Detection device and electronic device

Abstract

The application discloses a detection device and electronic equipment, and relates to the technical field of electronic equipment. The detection device comprises a detection part, the detection part has a first surface and a second surface opposite to each other, and the first surface and the second surface are used for being attached to a heating element and a heat dissipation element respectively; the detection part is provided with an electric connection port and a test conduction part, the test conduction part is electrically connected with the electric connection port, and the first surface and the second surface are close to a target state, and the test conduction part can be conducted with the electric connection port; wherein, in the target state, a first target area of the heating element and a second target area of the heat dissipation element are attached to each other.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a detection device and electronic equipment. Background Technology

[0002] As electronic devices become more diverse in function, their heat dissipation requirements increase significantly, especially for the central processing unit (CPU). CPU heat dissipation relies on a heat sink, which is placed above the CPU to absorb heat and conducts heat outward through fins. The degree of contact between the heat sink and the CPU significantly affects heat dissipation efficiency.

[0003] Currently, the degree of contact between the heatsink and the CPU can be detected through aging tests or visual inspection.

[0004] However, the above detection methods are rather one-sided and have significant limitations, resulting in inaccurate test results and failing to guarantee the heat dissipation efficiency of electronic devices. Utility Model Content

[0005] The first aspect of this application provides a detection device, which includes...

[0006] The detection unit has a first surface and a second surface facing away from each other, the first surface and the second surface being used to attach a heating element and a heat dissipation element, respectively.

[0007] The detection unit is provided with an electrical connection port and a test continuity part. The test continuity part is electrically connected to the electrical connection port. When the first surface and the second surface are brought close to the target state, the test continuity part can be connected to the electrical connection port.

[0008] In the target state, the first target area of ​​the heating element and the second target area of ​​the heat dissipation element are in contact.

[0009] In some modified embodiments of the first aspect of this application, the aforementioned detection device includes a first circuit layer and a second circuit layer spaced apart along a first direction.

[0010] The first circuit layer is provided with a first wire, and the second circuit layer is provided with a second wire;

[0011] The projection of the first conductor along the first direction can be spliced ​​with the second conductor to form a continuous loop circuit around the first target area, so that when the first surface and the second surface are close to the target state, the continuous loop circuit formed by the splicing of the first conductor and the second conductor can be connected to the electrical connection port;

[0012] Wherein, the first direction is the direction from the first surface to the second surface.

[0013] In some modified embodiments of the first aspect of this application, the aforementioned detection device includes at least three splicing points between the first wire and the second wire, and the at least three splicing points are distributed at intervals around the first target area or the second target area.

[0014] In some modified embodiments of the first aspect of this application, the aforementioned detection device, wherein the projection of the first conductor along the first direction at least covers the end of the second conductor to which it is spliced.

[0015] In some modified embodiments of the first aspect of this application, the aforementioned detection device, wherein the first circuit layer includes at least three mutually spaced first ends, the at least three first ends being disposed around the first target region, and some adjacent first ends being connected by the first wire;

[0016] The second circuit layer includes at least three mutually spaced second ends, the at least three second ends being arranged around the first target region, the projection of the second ends along the first direction at least partially covering the first ends, and adjacent second ends being connected by the second wire;

[0017] The second conductor and the first conductor are arranged alternately around the first target area.

[0018] In some modified embodiments of the first aspect of this application, the aforementioned detection device is provided with a protruding contact at least at the target end, wherein the target end is the end of the first wire used for splicing with the second wire or the end of the second wire used for splicing with the first wire.

[0019] In some modified embodiments of the first aspect of this application, the aforementioned detection device includes an insulating layer in the test conductive portion;

[0020] The insulating layer is disposed between the first circuit layer and the second circuit layer, and a through hole is provided on the insulating layer corresponding to the splice, so that the first wire and the second wire can pass through the through hole and abut against each other.

[0021] In some modified embodiments of the first aspect of this application, the aforementioned detection device is provided with a pressing member on the side of the first circuit layer opposite to the second circuit layer and / or on the side of the second circuit layer opposite to the first circuit layer, the pressing member being directly opposite to the splice, and the pressing member being capable of deformation in the first direction.

[0022] In some modified embodiments of the first aspect of this application, the aforementioned detection device, wherein the dimension of the test conduction portion along the first direction is not greater than 0.3 mm;

[0023] Wherein, the first direction is the direction from the first surface to the second surface.

[0024] A second aspect of this application provides an electronic device comprising:

[0025] The electronic device body, wherein the electronic device body is provided with a heat-generating element and a heat-dissipating element;

[0026] The first heat-treated surface of the heating element is used to adhere to the second heat-treated surface of the heat dissipation element for heat conduction;

[0027] The heating element includes a heating element body and a detection device;

[0028] The heating element body has the first heat-treated surface;

[0029] The detection device includes a detection unit having a first surface and a second surface facing away from each other. The first surface is used to adhere to the first heat-treated surface, and the second surface is used to adhere to the second heat-treated surface. The detection unit is provided with an electrical connection port and a test continuity part. The electrical connection port is used to electrically connect to an external electronic device. The test continuity part is electrically connected to the electrical connection port. When the first surface and the second surface are brought close together to a target state, the test continuity part can conduct electricity with the electrical connection port.

[0030] The first target area on the first heat treatment surface of the heating element and the second target area on the second heat treatment surface of the heat dissipation element are attached to each other so that the first surface and the second surface are close to the target state. Attached Figure Description

[0031] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0032] Figure 1 A schematic diagram of the detection device provided in the embodiments of this application is shown.

[0033] Figure 2 A schematic diagram illustrating the correspondence between the detection device and the heating element provided in the embodiments of this application is shown.

[0034] Figure 3 schematically shown Figure 1 Schematic diagram of the exploded structure of the detection device;

[0035] Figure 4 schematically shown Figure 1 A schematic diagram of the cross-section of the detection device along AA;

[0036] Figure 5 This illustration schematically shows another structural diagram of the detection device provided in an embodiment of this application;

[0037] Figure 6 schematically shown Figure 5 A schematic diagram showing the correspondence between the detection device and the heating element;

[0038] Figure 7 schematically shown Figure 5 Schematic diagram of the explosion detection device in the middle;

[0039] Reference numerals in the attached drawings: Detection section 1, First surface 11, Second surface 12, Electrical connection port 13, Test continuity section 2, First circuit layer 21, First wire 211, First end 212, Second circuit layer 22, Second wire 221, Second end 222, Insulating layer 23, Through hole 231, Raised contact 24, Heating element 3, Extrusion part 4, First direction a. Detailed Implementation

[0040] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0041] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined. "Vertical" is not strictly vertical, but...

[0042] It is within the allowable error range. "Parallel" is not parallel in the strict sense, but rather within the allowable error range. Words such as "include" or "contain" mean that the element preceding the word covers the element listed after the word, and do not exclude the possibility of covering other elements as well.

[0043] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0044] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0045] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0046] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0047] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains;

[0048] It should be noted that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that there can be three relationships, such as A and / or B. Specifically, it can be understood as: A and B can be included at the same time, A can exist alone, or B can exist alone, and any of the above three situations can be met.

[0049] The technical solution of this application embodiment is to solve the above-mentioned technical problems, and the general idea is as follows:

[0050] Example 1

[0051] Reference Appendix Figure 1 and attached Figure 4 The detection device provided in this application includes a detection unit 1, which has a first surface 11 and a second surface 12 facing away from each other. The first surface 11 and the second surface 12 are respectively used to attach a heating element 3 (not shown in the figure) and a heat dissipation element (not shown in the figure). The detection unit 1 is provided with an electrical connection port 13 and a test conduction part 2. The test conduction part 2 is electrically connected to the electrical connection port 13. When the first surface 11 and the second surface 12 are brought close to each other in a target state, the test conduction part 2 can conduct to the electrical connection port 13.

[0052] In the target state, the first target area of ​​the heating element 3 and the second target area of ​​the heat dissipation element are in contact.

[0053] It is understandable that, in order to solve the current defects in the yield detection of CPU and heat sink contact, the detection device provided in this embodiment provides a test conduction part 2 between its first surface 11 and second surface 12. By testing whether the conduction part 2 is connected to the electrical connection port 13, it is determined whether the heat-generating element 3 and the heat-dissipating element are tightly attached, so as to achieve effective detection and interception before leaving the factory, and improve product quality and user experience.

[0054] The detection device provided in this embodiment can be applied to electronic devices that require heat dissipation, such as mobile phones, tablets, laptops, game consoles, and displays. Accordingly, the heat-generating element 3 can be, but is not limited to, components that generate heat during operation, such as CPUs, GPUs, and motherboards. The heat dissipation element can be, but is not limited to, heat sinks, hot plates, heat pipes, etc., which are structures that first absorb heat and then dissipate it. The following description of this embodiment will take the CPU and heat sink as examples of heat-generating and heat dissipation elements, respectively.

[0055] The detection unit 1 is used to test whether the first target area of ​​the heat-generating element and the second target area of ​​the heat-dissipating element are in close contact, thereby improving the heat dissipation efficiency of the heat-generating element. Correspondingly, the first target area of ​​the heat-generating element 3 and the second target area of ​​the heat-dissipating element can be the structurally feasible parts for effective heat conduction, for example, referring to the attached... Figure 2 and attached Figure 5For the heat-generating element 3 (CPU), its circumferential periphery can have four corners. Its main heat dissipation area, i.e., the first target area, is a rectangular area excluding the four corners located in the middle. Therefore, the detection unit 1 or the test conduction unit 2 in this embodiment can be set corresponding to the four corners, thus avoiding occupying the first target area of ​​the heat-generating element 3 while still achieving detection accuracy. Of course, for heat-generating elements 3 with different structural forms, the first target area can be set and adjusted according to actual needs; that is, the first target area can also be part of the area capable of heat dissipation. For example, for heat-generating elements 3 without... Figure 5 For a CPU with only rectangular heat dissipation surfaces at its four corners in the circumferential direction, then a portion of the heat dissipation area needs to be occupied in the circumferential direction of its rectangular heat dissipation surface to set up the test conduction part 2. It is easy to understand that the test conduction part 2 can be, but is not limited to, ring-shaped, and can be set around the first target area. The second target area is similar, and will not be elaborated here.

[0056] Based on the above, at least the test continuity part 2 needs to be positioned between the heating element 3 and the heat dissipation element. Therefore, it is easy to understand that the first surface 11 and the second surface 12 can be two opposing surfaces on the test continuity part 2, or they can be two opposing surfaces located outside the test continuity part 2. The first surface 11 and the second surface 12 gradually approach each other during the process of the heating element and the heat dissipation element approaching and tightly fitting together. Therefore, the target state described in this embodiment could be a situation where the distance between the first surface 11 and the second surface 12 cannot be reduced further, or a situation where the distance between the first surface 11 and the second surface 12 is sufficient to conduct the test continuity part 2 and the electrical connection port 13, etc. In this embodiment, the test continuity section 2 can be in the form of multiple push switches and circuits. When the first target area of ​​the heating element and the second target area of ​​the heat dissipation element are tightly attached, causing the first surface 11 and the second surface 12 to approach the target state, all switches are turned on to connect the test continuity section 2 to the electrical connection port 13. The test continuity section 2 can also be in the form of stacked circuits, where each layer of circuits is local. Only when the first target area of ​​the heating element and the second target area of ​​the heat dissipation element are tightly attached, causing the first surface 11 and the second surface 12 to approach the target state, can the stacked circuits form a closed loop to connect to the electrical connection port 13.

[0057] The electrical connection port 13 can extend outward from the test conductive part 2 to avoid being clamped by the heating element 3 and the heat dissipation element. During testing, the test conductive part 2 can be adhered to the heating element 3 or the heat dissipation element, or it can be placed simply between them. The electrical connection port 13 can be, but is not limited to, a pin-type interface, a USB interface, a Type-C interface, a Lightning interface, etc. The test conductive part 2 and the electrical connection port 13 are electrically connected, but they can only conduct to each other when the first target area of ​​the heating element and the second target area of ​​the heat dissipation element are tightly fitted together, causing the first surface 11 and the second surface 12 to approach the target state. Only then can the electronic device, observation device, or detection device connected to the electrical connection port 13 detect the conduction state between them. This can be, but is not limited to, observing voltage, current, etc. It should be noted that the detection part 1 provided in this embodiment will remain inside the device after completing the test and will be shipped with the device from the factory. After the test is completed, it ensures that the heating element 3 and the heat dissipation element are always in a tightly fitted state to improve heat dissipation efficiency. Two wires can be led out from the electrical connection port 13 and extended to both sides to bypass the first target area. The test continuity part 2 can connect these two wires to form a continuous loop.

[0058] According to the above, the detection device provided in this application utilizes the special conductivity of the test conductivity part 2 and the electrical connection port 13 to achieve conductivity only when the first surface 11 and the second surface 12 are close to the target state. This allows it to detect whether the first target area of ​​the heat-generating element 3 is in close contact with the second target area of ​​the heat-dissipating element. By checking whether the two are in contact, it can be determined whether they are properly attached. This is convenient, quick, and avoids human error, thereby solving the current defects in the yield detection of CPU-heat sink contact.

[0059] Further, see Appendix Figure 3 and attached Figure 4 In the specific implementation of the detection device provided in this embodiment, the test conduction part 2 includes a first circuit layer 21 and a second circuit layer 22 spaced along a first direction a; the first circuit layer 21 is provided with a first wire 211, and the second circuit layer 22 is provided with a second wire 221; the projection of the first wire 211 along the first direction a can be spliced ​​with the second wire 221 to form a continuous ring circuit around the first target area, so that when the first surface 11 and the second surface 12 are close to the target state, the continuous ring circuit formed by the splicing of the first wire 211 and the second wire 221 can be connected to the electrical connection port 13; wherein, the first direction a is the direction from the first surface 11 to the second surface 12.

[0060] It is understandable that, in order to ensure that the test conduction section 2 can only be connected to the electrical connection port 13 when the first target area of ​​the heating element 3 and the second target area of ​​the heat dissipation element are tightly attached and the first surface 11 and the second surface 12 are close to the target state, in this embodiment, the test conduction section 2 can be configured to include a first circuit layer 21 and a second circuit layer 22 that are stacked and spaced apart. Both the first circuit layer 21 and the second circuit layer 22 are formed by setting wires on a flexible printed circuit board (FPC). The first wire 211 and the second wire 221 can be, but are not limited to, copper wires. The first direction a can be the thickness direction of the test conduction section 2, and the gap between them can be formed during the molding and mounting process. For example, a shell can be provided for the test conduction section 2, and the first circuit layer 21 and the second circuit layer 22 can be attached to the two opposite inner walls of the shell, respectively; the gap between them can also be achieved by setting a barrier layer between them. Accordingly, the two wires of the electrical connection port 13 can be electrically connected to the first circuit layer 21 simultaneously, or to the second circuit layer 22 simultaneously, or they can be electrically connected to the first circuit layer 21 and the second circuit layer 22 separately. In this embodiment, the wires on the first circuit layer 21 and the second circuit layer 22 are discontinuous or cannot form a complete loop, and cannot form a continuous circuit around the first target area independently. Therefore, the two ends of the electrical connection port 13 cannot be connected. For example, refer to the attached diagram. Figure 3 A portion of the first conductors 211 on the first circuit layer 21 are electrically connected to the electrical connection port 13. However, there may be several segments of the first conductors 211 spaced apart on the first circuit layer 21. Therefore, even if an external power supply signal is received at the electrical connection port 13, the first conductors 211 on the first circuit layer 21 cannot form a complete loop to the electrical connection port 13. The same applies to the second circuit layer 22. Therefore, in this embodiment, the projection of the first conductor 211 along the first direction a can be spliced ​​with the second conductor 221 to form a continuous ring circuit around the first target area. When the first target area of ​​the heating element and the second target area of ​​the heat dissipation element are closely attached, causing the first surface 11 and the second surface 12 to approach the target state, the first conductor 211 and the second conductor 221 approach each other and splice with each other to form a continuous ring circuit, thereby connecting the two ends of the electrical connection port 13.

[0061] Further, see Appendix Figure 3 and attached Figure 4 In the specific implementation of the detection device provided in this embodiment, the test conductive part 2 includes an insulating layer 23; the insulating layer 23 is disposed between the first circuit layer 21 and the second circuit layer 22, and a through hole 231 is provided on the insulating layer 23 corresponding to the splicing point, so that the first wire 211 and the second wire 221 can pass through the through hole 231 and abut against each other.

[0062] Understandably, to prevent accidental contact and conduction between the first circuit layer 21 and the second circuit layer 22, an insulating layer 23 can be provided between them in this embodiment. The insulating layer 23 has electrical insulation properties and can be, but is not limited to, polyimide film (PI), polyester film (PET), etc. The insulating layer 23 can maintain the interval between the first circuit layer 21 and the second circuit layer 22, and a through hole 231 is provided at the splice of the two wires to provide space or channel for contact between the two wires. The shape and size of the through hole 231 can be set and adjusted according to actual needs and are not limited here. It can be only exposed at the splice to prevent accidental contact; or it can be larger than the size of the splice to reduce the restriction of the insulating layer 23 on contact in the first direction a. It is not difficult to understand that in this configuration, the test continuity part 2 does not require a housing structure. The first surface 11 and the second surface 12 are respectively the side of the first circuit layer 21 away from the second circuit layer 22 and the side of the second circuit layer 22 away from the first circuit layer 21. The first circuit layer 21, the insulating layer 23 and the second circuit layer 22 are stacked and attached to each other to form a complete test continuity part 2.

[0063] Further, see Appendix Figure 1 and attached Figure 3 In the specific implementation of the detection device provided in this embodiment, the splicing points of the first wire 211 and the second wire 221 include at least three locations, and the at least three splicing points are distributed at intervals around the first target area or the second target area.

[0064] To ensure that the conductivity test section 2 accurately represents the close fit between the first and second target areas when they are connected, this embodiment includes at least three joints between the first conductor 211 and the second conductor 221. These three points form a plane. When all three joints are connected and conductivity is achieved, it indicates that the three joints are simultaneously within the same plane, which is pressed against the first and second target areas. Since both the first and second target areas are rigid surfaces and therefore flat, it is obvious that they are also in close fit. If any area or part of the first or second target areas warps and fails to fit together, the three joints cannot simultaneously connect and conduct. It is easy to understand that the three joints can be located on three different sides of the first target area, or two joints can be located on the same side of the first target area, and the third joint can be on a different side.

[0065] Furthermore, in a specific implementation of the detection device provided in this embodiment, the projection of the first conductor 211 along the first direction a at least covers the end of the second conductor 221 that is spliced ​​with it.

[0066] It is understandable that, in order to improve the sensitivity of the splicing point, the splicing point of the first wire 211 and the second wire 221 can be set to overlap in the first direction a in this embodiment. Then, when the first wire 211 and the second wire 221 approach the splicing point and overlap and fit together, they can be connected immediately. This is more sensitive and reliable than the docking. The length of the overlap or coverage can be set and adjusted according to actual needs, and is not limited here.

[0067] Further, see Appendix Figure 3 In the specific implementation of the detection device provided in this embodiment, the first circuit layer 21 includes at least three mutually spaced first ends 212, which are arranged around the first target area, and some adjacent first ends 212 are connected by the first wire 211; the second circuit layer 22 includes at least three mutually spaced second ends 222, which are arranged around the first target area, and the projection of the second ends 222 along the first direction a at least partially covers the first ends 212, and some adjacent second ends 222 are connected by the second wire 221; wherein, the second wire 221 and the first wire 211 are arranged alternately around the first target area.

[0068] It is understandable that, in order to achieve the splicing of the first wire 211 and the second wire 221 without increasing the thickness of the continuity test section 2, in this embodiment, the orthographic projections of the second wire 221 and the first wire 211 in the first direction a can be set to be arranged alternately around the first target area. Thus, the splicing point of the first wire 211 and the second wire 221 can be either butt joint or only partially overlapped, thereby eliminating unnecessary overlap in the first direction a, reducing the overall thickness of the continuity test section 2, and reducing its influence on the tight fit between the first target area and the second target area. Specifically, at least three first ends 212 can be provided on the circuit board of the first circuit layer 21, and second ends 222 corresponding to the first ends 212 can be provided on the circuit board of the second circuit layer 22. Both the first ends 212 and the second ends 222 are made of conductive materials, such as conductive blocks or conductive contacts. The first ends 212 and the second ends 222 can be the junctions of the first wires 211 and 221, thus at least partially overlapping in the first direction a. Simultaneously, a first wire 211 can be connected between some adjacent first ends 212, and a second wire 221 should correspond to each other between adjacent first ends 212 that are not connected to the first wire 211. Therefore, the orthographic projection in the first direction a is a staggered arrangement of the second wires 221 and the first wires 211 around the first target area, with the overlapping positions of the first ends 212 and the second ends 222 between adjacent second wires 221 and first wires 211. For details, refer to the appendix. Figure 3 Two wires are led out from the electrical connection port 13, one connected to the first circuit layer 21 and the other to the second circuit layer 22. Three first ends 212 on the first circuit layer 21 are distributed around the upper, left, and right sides of the first target area. The left first end 212 is directly connected to the wire of the electrical connection port 13, and the upper and right first ends 212 are connected by a first wire 211. Correspondingly, the second circuit layer 22 also has three second ends 222 distributed around the upper, left, and right sides of the first target area. The upper second end 222 is connected to the second wire of the electrical connection port 13 to compensate for the missing wire between the upper and left first ends 212. The left and right second ends 222 are connected by a second wire 221 to compensate for the missing wire between the left and right first ends 212, thus forming a complete and continuous loop between the two wires of the electrical connection port 13. With this configuration, the circuit board of the second circuit layer 22 can be made larger to accommodate the second wire of the electrical connection port 13. Alternatively, the second wire can be made as... Figure 1 and Figure 2As shown, it is suspended separately. In this embodiment, the number and arrangement of the first end 212 and the second end 222 can be designed and adjusted according to actual needs, for example, referring to the attached diagram. Figure 6 and attached Figure 7 In this configuration, the two wires of the electrical connection port 13 are simultaneously set on the first circuit layer 21. The first end 212 and the second end 222 are set to four, respectively, to correspond to the CPU with four corners. The first end 212 on the first circuit layer 21 are located on opposite sides in pairs. The upper and lower first end 212 on the left side of the figure are respectively connected to the two wires of the electrical connection port 13. The upper and lower first end 212 on the right side of the figure are connected by the first wire 211. Therefore, the upper two first end 212 and the lower two first end 212 in the figure lack wires and cannot form a complete and continuous circuit. Correspondingly, the second circuit layer 22 has a corresponding second end 222 at the position of the first end 212. The upper two second end 222 are connected by the second wire 221, and the lower two second end 222 are connected by the second wire 221. Therefore, the two parts of the second wire 221 can be spliced ​​to the position of the missing first wire 211 on the first circuit layer 21. Of course, it is easy to understand that, for a CPU that does not have four corners, the four first ends 212 and the four second ends 222 mentioned above can be set at the four corner positions respectively.

[0069] Further, see Appendix Figure 4 In the specific implementation of the detection device provided in this embodiment, at least the target end is provided with a protruding contact 24. The target end is the end of the first wire 211 used to splice with the second wire 221 or the end of the second wire 221 used to splice with the first wire 211.

[0070] It is understandable that, due to the presence of the insulating layer 23, the mutual contact between the first end 212 and the second end 222 requires a distance exceeding the thickness of the insulating layer 23. Therefore, to improve the contact sensitivity between the first end 212 and the second end 222, a raised contact 24 can be provided in this embodiment. The raised contact 24 can be a rigid structure or an elastic structure. The raised contact 24 is conductive and can be integrally formed with the first wire 211 or the second wire 221. For example, the end thickness of the first wire 211 or the second wire 221 can be set... For a thickness greater than its non-end portion, the raised contact (not shown in the figure) can also be additionally connected to the first end 212 or the second end 222, and can be, but is not limited to, welded; the raised contact can also achieve its elastic property through a spring and a conductive shell, for example: a spring is provided at the end of the first wire 211 and fixed to the FPC of the first circuit layer 21, extending perpendicular to the FPC and away from the FPC, the conductive shell is sleeved on the outside of the spring, the inner wall of the top of the conductive shell can be fixed to the spring, and the side wall of the conductive shell can be in contact with the first wire 211. The setting of the raised contact 24 can increase the size of the first end 212 and / or the second end 222 in the first direction a, and reduce the distance and duration of the first end 212 and the second end 222 approaching to abutting. In this embodiment, the shape and size of the raised contact 24 are not limited. It can be any shape such as circle, rectangle, triangle, etc., and can cover at least part of the first end 212 and the second end 222. It is easy to understand that the target end can be the first end 212, the second end 222, or both the first end 212 and the second end 222.

[0071] Further, see Appendix Figure 4 In the specific implementation of the detection device provided in this embodiment, the first circuit layer 21 is provided with an extrusion member 4 on the side opposite to the second circuit layer 22 and / or the second circuit layer 22 is provided with an extrusion member 4 on the side opposite to the first circuit layer 21. The extrusion member 4 is directly opposite to the splice and the extrusion member 4 can deform in the first direction a.

[0072] It is understood that, due to the presence of the insulating layer 23, the mutual contact between the first end 212 and the second end 222 requires a distance exceeding the thickness of the insulating layer 23. Therefore, to improve the contact sensitivity of the first end 212 and the second end 222, this embodiment provides a pressing member 4. The pressing member 4 can be disposed on the first surface 11 and / or the second surface 12 and corresponds to the corresponding first end 212 and / or second end 222. Thus, when the heating element 3 and the heat dissipation element approach and adhere to each other, the pressing member 4 can drive the first end 212 and the second end 222 to approach and abut more quickly, reducing the force or time required for the first end 212 and the second end 222 to approach and abut. The pressing member 4 can be elastic and deformable in the first direction a, and can be, but is not limited to, materials such as rubber and silicone. When the heating element 3 and the heat dissipation element approach and adhere to each other, the pressing member 4 can reduce its obstruction to the approach and contact of the heating element and the heat dissipation element by deforming and compressing to its minimum thickness.

[0073] Furthermore, in the specific implementation of the detection device provided in this embodiment, the size of the test conductive part 2 along the first direction a is not greater than 0.3mm.

[0074] It is understandable that because the heating element 3 and the heat dissipation element are made of different materials, their thermal conductivity is relatively low after they are bonded together. Therefore, thermal grease is usually applied between the heating element 3 and the heat dissipation element during bonding to improve their thermal conductivity and heat dissipation efficiency. It is easy to understand that the thermal grease is applied at least between the first target area and the second target area. The thickness of the thermal grease in the first direction a is typically 0.3 mm. In this embodiment, the thickness of the test conductive part 2 in the first direction a can be set to less than or equal to 0.3 mm, which can be, but is not limited to, 0.1 mm, 0.2 mm, etc., so that the test conductive part 2 will not affect the bonding between the first target area and the second target area. Simultaneously, in this embodiment, the test conductive part 2 is annular, surrounding the thermal grease, which can confine and limit the thermal grease to a certain extent, reducing the degree of thermal grease overflow and improving the cleanliness of the CPU or motherboard and the continuity of signal transmission.

[0075] Example 2

[0076] This embodiment provides an electronic device, which includes an electronic device body; the electronic device body is provided with a heating element 3 and a heat dissipation element; the first heat-treated surface of the heating element 3 is used to be in contact with the second heat-treated surface of the heat dissipation element for heat conduction;

[0077] The heating element 3 includes a heating element 3 body and a detection device;

[0078] The heating element 3 body has the first heat-treated surface;

[0079] The detection device includes a detection unit 1, which has a first surface 11 and a second surface 12 facing away from each other. The first surface 11 is used to adhere to the first heat-treated surface, and the second surface 12 is used to adhere to the second heat-treated surface. The detection unit 1 is provided with an electrical connection port 13 and a test continuity part 2, which is used to electrically connect to an external electronic device. The test continuity part 2 is electrically connected to the electrical connection port 13. When the first surface 11 and the second surface 12 are brought close to a target state, the test continuity part 2 can conduct to the electrical connection port 13. In this case, a first target area on the first heat-treated surface of the heating element 3 and a second target area on the second heat-treated surface of the heat dissipation element are brought close to a target state.

[0080] It is understood that the electronic device provided in this embodiment may be, but is not limited to, mobile phones, tablets, laptops, game consoles, displays, and other electronic devices that require heat dissipation. The heat-generating element 3 may be, but is not limited to, components that generate heat during operation, such as CPUs, GPUs, and motherboards. The heat dissipation element may be, but is not limited to, heat sinks, heat plates, heat pipes, and other structures that first absorb heat and then dissipate it. Accordingly, the first heat-treated surface is the surface where the first target area is located, and the second heat-treated surface is the surface where the second target area is located. The detection device can be adapted to heat dissipation structures with or without fans without affecting heat dissipation performance.

[0081] It is understood that the detection device provided in this embodiment is the same as the detection device described in Embodiment 1. For its specific structure and working principle, please refer to the detailed description of Embodiment 1, which will not be elaborated further here.

[0082] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A detection device, characterized in that, include: The detection unit has a first surface and a second surface facing away from each other, the first surface and the second surface being used to attach a heating element and a heat dissipation element, respectively. The detection unit is provided with an electrical connection port and a test continuity part. The test continuity part is electrically connected to the electrical connection port. When the first surface and the second surface are brought close to the target state, the test continuity part can be connected to the electrical connection port. In the target state, the first target area of ​​the heating element and the second target area of ​​the heat dissipation element are in contact.

2. The detection device according to claim 1, characterized in that: The test conductive section includes a first circuit layer and a second circuit layer spaced apart along a first direction. The first circuit layer is provided with a first wire, and the second circuit layer is provided with a second wire; The projection of the first conductor along the first direction can be spliced ​​with the second conductor to form a continuous loop circuit around the first target area, so that when the first surface and the second surface are close to the target state, the continuous loop circuit formed by the splicing of the first conductor and the second conductor can be connected to the electrical connection port; Wherein, the first direction is the direction from the first surface to the second surface.

3. The detection device according to claim 2, characterized in that: The splicing points of the first conductor and the second conductor include at least three locations, and the at least three splicing points are distributed at intervals around the first target area or the second target area.

4. The detection device according to claim 2, characterized in that: The projection of the first conductor along the first direction at least covers the end of the second conductor to which it is spliced.

5. The detection device according to claim 3, characterized in that: The first circuit layer includes at least three mutually spaced first ends, the at least three first ends being arranged around the first target region, and some adjacent first ends being connected by the first wire; The second circuit layer includes at least three mutually spaced second ends, the at least three second ends being arranged around the first target region, the projection of the second ends along the first direction at least partially covering the first ends, and adjacent second ends being connected by the second wire; The second conductor and the first conductor are arranged alternately around the first target area.

6. The detection device according to claim 3, characterized in that: At least the target end is provided with a protruding contact point, wherein the target end is the end of the first wire used for splicing with the second wire or the end of the second wire used for splicing with the first wire.

7. The detection device according to claim 2, characterized in that: The test conductive part includes an insulating layer; The insulating layer is disposed between the first circuit layer and the second circuit layer, and a through hole is provided on the insulating layer corresponding to the splice, so that the first wire and the second wire can pass through the through hole and abut against each other.

8. The detection device according to claim 7, characterized in that: The first circuit layer is provided with an extrusion member on the side opposite to the second circuit layer and / or the second circuit layer is provided with an extrusion member on the side opposite to the first circuit layer. The extrusion member is directly opposite to the splice and the extrusion member is capable of deformation in the first direction.

9. The detection device according to claim 1, characterized in that: The dimension of the test conductive part along the first direction is no greater than 0.3 mm; Wherein, the first direction is the direction from the first surface to the second surface.

10. An electronic device, characterized in that, It includes: The electronic device body, wherein the electronic device body is provided with a heat-generating element and a heat-dissipating element; The first heat-treated surface of the heating element is used to adhere to the second heat-treated surface of the heat dissipation element for heat conduction; The heating element includes a heating element body and a detection device; The heating element body has the first heat-treated surface; The detection device includes a detection unit having a first surface and a second surface facing away from each other. The first surface is used to adhere to the first heat-treated surface, and the second surface is used to adhere to the second heat-treated surface. The detection unit is provided with an electrical connection port and a test continuity part. The electrical connection port is used to electrically connect to an external electronic device. The test continuity part is electrically connected to the electrical connection port. When the first surface and the second surface are brought close together to a target state, the test continuity part can conduct electricity with the electrical connection port. The first target area on the first heat treatment surface of the heating element and the second target area on the second heat treatment surface of the heat dissipation element are attached to each other so that the first surface and the second surface are close to the target state.

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