A high utilization isolator chip

Abstract

The utility model relates to a high utilization rate isolator chip relates to optical communication device technical field, the chip body is the "big and small head" hexahedron structure, and the size of the light entrance surface and the light exit surface is not identical, and the light entrance surface and the light exit surface all are equipped with anti -reflection angle, the thickness of chip body is set as 0.7mm 1.0mm, this thickness range can satisfy the installation space demand of optical module, can guarantee the optical rotation angle in the chip body of light beam, ensures the light isolation effect. The chip body includes polarization film, Faraday sheet, half wave plate and polarization film that are sequentially laminated, and the half wave plate is located at the intermediate position of the chip body, wherein, the polarization film is used for screening the polarization direction of light, the Faraday sheet realizes the polarization direction rotation of light under the action of external magnetic field, and the half wave plate changes the polarization state of light by phase delay, and the three cooperate and form the functional link of "polarization screening, optical rotation, polarization state change, polarization screening", and provide structural basis for the polarization state selection and reciprocity of chip.

Description

Technical Field

[0001] This utility model relates to the field of optical communication device technology, specifically to an isolator chip with high utilization rate. Background Technology

[0002] Isolators are key components in optical communication systems. Their core function is to eliminate interference from reflected light and other reverse light generated during the forward propagation of optical signals, preventing stray light from causing poor light source stability and substandard system transmission quality. Faraday rotator crystals, as the core functional material of isolators, are typically expensive due to their complex manufacturing process and scarcity. Their utilization rate directly determines the production cost of isolators.

[0003] In existing technologies, isolator chips are generally designed as parallelepiped structures with the same size incident and emitting surfaces. The incident and emitting surfaces typically have fixed anti-reflection angles to reduce light reflection loss. However, in practical applications of optical modules, some optical paths employ focusing system designs, resulting in a converged beam after passing through the isolator—that is, the spot size of the beam on the incident surface is larger than the spot size on the emitting surface. In this case, if a parallelepiped chip with the same incident and emitting surface size is still used, the portion of the emitting surface exceeding the actual spot size requirement will result in a waste of materials such as Faraday rotator crystals, leading to low chip utilization and high device costs, failing to meet the economic requirements of converged beam scenarios. Utility Model Content

[0004] To address the issues of low material utilization and high cost in converging light scenarios caused by the uniform size of the input and output light surfaces in existing isolator chips, this invention provides a high-utilization isolator chip. By optimizing the chip structure design, the material utilization rate is improved while ensuring the polarization state stability and optical isolation performance of the isolator.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A high-utilization isolator chip includes at least one chip body, which has a large-head hexahedral structure with different sizes of light-incident and light-exit surfaces. Both the light-incident and light-exit surfaces are provided with a certain anti-reflection angle to reduce light reflection loss.

[0006] According to one aspect of the embodiments of this application, the chip body includes a polarizer, a Faraday plate, a half-wave plate and a polarizer stacked in sequence; the half-wave plate is located in the middle of the chip body, and each layer is fixed by optical adhesive.

[0007] According to one aspect of the embodiments of this application, the light spot size of the light incident surface of the chip body is larger than the light spot size of the light emitting surface, and the side of the chip body is trapezoidal.

[0008] According to one aspect of the embodiments of this application, the chip body has reciprocity, and based on the phase compensation effect of the half-wave plate in the stacked structure, the polarization direction of the emitted light is consistent when incident from the incident surface or the emitted surface.

[0009] According to one aspect of the embodiments of this application, the thickness of the chip body is set to 0.7mm-1.0mm.

[0010] According to one aspect of the embodiments of this application, the light-incident surface and the light-exit surface of the chip body are coated with an anti-reflective film, and the anti-reflective film is a composite film layer of silicon dioxide and tantalum pentoxide.

[0011] According to one aspect of the embodiments of this application, the reciprocity of the chip body is based on the phase delay of the half-wave plate placed in the middle to change the polarization state of the light; when the light beam is incident in the opposite direction from the light-emitting surface, the optical rotation angle of the Faraday plate is superimposed with the phase delay of the half-wave plate to ensure that the polarization direction of the emitted light is consistent with the forward incident direction.

[0012] Compared with the prior art, the beneficial effects of this utility model are: By designing the chip body as a "large-head" hexahedral structure, the size of the light-incident surface is adapted to the large light spot requirements of the light-converging surface, and the size of the light-exiting surface is adapted to the small light spot requirements. This avoids the material waste of the redundant part of the light-exiting surface in traditional parallelepiped chips, and the utilization rate of core materials such as Faraday wafers can be increased by 15%-25%, directly reducing the device manufacturing cost.

[0013] Based on the symmetrical stacked structure of "polarizer, Faraday plate, half-wave plate, polarizer", and the phase compensation function of the half-wave plate, the chip body achieves reciprocity, and the light-incident surface and the light-outcident surface can be interchanged. This not only improves the installation flexibility of the chip and adapts it to a variety of practical scenarios, but the large and small head structure also makes it easy to identify the light-incident and light-outcident surfaces, which can reduce the risk of mis-installation during the optical module assembly process. Attached Figure Description

[0014] Figure 1 This is a perspective view of an isolator chip with high utilization rate according to this utility model.

[0015] Figure 2 This utility model Figure 1 A magnified view of a portion of area A.

[0016] In the diagram: 1. Chipset; 2. Chip body; 21. Polarizer; 22. Half-wave plate; 23. Faraday plate; 24. Light-incident and light-outcrystal surfaces. Detailed Implementation

[0017] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0018] To address the issues of low material utilization and high cost in converging light scenarios caused by the uniform size of the input and output light surfaces in existing isolator chips, this invention provides a high-utilization isolator chip. By optimizing the chip structure design, the material utilization rate is improved while ensuring the polarization state stability and optical isolation performance of the isolator. Example

[0019] This utility model relates to a highly utilized isolator chip, which, in practical applications, such as... Figure 1 As shown, the chip body 2 has a "large and small head" hexahedral structure, with different sizes for the light-incident surface and the light-outcrystal surface, and both the light-incident surface and the light-outcrystal surface are provided with anti-reflection angles; the thickness of the chip body 2 is set to 0.7mm-1.0mm. This thickness range can meet the installation space requirements of the optical module and ensure the optical rotation angle of the beam within the chip body 2, thus ensuring the optical isolation effect.

[0020] Furthermore, the chip body 2 includes a polarizer 21, a Faraday plate 23, a half-wave plate 22, and a polarizer 21 stacked sequentially, with the half-wave plate 22 located in the middle of the chip body 2. The polarizer 21 is used to filter the polarization direction of the incident light, the Faraday plate 23 rotates the polarization direction of the light under the action of an external magnetic field, and the half-wave plate 22 is used for phase compensation. The three work together to form a functional link of "polarization filtering, optical rotation, polarization state change, and polarization filtering", providing a structural basis for the polarization state stability and reciprocity of the chip.

[0021] Furthermore, for the converging light scenario in the optical module, the light spot size of the light-incident surface of the chip body 2 is larger than the light spot size of the light-exit surface, and the side of the chip body 2 is trapezoidal. This trapezoidal structure is determined by the size difference between the light-incident and light-exit surfaces and the chip thickness. For example, when the size difference between the light-incident and light-exit surfaces is 0.1mm and the chip thickness is 0.8mm, the side trapezoidal angle can be calculated to be approximately 3.58° using the formula "Arctan((size difference between the light-incident and light-exit surfaces / 2) / thickness of the chip body 2)". This angle design can ensure that the converging light propagates along the preset optical path within the chip body 2, avoiding light leakage.

[0022] Furthermore, the chip body 2 is reciprocal, with the incident surface and the emitting surface interchangeable, and the polarization direction of the emitted light remains consistent. This reciprocity is achieved based on the phase compensation effect of the half-wave plate 22: when the light beam is incident in the opposite direction from the emitting surface, the optical rotation direction of the Faraday plate 23 matches the phase delay direction of the half-wave plate 22. The optical rotation angle of the Faraday plate 23 and the phase delay angle of the half-wave plate 22 are superimposed to cancel the polarization direction deviation when incident in the opposite direction, ultimately ensuring that the polarization direction of the emitted light remains consistent with that when incident in the forward direction, thus ensuring the performance stability of the chip when used in the reverse direction.

[0023] Furthermore, both the light-incident and light-exit surfaces of the chip body 2 are provided with anti-reflection films, which are composite films of silicon dioxide and tantalum pentoxide. Silicon dioxide has low refractive index characteristics, while tantalum pentoxide has high refractive index characteristics. The two are deposited alternately to form a composite film (typical thickness of 100nm-150nm). The light reflection of the chip can be canceled by the thin film interference principle, reducing the beam reflectivity to below 0.3%, reducing light energy loss, and thus improving the overall light transmission efficiency of the isolator.

[0024] In addition, such as Figure 1 As shown, the chip body 2 is manufactured using a "W"-shaped cutting process: Before cutting, a large piece of isolator material is bonded to an angle pad using wax (the tilt angle of the angle pad is consistent with the trapezoidal angle of the chip side), and positioned by a stop bar; during cutting, the chip assembly 1 is first cut into strips along the "W"-shaped path to obtain a long strip of material with trapezoidal sides, and then the long strip of material is rotated 90° and then granulated to finally form the chip body 2 with a "large and small head" hexahedral structure; this cutting process can precisely control the size difference and side angle of the light-entry and light-exit surfaces, ensuring that the chip size accuracy meets the optical path design requirements of the optical module (cutting accuracy controlled within ±0.02mm).

[0025] In actual use, when the thickness of the chip body 2 is set to 0.8mm, the difference between the light-incident surface (size 0.7mm×0.7mm) and the light-exit surface (size 0.6mm×0.6mm) is 0.1mm, and the side trapezoidal angle is calculated to be 3.58° using the formula "Arctan(0.05 / 0.8)".

[0026] The stacked structure is as follows: polarizer 21 (fused silica, 0.2 mm thick); Faraday plate 23 (yttrium iron garnet (YIG) crystal, 0.31 mm thick); half-wave plate 22 (quartz crystal, 0.08 mm thick); polarizer 21 (same as above, 0.2 mm thick); each layer is bonded together with optical adhesive, the adhesive layer thickness is 3 μm (refractive index 1.52, refractive index difference with adjacent components ≤0.03); The anti-reflection angles of the light-incident and light-excising surfaces are generally set to 7° and coated with an anti-reflection film. The material is a composite anti-reflection coating of silicon dioxide and tantalum pentoxide (thickness 120nm, reflectivity 0.3%). Example

[0027] This embodiment focuses on a converged light scenario for a 200G optical module (incident light spot size 0.6mm, output light spot size 0.4mm), and adjusts the chip design parameters as follows: The chip body 2 has a thickness of 1.0 mm, an incident light surface size of 0.8 mm × 0.8 mm, an exit light surface size of 0.6 mm × 0.6 mm, a size difference of 0.2 mm, and a side trapezoidal angle of Arctan(0.1 / 1.0) ≈ 5.71°; The half-wave plate 22 is made of quartz crystal material (thickness 0.09mm), and the Faraday plate 23 is made of quartz crystal material (thickness 0.50mm). The light-incident and light-exit surfaces have an anti-reflection angle of 8° and are coated with an anti-reflection coating of the corresponding wavelength (thickness 150nm, reflectivity 0.2%).

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high-utilization isolator chip, characterized in that, It includes at least one chip body, which has a large-head hexahedral structure with different sizes of light-incident and light-exit surfaces, and both the light-incident and light-exit surfaces are provided with anti-reflection angles to reduce light reflection loss.

2. The isolator chip with high utilization rate according to claim 1, characterized in that, The chip body includes a polarizer, a Faraday plate, a half-wave plate, and another polarizer stacked in sequence; the half-wave plate is located in the middle of the chip body, and the layers are fixed together by optical adhesive.

3. The isolator chip with high utilization rate according to claim 1, characterized in that, The light spot size on the incident surface of the chip body is larger than the light spot size on the emitting surface, and the side of the chip body is trapezoidal.

4. The isolator chip with high utilization rate according to claim 1, characterized in that, The chip body is reciprocal. Based on the phase compensation effect of the half-wave plate in the stacked structure, the polarization direction of the emitted light is consistent when incident from either the incident or emitted surface.

5. The isolator chip with high utilization rate according to claim 1, characterized in that, The thickness of the chip body is set to 0.7mm-1.0mm.

6. The isolator chip with high utilization rate according to claim 1, characterized in that, The light-incident and light-exit surfaces of the chip body are coated with anti-reflective films, which are made of a composite film of silicon dioxide and tantalum pentoxide.

7. The isolator chip with high utilization rate according to claim 2, characterized in that, The reciprocity of the chip body is achieved based on the phase compensation effect of the half-wave plate; when the light beam is incident in the opposite direction from the light-emitting surface, the optical rotation angle of the Faraday plate and the phase delay angle of the half-wave plate are superimposed to cancel the polarization direction deviation caused by the reverse incident.

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