A test fixture for testing a semiconductor device package

CN224788787UActive Publication Date: 2026-09-22JIANGSU GLORY TECH CO LTD
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Patent Information

Application Number
CN202521998040.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-17
Publication Date
2026-09-22
Estimated Expiration
2035-09-17

AI Technical Summary

Technical Problem

[0003]现有技术中,授权公布号CN 222330946 U的专利公开了涉及一种半导体测试用托盘流转结构,当需要较小或较大的托板时,需要改变两个真空吸盘的相对位置,以便于能够更加稳定地对托盘进行吸附搬运,此时可通过转动传动转盘,当传动转盘进行转动时,可带动调节齿轮转动,该设备虽然能够通过真空吸盘来对半导体元件来进行吸附固定,但是真空吸盘对半导体元件的表面平整度要求较高,对于表面不平整或有缺陷的半导体元件,真空吸盘可能无法有效固定,这样会降低半导体元件的稳定性,最后影响了封装工作和测试结果的质量

Benefits of technology

通过齿条板和齿轮的配合设置,能够带动两个夹板进行移动,最后由夹板来对半导体元件进行固定,代替传统通过真空吸盘来对半导体元件进行固定的方式,解决了因半导体元件表面不平整而影响了真空吸盘固定效果的问题,提高了半导体元件的稳定性,保证了封装工作和测试结果的质量。

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Abstract

This utility model discloses a test fixture for semiconductor component packaging and testing, including a frame body with a placement groove in the middle of the upper end of the frame body, and a fixing mechanism. The fixing mechanism includes a crossbar, connecting plates, clamping plates, and a driving assembly. The crossbar is respectively disposed in sliding grooves on the front and rear sides of the bottom wall of the placement groove. The outer arc surface of the crossbar is slidably connected to the connecting plates on the side away from the center of the placement groove. The two connecting plates are slidably connected to vertically adjacent sliding grooves. Clamping plates are disposed at the upper end of each connecting plate. The driving assembly is disposed at the lower end of the frame body, and the clamping plates are driven by the driving assembly. A PLC controller is disposed at the upper end of the frame body, and the input terminal of the PLC controller is electrically connected to an external power supply. This utility model improves the stability of semiconductor components and ensures the quality of packaging work and test results by replacing the traditional vacuum suction cup for fixing semiconductor components.
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Description

Technical Field

[0001] This utility model relates to the field of test packaging equipment technology, specifically a test fixture for semiconductor component packaging testing. Background Technology

[0002] Semiconductor component packaging and testing is a critical step in the semiconductor manufacturing process. It ensures the performance and reliability of semiconductor components in practical applications. Packaging protects semiconductor chips from physical damage, chemical corrosion, and environmental influences, while testing ensures that the electrical performance of semiconductor components meets design specifications. A test fixture for semiconductor component packaging and testing is a device specifically designed for the semiconductor component packaging and testing process. It is used to fix and support semiconductor components, ensuring the accuracy and reliability of the testing process.

[0003] In the prior art, patent publication number CN 222330946 U discloses a tray transfer structure for semiconductor testing. When a smaller or larger tray is needed, the relative position of two vacuum suction cups needs to be changed to enable more stable adsorption and handling of the tray. This can be achieved by rotating a transmission turntable, which drives the adjustment gear to rotate. Although this device can adsorb and fix semiconductor components using vacuum suction cups, the vacuum suction cups have high requirements for the surface flatness of the semiconductor components. For semiconductor components with uneven or defective surfaces, the vacuum suction cups may not be able to fix them effectively, which will reduce the stability of the semiconductor components and ultimately affect the quality of the packaging work and test results. Utility Model Content

[0004] The technical problem this invention aims to solve is to overcome existing defects and provide a test fixture for semiconductor component packaging testing. Through the coordinated arrangement of a rack and pinion plate and gears, two clamping plates can be moved, ultimately fixing the semiconductor component. This replaces the traditional method of fixing semiconductor components using vacuum suction cups, solving the problem that uneven semiconductor component surfaces affect the fixing effect of vacuum suction cups. It improves the stability of semiconductor components, ensures the quality of packaging work and test results, and effectively solves the problems in the background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a test fixture for semiconductor component packaging and testing, comprising a frame and a PLC controller, wherein a placement slot is provided in the middle of the upper end of the frame, and a fixing mechanism is also included; The fixing mechanism includes a crossbar, a connecting plate, a clamping plate, and a driving assembly. The crossbar is respectively set in the sliding grooves opened on the front and rear sides of the bottom wall of the placement groove. The outer arc surface of the crossbar is slidably connected to the connecting plate on the side away from the center of the placement groove. The two connecting plates are slidably connected to the vertically adjacent sliding grooves. The upper end of the two connecting plates is provided with a clamping plate. The driving assembly is set at the lower end of the frame, and the clamping plate is driven by the driving assembly.

[0006] Furthermore, the drive assembly includes a protective cover, a rack plate, a mounting rod, and a gear. The protective cover is located in the middle of the lower end of the frame. The mounting rod is rotatably connected to the middle of the bottom wall of the protective cover. A gear is provided on the upper side of the outer arc surface of the mounting rod. A rack plate is provided at the lower end of each of the two connecting plates. Both rack plates are meshed with the gear, and the rack plates can be moved by the gear.

[0007] Furthermore, the drive assembly also includes a drive gear, a slider, and a drive rack plate. The drive gear is disposed on the lower side of the outer arc surface of the mounting rod, the slider is slidably connected to the bottom wall of the protective cover, and a drive rack plate is disposed at the upper end of the drive gear. The drive rack plate is meshed with the drive gear and can drive the gear to rotate through the mounting rod.

[0008] Furthermore, the drive assembly also includes an electric push rod, which is disposed on the right side of the rear wall of the protective cover. The front end of the telescopic end of the electric push rod is fixedly connected to the rear end of the slider, and the input end of the electric push rod is electrically connected to the output end of the PLC controller, which can drive the slider to move.

[0009] Furthermore, a laser rangefinder is installed on the rear side of the left wall of the placement slot. The laser rangefinder corresponds to the left and right positions of the left clamping plate. The laser rangefinder is bidirectionally electrically connected to the PLC controller and can detect the position of the left clamping plate.

[0010] Furthermore, a mounting plate is provided in the middle of the right end of the frame, and a tool box is provided in the middle of the upper part of the mounting plate, which can store various tools, ensuring the cleanliness and orderliness of the testing tools and improving work efficiency.

[0011] Compared with the prior art, the beneficial effects of this utility model are: By using a rack and pinion mechanism with gears, two clamping plates can be moved to fix the semiconductor components. This replaces the traditional method of fixing semiconductor components with vacuum chucks, solving the problem that uneven semiconductor component surfaces affect the fixing effect of vacuum chucks. This improves the stability of semiconductor components and ensures the quality of packaging and testing results. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the front sectional structure of the present invention; Figure 3 This is a schematic diagram of the internal structure of the protective cover of this utility model; Figure 4 This is a schematic diagram of the upper cross-sectional structure of the protective cover of this utility model; Figure 5 This is an enlarged structural diagram of point A in this utility model.

[0013] In the diagram: 1. Frame, 2. PLC controller, 3. Placement slot, 4. Fixing mechanism, 41. Crossbar, 42. Connecting plate, 43. Clamping plate, 44. Drive assembly, 441. Protective cover, 442. Rack plate, 443. Mounting rod, 444. Gear, 445. Drive gear, 446. Slider, 447. Drive rack plate, 448. Electric push rod, 5. Mounting plate, 6. Tool box, 7. Laser rangefinder. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-5 This embodiment provides a technical solution: a test fixture for semiconductor component packaging testing, including a frame 1 and a PLC controller 2, with a placement slot 3 provided in the middle of the upper end of the frame 1.

[0016] The system also includes a fixing mechanism 4. The fixing mechanism 4 includes a crossbar 41, a connecting plate 42, a clamping plate 43, and a driving assembly 44. The crossbar 41 is respectively set in the sliding grooves opened on the front and rear sides of the bottom wall of the placement groove 3. The side of the outer arc surface of the crossbar 41 away from the center of the interior of the placement groove 3 is slidably connected to the connecting plate 42. The two connecting plates 42 are slidably connected to the vertically adjacent sliding grooves. The upper end of the two connecting plates 42 is provided with a clamping plate 43. The driving assembly 44 is set at the lower end of the frame 1, and the clamping plate 43 is driven by the driving assembly 44.

[0017] The drive assembly 44 includes a protective cover 441, a rack plate 442, a mounting rod 443, and a gear 444. The protective cover 441 is located in the middle of the lower end of the frame 1. The mounting rod 443 is rotatably connected to the middle of the bottom wall of the protective cover 441. A gear 444 is provided on the upper side of the outer arc surface of the mounting rod 443. A rack plate 442 is provided at the lower end of each of the two connecting plates 42, and both rack plates 442 are meshed with the gear 444. The drive assembly 44 also includes a drive gear 445, a slider 446, and a drive rack plate 447. Wheel 445 is located on the lower side of the outer arc surface of mounting rod 443. Slider 446 is slidably connected to the bottom wall of protective cover 441. A drive rack plate 447 is provided at the upper end of drive gear 445, and drive rack plate 447 is meshed with drive gear 445. Drive assembly 44 also includes electric push rod 448. Electric push rod 448 is located on the right side of the rear wall of protective cover 441. The front end of the telescopic end of electric push rod 448 is fixedly connected to the rear end of slider 446. The input end of electric push rod 448 is electrically connected to the output end of PLC controller 2.

[0018] Among them: a laser rangefinder 7 is installed on the rear side of the left wall of the placement slot 3. The laser rangefinder 7 corresponds to the left and right positions of the clamping plate 43 on the left side. The laser rangefinder 7 is bidirectionally electrically connected to the PLC controller 2.

[0019] Among them: a mounting plate 5 is set in the middle of the right end of the frame 1, and a tool box 6 is set in the middle of the upper end of the mounting plate 5, which can store various tools, ensure the cleanliness and orderliness of the testing tools, and improve work efficiency.

[0020] The working principle of this utility model is as follows: During the use of the test fixture for semiconductor component packaging testing, the operator places the semiconductor component to be packaged and tested inside the placement slot 3, and then the operator measures the width of the semiconductor component and the distance between the two clamping plates 43 relative to each other (e.g., a and b), and then measures the distance between the right end of the laser rangefinder 7 and the left end of the left clamping plate 43. During use, the laser rangefinder 7 emits a laser beam from its built-in light source to the left end of the front clamp 43. The laser beam is reflected after contacting the left end of the left clamp 43, and then the laser rangefinder 7 receives the reflected light. The laser rangefinder 7 calculates the distance (e.g., c) between the right end of the laser rangefinder 7 and the left end of the left clamp 43 by measuring the round-trip time (TOF) or phase difference of the laser beam. Subsequently, the laser rangefinder 7 will transmit the detected information to the PLC controller 2 through the built-in data transmission module. The PLC controller 2 will receive the detected data through the built-in serial communication port. Then, the distance between the inner sides of the two clamping plates 43 minus the width of the semiconductor element and divided by 2 can be used to obtain the distance between the right end of the left clamping plate 43 and the left end of the semiconductor element [e.g., set as d, d = (ab) ÷ 2]. Subsequently, by adding the distance between the right end of the laser rangefinder 7 and the left end of the left clamping plate 43 to the distance between the right end of the left clamping plate 43 and the left end of the semiconductor element, we can obtain the distance between the right end of the laser rangefinder 7 and the left end of the left clamping plate 43 when the right end of the left clamping plate 43 is in contact with the left end of the semiconductor element (e, e = c + d). Then, under the control of PLC controller 2, the electric push rod 448 starts to operate. The telescopic end of the electric push rod 448 extends, thereby causing the electric push rod 448 to drive the slider 446 forward. At this time, the slider 446 will slide against the bottom wall of the protective cover 441, so the bottom wall of the protective cover 441 will provide a guide support. This can reduce the radial force applied by the slider 446 to the electric push rod 448 and prevent the telescopic end of the electric push rod 448 from bending and deforming (the radial force of the electric push rod 448 is borne by the sliding bottom wall of the protective cover 441, and the electric push rod 448 is only subjected to the front and rear axial force). During the movement of the slider 446, it will drive the drive rack plate 447 to move forward. During the movement of the drive rack plate 447, the drive rack plate 446 will drive the drive rack plate 447 to move forward. 47 drives the rack plate 447 to rotate through meshing connection. During the rotation of the rack plate 447, the rack plate 447 drives the gear 444 to rotate through the mounting rod 443. During the rotation of the gear 444, the rack plate 442 moves through meshing connection. The rack plate 442 moves the clamping plate 43 through the connecting plate 42. At this time, the distance between the two clamping plates 43 will gradually decrease. The distance moved by the two clamping plates 43 is equal. When the distance between the right end of the laser rangefinder 5 and the left end of the left clamping plate 45 is equal to e, it means that the clamping plate 43 is in contact with the outer surface of the semiconductor element, thereby realizing the limiting and fixing of the semiconductor element. The operator can then use external tools to perform packaging and testing on the semiconductor element.

[0021] It is worth noting that the PLC controller 2 disclosed in the above embodiments can be AT89C51, the electric actuator 448 can be LINAK LA20, and the laser rangefinder 7 can be HMLDM-UD100A. The PLC controller 2 controls the operation of the electric actuator 448 and the laser rangefinder 7 using methods commonly used in the prior art.

[0022] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A test fixture for semiconductor component packaging testing, comprising a frame (1) and a PLC controller (2), wherein a placement slot (3) is provided in the middle of the upper end of the frame (1), characterized in that: It also includes fixed mechanisms (4); The fixing mechanism (4) includes a crossbar (41), a connecting plate (42), a clamping plate (43), and a driving assembly (44). The crossbar (41) is respectively set in the sliding grooves opened on the front and rear sides of the bottom wall of the placement groove (3). The outer arc surface of the crossbar (41) is slidably connected to the connecting plate (42) on the side away from the center of the placement groove (3). The two connecting plates (42) are slidably connected to the vertically adjacent sliding grooves respectively. The upper end of the two connecting plates (42) is provided with a clamping plate (43). The driving assembly (44) is set at the lower end of the frame (1). The clamping plate (43) is driven by the driving assembly (44).

2. The test fixture for semiconductor device packaging testing according to claim 1, characterized in that: The drive assembly (44) includes a protective cover (441), a rack plate (442), a mounting rod (443), and a gear (444). The protective cover (441) is located in the middle of the lower end of the frame (1). The mounting rod (443) is rotatably connected to the middle of the bottom wall of the protective cover (441). A gear (444) is provided on the upper side of the outer arc surface of the mounting rod (443). A rack plate (442) is provided at the lower end of both connecting plates (42). Both rack plates (442) are meshed with the gear (444).

3. The test fixture for semiconductor device packaging testing according to claim 2, characterized in that: The drive assembly (44) further includes a drive gear (445), a slider (446), and a drive rack plate (447). The drive gear (445) is located on the lower side of the outer arc surface of the mounting rod (443). The slider (446) is slidably connected to the bottom wall of the protective cover (441). The upper end of the drive gear (445) is provided with a drive rack plate (447), and the drive rack plate (447) is meshed with the drive gear (445).

4. The test fixture for semiconductor device packaging testing according to claim 3, characterized in that: The drive assembly (44) also includes an electric push rod (448), which is located on the right side of the rear wall of the protective cover (441). The front end of the telescopic end of the electric push rod (448) is fixedly connected to the rear end of the slider (446), and the input end of the electric push rod (448) is electrically connected to the output end of the PLC controller (2).

5. A test fixture for semiconductor device packaging testing according to claim 1, characterized in that: A laser rangefinder (7) is provided on the rear side of the left wall of the placement slot (3). The laser rangefinder (7) corresponds to the left and right positions of the clamp (43) on the left side. The laser rangefinder (7) is bidirectionally electrically connected to the PLC controller (2).

6. A test fixture for semiconductor device packaging testing according to claim 1, characterized in that: A mounting plate (5) is provided at the middle of the right end of the frame (1), and a tool box (6) is provided at the middle of the upper end of the mounting plate (5).

Citation Information

Patent Citations

  • Tray transfer structure for semiconductor test

    CN222330946U