An SFF optical module packaging structure

Abstract

The utility model relates to communication equipment technical field especially, it relates to a kind of SFF optical module packaging structure, including shell, the shell inside integration has PCBA board, electric interface and optical interface, heat buffer is equipped between the PCBA board and shell, the heat buffer includes protective cover and the heat-conducting gel of being set in protective cover. The heat dissipation of the SFF optical module packaging structure of the application is good.

Description

Technical Field

[0001] This utility model relates to the field of communication equipment technology, and in particular to an SFF optical module packaging structure. Background Technology

[0002] SFF optical modules are a type of non-hot-swappable optical module package, primarily used in the optical network unit (ONU) side of Ethernet passive optical network (PON) systems. In the design of this type of module, heat dissipation performance is a key factor in ensuring its long-term reliable operation. SFF optical modules contain internal chips that generate sensible heat during operation. If this heat cannot be dissipated in time, the chip junction temperature will rise, leading to optical wavelength drift, output power fluctuations, and a significant increase in the communication bit error rate. In severe cases, it may even cause permanent damage to the module.

[0003] Traditional SFF optical modules typically employ a fully enclosed metal casing as their primary heat dissipation method, transferring internal heat to the outside through metal shells covering the top, bottom, and sides. However, as optical modules evolve towards higher transmission rates and power densities, this passive heat dissipation method, which relies on surface area, has gradually revealed insufficient thermal conductivity, making it difficult to meet the ever-increasing heat dissipation requirements. Utility Model Content

[0004] To address the problems mentioned above, this invention provides an SFF optical module packaging structure with good heat dissipation performance.

[0005] The solution adopted by this utility model to solve its technical problem is: an SFF optical module packaging structure, including a shell, wherein a PCBA board, an electrical interface and an optical interface are integrated inside the shell, and a thermal buffer is provided between the PCBA board and the shell, wherein the thermal buffer includes a protective cover and thermally conductive gel disposed inside the protective cover.

[0006] Furthermore, the corners of the protective cover are provided with elastic silicone pillars.

[0007] Furthermore, the bottom of the protective cover is provided with a support foot, and the top of the base is provided with a groove that matches the support angle.

[0008] Furthermore, the protective cover is made of plastic.

[0009] Furthermore, the plastic material is filled with aluminum oxide or boron nitride.

[0010] Furthermore, the outer casing surface is provided with polygonal heat dissipation grooves.

[0011] In summary, the beneficial effects of this utility model are as follows:

[0012] 1. The thermal buffer of this application can be placed in the air gap between the PCBA board and the metal casing to establish a thermal path, quickly conduct the heat generated by the chip to the casing, and then dissipate it to the surrounding environment, thereby effectively reducing the chip junction temperature and avoiding performance degradation or damage caused by overheating.

[0013] 2. When the optical module is subjected to external pressure, vibration or temperature change causing the material to expand and contract, the sharp corners of the protective cover will generate huge concentrated stress on the PCBA board. The elastic silicone pillars can effectively absorb and disperse this concentrated stress through their own elastic deformation, thereby providing protection for the components on the PCBA board.

[0014] 3. The polygonal heat dissipation slots on the top of the casing can enhance the heat dissipation effect: on the one hand, it promotes airflow at the top and enhances forced convection; on the other hand, it provides multi-dimensional heat dissipation paths, which together improve the heat dissipation efficiency.

[0015] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0016] Figure 1 This is the front view of this embodiment;

[0017] Figure 2 This is a schematic diagram of the structure in this example.

[0018] In the diagram: 1. Outer shell; 2. PCBA board; 3. Electrical interface; 4. Optical transceiver assembly; 5. Thermal buffer; 6. Flexible silicone pillar; 7. Polygonal heat sink. Detailed Implementation

[0019] To make the content of this utility model easier to understand, the present utility model will be further described below with reference to specific embodiments and accompanying drawings.

[0020] It should be noted that the terms "center," "upper," "lower," "front," "rear," "left," "right," "inner," and "outer" used herein to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Unless otherwise stated, "a plurality of" means two or more.

[0021] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] like Figures 1 to 2 As shown, an SFF optical module packaging structure includes a housing 1, which comprises a base and a top cover. The top cover is screwed to the top surface of the base. The base has a receiving cavity, which integrates a PCBA board 2, an electrical interface 3, and an optical transceiver assembly 4. Figure 2 As shown, a thermal buffer 5 is provided between the PCBA board 2 and the outer shell 1. In this embodiment, the thermal buffer 5 includes thermal conductive gel and a protective cover wrapped around the thermal conductive gel. The outer end of the optical transceiver assembly 4 is provided with an optical port flange.

[0023] The protective cover in this embodiment has edges and corners set as follows: Figure 2 The elastic silicone pillar 6 is shown. Since equipment inevitably experiences vibration and impact during transportation, installation, or operation, the corners of the protective cover are areas of highest stress concentration. Rigid contact can easily lead to bending of the PCBA at the bottom of the protective cover or fatigue cracking of component solder joints. The elastic silicone pillar 6, through its high resilience and compressibility, transforms concentrated point stress into distributed surface stress, effectively absorbing and buffering these mechanical impacts.

[0024] Specifically, the elastic silicone pillar 6 is preferably made of solid silicone rubber. Furthermore, the silicone pillar is not limited to... Figure 2 The cylindrical shape shown can also be a square column, a frustum, or an irregular shape. Its top can be flush with the inner top surface of the protective cover, or designed as a raised hemisphere to achieve more optimized point contact or surface contact.

[0025] like Figure 2 As shown, the protective cover has support feet at the bottom, while the base has corresponding grooves at the top. During assembly, the support feet are inserted into the grooves, allowing the protective cover to be securely clamped between the base and the top cover, thus achieving reliable fixation.

[0026] The protective cover is made of plastic, specifically nylon, PPS, or PBT. The plastic material is filled with a thermally conductive material, such as alumina or boron nitride, to give the cover thermal conductivity. Through this design, the protective cover possesses sufficient mechanical strength, rigidity, and heat resistance to encapsulate the thermally conductive gel, while also providing insulation, support, and lateral heat dissipation.

[0027] like Figure 1or Figure 2 As shown, the upper cover surface of this embodiment is provided with polygonal heat dissipation grooves 7 to increase the contact area between the upper cover and the air, and to effectively improve the convective heat transfer efficiency by disrupting the laminar boundary layer and promoting air turbulence. The polygonal heat dissipation grooves 7 in this embodiment are... Figure 2 The hexagonal heat dissipation groove shown.

[0028] To ensure that the protective cover of the thermal buffer 5 provides rigid support while avoiding pressure on the functional components on the PCBA board 2, in this embodiment, the bottom surface of the protective cover maintains a distance of 2–4 mm from the top of the tallest component on the PCBA board 2. To compensate for the impact of this gap on the heat dissipation path, several thermal pads are further attached to the bottom of the protective cover at positions corresponding to high-heat-generating chips on the PCBA board 2.

[0029] Specifically, the thermal pad uses filled silicone rubber as a matrix, in which highly thermally conductive fillers are dispersed, including but not limited to alumina, boron nitride, aluminum nitride or magnesium oxide, thereby establishing efficient heat conduction channels in the structural gaps and improving the overall heat dissipation performance.

[0030] The embodiments described above are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and modifications made by those skilled in the art based on this utility model shall fall within the scope of protection of this utility model.

Claims

1. An SFF optical module packaging structure, characterized in that, The device includes a housing (1), which integrates a PCBA board (2), an electrical interface (3) and an optical interface. A thermal buffer (5) is provided between the PCBA board (2) and the housing (1). The thermal buffer (5) includes a protective cover and a thermally conductive gel disposed within the protective cover.

2. The SFF optical module packaging structure according to claim 1, characterized in that, The protective cover has elastic silicone pillars (6) at its corners.

3. The SFF optical module packaging structure according to claim 1, characterized in that, The protective cover has a support foot at the bottom, and the base has a groove at the top that matches the support angle.

4. The SFF optical module packaging structure according to claim 1, characterized in that, The protective cover is made of plastic.

5. The SFF optical module packaging structure according to claim 4, characterized in that, The plastic material is filled with aluminum oxide or boron nitride.

6. The SFF optical module packaging structure according to claim 1, characterized in that, The outer casing (1) has polygonal heat dissipation grooves (7) on its surface.

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