A test device capable of testing multiple chips under test simultaneously

CN224788876UActive Publication Date: 2026-09-22SHENZHEN PAISIDI POWER SEMICON CO LTD
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Patent Information

Application Number
CN202521680197.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-07
Publication Date
2026-09-22
Estimated Expiration
2035-08-07

AI Technical Summary

Technical Problem

[0003]常规的测试装置,由于需要测试的芯片比较多,而所有的芯片都需要输送到测试区,因此在输送过程中需要自动进行测试,人工操作不仅浪费时间还降低工作效率,需要改进,为此我们提出了一种可同时测试多个待测芯片的测试装置

Benefits of technology

本实用新型通过上料推动组件和输送导向组件之间的互相配合,将待测试的芯片多组输送到待检测的位置,通过升降芯片检测组件内部的红外检测器作用,检测芯片的传输位置,同时分别对每一道的芯片进行测试,并将测试完成的芯片进行集中收集。

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Abstract

The utility model relates to chip test technical field, and disclose a kind of test device of simultaneously testing multiple chips to be tested, including work support platform, the top surface right side of work support platform is fixedly connected with feeding support platform, the top surface of feeding support platform is provided with feeding push subassembly, the top surface fixedly connected with conveying drive motor of work support platform, the output shaft of conveying drive motor is provided with conveying guide component, the top of work support platform is fixedly connected with detection support frame, the inboard of detection support frame is provided with lifting chip detection component, the left side of work support platform is provided with chip collection component, the utility model is mutually matched between feeding push subassembly and conveying guide component, and multiple groups of chips to be tested are conveyed to the position to be detected, by the effect of infrared detector inside lifting chip detection component, the transmission position of chip is detected, and each chip is tested simultaneously.
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Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, specifically a testing device that can simultaneously test multiple chips under test. Background Technology

[0002] The development of emerging electronic information technology relies on the continuous promotion of the semiconductor industry. As a core technology, chips are being used more and more frequently and are becoming increasingly important. Chips generally refer to integrated circuit carriers, which are separated by wafers. They also refer to the results of integrated circuits after design, manufacturing, packaging, and testing. After the mass production of chips is completed, it is necessary to test the basic functions of the chips.

[0003] Conventional testing devices require a large number of chips to be tested, and all chips need to be transported to the testing area. Therefore, the testing process needs to be automated during transport. Manual operation not only wastes time but also reduces work efficiency, which needs to be improved. To address this, we propose a testing device that can test multiple chips simultaneously. Utility Model Content

[0004] Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a testing device capable of simultaneously testing multiple chips under test, thus solving the aforementioned problems.

[0005] (II) Technical Solution To achieve the above-mentioned objectives, this utility model provides the following technical solution: A testing device capable of simultaneously testing multiple chips under test includes a working support platform. A feeding support platform is fixedly connected to the right side of the top surface of the working support platform. A feeding pushing component is provided on the top surface of the feeding support platform. A conveying drive motor is fixedly connected to the top surface of the working support platform. A conveying guide component is provided on the output shaft of the conveying drive motor. A detection support frame is fixedly connected to the top of the working support platform. A chip lifting detection component is provided on the inner side of the detection support frame. A chip collecting component is provided on the left side of the working support platform.

[0006] Preferably, a feeding support platform is fixedly connected to the right side of the top surface of the working support platform, rotating support platforms are fixedly connected to the top surface of the working support platform at equal intervals, a conveying groove is opened on the top surface of the working support platform, fixed support platforms are fixedly connected to the top surface of the working support platform symmetrically distributed, and a collecting support plate is fixedly connected to the bottom left side of the working support platform.

[0007] Preferably, the feeding push assembly includes a pushing cylinder, a guide support frame, a storage collection frame, a feeding sliding pusher, and a feeding push rod. The pushing cylinder is fixedly connected to the top surface of the feeding support frame, and the feeding push rod is slidably connected to the inner side of the pushing cylinder. The feeding sliding pusher is fixedly connected to the left side of the feeding push rod, and the feeding sliding pusher is slidably connected to the top surface of the feeding support frame. The guide support frame is fixedly connected to the left side of the top surface of the feeding support frame, and the storage collection frame is fixedly connected to the top surface of the guide support frame. The storage collection frame has storage slots that are equidistantly distributed through the bottom on its top surface. A test chip is slidably connected to the inner side of the storage slots, and the feeding sliding pusher is slidably connected to the top inner side of the guide support frame.

[0008] Preferably, the conveying and guiding assembly includes a conveying drive motor, a conveying guide belt, a conveyor belt, and a transmission wheel. The top surface of the working support platform is fixedly connected to the conveying drive motor, and the output shaft of the conveying drive motor is fixedly connected to the transmission wheel. The top of the rotating support platform is provided with a rotating hole, and the transmission wheel is rotatably connected to the inner side of the rotating hole. The outer side of the transmission wheel is frictionally connected to the conveyor belt, and the outer side of the conveyor belt is fixedly connected to equidistantly distributed conveying guide belts. The inner side of the conveying trough is slidably connected to the conveyor belt.

[0009] Preferably, the lifting chip detection assembly includes a chip detector, a detection support frame, a top pushing cylinder, a top pushing rod, and an infrared detector. The detection support frame is fixedly connected to the top inner side of the fixed support platform. A sliding fixing hole is opened on the inner side of the detection support frame. The top pushing cylinder is fixedly connected to the inner side of the sliding fixing hole. The top pushing rod is slidably connected to the bottom of the top pushing cylinder. The chip detector is fixedly connected to the bottom of the top pushing rod. The chip detector is slidably connected to the inner side of the sliding fixing hole. Equally spaced infrared detectors are fixedly connected to the right side of the detection support frame.

[0010] Preferably, the chip collecting assembly includes a collecting box, and the collecting box is fixedly connected to the top of the collecting support plate.

[0011] (III) Beneficial Effects Compared with the prior art, the advantages of this utility model are: This invention utilizes the cooperation between the feeding and guiding components to transport multiple groups of chips to be tested to the testing position. The transmission position of the chips is detected by the infrared detector inside the chip detection component. At the same time, each chip is tested separately, and the tested chips are collected in a centralized manner. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram showing the overall structure of this utility model disassembled; Figure 3 This is a cross-sectional view of the overall structure of this utility model; Figure 4 This is a cross-sectional schematic diagram of the material pushing component in part of the structure of this utility model.

[0013] In the diagram: 1. Working support platform; 2. Feeding support platform; 3. Pushing cylinder; 4. Conveyor drive motor; 5. Guide support frame; 6. Conveyor guide belt; 7. Fixed support platform; 8. Conveyor belt; 9. Drive wheel; 10. Rotating support platform; 11. Collection box; 12. Chip detector; 13. Detection support frame; 14. Top push cylinder; 15. Storage collection box; 16. Test chip; 17. Feeding sliding push platform; 18. Feeding push rod; 19. Conveying trough; 20. Collection support plate; 21. Top push rod; 22. Infrared detector; 23. Storage trough. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-4 This utility model provides a technical solution; A testing device capable of simultaneously testing multiple chips under test includes a working support platform 1, a feeding support platform 2 fixedly connected to the right side of the top surface of the working support platform 1, a feeding push assembly provided on the top surface of the feeding support platform 2, a conveying drive motor 4 fixedly connected to the top surface of the working support platform 1, a conveying guide assembly provided on the output shaft of the conveying drive motor 4, a detection support frame 13 fixedly connected to the top of the working support platform 1, a lifting chip detection assembly provided on the inner side of the detection support frame 13, and a chip collection assembly provided on the left side of the working support platform 1.

[0016] Furthermore, a feeding support platform 2 is fixedly connected to the right side of the top surface of the working support platform 1, and rotating support platforms 10 are fixedly connected to the top surface of the working support platform 1 at equal intervals. A conveying trough 19 is opened on the top surface of the working support platform 1, and fixed support platforms 7 are fixedly connected to the top surface of the working support platform 1 in a symmetrical manner. A collection support plate 20 is fixedly connected to the bottom left side of the working support platform 1.

[0017] Furthermore, the feeding and pushing assembly includes a pushing cylinder 3, a guide support frame 5, a storage collection frame 15, a feeding sliding pusher 17, and a feeding pusher 18. The pushing cylinder 3 is fixedly connected to the top surface of the feeding support frame 2, and the feeding pusher 18 is slidably connected to the inner side of the pushing cylinder 3. The feeding sliding pusher 17 is fixedly connected to the left side of the feeding pusher 18, and the feeding sliding pusher 17 is slidably connected to the top surface of the feeding support frame 2. The guide support frame 5 is fixedly connected to the left side of the top surface of the feeding support frame 2, and the storage collection frame 15 is fixedly connected to the top surface of the guide support frame 5. The storage collection frame 15 has storage slots 23 that are evenly distributed through the bottom on its top surface. The test chip 16 is slidably connected to the inner side of the storage slot 23, and the feeding sliding pusher 17 is slidably connected to the inner top of the guide support frame 5. Through the action of the feeding and pushing assembly, the chips are fed to the conveying and guiding assembly in multiple groups at the same time, so as to test multiple groups of chips at the same time.

[0018] Furthermore, the conveying and guiding assembly includes a conveying drive motor 4, a conveying guide belt 6, a conveyor belt 8, and a transmission wheel 9. The top surface of the work support platform 1 is fixedly connected to the conveying drive motor 4, and the output shaft of the conveying drive motor 4 is fixedly connected to the transmission wheel 9. The top of the rotating support platform 10 is provided with a rotating hole, and the transmission wheel 9 is rotatably connected to the inner side of the rotating hole. The outer side of the transmission wheel 9 is frictionally connected to the conveyor belt 8, and the outer side of the conveyor belt 8 is fixedly connected to the equidistantly distributed conveying guide belts 6. The inner side of the conveying trough 19 is slidably connected to the conveyor belt 8. Through the function of the conveying and guiding assembly, multi-channel guiding and conveying is realized, while avoiding mutual interference between chips and affecting the simultaneous testing of multiple chips.

[0019] Furthermore, the lifting chip detection assembly includes a chip detector 12, a detection support frame 13, a top push cylinder 14, a top push rod 21, and an infrared detector 22. The detection support frame 13 is fixedly connected to the inner top of the fixed support platform 7. A sliding fixing hole is opened on the inner side of the detection support frame 13. The top push cylinder 14 is fixedly connected to the inner side of the sliding fixing hole. The top push rod 21 is slidably connected to the bottom of the top push cylinder 14. The chip detector 12 is fixedly connected to the bottom of the top push rod 21. The chip detector 12 is slidably connected to the inner side of the sliding fixing hole. The infrared detectors 22 are equidistantly distributed on the right side of the detection support frame 13. By upgrading the chip detection assembly, each chip can be detected separately.

[0020] Furthermore, the chip collection component includes a collection box 11, which is fixedly connected to the top of the collection support plate 20. Through the function of the collection component, the chips are collected in a centralized manner.

[0021] Working principle: In the initial state, multiple test chips are placed in the storage tank 23 of the storage collection frame 15. The pusher cylinder 3 is activated, pushing the feeding push rod 18 to move to the left. The feeding push rod 18 drives the feeding sliding pusher 17 to slide on the inner side of the top of the guide support frame 5. The feeding sliding pusher 17 pushes the bottom row of test chips to the left, causing them to fall from the storage tank 23 onto the conveyor guide assembly. The conveyor drive motor 4 is activated, driving the transmission wheel 9 on the output shaft to rotate. The transmission wheel 9 rotates in the rotation hole of the rotating support platform 10, and drives the conveyor belt 8 to slide in the conveyor trough 19 through friction. The equidistantly distributed conveyor guide belts 6 fixed on the outer side of the conveyor belt 8 move accordingly. Multiple test chips are transported forward from the support frame 13. When the chip moves to the detection position with the transport guide assembly, the infrared detector 22 on the right side of the detection support frame 13 detects the chip's transmission position signal. The signal is transmitted to the control system, which then activates the top push cylinder 14. The top push cylinder 14 pushes the top push rod 21 downward. The top push rod 21 drives the chip detector 12 to slide downward along the sliding fixing hole on the inner side of the detection support frame 13, bringing the chip detector closer to the chip. Each chip is tested, and the test data is transmitted to the control system for analysis and processing. After the test is completed, the chips are collected in a collection box 11.

[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A testing apparatus capable of simultaneously testing multiple chips under test, comprising a work support stage (1), characterized in that: A feeding support platform (2) is fixedly connected to the right side of the top surface of the working support platform (1). A feeding push assembly is provided on the top surface of the feeding support platform (2). A conveying drive motor (4) is fixedly connected to the top surface of the working support platform (1). A conveying guide assembly is provided on the output shaft of the conveying drive motor (4). A detection support frame (13) is fixedly connected to the top of the working support platform (1). A lifting chip detection assembly is provided on the inner side of the detection support frame (13). A chip collection assembly is provided on the left side of the working support platform (1).

2. The testing device for simultaneously testing multiple chips under test according to claim 1, characterized in that: The top surface of the working support platform (1) is fixedly connected with rotating support platforms (10) that are evenly distributed. The top surface of the working support platform (1) is provided with a conveying groove (19). The top surface of the working support platform (1) is fixedly connected with symmetrically distributed fixed support platforms (7). The bottom left side of the working support platform (1) is fixedly connected with a collection support plate (20).

3. The testing device for simultaneously testing multiple chips under test according to claim 2, characterized in that: The feeding push assembly includes a pushing cylinder (3), a guide support frame (5), a storage collection frame (15), a feeding sliding push table (17), and a feeding push rod (18). The pushing cylinder (3) is fixedly connected to the top surface of the feeding support table (2), and the feeding push rod (18) is slidably connected to the inner side of the pushing cylinder (3). The feeding sliding push table (17) is fixedly connected to the left side of the feeding push rod (18), and the feeding support table (2) is slidably connected to the top surface of the feeding support table (2). The feeding sliding pusher (17) has a guide support frame (5) fixedly connected to the top left side of the feeding support platform (2), and a storage collection frame (15) fixedly connected to the top surface of the guide support frame (5). The top surface of the storage collection frame (15) is provided with storage troughs (23) that are evenly distributed through the bottom. The inner side of the storage trough (23) is slidably connected to the test chip (16), and the top inner side of the guide support frame (5) is slidably connected to the feeding sliding pusher (17).

4. The testing device for simultaneously testing multiple chips under test according to claim 2, characterized in that: The conveying and guiding assembly includes a conveying drive motor (4), a conveying guide belt (6), a conveyor belt (8), and a transmission wheel (9). The output shaft of the conveying drive motor (4) is fixedly connected to the transmission wheel (9). The top of the rotating support platform (10) is provided with a rotating hole. The inner side of the rotating hole is rotatably connected to the transmission wheel (9). The outer side of the transmission wheel (9) is frictionally connected to the conveyor belt (8). The outer side of the conveyor belt (8) is fixedly connected to the equidistantly distributed conveying guide belts (6). The inner side of the conveying trough (19) is slidably connected to the conveyor belt (8).

5. A testing device capable of simultaneously testing multiple chips under test according to claim 2, characterized in that: The lifting chip detection assembly includes a chip detector (12), a detection support frame (13), a top push cylinder (14), a top push rod (21), and an infrared detector (22). The detection support frame (13) is fixedly connected to the top inner side of the fixed support platform (7). A sliding fixing hole is opened on the inner side of the detection support frame (13). The top push cylinder (14) is fixedly connected to the inner side of the sliding fixing hole. The top push rod (21) is slidably connected to the bottom of the top push cylinder (14). The chip detector (12) is fixedly connected to the bottom of the top push rod (21). The chip detector (12) is slidably connected to the inner side of the sliding fixing hole. The infrared detectors (22) are equidistantly distributed and fixedly connected to the right side of the detection support frame (13).

6. A testing device capable of simultaneously testing multiple chips under test according to claim 2, characterized in that: The chip collection assembly includes a collection box (11), and the collection box (11) is fixedly connected to the top of the collection support plate (20).