A PCB signal integrity coupon detection module

Abstract

The utility model discloses a kind of PCB signal integrity coupon detection module, belong to electronic testing technical field, by test fixture upper die and lower die are split and form the test area between first recess, second recess and place PCB board, make the test hole of coupon detection area on PCB board and the wiring hole of upper die be connected, by the external connection hole electrically connected with wiring hole and access external connection pipeline to form test loop to test, since upper die and lower die are split by fastening mechanism, after completing the test of a group of test holes, only need to disassemble upper die and lower die, without disassembling external connection pipeline, upper die and lower die can be quickly moved, after upper die and lower die are moved to the position of next group of test holes, again upper die and lower die are split, make wiring hole and next group of test hole connect and carry out the test of next group of test holes, solve the problem that current PCB board signal is tested in process, and external connection pipeline joint and test hole are frequently unplugged, and the operation amount is large, joint is easily damaged.

Description

Technical Field

[0001] This utility model relates to a PCB signal integrity coupon detection module, belonging to the field of electronic testing technology. Background Technology

[0002] During PCB board signal testing, corresponding coupons are usually made for testing. Typically, test holes are made on the coupons, and then the test holes are connected to external pipelines for testing. After testing one set of test holes, the pipeline connectors need to be removed and connected to another set of test holes. This involves too much work, and because the pipeline connectors are frequently plugged and unplugged from the test holes, the connectors will become loose over time, eventually leading to unstable testing. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a PCB signal integrity coupon detection module that can quickly detach and assemble with the test holes on the coupon and avoid frequent plugging and unplugging of external pipeline connectors and test holes. This solves the problem that in the current process of testing PCB signals, it is necessary to frequently plug and unplug external pipeline connectors and test holes, resulting in a large amount of operation and easy damage to the connectors.

[0004] To solve the above-mentioned technical problems, this utility model is implemented using the following technical solution: This utility model provides a PCB signal integrity coupon detection module, including: The coupon detection area is located on the PCB board and includes multiple sets of test holes, each set of test holes being connected by a circuit. Test fixtures, including upper and lower molds; The upper mold has a first groove on one side, and the lower mold has a second groove on the side facing the first groove. A guide mechanism and a fastening mechanism are also provided between the lower mold and the upper mold. The upper mold moves perpendicular to the lower mold via a guide mechanism and, after being assembled with the lower mold, forms a test area for placing the PCB board between the first groove and the second groove. The upper mold and the lower mold are fastened together by a fastening mechanism to fix the PCB board in the test area. The upper mold is provided with wiring holes that match multiple sets of test holes and external connection holes for connecting to external pipeline connectors. After the upper mold and the lower mold are assembled, the wiring holes are inserted into the test holes. The external connection hole is electrically connected to the wiring hole.

[0005] Optionally, the guiding mechanism includes a plurality of guide rods disposed on one side of the lower mold and a plurality of through holes disposed on the upper mold corresponding to the guide rods; The guide rod is movably inserted into the through hole.

[0006] Optionally, the fastening mechanism includes a retaining plate movably disposed on the side of the upper mold and a retaining groove disposed on the side of the lower mold, wherein the retaining plate and the retaining groove are engaged.

[0007] Optionally, the outer side of the test hole is also provided with a plurality of positioning holes, and the second groove is provided with a positioning rod corresponding to the positioning hole, the positioning rod being movably inserted into the positioning hole.

[0008] Optionally, the plurality of positioning holes are evenly distributed on the outside of the test hole.

[0009] Optionally, the lines between the test holes in the same group are differential distribution lines, and the lines extend in a zigzag pattern with U-shaped corners.

[0010] Optionally, a group of grounding holes for suppressing electromagnetic interference is provided around the test hole.

[0011] Optionally, the grounding hole group includes an inner ring hole group close to the test hole and an outer ring hole group away from the test hole; The inner ring hole group includes a plurality of first grounding holes, which are evenly distributed on the outside of the test hole with a starting angle of 0 degrees and an interval of 45 degrees. The outer ring hole group includes multiple second grounding holes, which are evenly distributed on the outside of the inner ring hole group with a starting angle of 22.5 degrees and an interval of 45 degrees.

[0012] Compared with the prior art, the beneficial effects achieved by this utility model are as follows: 1. This utility model uses a test area formed between the first and second grooves of the test fixture after the upper and lower molds are assembled. A PCB board is placed in this test area, and the test holes in the coupon detection area on the PCB board are connected to the wiring holes of the upper mold. An external pipeline is connected through an external connection hole electrically connected to the wiring hole to form a test circuit for testing. Since the upper and lower molds are assembled by a fastening mechanism, after completing the test of a set of test holes, the upper and lower molds can be quickly moved without disassembling the external pipeline. After the upper and lower molds are moved to the position of the next set of test holes, they are assembled again so that the wiring hole is connected to the new set of test holes and the next set of test holes is tested. This solves the problem that in the current process of testing PCB board signals, it is necessary to frequently plug and unplug the external pipeline connectors to the test holes, resulting in a large amount of operation and easy damage to the connectors.

[0013] 2. This utility model enables the PCB board to be quickly placed in the second groove by setting multiple positioning holes outside the test hole and setting positioning rods corresponding to the positioning holes in the second groove, which is beneficial to the rapid assembly of the upper and lower molds.

[0014] 3. This utility model sets up a group of grounding holes around the test hole to suppress electromagnetic interference. By distributing the inner and outer ring groups of holes, the grounding holes form a grounding barrier around the test hole, which limits the radiation to a fixed area and can also resist external electromagnetic interference, reducing crosstalk. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the coupon detection area provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the overall structure of a PCB signal integrity coupon detection module provided in an embodiment of the present invention; Figure 3 This is a schematic diagram showing the positional distribution of the test holes and positioning holes provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the circuit structure provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the upper mold structure provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the lower mold structure provided in an embodiment of the present invention.

[0016] In the diagram: 1. Coupon detection area; 201. Test hole A; 202. Test hole B; 203. Test hole C; 204. Test hole D; 3. Circuit; 401. First grounding hole; 402. Second grounding hole; 5. Test fixture; 501. Upper mold; 5011. First groove; 5012. Wiring hole; 5013. External connection hole; 502. Lower mold; 5021. Second groove; 5022. Support base; 601. Card plate; 602. Card slot; 7. Guide rod; 8. Through hole; 9. Positioning rod; 10. Positioning hole. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention. Example 1

[0018] A PCB signal integrity coupon detection module includes a coupon detection area 1 and a test fixture 5. The coupon detection area 1 is located on the PCB board, and multiple sets of test holes are formed on the coupon detection area 1. Each set of test holes is connected via a line 3. Specifically: like Figure 1As shown, in this embodiment, a set of four test holes is used as an example, namely test hole A201, test hole B202, test hole C203 and test hole D204. Test hole A201 and test hole B202 are electrically connected through line 3, and test hole C203 and test hole D204 are connected through another line 3. Line 3 is a differential line, and there is a differential line between test hole A201 and test hole B202. A differential line includes two single lines, and the two single lines are of equal length and equal line width. To ensure that the traces rotate at a certain angle and avoid test abnormalities caused by the fiberglass effect, differential line 3 extends in a zigzag pattern, and the corners of the traces are U-shaped to keep the corners smooth.

[0019] A group of grounding holes is provided around the test hole to suppress electromagnetic interference.

[0020] like Figure 2 As shown, the test fixture 5 includes an upper mold 501 and a lower mold 502; like Figure 5 and Figure 6 As shown, the upper mold 501 has a first groove 5011 at its bottom, and the lower mold 502 has a second groove 5021 at its top. A guiding mechanism and a fastening mechanism are also provided between the lower mold 502 and the upper mold 501. The upper mold 501 moves perpendicularly to the lower mold 502 via the guiding mechanism and, after merging with the lower mold 502, forms a test area for placing the PCB board between the first groove 5011 and the second groove 5021. The upper mold 501 and the lower mold 502 fix the PCB board to the test area via the fastening mechanism. Specifically: The guiding mechanism includes multiple guide rods 7 fixed to the top of the lower mold 502 and multiple through holes 8 opened in the upper mold 501 corresponding to the guide rods 7. The guide rods 7 and the through holes 8 are movably inserted into each other, and the upper mold 501 can move perpendicularly to the lower mold 502 along the guide rods 7. The fastening mechanism includes a clamping plate 601 rotatably connected to the front and rear sides of the upper mold 501 and a clamping groove 602 opened on the front and rear sides of the lower mold 502. The position of the clamping groove 602 corresponds to the position of the clamping plate 601, and the clamping plate 601 is engaged with the clamping groove 602. The first groove 5011 is equipped with a wiring hole 5012 that matches the test hole. The top of the upper mold 501 is equipped with an external connection hole 5013 that is electrically connected to the wiring hole 5012. It should be noted that the external connection hole 5013 is an SMA connector, which is used to connect with an external pipeline connector. The second groove 5021 is also fixed with a support base 5022, which is used to support the PCB board placed in the second groove 5021. After the PCB board is placed in the second groove 5021, the test hole on the coupon detection area 1 faces the first groove 5011. The upper mold 501 is moved down along the guide rod 7 so that the upper mold 501 contacts the lower mold 502. At this time, the wiring hole 5012 is connected to the test hole. After the card plate 601 is engaged with the card slot 602, the assembly of the upper mold 501 and the lower mold 502 is completed. Then, the external pipeline connector is connected to the external connection hole 5013, thus forming a test circuit. Example 2

[0021] A PCB signal integrity coupon detection module includes a coupon detection area 1 and a test fixture 5. The coupon detection area 1 is located on the PCB board, and multiple sets of test holes are formed on the coupon detection area 1. Each set of test holes is connected via a line 3. Specifically: like Figure 1 and Figure 4 As shown, in this embodiment, a set of four test holes is used as an example, namely test hole A201, test hole B202, test hole C203 and test hole D204. Test hole A201 and test hole B202 are electrically connected through line 3, and test hole C203 and test hole D204 are connected through another line 3. Line 3 is a differential line, and there is a differential line between test hole A201 and test hole B202. A differential line includes two single lines, and the two single lines are of equal length and equal line width. To ensure that the traces rotate at a certain angle and avoid test abnormalities caused by the fiberglass effect, differential line 3 extends in a zigzag pattern, and the corners of the traces are U-shaped to keep the corners smooth.

[0022] A set of grounding holes for suppressing electromagnetic interference is provided around the test hole. The set of grounding holes includes an inner ring of holes close to the test hole and an outer ring of holes away from the test hole. The inner ring hole group includes multiple first grounding holes 401. With the test hole as a reference, the multiple first grounding holes 401 are evenly distributed on the outside of the test hole with a starting angle of 0 degrees and an interval of 45 degrees. The outer ring hole group includes multiple second grounding holes 402. With the test hole as a reference, the multiple second grounding holes 402 are evenly distributed on the outside of the inner ring hole group with a starting angle of 22.5 degrees and an interval of 45 degrees. By using the distribution of inner and outer ring hole groups, the grounding holes form a grounding barrier around the test holes, which limits radiation to a fixed area and can also resist external electromagnetic interference, reducing crosstalk.

[0023] like Figure 2 As shown, the test fixture 5 includes an upper mold 501 and a lower mold 502; like Figure 5 and Figure 6 As shown, the upper mold 501 has a first groove 5011 at its bottom, and the lower mold 502 has a second groove 5021 at its top. A guiding mechanism and a fastening mechanism are also provided between the lower mold 502 and the upper mold 501. The upper mold 501 moves perpendicularly to the lower mold 502 via the guiding mechanism and, after merging with the lower mold 502, forms a test area for placing the PCB board between the first groove 5011 and the second groove 5021. The upper mold 501 and the lower mold 502 fix the PCB board to the test area via the fastening mechanism. Specifically: The guiding mechanism includes multiple guide rods 7 fixed to the top of the lower mold 502 and multiple through holes 8 opened in the upper mold 501 corresponding to the guide rods 7. The guide rods 7 and the through holes 8 are movably inserted into each other, and the upper mold 501 can move perpendicularly to the lower mold 502 along the guide rods 7. The fastening mechanism includes a clamping plate 601 rotatably connected to the front and rear sides of the upper mold 501 and a clamping groove 602 opened on the front and rear sides of the lower mold 502. The position of the clamping groove 602 corresponds to the position of the clamping plate 601, and the clamping plate 601 is engaged with the clamping groove 602. The first groove 5011 is equipped with a wiring hole 5012 that matches the test hole. The top of the upper mold 501 is equipped with an external connection hole 5013 that is electrically connected to the wiring hole 5012. It should be noted that the external connection hole 5013 is an SMA connector, which is used to connect with an external pipeline connector. The second groove 5021 is also fixed with a support base 5022, which is used to support the PCB board placed in the second groove 5021. After the PCB board is placed in the second groove 5021, the test hole on the coupon detection area 1 faces the first groove 5011. The upper mold 501 is moved down along the guide rod 7 so that the upper mold 501 contacts the lower mold 502. At this time, the wiring hole 5012 is connected to the test hole. After the card plate 601 is engaged with the card slot 602, the assembly of the upper mold 501 and the lower mold 502 is completed. Then, the external pipeline connector is connected to the external connection hole 5013, thus forming a test circuit. like Figure 1 , Figure 3 and Figure 6 As shown, in order to improve the assembly speed of the upper mold 501 and the lower mold 502, multiple positioning holes 10 are symmetrically opened on the outside of the test hole. Multiple positioning rods 9 are fixed in the second groove 5021 corresponding to the positioning holes 10, and the positioning rods 9 are inserted into the positioning holes 10. During the placement of the PCB board, the PCB board can be quickly placed in the second groove 5021 by aligning the positioning hole 10 with the positioning rod 9, which improves the subsequent assembly speed of the upper mold 501 and the lower mold 502.

[0024] Working principle Align the positioning hole 10 on the PCB board with the positioning rod 9 in the second groove 5021, place the PCB board in the second groove 5021, move the upper mold 501 down along the guide rod 7 so that the upper mold 501 contacts the lower mold 502, and after the card plate 601 is engaged with the card slot 602, the assembly of the upper mold 501 and the lower mold 502 is completed. Then connect the external pipeline connector on the external connection hole 5013 to form a test circuit. After the current set of test holes has been tested, remove the card plate 601 from the card slot 602, move the upper mold 501 up until it is disengaged from the guide rod 7, remove the PCB board from the lower mold 502, and place the PCB board back into the second groove 5021 according to the position of the new set of test holes. Align the through hole 8 of the upper mold 501 with the guide rod 7 and insert it. Move the upper mold 501 down and assemble the upper mold 501 with the lower mold 502 to test the new set of test holes.

[0025] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A PCB signal integrity coupon detection module, characterized in that, include: The coupon detection area (1) is located on the PCB board and includes multiple sets of test holes, each set of test holes being connected by a line (3); The test fixture (5) includes an upper mold (501) and a lower mold (502); The upper mold (501) has a first groove (5011) on one side, and the lower mold (502) has a second groove (5021) on the side facing the first groove (5011). A guide mechanism and a fastening mechanism are also provided between the lower mold (502) and the upper mold (501). The upper mold (501) moves perpendicular to the lower mold (502) through a guide mechanism and is assembled with the lower mold (502) to form a test area for placing the PCB board between the first groove (5011) and the second groove (5021). The upper mold (501) and the lower mold (502) fix the PCB board in the test area through a fastening mechanism. The upper mold (501) is provided with wiring holes (5012) that match multiple sets of test holes and external connection holes (5013) for connecting to external pipeline connectors. After the upper mold (501) and the lower mold (502) are assembled, the wiring holes (5012) are inserted into the test holes. The external connection hole (5013) is electrically connected to the wiring hole (5012).

2. The PCB signal integrity coupon detection module according to claim 1, characterized in that, The guiding mechanism includes a plurality of guide rods (7) disposed on one side of the lower mold (502) and a plurality of through holes (8) disposed on the upper mold (501) corresponding to the guide rods (7). The guide rod (7) is movably inserted into the through hole (8).

3. The PCB signal integrity coupon detection module according to claim 1, characterized in that, The fastening mechanism includes a clamping plate (601) movably disposed on the side of the upper mold (501) and a clamping groove (602) disposed on the side of the lower mold (502), wherein the clamping plate (601) and the clamping groove (602) are engaged.

4. The PCB signal integrity coupon detection module according to claim 1, characterized in that, The outer side of the test hole is also provided with a plurality of positioning holes (10), and the second groove (5021) is provided with a positioning rod (9) corresponding to the positioning hole (10), and the positioning rod (9) is movably inserted into the positioning hole (10).

5. The PCB signal integrity coupon detection module according to claim 4, characterized in that, Multiple positioning holes (10) are evenly distributed on the outside of the test hole.

6. The PCB signal integrity coupon detection module according to claim 1, characterized in that, The lines (3) between the test holes in the same group are differential distribution lines, and the lines (3) extend in a broken line shape with a U-shape at the corner.

7. The PCB signal integrity coupon detection module according to claim 1, characterized in that, The test hole is surrounded by a group of grounding holes for suppressing electromagnetic interference.

8. The PCB signal integrity coupon detection module according to claim 7, characterized in that, The grounding hole group includes an inner ring of holes close to the test hole and an outer ring of holes away from the test hole; The inner ring hole group includes a plurality of first grounding holes (401), which are evenly distributed on the outside of the test hole with a starting angle of 0 degrees and an interval of 45 degrees. The outer ring hole group includes a plurality of second grounding holes (402), which are evenly distributed on the outside of the inner ring hole group with a starting angle of 22.5 degrees and an interval of 45 degrees.

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