Optical module heat dissipation structure

Abstract

The utility model provides a kind of optical module heat dissipation structure, including upper cover, base, PCBA board, the upper cover and base enclose and form the accommodation space of PCBA board, the upper cover includes upper cover support and copper block, the copper block and the upper cover support detachably connect, copper block is equipped with heat conduction boss, the upper cover support is equipped with the hollowing-out mouth that heat conduction boss is inserted into base and is contacted with PCBA board on heating device.The copper block is good and directly contacted with heating device with heat conduction performance, can better help heating device heat dissipation, effectively enhance the heat dissipation performance of optical module itself, and because copper block and upper cover support detachably connect, when PCBA board inside optical module is different, i. e. heating device position changes, only need to replace copper block, change the position of heat conduction boss, and upper cover support need not to replace, can save cost, can be applicable to multiple optical modules.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, and in particular to a heat dissipation structure for optical modules. Background Technology

[0002] After the optical module reaches a single-wavelength speed of 200Gb / s, the heat density of the digital signal processor (DSP) on the PCBA board inside the optical module surges, reaching 6.2×10⁻⁶. 5 W / m 2 Such a high heat flux density puts a great strain on the heat dissipation of optical modules and even switches.

[0003] For OSFP-RHS optical modules that are mounted on switch cages (switch interface slots), the current approach is to use higher heat dissipation fins on the switch cage to enhance the heat dissipation of the optical modules. Some switch cages even use cold plate water cooling solutions to enhance the heat dissipation of the optical modules. These are all methods that rely on the switch cage to achieve heat dissipation of the optical modules, which are external methods to help the optical modules dissipate heat. However, there is still no perfect solution for how to enhance the heat dissipation capacity of the OSFP-RHS optical modules themselves. Moreover, most optical modules currently use traditional zinc alloy die-cast parts. Because zinc alloy has poor thermal conductivity, it also affects the heat dissipation performance of the optical modules themselves.

[0004] Therefore, it is necessary to design a heat dissipation structure for optical modules that can enhance the heat dissipation capacity of the optical modules themselves while controlling costs as much as possible, and is applicable to various types of optical modules. Utility Model Content

[0005] The purpose of this invention is to overcome the defects of the prior art and provide a heat dissipation structure for optical modules. This invention overcomes at least some of the problems in the prior art.

[0006] This utility model is implemented as follows:

[0007] This utility model provides a heat dissipation structure for an optical module, including an upper cover, a base, and a PCBA board. The upper cover and the base together form a receiving space for the PCBA board. The upper cover includes an upper cover bracket and a copper block. The copper block and the upper cover bracket are detachably connected. The copper block is provided with a heat-conducting protrusion. The upper cover bracket has a cutout for the heat-conducting protrusion to extend into the base and contact the heat-generating devices on the PCBA board.

[0008] Furthermore, the top cover and the base are fixedly connected by screws.

[0009] Furthermore, the copper block is fixed to the upper cover bracket by screws.

[0010] Furthermore, the thermally conductive protrusion is connected to the heating device via thermally conductive gel.

[0011] Furthermore, the upper cover bracket is provided with a copper block mounting groove, and the cutout is located in the copper block mounting groove.

[0012] Furthermore, the copper block mounting groove is coated with a high-temperature resistant conductive adhesive that comes into contact with the copper block.

[0013] Furthermore, both the edge of the copper block mounting groove and the edge of the copper block are chamfered.

[0014] Furthermore, both the copper block and the copper block mounting groove extend to the edge of the optical module electrical interface end, and the copper block is positioned above the upper surface of the upper cover bracket at the optical module electrical interface end.

[0015] Furthermore, both the top cover and the base are provided with tilt angles at the electrical interface end of the optical module to facilitate the insertion and removal of the optical module.

[0016] Furthermore, the edges of the inclined angle are chamfered.

[0017] This utility model has the following beneficial effects:

[0018] This utility model provides a heat dissipation structure for an optical module. The upper cover includes an upper cover bracket and a copper block, which are detachably connected. The copper block is provided with a heat-conducting protrusion, and the upper cover bracket has a cutout. The heat-conducting protrusion can extend into the base through the cutout and directly contact the heat-generating components on the PCBA board. The copper block has good thermal conductivity and is in direct contact with the heat-generating components, which can better help the heat-generating components dissipate heat and effectively enhance the heat dissipation performance of the optical module itself. Moreover, because the copper block and the upper cover bracket are detachably connected, when the PCBA board inside the optical module is different, that is, when the position of the heat-generating components changes, only the copper block needs to be replaced and the position of the heat-conducting protrusion needs to be changed, while the upper cover bracket does not need to be replaced, which can save costs and is applicable to various optical modules. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 An exploded view of the heat dissipation structure of the optical module provided in this embodiment of the utility model;

[0021] Figure 2 A side view of the heat dissipation structure of the optical module provided in an embodiment of this utility model;

[0022] Figure 3Provided for the embodiments of this utility model Figure 2 Enlarged view of point A in the image;

[0023] Figure 4 A schematic diagram showing the application of high-temperature resistant silver-nickel adhesive between the top cover bracket and the copper block in an embodiment of this utility model;

[0024] Figure 5 Provided for the embodiments of this utility model Figure 4 Enlarged view on the right;

[0025] Figure 6 A front view of the copper block provided in an embodiment of this utility model;

[0026] Figure 7 A back view of the copper block provided in an embodiment of this utility model;

[0027] Figure 8 This is a schematic cross-sectional view of the top cover provided in an embodiment of the present utility model;

[0028] Figure 9 A schematic diagram of the integral forging of the upper cover provided in this embodiment of the utility model;

[0029] Figure 10 Provided for the embodiments of this utility model Figure 9 Enlarged view of section B in the middle.

[0030] In the diagram: 1. Top cover; 2. Base; 3. Base component one; 4. Base component two; 5. Top cover bracket; 6. Copper block; 7. Heat-conducting boss; 8. Cutout; 9. Electrical interface end; 10. Tilt angle; 11. Copper block mounting groove; 12. High-temperature resistant silver-nickel glue; 13. Chamfer; 14. Through hole; 15. A protruding section of the copper block; 16. Screw hole. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0032] like Figures 1-10This utility model provides a heat dissipation structure for an optical module, including an upper cover 1, a base 2, and a PCBA board 3. The upper cover 1 and the base 2 enclose a housing space for the PCBA board. The upper cover includes an upper cover bracket 5 and a copper block 6. The copper block 6 and the upper cover bracket 5 are detachably connected. The copper block 6 is provided with a heat-conducting protrusion 7. The upper cover bracket 5 has a cutout 8 for the heat-conducting protrusion 7 to extend into the base 2 and contact the heat-generating components on the PCBA board. The cutout 8 is located near the tail of the upper cover, i.e., near the electrical interface end 9 of the optical module. The copper block 6 has good thermal conductivity and is in direct contact with the heat-generating components, which can better help dissipate heat from the heat-generating components and effectively enhance the heat dissipation performance of the optical module itself. Moreover, because the copper block 6 and the upper cover bracket 5 are detachably connected, when the PCBA board inside the optical module is different, i.e., the position of the heat-generating components changes, only the copper block 6 needs to be replaced and the position of the heat-conducting protrusion 7 needs to be changed, while the upper cover bracket 5 does not need to be replaced, which can save costs and is applicable to various optical modules. In this embodiment, the heat-generating device may be a digital signal processor (DSP), power supply chip, etc. on the optical module PCBA board.

[0033] In this embodiment, the upper cover 1 and the base 2 are fixedly connected by screws. The copper block 6 is fixed to the upper cover bracket 5 by screws.

[0034] In this embodiment, the thermally conductive protrusion is connected to the heating device through thermally conductive gel, resulting in better heat transfer.

[0035] The end of the optical module closer to the handle is the optical port for connecting the optical fiber, and the end further away from the handle is the electrical interface 9 (electrical port) for plugging into the switch cage (switch interface slot). Spring contacts are located on the left and right sides inside the switch cage. When the optical module is inserted or removed, the spring contacts slide across the left and right sides of the optical module. To avoid interference that could prevent the optical module from being properly inserted or removed, both the top cover 1 and the base 2 have a tilt angle 10 at the electrical interface 9 of the optical module to facilitate insertion and removal. The edges of the tilt angle are chamfered. This design of tilt angle and chamfer helps the spring contacts inside the switch cage to smoothly transition when in contact with the optical module. The tilt angles of the top cover and the base are the same.

[0036] In this embodiment, the upper cover bracket 5 has a copper block mounting groove 11, and the cutout 8 is located within the copper block mounting groove 11. The copper block mounting groove 11 is coated with a high-temperature resistant conductive adhesive that contacts the copper block 6, enhancing the electrical continuity between the mating surfaces of the upper cover bracket 5 and the copper block 6, and improving the overall EMC (electromagnetic compatibility) performance. In this embodiment, the high-temperature resistant conductive adhesive can be a high-temperature resistant silver-nickel adhesive 12.

[0037] In this embodiment, the edges of the copper block mounting groove 11 and the four sides of the copper block 6 are provided with chamfers 13, which can prevent the optical module from interfering with the EMC spring in the switch cage when it is plugged in or unplugged.

[0038] In this embodiment, the copper block 6 has a through hole 14 at its tail end for easy plating. The back of the copper block has four screw holes 16 for connection with the upper cover bracket screws. The copper block can be forged to reduce manufacturing costs.

[0039] Both the copper block 6 and the copper block mounting groove 11 extend to the edge of the optical module electrical interface end 9, and the copper block 6 is positioned above the upper surface of the upper cover bracket 5 at the optical module electrical interface end. In this embodiment, as... Figure 3 At the electrical interface end 9 of the optical module, the protruding section 15 of the copper block is higher than the upper surface of the upper cover bracket 5, so that the EMC spring and heat dissipation teeth at the top of the switch cage first contact the smooth copper block 6. The contact area is small and the friction is small, so it can be smoothly guided and transitioned, avoiding the EMC spring and heat dissipation teeth from directly hitting the sharp edges that may exist on the upper cover bracket 5. That is, it avoids the interference between the EMC spring and heat dissipation teeth and the upper cover bracket, and reduces the insertion and extraction force of the optical module.

[0040] Most of the heat emitted by the heat-generating components on the optical module PCBA board is carried away by the copper block 6, and some of the heat is transferred to the base 2. The large surface of the copper block 6 and the upper cover bracket 5 are in hard contact through screws. The heat on the base 2 can be transferred to the upper cover 1 and even the copper block 6, thus minimizing the interface thermal resistance between the upper cover bracket and the copper block.

[0041] Since the above-mentioned split design has certain requirements on the thickness of the top cover, for optical modules with relatively high PCBA board height, the top cover can also adopt an integral forging design as needed. Although this has poor compatibility (the top cover needs to be replaced according to different optical module PCBAs), it can still meet the heat dissipation requirements of a single-wavelength 200Gb / s module. Figure 9 This is a schematic diagram of the overall forging of the top cover.

[0042] The optical module heat dissipation structure provided by this utility model belongs to a highly adaptable and efficient optical module heat dissipation solution. It adopts a detachable integrated copper heat sink (copper block) design. On the one hand, it optimizes the thermal resistance of the digital signal processor (DSP) in the vertical direction by changing the material; on the other hand, it improves cost and adaptability through structural design optimization. This greatly helps the production and functional realization of 1.6T optical modules.

[0043] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0044] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for an optical module, characterized in that: The device includes a top cover, a base, and a PCBA board. The top cover and the base together form a housing space for the PCBA board. The top cover includes a top cover bracket and a copper block. The copper block and the top cover bracket are detachably connected. The copper block is provided with a heat-conducting boss. The top cover bracket has a cutout for the heat-conducting boss to extend into the base and contact the heat-generating devices on the PCBA board.

2. The optical module heat dissipation structure as described in claim 1, characterized in that: The top cover and the base are fixedly connected by screws.

3. The optical module heat dissipation structure as described in claim 1, characterized in that: The copper block is fixed to the upper cover bracket by screws.

4. The optical module heat dissipation structure as described in claim 1, characterized in that: The thermally conductive boss is connected to the heating device via thermally conductive gel.

5. The optical module heat dissipation structure as described in claim 1, characterized in that: The upper cover bracket has a copper block mounting groove, and the cutout is located in the copper block mounting groove.

6. The optical module heat dissipation structure as described in claim 5, characterized in that: The copper block mounting groove is coated with a high-temperature resistant conductive adhesive that comes into contact with the copper block.

7. The optical module heat dissipation structure as described in claim 5, characterized in that: Both the edge of the copper block mounting groove and the edge of the copper block are chamfered.

8. The optical module heat dissipation structure as described in claim 5, characterized in that: Both the copper block and the copper block mounting groove extend to the edge of the optical module electrical interface end, and the copper block is set above the upper surface of the upper cover bracket at the optical module electrical interface end.

9. The optical module heat dissipation structure as described in claim 1, characterized in that: Both the top cover and the base have tilt angles at the electrical interface end of the optical module to facilitate the insertion and removal of the optical module.

10. The optical module heat dissipation structure as described in claim 9, characterized in that: The edges of the inclined angle are chamfered.

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