Micron-level wire needle jig

Abstract

The utility model discloses a micron level line needle fixture belongs to circuit board test fixture technical field, including base aluminum plate, the wire reel support layer of fixed base aluminum plate, the wire reel of fixed wire reel support layer, the needle disc of located wire reel top, wherein: the needle disc is provided with the same test probe of the test point number of the CPU chip board of being measured with, this needle disc is fixed on the suspension mechanism, and this suspension mechanism is fixed on wire reel support layer, suspension mechanism is used for test probe and the wire alignment of fixed wire reel, the head of wire is fixed on wire reel, and the tail of wire is electrically connected with the head of Block disc PIN needle, and the tail of Block disc PIN needle is electrically connected with machine table Block disc, Block disc PIN needle is fixed on Block disc, and Block disc is fixed on base aluminum plate. The utility model discloses due to the scheme, has reduced enterprise fixture cost investment and reduced test cost.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board testing fixture technology, and provides a micron-level needle fixture that reduces enterprise fixture costs and testing costs. Background Technology

[0002] When testing high-precision PCB circuit boards, carrier boards, and high-end custom equipment (such as the CPU chip shown in the Leadtec GATS7880), the testing of these CPU chip boards currently requires imported fixtures from foreign companies due to the small BGA line spacing and densely protruding test points. The manufacturing of these fixtures from foreign companies is difficult, time-consuming, and involves complex processing techniques, requiring the fabrication of conversion circuit boards, which are also difficult to manufacture. This results in high fixture costs and testing costs for the companies involved. Utility Model Content

[0003] In view of this, the purpose of this utility model is to provide a micron-level needle fixture, which aims to solve the problem of high fixture costs and high testing costs caused by existing foreign-funded fixtures.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] This utility model provides a micron-level needle fixture, including a base aluminum plate, a spool support layer fixed on the base aluminum plate, a spool fixed on the spool support layer, and a needle plate located above the spool; wherein: the needle plate is provided with test probes of the same number as the test points of the CPU chip board under test, the needle plate is fixed on a suspension mechanism, the suspension mechanism is fixed on the spool support layer, and the suspension mechanism is used to align the test probes with the wires fixed on the spool;

[0006] The head of the wire is fixed on the reel, and the tail of the wire is electrically connected to the head of the Block PIN. The tail of the Block PIN is electrically connected to the Block of the machine. The Block PIN is fixed on the Block, and the Block is fixed on the aluminum plate of the base.

[0007] To ensure accurate needle placement and prevent needle bending during product testing, the above solution further includes: the needle plate comprising, from top to bottom, a first needle plate guide layer, a second needle plate guide layer, a third needle plate guide layer, a fourth needle plate guide layer, a fifth needle plate guide layer, a sixth needle plate guide layer, a seventh needle plate guide layer, and a needle plate back plate;

[0008] The first needle plate guide layer, the second needle plate guide layer, the third needle plate guide layer, the fourth needle plate guide layer, the fifth needle plate guide layer, the sixth needle plate guide layer, the seventh needle plate guide layer and the needle plate back plate are all provided with hollowed-out parts;

[0009] Vertical through holes are provided on the first needle plate guide layer, the second needle plate guide layer and the third needle plate guide layer;

[0010] The fourth needle plate guide layer, the fifth needle plate guide layer, the sixth needle plate guide layer, the seventh needle plate guide layer and the needle plate back plate are provided with inclined through holes;

[0011] The space between the fourth and fifth needle plate guide layers is greater than the space between other adjacent needle plate guide layers.

[0012] The first, second, third, fourth, fifth, and sixth needle plate guide layers have the same diameter; the seventh needle plate guide layer has the same diameter as the needle plate back plate.

[0013] The diameter of the needle plate back plate is larger than the diameter of the sixth needle plate guide layer;

[0014] The needle plate backplate is fixed to the suspension mechanism.

[0015] To facilitate maintaining a height of 0.mm during testing, the above solution further includes: a height control mechanism fixed on the coil support layer, which is used to ensure that the distance between the tail end of the test probe and the top surface of the coil remains unchanged under normal conditions.

[0016] To facilitate the fabrication of the height control mechanism, the above scheme further includes: the height control mechanism comprising at least two L-shaped limiting plates, which are evenly distributed on the coil support layer. Each L-shaped limiting plate includes a vertical elevation limiting plate, the bottom of which is fixed to the coil support layer, and a horizontal limiting plate is fixed to the top of which is normally located on the top surface of the seventh needle plate guide layer.

[0017] To facilitate the fabrication of the suspension mechanism, the above scheme further includes: a suspension block a, a suspension block b, a suspension spring, and a suspension movable bearing;

[0018] The tail ends of both the suspension spring and the suspension movable bearing are fixed on the coil support layer. The head of the suspension spring is fixed on the bottom plate of the suspension block b, and the head of the suspension movable bearing is fixed on the bottom plate of the suspension block a.

[0019] To ensure the dustproof properties of the Block disk PIN pins and the Block disk, the above solution further includes: a Block disk cover plate provided on the base aluminum plate.

[0020] The beneficial effects of this utility model are:

[0021] Because of the aforementioned structure, there is no longer a need to manufacture conversion circuit boards, which reduces the difficulty of fixture manufacturing and shortens the fixture manufacturing cycle, thereby reducing the enterprise's fixture cost investment and testing costs.

[0022] Other advantages, objectives, and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination and study, or may be learned from practice of this invention. The objectives and other advantages of this invention can be realized and obtained through the following description. Attached Figure Description

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the preferred embodiments of this utility model will be described in detail below with reference to the accompanying drawings, wherein:

[0024] Figure 1 This is a schematic diagram of the structure of this utility model;

[0025] Reference numerals: 1. First needle tray guide layer; 2. Second needle tray guide layer; 3. Third needle tray guide layer; 4. Fourth needle tray guide layer; 5. Fifth needle tray guide layer; 6. Sixth needle tray guide layer; 7. Seventh needle tray guide layer; 8. Needle tray backplate; 9. Test probe; 10. Coil; 11. Suspension mechanism; 12. Coil support layer; 13. Wire; 14. Block tray; 15. Base aluminum plate; 16. Machine block tray; 17. Needle tray; 18. Height control mechanism; 19. Test point; 20. Block tray PIN pin; 21. Block tray cover plate; 22. CPU chip board under test; 11-1. Suspension block a; 11-2. Suspension block b; 11-3. Suspension spring; 11-4. Suspension movable bearing; 18-1. Vertical elevation limit plate; 18-2. Horizontal limit plate. Detailed Implementation

[0026] The present invention will be further described below with reference to specific embodiments. The accompanying drawings are for illustrative purposes only, representing schematic diagrams rather than actual physical objects, and should not be construed as limiting the scope of this patent. To better illustrate the embodiments of the present invention, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable that some well-known structures and their descriptions may be omitted in the drawings for those skilled in the art. The illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Where there is no conflict, the following embodiments and features can be combined with each other.

[0027] Furthermore, the reference numbers and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or settings discussed.

[0028] like Figure 1 As shown, the present invention discloses a micron-level needle fixture, comprising a base aluminum plate 15, a coil support layer 12 fixed on the base aluminum plate 15, a coil 10 fixed on the coil support layer 12, and a needle plate 17 located above the coil 10; wherein: the needle plate 17 is provided with test probes 9 in the same number as the test points 19 of the CPU chip board 22 under test, the needle plate 17 is fixed on a suspension mechanism 11, the suspension mechanism 11 is fixed on the coil support layer 12, and the suspension mechanism 11 is used to align the test probes 9 with the wires 13 fixed on the coil 10;

[0029] The head of the wire 13 is fixed on the reel 10, the tail of the wire 13 is electrically connected to the head of the Block PIN 20, the tail of the Block PIN 20 is electrically connected to the Block 16 of the machine, the Block PIN 20 is fixed on the Block 14, and the Block 14 is fixed on the base aluminum plate 15.

[0030] To ensure accurate needle placement and prevent needle bending during product testing, in the above embodiment, preferably, the needle tray includes, from top to bottom, a first needle tray guide layer 1, a second needle tray guide layer 2, a third needle tray guide layer 3, a fourth needle tray guide layer 4, a fifth needle tray guide layer 5, a sixth needle tray guide layer 6, a seventh needle tray guide layer 7, and a needle tray back plate 8. In specific implementation, the thicknesses of the first needle tray guide layer 1, the second needle tray guide layer 2, the third needle tray guide layer 3, the fourth needle tray guide layer 4, the fifth needle tray guide layer 5, the sixth needle tray guide layer 6, the seventh needle tray guide layer 7, and the needle tray back plate 8 are set according to actual needs.

[0031] The first needle plate guide layer 1, the second needle plate guide layer 2, the third needle plate guide layer 3, the fourth needle plate guide layer 4, the fifth needle plate guide layer 5, the sixth needle plate guide layer 6, the seventh needle plate guide layer 7, and the needle plate back plate 8 are all provided with hollowed-out portions. The hollowed-out portions adopt conventional technology and are countersunk hollowed out to facilitate the smooth insertion of the test probes 9 designed with an inclination.

[0032] Vertical through holes are provided on the first needle plate guide layer 1, the second needle plate guide layer 2, and the third needle plate guide layer 3. Inclined through holes are provided on the fourth needle plate guide layer 4, the fifth needle plate guide layer 5, the sixth needle plate guide layer 6, the seventh needle plate guide layer 7, and the needle plate back plate 8. This ensures accurate needle insertion and prevents needle bending during product testing.

[0033] The gap between the fourth needle guide layer 4 and the fifth needle guide layer 5 is greater than the gap between other adjacent needle guide layers. This ensures that the test probe 9 can bend and spring back smoothly during the test.

[0034] The first needle plate guide layer 1, the second needle plate guide layer 2, the third needle plate guide layer 3, the fourth needle plate guide layer 4, the fifth needle plate guide layer 5, and the sixth needle plate guide layer 6 have the same disc diameter; the seventh needle plate guide layer 7 has the same disc diameter as the needle plate back plate 8; the disc diameter of the needle plate back plate 8 is larger than that of the sixth needle plate guide layer 6; the needle plate back plate 8 is fixed to the suspension mechanism 11. This makes it easy for the height control mechanism 18 to control the elevation of the needle plate 17. In this embodiment, the first needle plate guide layer 1, the second needle plate guide layer 2, and the third needle plate guide layer 3 are provided with vertical through holes. The fourth needle plate guide layer 4, the fifth needle plate guide layer 5, the sixth needle plate guide layer 6, and the seventh needle plate guide layer 7 are aligned with adjacent needle plate guide layers through pin holes, and then assembled and positioned by pins passing through the pin holes. The first needle plate guide layer 1 and the needle plate back plate 8 are fastened together with screws.

[0035] To facilitate maintaining a height control of 0.1mm during testing, in the above embodiment, preferably, a height control mechanism 18 is fixed on the coil support layer 12. This height control mechanism 18 is used to ensure that the distance between the tail end of the test probe 9 and the top surface of the coil 10 remains unchanged under normal conditions. In this embodiment, "normal conditions" refers to the state when the test probe 9 is in a naturally relaxed state, i.e., the tail end of the test probe 9 is not in contact with the wire 13 on the coil 10.

[0036] To facilitate the fabrication of the height control mechanism 18, in the above embodiment, preferably: the height control mechanism 18 includes at least two L-shaped limiting plates, which are evenly distributed on the coil support layer 12. The L-shaped limiting plates include a vertical elevation limiting plate 18-1, the bottom end of which is fixed to the coil support layer 12, and a horizontal limiting plate 18-2 fixed to the top end of which is normally located on the top plate surface of the seventh needle plate guide layer 7.

[0037] To facilitate the fabrication of the suspension mechanism 11, in the above embodiments, preferably, the suspension mechanism 11 includes a suspension block a11-1, a suspension block b11-2, a suspension spring 11-3, and a suspension movable bearing 11-4;

[0038] The tails of the suspension spring 11-3 and the suspension movable bearing 11-4 are both fixed on the coil support layer 12. The head of the suspension spring 11-3 is fixed on the bottom plate of the suspension block b11-2, and the head of the suspension movable bearing 11-4 is fixed on the bottom plate of the suspension block a11-1.

[0039] To ensure the dustproof properties of the Block PIN pins 20 and the Block 14, in the above embodiment, preferably, a Block cover plate 21 is provided on the base aluminum plate 15.

[0040] In the above embodiments, all components are commercially available products.

[0041] The testing process of this scheme is as follows: When testing the CPU chip board 22 under test, the equipment presses the fixture, and the entire needle plate 17 presses down on the suspension mechanism 11. The suspension block a11-1, suspension block b11-2, suspension spring 11-3, and suspension movable bearing 11-4 of the suspension mechanism 11 are pressed down synchronously. The test point 19 on the CPU chip board 22 under test is connected to the test probe 9, the test probe 9 is connected to the wire 13 on the wire plate 10, the wire 13 is connected to the PIN pin 20 of the Block plate, and the PIN pin 20 of the Block plate is connected to the PIN pin of the machine Block plate 16, forming a complete conductive line to detect whether the CPU chip board 22 under test is qualified. At the same time, the testing press fixture forms a certain degree of bending on the test probe 9, which is formed between the fourth needle plate guide layer 4 and the fifth needle plate guide layer 5. When the fixture rises after testing, the suspension blocks a11-1 and b11-2 are lifted by the suspension spring 11-3, and the needle plate 17 is also lifted. The height control mechanism 18 controls the height by maintaining a 0.1mm space between the needle plate 17 and the wire spool 10. The tail of the test probe 9 disengages from the wire 13 on the wire spool 10, and the test probe 9 returns to its natural relaxed state, no longer in contact with the wire 13. The above process is repeated to complete the testing of other products.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of this technical solution, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A micron-level thread needle fixture, comprising a base aluminum plate (15), a thread spool support layer (12) fixed on the base aluminum plate (15), a thread spool (10) fixed on the thread spool support layer (12), and a needle spool (17) located above the thread spool (10); characterized in that: The probe disk (17) is provided with the same number of test probes (9) as the test points (19) of the CPU chip board (22) under test. The probe disk (17) is fixed on the suspension mechanism (11), which is fixed on the wire support layer (12). The suspension mechanism (11) is used to align the test probes (9) with the wires (13) fixed on the wire disk (10). The head of the wire (13) is fixed on the reel (10), the tail of the wire (13) is electrically connected to the head of the Block PIN (20), the tail of the Block PIN (20) is electrically connected to the Block reel (16) of the machine, the Block PIN (20) is fixed on the Block reel (14), and the Block reel (14) is fixed on the base aluminum plate (15).

2. The micron-level thread needle fixture according to claim 1, characterized in that: The needle plate includes, from top to bottom, a first needle plate guide layer (1), a second needle plate guide layer (2), a third needle plate guide layer (3), a fourth needle plate guide layer (4), a fifth needle plate guide layer (5), a sixth needle plate guide layer (6), a seventh needle plate guide layer (7), and a needle plate back plate (8). The first needle plate guide layer (1), the second needle plate guide layer (2), the third needle plate guide layer (3), the fourth needle plate guide layer (4), the fifth needle plate guide layer (5), the sixth needle plate guide layer (6), the seventh needle plate guide layer (7) and the needle plate back plate (8) are all provided with hollowed-out parts; Vertical through holes are provided on the first needle plate guide layer (1), the second needle plate guide layer (2) and the third needle plate guide layer (3); Inclined through holes are provided on the fourth needle plate guide layer (4), the fifth needle plate guide layer (5), the sixth needle plate guide layer (6), the seventh needle plate guide layer (7) and the needle plate back plate (8); The space between the fourth needle plate guide layer (4) and the fifth needle plate guide layer (5) is greater than the space between other adjacent needle plate guide layers; The first needle plate guide layer (1), the second needle plate guide layer (2), the third needle plate guide layer (3), the fourth needle plate guide layer (4), the fifth needle plate guide layer (5), and the sixth needle plate guide layer (6) have the same diameter; the seventh needle plate guide layer (7) and the needle plate back plate (8) have the same diameter. The diameter of the needle plate back plate (8) is larger than the diameter of the sixth needle plate guide layer (6); The needle plate back plate (8) is fixed on the suspension mechanism (11).

3. The micron-level needle fixture according to claim 2, characterized in that: A height control mechanism (18) is fixed on the coil support layer (12). The height control mechanism (18) is used to ensure that the distance between the tail end of the test probe (9) and the top surface of the coil (10) remains unchanged under normal conditions.

4. The micron-level needle fixture according to claim 3, characterized in that: The height control mechanism (18) includes at least two L-shaped limiting plates, which are evenly distributed on the coil support layer (12). The L-shaped limiting plates include a vertical elevation limiting plate (18-1), the bottom end of which is fixed on the coil support layer (12), and a horizontal limiting plate (18-2) is fixed at the top end of which is normally located on the top plate surface of the seventh needle plate guide layer (7).

5. The micron-scale needle fixture according to claim 1 or 2, characterized in that: The suspension mechanism (11) includes suspension block a (11-1), suspension block b (11-2), suspension spring (11-3), and suspension movable bearing (11-4); The tails of the suspension spring (11-3) and the suspension movable bearing (11-4) are both fixed on the coil support layer (12). The head of the suspension spring (11-3) is fixed on the bottom plate of the suspension block b (11-2), and the head of the suspension movable bearing (11-4) is fixed on the bottom plate of the suspension block a (11-1).

6. The micron-level needle fixture according to claim 1, characterized in that: A Block cover plate (21) is provided on the base aluminum plate (15).

Images