser emitted by the laser emitter 10 first passes through the first set of beam expanders 20, which performs the first beam expansion. Then, it passes through the second set of beam expanders 20 for the second beam expansion. Through these two beam expansion operations, the irradiation range of the laser is significantly amplified, completely covering and enveloping the entire surface of the chip. After the laser irradiates the chip surface, it is reflected. The reflected laser beam carries relevant information about the chip surface, such as the crystal filling status, and propagates to the projection light-blocking plate 40, forming an image of the crystal filling result on its surface. At this time, the operator can judge the quality status of the chip, such as whether the crystal filling is sufficient, by observing the image formed on the projection light-blocking plate 40. The operator can then provide timely feedback on the test results, facilitating timely adjustments to the production process based on the results.

[0040] When testing the next chip, the back plate 30 is pushed horizontally, and the bolt 801 on the back plate 30 moves relative to the slide groove 301 on the back plate 30. At this time, the back plate 30 drives the next chip to face the laser, and the laser reflection detection can be performed quickly. During this process, the anti-slip pad 802 and the bolt 801 can ensure the horizontal stability of the back plate 30, so that the remaining chips can face the laser in turn, improving the detection efficiency. The overall detection efficiency is improved by nearly 50%.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An optical quality inspection mechanism for LCOS chips, characterized in that, include: Laser emitter; Several sets of beam expanders; A backplate that can fix the chip is provided. The laser emitter, several sets of beam expanders and the backplate are arranged in sequence on the same horizontal line. The beam expanders can expand the laser beam emitted by the laser emitter and irradiate the chip on the backplate. A projection light-blocking plate, wherein the projection light-blocking plate receives laser light reflected from a back plate; The base plate, the laser emitter, several sets of beam expanders, the back plate for fixing the chip, and the projection light-blocking plate can all be detachably installed on the base plate.

2. The LCOS chip optical quality inspection mechanism as described in claim 1, characterized in that, The number of beam expanders is two.

3. The LCOS chip optical quality testing mechanism as described in claim 2, characterized in that, It also includes a first lifting adjustment rod, the laser emitter is mounted on the top of the first lifting adjustment rod, and the lower end of the first lifting adjustment rod is detachably connected to the base plate.

4. The LCOS chip optical quality inspection mechanism as described in claim 3, characterized in that, It also includes several second lifting adjustment rods, the beam expander is installed on the top of the second lifting adjustment rods, and the lower end of the second lifting adjustment rods is detachably connected to the base plate.

5. The LCOS chip optical quality inspection mechanism as described in claim 4, characterized in that, It also includes a slide rail, which is horizontally fixedly installed on the base plate. The lower ends of the second lifting adjustment rod and the second lifting adjustment rod are each provided with a first slider that can slide and lock with the slide rail.

6. The LCOS chip optical quality inspection mechanism as described in claim 5, characterized in that, It also includes a second slider that can slide and lock into the slide rail, the second slider being mounted on the underside of the back plate.

7. The LCOS chip optical quality inspection mechanism as described in claim 6, characterized in that, It also includes bolts. The longitudinal section of the back plate is "L" shaped. A keyway-shaped groove runs vertically through the lower end of the back plate. The end of the bolt passes through the groove and is threadedly connected to the second slider. The bolt can abut against the upper side of the lower end of the back plate and can slide horizontally within the groove.

8. The LCOS chip optical quality inspection mechanism as described in claim 7, characterized in that, It also includes an annular anti-slip pad, which is coaxially mounted on the lower end of the bolt and is located between the second slider and the lower surface of the back plate.

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