A chip heat source simulation device

Abstract

The application discloses a chip heat source simulation device, and relates to the technical field of chip heat simulation, which comprises a heat insulation base with a containing cavity, a heat source part arranged in the containing cavity, a metal heat conduction part arranged in the containing cavity and in contact with the heat source part, and a heat insulation cover plate covering one side of the containing cavity of the heat insulation base to tightly fix the metal heat conduction part, wherein the heat insulation cover plate has an opening for exposing the metal heat conduction part. The heat source part and the metal heat conduction part are cooperated to realize the heat generation of a reduced chip. Different heat generation power distributions can be realized by changing the structure distribution of the heat source part, so as to simulate the semiconductor device with uneven heat generation. The structure of the application has the advantages of few required parts, compact structure, small overall thickness, small volume, easy installation in limited space, and the like. When used in a liquid cooling test environment, the heat source is not easy to lose heat from the side and bottom, the additional heat preservation and insulation measures can be reduced or not used, and the heat dissipation characteristics of the reduced chip in the liquid cooling environment are highly simulated.

Description

Technical Field

[0001] This application relates to the field of chip heat generation simulation technology, and in particular to a chip heat source simulation device. Background Technology

[0002] Chip-simulated heat sources are used to simulate the heating of semiconductor components such as chips. They are a commonly used tool in chip heat sink performance testing and play an irreplaceable role in heat sink performance testing. Chip-simulated heat sources usually need to have characteristics such as uniform heating, adjustable power, and measurable temperature. In special scenarios, such as immersion liquid cooling test environments, it is also necessary to ensure that the heat exchange between the heat source and the coolant is similar to that of the actual chip in terms of structure and materials. Traditional simulated heat sources mostly use heating rods embedded in copper blocks as the heat source for chip simulation. The heating rods themselves are relatively large, resulting in a large overall heat source volume, which is not convenient for installation in the confined spaces that closely resemble real-world usage scenarios. Furthermore, the heat transfer path of the columnar heating rod differs significantly from that of the actual chip, requiring more thermal insulation and making it difficult to accurately measure the heat sink performance. Utility Model Content

[0003] This application aims to solve one of the aforementioned technical problems in the prior art. Therefore, embodiments of this application provide a chip thermal source simulation device.

[0004] According to an embodiment of this application, a chip heat source simulation device is provided, including a heat-insulating base with a receiving cavity; A heat source is disposed in the receiving cavity; A metal heat-conducting component is disposed in the receiving cavity, and the metal heat-conducting component is in contact with the heat source component; A heat-insulating cover plate is fitted onto one side of the heat-insulating base having a receiving cavity to press and fix the metal heat-conducting component, the heat-insulating cover plate having an opening for exposing the metal heat-conducting component.

[0005] The aforementioned chip heat source simulation device has at least the following beneficial effects: the chip heat source simulation device of this application generates heat evenly during chip simulation. Through the cooperation of the heat source component and the metal heat-conducting component, it realizes the actual heating process of the chip. If necessary, different heat generation power distributions can be achieved by changing the structural distribution of the heat source component to simulate semiconductor devices with uneven heating. In addition, the structure of this application requires fewer components, has a compact structure, small overall thickness, and small volume, making it easy to install in a limited space. When the chip heat source simulation device of this application is used in an immersion liquid cooling test environment, its heat source does not easily lose heat from the side and bottom, which can reduce or eliminate the need for additional thermal insulation measures and highly reproduce the heat dissipation characteristics of the chip in a liquid cooling environment.

[0006] According to the chip heat source simulation device described in the embodiments of this application, the heat source includes multiple parallel alloy heating elements, the ends of which are connected sequentially, wherein the first and last alloy heating elements are provided with wires extending to the outside of the heat insulation base.

[0007] According to the chip heat source simulation device described in the embodiments of this application, the thickness of the heat source component is set to 0.1~0.5mm.

[0008] According to the chip heat source simulation device described in the embodiments of this application, an insulating pad is provided between the heat source component and the bottom of the receiving cavity. The insulating pad is used to slow down the conduction of heat to the heat insulation base, wherein the heat source component does not contact the cavity wall of the receiving cavity.

[0009] According to the chip heat source simulation device described in the embodiments of this application, the thickness of the insulating pad is 0.2~1mm.

[0010] According to the chip heat source simulation device described in the embodiments of this application, an insulating thermally conductive pad is provided between the heat source component and the metal thermally conductive component.

[0011] According to the chip heat source simulation device described in the embodiments of this application, a thermally conductive silicone grease layer is coated between the insulating thermal pad and the metal thermally conductive component, and between the heat source component and the insulating thermal pad.

[0012] According to the chip heat source simulation device described in the embodiments of this application, the metal heat-conducting component has a protrusion adapted to the opening on the side facing the opening, so that the metal heat-conducting component forms a step, the heat insulation cover plate presses against the step, a portion of the protrusion is exposed outside the heat insulation cover plate, and a sealing adhesive layer is provided at the gap between the step and the opening.

[0013] According to the chip heat source simulation device described in the embodiments of this application, the heat insulation cover is provided with a pressing groove adapted to the step on one side facing the heat insulation base, and the bottom of the pressing groove extends to the other side of the heat insulation cover to form the opening.

[0014] According to the chip heat source simulation device described in the embodiments of this application, the chip heat source simulation device further includes at least one temperature sensor, and the temperature sensor is provided on the side of the boss exposed outside the heat insulation cover.

[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0016] The present application will be further described below with reference to the accompanying drawings and embodiments; Figure 1 This is a schematic diagram of the structure of the chip heat source simulation device according to an embodiment of this application. Figure 1 ; Figure 2 This is a schematic diagram of the structure of the chip heat source simulation device in the embodiments of this application. Figure 2 ; Figure 3 yes Figure 2 A cross-sectional view along the AA direction; Figure 4 This is a schematic diagram of the structure of the heat insulation cover in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of the heat insulation base in an embodiment of this application; Figure 6 This is a schematic diagram of the structure of the metal heat-conducting component in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of the heat source component in an embodiment of this application.

[0017] Reference numerals: heat-insulating base 100, receiving cavity 110, groove 120, heat-insulating cover plate 200, pressing groove 210, opening 211, metal heat-conducting component 300, temperature measuring hole 310, step 320, boss 330, heat source component 400, alloy heating element 401, wire 410, insulating heat-conducting pad 510, insulating pad 520. Detailed Implementation

[0018] This section will describe in detail the specific embodiments of this application. Preferred embodiments of this application are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of this application, but they should not be construed as limiting the scope of protection of this application.

[0019] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] In the description of this application, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0021] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0022] Reference Figures 1 to 3 The chip heat source simulation device in this application includes a heat insulation base 100, a heat source component 400, a metal heat-conducting component 300, and a heat insulation cover. The simulation of the real chip heating process is achieved through the cooperation of the above components.

[0023] The heat insulation base 100 has a receiving cavity 110 on one side, and a heat source 400 is disposed in the receiving cavity 110. The heat source 400 is located at the bottom of the receiving cavity 110. The metal heat-conducting component 300 is also disposed in the receiving cavity 110 and is in contact with the heat source 400. The heat insulation cover 200 covers the side of the heat insulation base 100 with the receiving cavity 110 to press and fix the metal heat-conducting component 300. In addition, the heat insulation cover 200 has an opening 211 for the metal heat-conducting component 300 to be exposed.

[0024] During use, the heat source 400 generates heat after being powered on. The heat is conducted to the outside of the chip heat source simulation device through the metal heat conductor 300. Specifically, most of the heat is dissipated to the external environment through the portion of the metal heat conductor 300 exposed at the opening 211. The actual heating process of the chip is realistically reproduced through the combined action of the heat source 400 and the metal heat conductor 300.

[0025] The chip heat source simulation device of this application generates heat evenly during chip simulation. If necessary, different heat generation power distributions can be achieved by changing the structural distribution of the heat source 400 in order to simulate semiconductor devices with uneven heat generation.

[0026] In addition, the structure of this application requires fewer parts, is compact, has a small overall thickness and volume, and is easy to install in a limited space.

[0027] It should be noted that the heat insulation base 100 is made of a material with poor thermal conductivity, high temperature resistance and low coefficient of thermal expansion, which can prevent heat loss from the bottom and prevent the base from deforming (bulging) due to heat, resulting in poor contact between the heat source component 400, the metal heat-conducting component 300 and the heat insulation cover.

[0028] Like the heat insulation base 100, the heat insulation cover 200 is also made of a material with poor thermal conductivity, high temperature resistance and low coefficient of thermal expansion.

[0029] When the chip heat source simulation device of this application is used in an immersion liquid cooling test environment, its heat source does not easily lose heat from the sides and bottom, reducing or eliminating the need for additional thermal insulation measures and highly replicating the heat dissipation characteristics of the chip in a liquid cooling environment. It should be noted that the chip heat source simulation device of this application can also be used to simulate chip heating and test heat sink performance, meeting the needs of various test scenarios such as air cooling and cold plate liquid cooling.

[0030] In this embodiment, the heat-insulating base 100 and the heat-insulating cover 200 are fastened together with bolts to achieve a modular design, facilitating the disassembly and replacement of the internal heat source component 400. Furthermore, the gap between the heat-insulating base 100 and the heat-insulating cover 200 is filled with sealant to achieve a waterproof seal.

[0031] like Figure 7 As shown, the heat source 400 includes multiple parallel alloy heating elements 401, which are connected end-to-end. By rationally arranging the spacing between adjacent alloy heating elements 401, the heating simulation of different semiconductor chips can be achieved. The heat source elements are made of alloy and have a small thickness. The thickness of the heat source 400 is set to 0.1~0.5mm, and the heat source 400 is laid flat inside the receiving cavity 110. Compared with traditional columnar heating rods, uniform heating can be achieved without the use of thick copper blocks.

[0032] In some specific embodiments, the heat source 400 is supported by an alloy electric support and is formed by cutting multiple alloy electric heating elements 401 connected end to end.

[0033] It should be noted that the heat source 400 proposed in this application can also simulate chips with uneven heating: if it is necessary to increase the heating power at a specific location, the electrothermal alloy sheet at that location can be cut to a narrower size to increase the local resistance and allow the current to generate greater heat power locally; compared with traditional simulated heat sources using heating rods, the chip simulated heat source proposed in this patent is convenient to use in both scenarios requiring uniform heating and uneven heating.

[0034] In the embodiments shown in this application, the alloy heating elements 401 of the first and last pieces are provided with wires 410 extending beyond the heat-insulating base 100. Specifically, as... Figure 5 As shown, the heat insulation base 100 is also provided with a groove 120. The wire 410 is led out from the groove 120 to the outside of the heat insulation base 100 and connected to an external power supply. If the heat insulation base 100 is made of metal, the wire 410 is wrapped with insulating high-temperature resistant material to prevent short circuit.

[0035] In some embodiments, an insulating gasket 520 is provided between the heat source 400 and the bottom of the receiving cavity 110. The insulating gasket 520 is used to slow down the conduction of heat to the heat insulation base 100, wherein the heat source 400 does not contact the cavity wall of the receiving cavity 110.

[0036] An insulating gasket 520 is provided between the heat insulation base and the heat source component 400. The insulating gasket 520 is also heat-resistant and heat-insulating at high temperatures. The insulating properties of the insulating gasket 520 ensure the normal heating of the heat source component 400. The insulating gasket 520 should not be too thick; it is sufficient to provide adequate insulation. In this embodiment, the thickness of the insulating gasket 520 is 0.2~1mm. Within this thickness range, the insulating gasket 520 has sufficient insulation effect without affecting the overall thickness of the device.

[0037] In high-power testing scenarios, the internal heat source component 400 has a high temperature. The high temperature resistance and low thermal conductivity of the insulating pad 520 can reduce heat loss from the base. Furthermore, the fact that the heat source component 400 does not contact the cavity wall of the receiving cavity 110 can also prevent heat from being conducted to the heat insulation base 100.

[0038] In some embodiments, an insulating thermally conductive pad 510 is provided between the heat source component 400 and the metal heat-conducting component 300. By providing the insulating thermally conductive pad 510, poor contact between the metal heat-conducting component 300 and the heat source component 400 is avoided, which would lead to poor simulation results.

[0039] In some embodiments, a thermally conductive grease layer is coated between the insulating thermally conductive pad 510 and the metal thermally conductive element 300, and between the heat source element 400 and the insulating thermally conductive pad 510. The presence of the thermally conductive grease layer can reduce the thermal resistance of heat conduction from the heat source element 400 to the insulating thermally conductive pad 510 or from the insulating thermally conductive pad 510 to the metal thermally conductive element 300.

[0040] In some embodiments, such as Figure 6 As shown, the metal heat-conducting component 300 has a boss 330 adapted to the opening 211 on the side facing the opening 211, so that the metal heat-conducting component 300 forms a step 320. The heat insulation cover plate 200 presses against the step 320, and part of the boss 330 is exposed outside the heat insulation cover plate 200. A sealing layer is provided at the gap between the step 320 and the opening 211, and heat is directed to the external environment through the boss 330 exposed on the heat insulation cover plate 200.

[0041] In some embodiments, such as Figure 4 As shown, the heat insulation cover 200 is provided with a pressing groove 210 that is adapted to the step 320 on the side facing the heat insulation base 100. The bottom of the pressing groove 210 extends to the other side of the heat insulation cover 200 to form an opening 211. The pressing groove 210 facilitates quick positioning of the metal heat-conducting component 300, making installation more convenient.

[0042] Among them, the metal heat-conducting component 300 is made of copper. Copper is easy to process and has good thermal conductivity. The copper metal heat-conducting component 300 is the same material used on the top of most CPU and some GPU chips, which makes it easy to reflect the heat transfer characteristics of the chip top. The steps 320 around the metal heat-conducting component 300 are easy to apply sealant, which can prevent coolant from seeping into the heat source in the immersion liquid cooling test scenario. This sealing function is more critical for coolants that are easily decomposed at high temperatures.

[0043] In some embodiments, the chip heat source simulation device further includes at least one temperature sensor, with the temperature sensor disposed on the side of the protrusion 330 exposed outside the heat insulation cover 200. For example, Figure 6 As shown, temperature measuring holes 310 are drilled on the side of the step 320 for installing temperature sensors to measure temperature. The temperature sensors are thermocouple wires. There can be multiple temperature measuring holes 310, which can be used to measure the temperature consistency at different points.

[0044] The chip heat source simulation device of this application can be used to simulate chip heating and test heat sink performance, and can meet various testing scenarios such as air cooling, cold plate liquid cooling, and immersion liquid cooling. The proposed heat sink is composed of a high-temperature resistant and low-thermal-conductivity heat-insulating base 100, a high-temperature resistant insulating pad 520, an alloy heating element 401, an insulating heat-conducting sheet, metal parts, and a heat-insulating cover 200. It has a wide range of heating power adjustment, convenient temperature measurement, small size, and flexible application scenarios.

[0045] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A chip thermal source simulation device, characterized in that: include Insulated base with receiving cavity; A heat source is disposed in the receiving cavity; A metal heat-conducting component is disposed in the receiving cavity, and the metal heat-conducting component is in contact with the heat source component; A heat-insulating cover plate is fitted onto one side of the heat-insulating base having a receiving cavity to press and fix the metal heat-conducting component, the heat-insulating cover plate having an opening for exposing the metal heat-conducting component.

2. The chip heat source simulation device according to claim 1, characterized in that: The heat source component includes multiple parallel alloy heating elements, which are connected end to end in sequence. The first and last alloy heating elements are provided with wires extending to the outside of the heat insulation base.

3. The chip heat source simulation device according to claim 2, characterized in that: The thickness of the heat source component is set to 0.1~0.5mm.

4. The chip heat source simulation device according to claim 1, characterized in that: An insulating gasket is provided between the heat source component and the bottom of the receiving cavity. The insulating gasket is used to slow down the conduction of heat to the heat insulation base. The heat source component does not contact the cavity wall of the receiving cavity.

5. The chip heat source simulation device according to claim 4, characterized in that: The thickness of the insulating pad is 0.2~1mm.

6. The chip heat source simulation device according to claim 1, characterized in that: An insulating thermally conductive pad is provided between the heat source component and the metal heat-conducting component.

7. The chip heat source simulation device according to claim 6, characterized in that: A thermally conductive silicone grease layer is applied between the insulating thermally conductive pad and the metal thermally conductive component, and between the heat source component and the insulating thermally conductive pad.

8. The chip heat source simulation device according to claim 1, characterized in that: The metal heat-conducting component has a protrusion on the side facing the opening that is adapted to the opening, so that the metal heat-conducting component forms a step. The heat insulation cover plate presses against the step, and part of the protrusion is exposed outside the heat insulation cover plate. A sealing layer is provided at the gap between the step and the opening.

9. The chip heat source simulation device according to claim 8, characterized in that: The heat insulation cover plate has a pressing groove adapted to the step on one side facing the heat insulation base, and the bottom of the pressing groove extends to the other side of the heat insulation cover plate to form the opening.

10. The chip heat source simulation device according to claim 8, characterized in that: The chip heat source simulation device also includes at least one temperature sensor, and the temperature sensor is provided on the side of the boss exposed outside the heat insulation cover.

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