A multi-directional adjustable CCD detection device for semiconductor processing

Abstract

A multi-directional adjusting CCD detection device for semiconductor processing relates to the field of visual detection technology, including a vertical adjusting mechanism, the front end of the vertical adjusting mechanism is provided with a horizontal adjusting mechanism, the front end of the horizontal adjusting mechanism is provided with a mounting frame, one side of the front end of the mounting frame is provided with a CCD camera through a positioning frame, one side of the vertical adjusting mechanism is provided with a support frame, one side of the support frame is provided with an inclination adjusting mechanism, one side of the inclination adjusting mechanism is connected with a rotary adjusting mechanism, one side of the rotary adjusting mechanism is connected with a fixed plate, one side of the fixed plate is provided with a suction plate through bolts, a plurality of suction holes are formed in the surface of the suction plate in a rectangular array, the problem that the CCD detection device cannot visually detect the semiconductor in multiple directions due to the single adjusting mode is solved.

Description

Technical Field

[0001] This utility model relates to the field of visual inspection technology, specifically a multi-directional adjustable CCD inspection device for semiconductor processing. Background Technology

[0002] CCD inspection devices for semiconductor processing are specialized inspection equipment that uses charge-coupled devices (CCDs) as the core image sensor and integrates a high-precision optical system, motion control module, and image processing algorithm. Their core function is to perform non-contact, high-resolution image acquisition and rapid analysis of key indicators such as wafer surface defects, circuit pattern accuracy, and package size consistency in critical processing stages such as semiconductor wafer manufacturing and chip packaging. By converting optical signals into electrical signals and processing them with algorithms, the detection results are output, enabling real-time monitoring, defect screening, and process optimization of semiconductor product processing quality.

[0003] For example, the Chinese authorized patent CN207336393U, entitled "A CCD Detection Device," includes a CCD detection unit, a detection bracket, and a detection platform. The CCD detection unit and the detection platform are respectively fixed to the detection bracket. The CCD detection unit includes a driver, a detection camera, and a detection light source. The driver drives the detection camera to move, and the detection light source is used to provide light for the detection camera. The detection light source is movably mounted on the detection bracket. The detection bracket is provided with two shock-absorbing columns, and the detection platform is fixed to the detection bracket through the shock-absorbing columns. The detection platform has a hollow structure and is provided with a positioning groove for fixing the liquid crystal panel to be tested.

[0004] While the aforementioned existing technologies can detect semiconductors, they are not very flexible and can only perform visual inspection of semiconductors in one direction. However, with the increasing complexity of semiconductor structures, single-sided inspection cannot meet the detection requirements and therefore does not meet the current needs. In response, we propose a multi-directional adjustable CCD inspection device for semiconductor processing. Utility Model Content

[0005] The purpose of this invention is to provide a multi-directional adjustable CCD inspection device for semiconductor processing, so as to solve the problem that the CCD inspection device mentioned in the background art is unable to perform visual inspection of semiconductors in multiple directions due to its relatively simple adjustment method.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a multi-directional adjustable CCD inspection device for semiconductor processing, comprising a vertical adjustment mechanism, a horizontal adjustment mechanism at the front end of the vertical adjustment mechanism, a mounting frame at the front end of the horizontal adjustment mechanism, a CCD camera mounted on one side of the front end of the mounting frame via a positioning frame, a support frame on one side of the vertical adjustment mechanism, a tilt adjustment mechanism on one side of the support frame, a rotation adjustment mechanism connected to one side of the tilt adjustment mechanism, a fixed plate connected to one side of the rotation adjustment mechanism, and an adsorption plate mounted on one side of the fixed plate via bolts, wherein the surface of the adsorption plate has multiple adsorption holes arranged in a rectangular array.

[0007] Preferably, a first servo motor is fixedly installed at one end of both the vertical adjustment mechanism and the horizontal adjustment mechanism. The vertical adjustment mechanism and the horizontal adjustment mechanism are provided with limiting grooves inside. A threaded rod is rotatably installed inside the limiting grooves. The output shaft of the first servo motor is connected to the threaded rod through a coupling. A sliding block that slides and limits with the limiting groove is installed outside the threaded rod. The sliding block inside the vertical adjustment mechanism is connected to the outer shell of the horizontal adjustment mechanism. The sliding block inside the horizontal adjustment mechanism is connected to the mounting bracket.

[0008] Preferably, a connecting block is fixedly provided on one side of the rotation adjustment mechanism, and the connecting block is connected to the tilt adjustment mechanism via a rotating shaft. A first adjustment cavity is provided inside one side of the tilt adjustment mechanism, and the rotating shaft of the connecting block extends into the interior of the first adjustment cavity. A first worm gear is installed at one end of the connecting block rotating shaft located inside the first adjustment cavity. A first worm with a threaded engagement is provided on one side of the first worm gear. A second servo motor for driving the first worm to rotate is provided at the top of the tilt adjustment mechanism.

[0009] Preferably, the fixed plate is connected to the rotary adjustment mechanism by a rotating column. The rotary adjustment mechanism has a second adjustment cavity inside, and the rotating column of the rotary adjustment mechanism extends into the second adjustment cavity. A second worm gear is fixedly provided at one end of the rotating column of the rotary adjustment mechanism located inside the second adjustment cavity. A second worm is provided at the front end of the second worm gear with a threaded engagement. A third servo motor for driving the second worm to rotate is fixedly provided at the top end of the rotary adjustment mechanism.

[0010] Preferably, a negative pressure tube is provided on one side of the top of the adsorption plate, and one end of the negative pressure tube is connected to a negative pressure source.

[0011] Preferably, both the vertical adjustment mechanism and the support frame have a base with bolt holes at the bottom.

[0012] Preferably, the tilt adjustment mechanism is plugged into the support frame and reinforced with bolts.

[0013] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model features an angle adjustment mechanism and a rotation adjustment mechanism. After the second servo motor is started, its output end drives the first worm to rotate. The contact surface between the first worm and the first worm wheel forms a spiral friction transmission surface. The rotation of the first worm drives the first worm wheel to rotate, which in turn drives the shaft of the connecting block to rotate, thereby adjusting the angle of the semiconductor on the adsorption plate. By starting the third servo motor on the rotation adjustment mechanism, the semiconductor on the auxiliary plate is rotated and adjusted in the cooperation of the second worm wheel and the second worm. This allows the semiconductor to quickly change to any desired posture in space, meeting the complex assembly and testing needs of different workstations and improving the flexibility and adaptability of the equipment. During the transmission process, the spiral helix angle of the worm is smaller than the equivalent friction angle of the meshing surface, forming a mechanical self-locking effect. When the motor stops running, the semiconductor posture will not change due to slight external interference, ensuring that the adjusted angle is accurate and stable.

[0014] 2. This utility model features a vertical adjustment mechanism and a horizontal adjustment mechanism, both equipped with limiting grooves. By activating the first servo motor, its output shaft drives the threaded rod to rotate. Through friction with the threaded hole inside the sliding block, and in conjunction with the guiding effect of the limiting grooves on the sliding block, the vertical adjustment mechanism can adjust the height of the CCD camera, and the horizontal adjustment mechanism can adjust the horizontal distance of the CCD camera. This allows for precise and rapid changes in camera height and horizontal distance. Whether detecting workpieces of different heights and horizontal positions, or dealing with complex detection environments, it can easily adapt to different positions, greatly improving the versatility and operational efficiency of the equipment.

[0015] 3. This utility model features an adsorption plate with multiple adsorption holes arranged in a rectangular array on its surface. By connecting the negative pressure tube at the top of the adsorption plate to a negative pressure source, multiple semiconductors can be simultaneously adsorbed and fixed, enabling batch loading or unloading and increasing the throughput per unit time. In terms of stability, the evenly distributed adsorption holes can apply adsorption force to the semiconductors from multiple points, ensuring that the semiconductors are firmly attached to the adsorption plate and preventing displacement or falling during transportation and testing, thus laying the foundation for subsequent high-precision operations. Attached Figure Description

[0016] Figure 1 This is a perspective view of the present utility model; Figure 2 This is another perspective view of the present invention; Figure 3 This is a schematic diagram of the tilt adjustment mechanism and the rotation adjustment mechanism of this utility model; Figure 4 This is a schematic diagram of the transmission structure of the vertical adjustment mechanism and the horizontal adjustment mechanism of this utility model.

[0017] In the diagram: 1. Vertical adjustment mechanism; 2. First servo motor; 3. Lateral adjustment mechanism; 4. Mounting bracket; 5. CCD camera; 6. Support frame; 7. Fixing plate; 8. Tilt adjustment mechanism; 9. Second servo motor; 10. Rotation adjustment mechanism; 11. Third servo motor; 12. Adsorption plate; 13. Negative pressure pipe; 14. First adjustment chamber; 15. First worm gear; 16. First worm; 17. Connecting block; 18. Second adjustment chamber; 19. Second worm gear; 20. Second worm; 21. Limiting groove; 22. Threaded rod; 23. Sliding block. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Please see Figure 1-4 An embodiment of this utility model is provided: a multi-directional adjustable CCD inspection device for semiconductor processing, including a vertical adjustment mechanism 1, a horizontal adjustment mechanism 3 at the front end of the vertical adjustment mechanism 1, a mounting frame 4 at the front end of the horizontal adjustment mechanism 3, a CCD camera 5 mounted on one side of the front end of the mounting frame 4 via a positioning frame, a support frame 6 on one side of the vertical adjustment mechanism 1, a tilt adjustment mechanism 8 on one side of the support frame 6, a rotation adjustment mechanism 10 connected to one side of the tilt adjustment mechanism 8, a fixing plate 7 connected to one side of the rotation adjustment mechanism 10, and an adsorption plate 12 mounted on one side of the fixing plate 7 via bolts. The surface of the adsorption plate 12 has multiple adsorption holes arranged in a rectangular array. The various mechanisms of this device work together to form a complete detection system. The vertical adjustment mechanism 1 and the horizontal adjustment mechanism 3 can adjust the spatial position of the CCD camera 5, while the tilt adjustment mechanism 8 and the rotation adjustment mechanism 10 can change the orientation of the adsorption plate 12 and the semiconductor. This allows the CCD camera 5 to detect the semiconductor from different angles, enabling the CCD detection device to flexibly adapt to various complex detection scenarios and the detection requirements of different semiconductors, thereby improving the comprehensiveness and accuracy of the detection and expanding the application range of the device.

[0020] Please see Figure 1 , Figure 2 and Figure 4A first servo motor 2 is fixedly installed at one end of both the vertical adjustment mechanism 1 and the horizontal adjustment mechanism 3. The vertical adjustment mechanism 1 and the horizontal adjustment mechanism 3 are provided with a limiting slide groove 21. A threaded rod 22 is rotatably installed inside the limiting slide groove 21. The output shaft of the first servo motor 2 is connected to the threaded rod 22 through a coupling. A sliding block 23 that slides and limits with the limiting slide groove 21 is installed on the outside of the threaded rod 22. The sliding block 23 inside the vertical adjustment mechanism 1 is connected to the outer shell of the horizontal adjustment mechanism 3. The sliding block 23 inside the horizontal adjustment mechanism 3 is connected to the mounting bracket 4. When the first servo motor 2 is turned on, its output shaft drives the threaded rod 22 to rotate. The threaded rod 22 and the inner threaded hole of the sliding block 23 are driven by friction. Under the guidance of the limiting slide groove 21, the sliding block 23 in the vertical adjustment mechanism 1 drives the horizontal adjustment mechanism 3 to adjust the height of the CCD camera 5. The sliding block 23 in the horizontal adjustment mechanism 3 drives the mounting bracket 4 and the CCD camera 5 to adjust the horizontal distance. Through the precise motor drive and mechanical transmission, the position of the CCD camera 5 in both vertical and horizontal dimensions can be adjusted accurately and quickly to meet the detection requirements of workpieces with different heights and horizontal distances.

[0021] Please see Figure 1 and Figure 3 A connecting block 17 is fixedly provided on one side of the rotation adjustment mechanism 10, and the connecting block 17 is connected to the tilt adjustment mechanism 8 through a rotating shaft. A first adjustment cavity 14 is provided inside one side of the tilt adjustment mechanism 8, and the rotating shaft of the connecting block 17 extends into the interior of the first adjustment cavity 14. A first worm gear 15 is installed at one end of the rotating shaft of the connecting block 17 located inside the first adjustment cavity 14. A first worm 16 with a threaded engagement is provided on one side of the first worm gear 15. A second servo motor 9 for driving the first worm 16 to rotate is provided at the top of the tilt adjustment mechanism 8. The second servo motor 9 is started, which drives the first worm gear 16 to rotate. The helical friction transmission surface between the first worm gear 16 and the first worm wheel 15 plays a role. The rotation of the first worm gear 16 drives the first worm wheel 15 to rotate, which in turn drives the shaft of the connecting block 17 to rotate, thereby adjusting the tilt angle of the semiconductor on the adsorption plate 12. By using worm gear transmission, the tilt angle of the semiconductor on the adsorption plate 12 can be accurately and stably adjusted to meet the needs of multi-angle detection. At the same time, the self-locking characteristic of the worm gear ensures that the tilt angle of the semiconductor is fixed after the motor stops, preventing angle changes caused by external interference and ensuring the stability of the semiconductor posture during the detection process.

[0022] Please see Figure 1 and Figure 3The fixed plate 7 is connected to the rotary adjustment mechanism 10 by a rotating column. The rotary adjustment mechanism 10 has a second adjustment cavity 18 inside, and the rotating column of the rotary adjustment mechanism 10 extends into the interior of the second adjustment cavity 18. A second worm gear 19 is fixedly provided at one end of the rotating column of the rotary adjustment mechanism 10 inside the second adjustment cavity 18. A second worm 20 with a threaded engagement is provided at the front end of the second worm gear 19. A third servo motor 11 that drives the second worm 20 to rotate is fixedly provided at the top end of the rotary adjustment mechanism 10. The third servo motor 11 on the rotation adjustment mechanism 10 is activated, driving the second worm gear 20 to rotate. The second worm gear 20, in conjunction with the second worm wheel 19, drives the rotating column of the rotation adjustment mechanism 10 to rotate, thereby causing the semiconductor on the fixed plate 7 and the adsorption plate 12 to rotate. This structure enables the semiconductor to rotate in a plane. In conjunction with the tilt adjustment mechanism 8, it allows the semiconductor to achieve omnidirectional attitude adjustment in space, meeting the requirements of complex detection for multi-angle observation of semiconductors.

[0023] Please see Figure 2 A negative pressure tube 13 is provided on one side of the top of the adsorption plate 12, and one end of the negative pressure tube 13 is connected to a negative pressure source. By connecting the negative pressure tube 13 at the top of the adsorption plate 12 to the negative pressure source, the negative pressure source generates negative pressure, which acts through the negative pressure tube 13 on multiple adsorption holes in a rectangular array on the surface of the adsorption plate 12. Utilizing the atmospheric pressure difference, the semiconductor is adsorbed and fixed on the surface of the adsorption plate 12. The rectangular array of multiple adsorption holes allows for the simultaneous adsorption and fixation of multiple semiconductors, enabling batch loading or unloading and significantly improving work efficiency. The uniformly distributed adsorption force ensures that the semiconductors are firmly attached, preventing displacement or falling during transportation and testing, and ensuring the stable operation of the testing process.

[0024] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A multi-directional adjustable CCD inspection device for semiconductor processing, comprising a vertical adjustment mechanism (1), characterized in that: The vertical adjustment mechanism (1) is provided with a horizontal adjustment mechanism (3) at its front end. The horizontal adjustment mechanism (3) is provided with a mounting bracket (4) at its front end. A CCD camera (5) is mounted on one side of the front end of the mounting bracket (4) via a positioning bracket. A support bracket (6) is provided on one side of the vertical adjustment mechanism (1). An angle adjustment mechanism (8) is provided on one side of the support bracket (6). A rotation adjustment mechanism (10) is connected to one side of the angle adjustment mechanism (8). A fixing plate (7) is connected to one side of the rotation adjustment mechanism (10). An adsorption plate (12) is installed on one side of the fixing plate (7) via bolts. The surface of the adsorption plate (12) has multiple adsorption holes arranged in a rectangular array.

2. The multi-directional adjustable CCD inspection device for semiconductor processing according to claim 1, characterized in that: A first servo motor (2) is fixedly installed at one end of both the vertical adjustment mechanism (1) and the horizontal adjustment mechanism (3). The vertical adjustment mechanism (1) and the horizontal adjustment mechanism (3) are provided with a limiting groove (21). A threaded rod (22) is rotatably installed inside the limiting groove (21). The output shaft of the first servo motor (2) is connected to the threaded rod (22) through a coupling. A sliding block (23) that slides and limits with the limiting groove (21) is installed on the outside of the threaded rod (22). The sliding block (23) inside the vertical adjustment mechanism (1) is connected to the outer shell of the horizontal adjustment mechanism (3). The sliding block (23) inside the horizontal adjustment mechanism (3) is connected to the mounting bracket (4).

3. The multi-directional adjustable CCD inspection device for semiconductor processing according to claim 1, characterized in that: A connecting block (17) is fixedly provided on one side of the rotation adjustment mechanism (10), and the connecting block (17) is connected to the tilt adjustment mechanism (8) through a rotating shaft. A first adjustment cavity (14) is provided inside one side of the tilt adjustment mechanism (8), and the rotating shaft of the connecting block (17) extends into the interior of the first adjustment cavity (14). A first worm gear (15) is installed at one end of the rotating shaft of the connecting block (17) inside the first adjustment cavity (14). A first worm (16) with a threaded engagement is provided on one side of the first worm gear (15), and a second servo motor (9) for driving the first worm (16) to rotate is provided at the top of the tilt adjustment mechanism (8).

4. The multi-directional adjustable CCD inspection device for semiconductor processing according to claim 1, characterized in that: The fixed plate (7) is connected to the rotary adjustment mechanism (10) by a rotating column. The rotary adjustment mechanism (10) has a second adjustment cavity (18) inside, and the rotating column of the rotary adjustment mechanism (10) extends into the interior of the second adjustment cavity (18). A second worm gear (19) is fixedly provided at one end of the rotating column of the rotary adjustment mechanism (10) inside the second adjustment cavity (18). A second worm (20) with a threaded engagement is provided at the front end of the second worm gear (19). A third servo motor (11) for driving the second worm (20) to rotate is fixedly provided at the top end of the rotary adjustment mechanism (10).

5. The multi-directional adjustable CCD inspection device for semiconductor processing according to claim 1, characterized in that: A negative pressure tube (13) is provided on one side of the top of the adsorption plate (12), and one end of the negative pressure tube (13) is connected to a negative pressure source.

6. The multi-directional adjustable CCD inspection device for semiconductor processing according to claim 1, characterized in that: The bottom of both the vertical adjustment mechanism (1) and the support frame (6) is provided with a base with bolt holes.

7. The multi-directional adjustable CCD inspection device for semiconductor processing according to claim 1, characterized in that: The tilt adjustment mechanism (8) is plugged into the support frame (6) and reinforced by bolts.

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