A current sensor housing and a current sensor

Abstract

The utility model relates to a kind of current sensor shell and current sensor, including shell, core, PCB board and magnetic field measuring element;Wherein, shell includes installation shell and cover plate, cover plate and installation shell fixed connection;Installation shell and core constitute magnetic circuit module, PCB board and magnetic field measuring element constitute circuit module;Cover plate is equipped with placing groove and several mounting holes, core is located in installation shell, magnetic field measuring element and PCB board electrically connected, installation shell is equipped with containing cavity, circuit module and core are located in containing cavity respectively.There is following beneficial effect: magnetic circuit module and circuit module, clearly reflect the conversion process of open-loop hall current sensor "electric-magnetic-electric", and structure is simpler, cost is lower.Circuit module is assembled with magnetic circuit module when, circuit module can be completed with magnetic circuit module according to the track in first containing cavity preset and advance, reduce assembly time and artificial cost.

Description

Technical Field

[0001] This utility model relates to the field of current sensor technology, and more specifically, to a current sensor housing and a current sensor. Background Technology

[0002] Open-loop Hall current sensors are widely used due to their simple structure and low cost, but several drawbacks still exist that affect reliability and widespread adoption. First, the open-loop structure is highly sensitive to the air gap, core position, and fixing method. Magnetic circuit misalignment and changes in the relative position of the Hall element can cause zero-point drift and nonlinear errors. Improper on-site installation or alignment errors can also exacerbate measurement instability. Second, traditional rigid fastening and multi-part assembly structures are prone to stress concentration and bolt loosening under thermal cycling, vibration, or repeated maintenance conditions. This leads to increased contact resistance, grounding / shielding failure, and intermittent poor contact, potentially causing measurement anomalies or safety hazards. These problems not only affect measurement accuracy and long-term stability but also increase maintenance and replacement costs, hindering the widespread application of open-loop Hall sensors in high-reliability scenarios such as new energy, power distribution networks, rail transit, and portable power supplies. Utility Model Content

[0003] Based on the technical problems existing in the background art, this utility model proposes a current sensor housing and a current sensor.

[0004] The present invention provides a current sensor housing, comprising a housing, an iron core, a PCB board, and a magnetic field measuring element, wherein the housing includes a mounting shell and a cover plate, the cover plate being fixedly connected to the mounting shell, and the iron core being disposed inside the mounting shell; The magnetic field measuring element is electrically connected to the PCB board; The mounting housing and the iron core constitute a magnetic circuit module, which is used to convert the measured current into a measurable magnetic field; The PCB board and the magnetic field measuring element constitute a circuit module for detecting the magnetic field and converting it into a usable electrical signal output. The cover plate is provided with a placement groove and several mounting holes, and the cover plate is used to fix the PCB board and the magnetic field measuring element; The PCB board also includes several pins for electrical connection with external devices, and the pins pass through the mounting holes to position the magnetic field measuring element within the placement slot. The mounting shell is annular in shape and has a cavity on it. The circuit module and the iron core are located in the cavity respectively.

[0005] Furthermore, the cavity includes a first cavity and a second cavity, and the first cavity and the second cavity communicate with each other; The iron core has an opening located within the first cavity to provide a measurable magnetic field region.

[0006] Furthermore, the first cavity is provided with a first-level limiting structure to limit the movement of the cover plate; A slot is provided on one side of the first cavity, and the PCB board is inserted into the slot.

[0007] Furthermore, the shape of the cover plate corresponds to the shape of the first accommodating cavity, and a secondary limiting structure is provided on one side of the cover plate. When the secondary limiting structure abuts against the iron core, it limits the movement of the cover plate.

[0008] Furthermore, the mounting housing has a circular through hole in the middle for the conductor to pass through.

[0009] Furthermore, the outer side of the mounting shell is provided with several fixing structures, and the fixing structures are provided with positioning pins for fixing the mounting shell.

[0010] Furthermore, the mounting housing is also provided with a positioning groove for positioning and fixing.

[0011] Furthermore, one side of the mounting shell is provided with several limiting protrusions, which are distributed in a ring.

[0012] Furthermore, the mounting shell and the accommodating cavity are integrally formed.

[0013] Construct a current sensor, wherein the current sensor housing described in any of the above embodiments is included.

[0014] The beneficial effects of this invention are as follows: The housing of the current sensor includes a mounting shell and a cover plate. The mounting shell and the iron core constitute a magnetic circuit module, while the PCB board and the magnetic field measuring element constitute a circuit module. Each module can be deeply optimized in parallel or separately without excessive mutual interference. The magnetic circuit module can optimize the material, size, air gap width, and structure of the magnetic ring sleeve to achieve optimal magnetic field concentration and temperature stability. The circuit module can select or design superior magnetic field measuring elements, optimize the amplifier gain and bandwidth, and design more precise temperature compensation and offset voltage zeroing algorithms to improve measurement accuracy. The magnetic circuit module can be produced and inspected as an independent component. As long as the mechanical dimensions and magnetic characteristics of this module are qualified, it can be assembled with the circuit module, reducing the complexity of the overall assembly. The circuit module can be tested and pre-calibrated offline. For example, a known and stable standard magnetic field source can be directly applied to the magnetic field measuring element to calibrate its output characteristics, thereby improving production efficiency and calibration accuracy.

[0015] When assembling the circuit module and the magnetic circuit module, the circuit module can complete the assembly by advancing along the preset track within the first cavity, reducing sensor assembly time and labor costs. Furthermore, for faulty current sensors, it is possible to quickly determine whether the problem lies with the magnetic circuit module or the circuit module; simply replacing the faulty module not only shortens downtime but also reduces maintenance costs. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a current sensor housing in one embodiment of the present invention; Figure 2 This is a front view of a current sensor housing according to one embodiment of the present invention; Figure 3 yes Figure 2 A sectional view at point AA; Figure 4 This is a schematic diagram of the structure of a mounting shell for a current sensor housing in one embodiment of the present invention; Figure 5 This is a perspective view of the cover plate of a current sensor housing according to one embodiment of the present invention; Figure 6 This is a perspective view of a circuit module of a current sensor housing according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the assembly of the cover plate and circuit module of a current sensor housing in one embodiment of the present invention. Figure 8 This is a perspective view of a current sensor according to one embodiment of the present invention.

[0017] Labeling explanation: Outer shell 1; Mounting shell 11, accommodating cavity 111; First cavity 1111, first-level limiting structure 11111, slot 11112; second cavity 1112; Through hole 112, fixing structure 113, positioning pin 1131, positioning groove 114, limiting protrusion 115; Cover plate 12, placement groove 121, mounting hole 122, secondary limiting structure 123; Iron core 2; PCB board 3, pin 31; Magnetic field measuring element 4. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, a clear and complete description will be provided below in conjunction with the technical solutions in the embodiments of this utility model. Obviously, the described embodiments are some, but not all, embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0019] Please refer to the attached document. Figures 1-8 This utility model proposes a current sensor housing and a current sensor, including a housing 1, an iron core 2, a PCB board 3, and a magnetic field measuring element 4. The housing 1 includes a mounting shell 11 and a cover plate 12, with the cover plate 12 fixedly connected to the mounting shell 11. The mounting shell 11 and the iron core 2 constitute a magnetic circuit module for converting the measured current into a measurable magnetic field. The PCB board 3 and the magnetic field measuring element 4 constitute a circuit module for detecting the magnetic field and converting it into a usable electrical signal output. The circuit module also includes the cover plate 12, on which is provided... The device has a placement slot 121 and several mounting holes 122. The cover plate 12 is used to fix the PCB board 3 and the magnetic field measuring element 4. The iron core 2 is located in the mounting shell 11, and the magnetic field measuring element 4 is electrically connected to the PCB board 3. The mounting shell 11 is annular and has a housing cavity 111. The circuit module and the iron core 2 are located in the housing cavity 111 respectively. The PCB board 3 also includes several pins 31 for electrical connection with external devices. The pins 31 pass through the mounting holes 122 and place the magnetic field measuring element 4 in the placement slot 121.

[0020] In this embodiment, the outer casing 1 includes a mounting shell 11 and a cover plate 12, which are fixed to the mounting shell 11 by adhesive dispensing. The mounting shell 11 and the iron core 2 constitute a magnetic circuit module, while the PCB board 3 and the magnetic field measuring element 4 constitute a circuit module. Each module can be deeply optimized in parallel or separately without excessive mutual interference. The magnetic circuit module can optimize the material, size, air gap width, and structure of the magnetic ring sleeve to achieve optimal magnetic field concentration and temperature stability. The circuit module can select or design superior magnetic field measuring elements 4, optimize the amplifier gain and bandwidth, and design more precise temperature compensation and offset voltage zeroing algorithms to improve measurement accuracy.

[0021] The magnetic field measuring element 4 in the circuit module is electrically connected to the PCB board 3, and the magnetic field measuring element 4 is vertically fixed on the PCB board 3. The mounting shell 11 is annular, and a housing 111 is formed on the mounting shell 11, including a first housing 1111 and a second housing 1112, and the first housing 1111 and the second housing 1112 are connected. The iron core 2 is formed to the mounting shell 11 by injection molding and is located in the second housing 1112. The first housing 1111 is mainly used to place the circuit module. The cover plate 12 is provided with a placement groove 121 and a number of mounting holes 122, and the mounting holes 122 are located on the opening side of the placement groove 121. The PCB board 3 also includes a number of pins 31 for electrical connection with external devices. When the magnetic field measuring element 4 and the PCB board 3 are assembled with the cover plate 12, the magnetic field measuring element 4 is perpendicular to the PCB board 3, so that the magnetic field measuring element 4 is located in the placement slot 121. At the same time, the pins 31 of the PCB board 3 pass through the mounting holes 122, thereby fixing the PCB board 3 and the magnetic field measuring element 4. When assembling the circuit module and the magnetic circuit module, the circuit module can complete the assembly with the magnetic circuit module by advancing according to the preset track in the first housing cavity 1111, which reduces assembly time and labor costs. During maintenance and repair, only the faulty module needs to be replaced for the faulty current sensor, which not only shortens downtime but also reduces maintenance costs.

[0022] The iron core 2 has an opening, providing a measurable magnetic field region. The magnetic field measuring element 4, located in the placement slot 121, is placed at the opening (air gap) of the iron core 2 to detect the magnetic field signal at the air gap and convert and process it into a readable electrical signal. Specifically, the magnetic flux generated by the current in the conductor will produce a relatively easy-to-detect magnetic field at the air gap. The magnetic field at the air gap is converted into an electrical signal by the magnetic field measuring element 4 and output, thereby realizing the measurement of the current.

[0023] Please refer to Figure 1 , Figure 3 and Figure 4 The cavity 111 includes a first cavity 1111 and a second cavity 1112, and the first cavity 1111 and the second cavity 1112 are connected; the iron core 2 has an opening, and the opening is located inside the first cavity 1111 to provide a measurable magnetic field region.

[0024] In specific implementation: the housing 11 formed by the mounting shell 11 includes a first housing 1111 and a second housing 1112. The first housing 1111 is arranged perpendicular to the bottom of the mounting shell 11. Specifically, the first housing 1111 is recessed vertically from the bottom of the mounting shell 11 into the interior of the mounting shell 11 to form a chamber for placing devices, mainly for placing circuit modules. The second housing 1112 is a non-closed annular cavity and is located inside the mounting shell 11. The two ends of the second housing 1112 abut against and communicate with the first housing 1111.

[0025] In one embodiment, the iron core 2 has an opening. During the process of injection molding the iron core 2 into the mounting shell 11, the iron core 2 is located inside the mounting shell 11. The mounting groove of the iron core 2 forms a second accommodating cavity 1112. When the iron core 2 is fixed, the opening of the iron core 2 is located inside the first accommodating cavity 1111 to provide a measurable magnetic field area. The magnetic field measuring element 4 is placed at the opening (i.e., the air gap) and can detect a sufficiently strong and relatively concentrated magnetic field, and convert it into a usable electrical signal for output, thereby realizing the measurement of current.

[0026] Please refer to Figure 1 and Figure 4 The first cavity 1111 is provided with a first-level limiting structure 11111 to limit the movement of the cover plate 12; a slot 11112 is provided on one side of the first cavity 1111, and the PCB board 3 is inserted into the slot 11112.

[0027] In specific implementation: the primary limiting structure 11111 is disposed within the first receiving cavity 1111 and is closely attached to the side wall of the first receiving cavity 1111. Specifically, the distance from the primary limiting structure 11111 to the edge of the opening inside the first receiving cavity 1111 is equal to the thickness of the cover plate 12. That is, during assembly, the cover plate 12 is inserted into the first receiving cavity 1111 along the assembly direction until the side of the cover plate 12 facing the first receiving cavity 1111 abuts against the mating surface of the primary limiting structure 11111, and the other side is flush with the edge of the opening inside the first receiving cavity 1111. The primary limiting structure 11111 is mainly used to limit the movement of the cover plate 12, so that the cover plate 12 is engaged with the primary limiting structure 11111, preventing the cover plate 12 from being over-assembled and damaging the components located in the first receiving cavity 1111. Among them, an adhesive is provided between the primary limiting structure 11111 and the cover plate 12 to fix the cover plate 12 to the mounting shell 11.

[0028] In one embodiment, a slot 11112 is provided in the first cavity 1111. The slots 11112 are symmetrically arranged on both sides of the first cavity 1111 and form a movement track for the PCB board 3. When the circuit module and the magnetic circuit module are assembled, the PCB board 3 is pushed along the movement track until the magnetic field measuring element 4 of the circuit module is located at the opening (air gap) of the iron core 2. Then, the mounting hole 122 of the cover plate 12 passes through the pin 31 of the PCB board 3. At the same time, the side wall of the placement groove 121 on the cover plate 12 is embedded into the gap between the magnetic field measuring element 4 and the first cavity 1111, and the magnetic field measuring element 4 is located in the placement groove 121 of the cover plate 12 until the cover plate 12 abuts against the mating surface of the first-level limiting structure 11111, thus completing the assembly.

[0029] Please refer to Figure 4 and Figure 5 The shape of the cover plate 12 corresponds to the shape of the first accommodating cavity 1111, and a secondary limiting structure 123 is provided on one side of the cover plate 12. The secondary limiting structure 123 abuts against the iron core 2 to limit the cover plate 12.

[0030] In specific implementation: the shape of the cover plate 12 corresponds to the shape of the opening of the first receiving cavity 1111. At least two secondary limiting structures 123 are provided on one side of the cover plate 12. The secondary limiting structures 123 are mainly located on the side of the cover plate 12 facing the first receiving cavity 1111, and are situated on the left and right sides of the placement groove 121. Specifically, two inverted T-shaped secondary limiting structures 123 extend outward from the two opposite outer walls of the placement groove 121, and these two secondary limiting structures 123 are symmetrically arranged in the plane where the cover plate 12 and the primary limiting structure 11111 abut. A pre-installed assembly distance is provided between the secondary limiting structure 123 and the edge of the cover plate 12, and this assembly distance is greater than or equal to the height of the primary limiting structure 11111 protruding from the first receiving cavity 1111. The height of the secondary limiting structure 123 protruding from the plane of the cover plate 12 is greater than the distance from the primary limiting structure 11111 to the edge of the opening inside the first receiving cavity 1111. During assembly, the secondary limiting structure 123 abuts against the side of the primary limiting structure 11111 (i.e., the surface of the primary limiting structure 11111 that protrudes relative to the side wall of the first receiving cavity 1111 and is parallel to the side wall of the first receiving cavity 1111) or is located inside the first receiving cavity 1111 (i.e., it does not abut against the surface of the primary limiting structure 11111 that protrudes relative to the side wall of the first receiving cavity 1111 and is parallel to the side wall of the first receiving cavity 1111). When the cover plate 12 breaks through the primary limiting structure 11111 and is partially or completely embedded in the first receiving cavity 1111, the secondary limiting structure 123 acts to abut against the surface of the iron core 2 located in the first receiving cavity 1111 to perform secondary limiting on the cover plate 12 and prevent the cover plate 12 from being over-assembled and damaging the components located in the first receiving cavity 1111.

[0031] In one embodiment, the primary limiting structure 11111 and the secondary limiting structure 123 function simultaneously. The height of the secondary limiting structure 123 protruding from the cover plate 12 is equal to the distance from the primary limiting structure 11111 to the edge of the opening inside the first accommodating cavity 1111. During assembly, the cover plate 12 abuts against the mating surface of the primary limiting structure 11111, while the secondary limiting structure 123 abuts against the surface of the iron core 2 located inside the first accommodating cavity 1111, thus doubly limiting the movement path of the cover plate 12. Furthermore, the simultaneous force applied to the primary limiting structure 11111 and the secondary limiting structure 123 reduces stress concentration in a single limiting structure.

[0032] Please refer to Figure 1 and Figure 3 The mounting housing 11 has a circular through hole 112 in the middle for the conductor to pass through.

[0033] In specific implementation: A circular through hole 112 is opened in the middle of the mounting shell 11 to provide a channel for the conductor under test (such as solid wire, busbar / busbar or cable) to pass through. The edge of the through hole 112 is formed with an R-angle (that is, the part where the two ends of the circular through hole 112 in the middle of the mounting shell 11 intersect with the upper and lower surfaces of the mounting shell 11 respectively by a rounded transition). The R-angle provides a smooth transition at the intersection of the circular through hole 112 and the outer surface of the mounting shell 11, which can evenly distribute the stress to a larger area, significantly reduce the stress peak, and greatly improve the fatigue resistance of the mounting shell 11. In addition, the inner wall of the through hole 112 is formed with a smooth curved surface to prevent wear or scratching of the conductor insulation layer.

[0034] Please refer to Figure 1 and Figure 4 The outer side of the mounting shell 11 is provided with several fixing structures 113, and the fixing structure 113 is provided with positioning pins 1131 for fixing the mounting shell 11.

[0035] In practical implementation: A fixing protrusion is formed on the outer side of the mounting housing 11. One end of the positioning pin 1131 is injection molded into the fixing protrusion, and the other end is located at the bottom of the mounting housing 11 and protrudes relative to the bottom of the mounting housing 11, for connection and fixation with external equipment. The positioning pin 1131 serves as an anti-rotation and anti-misalignment component to ensure that the mounting housing 11 will not undergo relative displacement during operation or vibration. The positioning pin 1131 also enables quick disassembly and modular replacement. The positioning pins 1131 are symmetrically distributed to ensure the stability of the mounting housing 11.

[0036] Please refer to Figure 1 and Figure 4 The mounting housing 11 is also provided with a positioning groove 114 for positioning and fixing.

[0037] In practical implementation: the iron core 2 is precisely placed into the injection mold. The structure in the mold can fix the iron core 2 through the positioning groove 114 to ensure the accurate position of the iron core 2. Then the mold is closed, and molten plastic is injected into the mold cavity. The plastic will tightly wrap around the iron core 2. After cooling, it forms an integrated magnetic circuit module. After the mounting shell 11 cools and shrinks, it will generate a huge clamping force on the iron core 2, forming a very strong integrated structure with extremely strong resistance to vibration and impact.

[0038] Please refer to Figure 1 and Figure 4 The mounting shell 11 has several limiting protrusions 115 on one side, and the limiting protrusions 115 are distributed in a ring.

[0039] In practical implementation: The bottom of the mounting housing 11 is provided with several limiting protrusions 115, which can cooperate with the limiting grooves of the external device mounting plate to achieve the installation and positioning of the current sensor and the external device. The tight fit between the limiting protrusions 115 and the grooves of the external device greatly increases the contact area and engagement force between the current sensor and the mounting plate. When it is necessary to plug or unplug the sensor cable, the limiting protrusions 115 structure can resist torsional force, prevent the sensor body from rotating in the socket, thereby protecting the solder joints and preventing the pins from cracking on the PCB pads due to torque.

[0040] Please refer to Figure 1 The mounting shell 11 and the accommodating cavity 111 are integrally formed.

[0041] In practical implementation: The one-piece molded mounting shell 11 and the accommodating cavity 111 form a complete continuum, which not only has high structural strength but also better withstands external impacts, vibrations, and stresses, avoiding structural failures caused by loose screw connections or clips. In high-vibration application environments, the seamless one-piece mounting shell 11 will not loosen, thus protecting the iron core 2, PCB board 3, and magnetic field measuring element 4 inside the mounting shell 11, ensuring the stability and accuracy of the readings. It not only effectively isolates external electromagnetic interference (EMI) but also suppresses interference from the sensor's own magnetic field, thereby ensuring the purity and stability of the output signal.

[0042] Compared to traditional multi-part assembled housings that require the production of multiple parts, inventory management, and assembly, this utility model features a one-piece molded mounting housing 11. Furthermore, the sensor is divided into a magnetic circuit module and a circuit module. During assembly, simply pushing the circuit module into the receiving cavity 111 of the mounting housing 11 completes the assembly process, simplifying the assembly steps and significantly improving production efficiency. Simultaneously, it reduces the use of assembly labor, fasteners, and sealing materials, thereby lowering the overall manufacturing cost.

[0043] In the description of the embodiments of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0044] Furthermore, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0045] The above description is only a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A current sensor housing, comprising a housing, an iron core, a PCB board, and a magnetic field measuring element, characterized in that, The outer casing includes a mounting shell and a cover plate, the cover plate being fixedly connected to the mounting shell, and the iron core being disposed inside the mounting shell; The magnetic field measuring element is electrically connected to the PCB board; The mounting housing and the iron core constitute a magnetic circuit module, which is used to convert the measured current into a measurable magnetic field; The PCB board and the magnetic field measuring element constitute a circuit module for detecting the magnetic field and converting it into a usable electrical signal output. The cover plate is provided with a placement groove and several mounting holes, and the cover plate is used to fix the PCB board and the magnetic field measuring element; The PCB board also includes several pins for electrical connection with external devices, and the pins pass through the mounting holes to position the magnetic field measuring element within the placement slot. The mounting shell is annular in shape and has a cavity on it. The circuit module and the iron core are located in the cavity respectively.

2. The current sensor housing according to claim 1, characterized in that, The cavity includes a first cavity and a second cavity, and the first cavity and the second cavity are in communication. The iron core has an opening located within the first cavity to provide a measurable magnetic field region.

3. The current sensor housing according to claim 2, characterized in that, The first accommodating cavity is provided with a first-level limiting structure to limit the movement of the cover plate; A slot is provided on one side of the first cavity, and the PCB board is inserted into the slot.

4. The current sensor housing according to claim 3, characterized in that, The shape of the cover plate corresponds to the shape of the first cavity, and a secondary limiting structure is provided on one side of the cover plate. When the secondary limiting structure abuts against the iron core, it limits the movement of the cover plate.

5. The current sensor housing according to claim 1, characterized in that, The mounting housing has a circular through hole in the middle for the conductor to pass through.

6. The current sensor housing according to claim 5, characterized in that, The outer side of the mounting shell is provided with several fixing structures, and the fixing structures are provided with positioning pins for fixing the mounting shell.

7. The current sensor housing according to claim 6, characterized in that, The mounting housing is also provided with a positioning groove for positioning and fixing.

8. The current sensor housing according to claim 7, characterized in that, The mounting shell has several limiting protrusions on one side, and the limiting protrusions are distributed in a ring.

9. The current sensor housing according to claim 8, characterized in that, The mounting shell and the accommodating cavity are integrally formed.

10. A current sensor, characterized in that, Includes the current sensor housing as described in any one of claims 1-9.

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