Liquid crystal display module and display device with same

Abstract

The application provides a liquid crystal display module and a display device with the same. The liquid crystal display module comprises a metal frame, a light source and a light guide plate arranged in the metal frame, a driving chip arranged above the metal frame, and a printed circuit board arranged vertically on the other side of the metal frame different from the light guide plate. The application optimizes the structure layout, effectively improves the overall mechanical strength of the LCM, reduces the risk of rupture of the driving chip and the TFT array substrate layer when extruded by external force, cancels the traditional metal frame tongue piece opening design, avoids the light leakage problem caused by the opening and the risk of foreign matter entering the backlight module, eliminates the dislocation of the light source and the light guide plate caused by the deformation of the flexible circuit board in the temperature cycle test, thereby significantly reducing the probability of uneven light emission after the temperature cycle reliability test, and further reasonably plans the fixing structure and the space layout of the printed circuit board, reduces the occupied size of the lower frame of the LCM, and realizes a narrower frame design.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a liquid crystal display module and a display device having the same. Background Technology

[0002] In notebook (NB) projects using non-reflective flexible printed circuit boards (FPCs), traditional designs typically require drilling holes in the back of the backlight metal frame to form a tab, and then connecting the PCB to the backlight metal frame using screws. However, this structure has several significant drawbacks.

[0003] First, the openings required for tongue forming will damage the integrity of the backlight metal frame, making the opening area prone to light leakage. At the same time, it provides a channel for dust and foreign objects to enter the backlight module, affecting the display effect and product reliability. Second, during the LCM temperature cycling test (TST, -20℃ to 65℃, 30 minutes per stage, 100 cycles in total), the light guide plate (LGP) shrinks under low temperature conditions, which will cause the FPC to deform. This will cause the FPC to bulge locally at the opening, resulting in misalignment between the light source and the light guide plate, thus causing obvious uneven light emission.

[0004] Furthermore, the PCB mounting area is typically located near the single-layer glass region (the area containing only the TFT array substrate). When subjected to external pressure, this region is prone to breakage of the driver chip and TFT array substrate layer due to its lower structural strength, further exacerbating the risk of display abnormalities. In summary, existing PCB mounting solutions based on perforated tongue tabs have significant shortcomings in terms of optical stability, structural protection, and resistance to mechanical stress. Utility Model Content

[0005] This application proposes a liquid crystal display module for a display device. The technical solution provided by this application is as follows: A liquid crystal display module includes: a metal frame, in which a light source and a light guide plate are disposed; a driving chip, which is disposed above the metal frame; and a printed circuit board, which is vertically disposed on the side of the metal frame other than the light guide plate.

[0006] Furthermore, the printed circuit board has a first surface and a second surface that are arranged opposite to each other in the Z direction, and the distance between the first surface and the second surface is a height h; the distance from the surface of the metal frame away from the printed circuit board to the surface of the driving chip away from the metal frame is d; the value of d is in the range that h > d.

[0007] Furthermore, the printed circuit board is connected to the metal frame via a plug-in connection.

[0008] Furthermore, the metal frame includes a horizontal portion, a first folded portion, and a second folded portion, wherein the first folded portion is perpendicular to the horizontal portion, and the second folded portion is perpendicular to the first folded portion; At least one protrusion is provided in the horizontal part of the metal frame and in the X direction of the first folding part, and the printed circuit board is inserted into the protrusion.

[0009] Furthermore, at least one snap-fit ​​portion is provided in the Z direction of the printed circuit board, and at least one slot is provided on the second surface of the snap-fit ​​portion, the slot being inserted into the protrusion of the metal frame.

[0010] Furthermore, the projected area of ​​the protrusion of the printed circuit board in the XZ direction is smaller than the projected area of ​​the first folded portion in the XZ direction.

[0011] Furthermore, the printed circuit board is adhered to the metal frame on the side away from the light guide plate.

[0012] Furthermore, the printed circuit board is adhered to the metal frame using any one of liquid adhesive, UV adhesive, or double-sided adhesive.

[0013] Furthermore, the liquid crystal display module of the display device provided in this application includes: an optical functional film located above a light guide plate; a TFT array substrate disposed above the metal frame and the optical functional film; and a driving chip disposed on the TFT array substrate.

[0014] This application also provides a display device, including the liquid crystal display module provided in any of the above specific embodiments.

[0015] The beneficial effects of this application are that by eliminating the metal frame tongue opening design, the PCB fixing structure is optimized to improve the mechanical strength of the LCM, reduce the risk of breakage and the problem of uneven light emission after temperature cycling reliability testing, and at the same time reduce the size of the bottom bezel to achieve a narrow bezel design. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the liquid crystal display module provided in an embodiment of this application.

[0018] Figure 2This is a front view of the structure of the printed circuit board and metal frame in region A of the liquid crystal display module provided in this embodiment of the application.

[0019] Figure 3 This is a structural side view of the printed circuit board and metal frame in region A of the liquid crystal display module provided in this embodiment of the application.

[0020] Figure 4 This is a schematic diagram of the structure of the liquid crystal display module provided in Embodiment 2 of this application.

[0021] Figure label: 1: LCD display module; 11: Backlight module; 12: Display panel 2: Printed circuit board 21: First surface 22: Second surface 23: Snap-fit ​​part 24: Slot 3: Metal frame; 31: Horizontal part; 32: First folding part; 33: Second folding part; 34: Protrusion. 41: First flexible circuit board; 42: Second flexible circuit board 51: Light source; 52: Light guide plate; 531: First reflector; 531: Second reflector; 54: Optical functional film. 61: Lower polarizer 62: Upper polarizer 71: TFT array substrate; 72: Color filter substrate 8: Driver chip 9: Double-sided adhesive Detailed Implementation The following descriptions of the embodiments are based on the accompanying illustrations, illustrating specific embodiments in which this application can be implemented. Directional terms used in this application, such as up, down, front, back, left, right, inside, outside, side, etc., are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustration and understanding of this application, and not for limiting this application. In the figures, structurally similar units are denoted by the same reference numerals. In the figures, the thickness of some layers and regions is exaggerated for clarity and ease of description. That is, the dimensions and thicknesses of each component shown in the figures are arbitrarily shown, but this application is not limited thereto.

[0022] Please see Figure 1 , Figure 2 and Figure 3 The first embodiment of this application provides a liquid crystal display module 1, which includes a backlight module 11 and a display panel 12. The display panel 12 is located above the backlight module 11. The backlight module 11 includes a metal frame 3 and a backlight component fixed in the metal frame 3.

[0023] Specifically, the backlight assembly includes a first flexible circuit board 41, a light source 51 formed on and electrically connected to the first flexible circuit board 41, a light guide plate 52, a first reflective sheet 531, a second reflective sheet 532, and an optical functional film 54.

[0024] The display panel 12 includes a TFT array substrate 71, a color filter substrate 72 disposed opposite to the TFT array substrate 71, a liquid crystal (not shown) formed between the TFT array substrate 71 and the color filter substrate 72, a lower polarizer 61 formed on the TFT array substrate 71, an upper polarizer 62 formed on the color filter substrate 72, a driver chip 8 formed on the TFT array substrate 71, a printed circuit board 2, and a second flexible circuit board 42. The printed circuit board 2 is vertically disposed on the other side of the metal frame 3, which is different from the light guide plate 52.

[0025] Specifically, the metal frame 3 is formed by two vertical folds to create a horizontal portion 31, a first folded portion 32, and a second folded portion 33. The horizontal portion 31, the first folded portion 32, and the second folded portion 33 form a receiving space.

[0026] In this embodiment, the first folding portion 32 and the second folding portion 33 are integrally formed, and the first folding portion 32 and the horizontal portion 31 are integrally formed. In other embodiments, the connection between the first folding portion 32 and the second folding portion 33, as well as between the first folding portion 32 and the horizontal portion 31, can also be achieved through mechanical structures, mortise and tenon structures, adhesives, etc.

[0027] Specifically, a light source 51 is provided in the receiving space of the metal frame 3, and a light guide plate 52 is provided on one side of the light source 51. The light guide plate 52 is used to convert the light emitted by the light source 51 on the side into a surface light source and make the light emission uniform.

[0028] Specifically, the first flexible circuit board 41 is disposed within the receiving space of the metal frame 3 and fixed to the surface of the horizontal portion 31 of the metal frame 3 facing the light source 51. The first flexible circuit board 41 is used to drive the light source 51 to emit light.

[0029] Specifically, the two opposing surfaces of the first reflective sheet 531 are in contact with the horizontal portion 31 of the metal frame 3 and the light guide plate 52, respectively. The first reflective sheet 531 is used to reflect light exposed from the side of the light guide plate 52 facing the horizontal portion 31 back into the light guide plate 52, thereby improving light utilization efficiency.

[0030] Specifically, the second reflective sheet 532 is located on the surface of the light guide plate 52 opposite to the first reflective sheet 531 and on the surface of the light source 51 opposite to the first flexible circuit board 41. The surface of the second reflective sheet 532 opposite to the light source 51 is in contact with the surface of the second folded portion 33 facing the horizontal portion 31. The second reflective sheet 532 is used to reflect light exposed from the side of the light guide plate 52 opposite to the horizontal portion 31 back into the light guide plate 52, thereby improving light utilization efficiency.

[0031] Specifically, the optical functional film 54 is disposed on the surface of the light guide plate 52 facing away from the first reflective sheet 53 and facing the second reflective sheet 532. Specifically, in an optional embodiment of this application, the optical functional film 54 may be composed of multiple diffusers and brightness enhancers. Light emitted from the light guide plate 52 enters the optical functional film 54 to provide a uniform surface light source. Of course, in other embodiments, the optical functional film 54 is not limited to diffusers and brightness enhancers, and can be designed according to actual conditions.

[0032] Please refer to it again. Figures 1-3 The display panel 12 includes a TFT array substrate 71, a color filter substrate 72 disposed opposite to the TFT array substrate 71, liquid crystal (not shown) formed between the TFT array substrate 71 and the color filter substrate 72, a lower polarizer 61 formed on the TFT array substrate 71, an upper polarizer 72 formed on the color filter substrate 72, a driver chip 8 formed on the TFT array substrate 71, and a second flexible circuit board 42 connected to a printed circuit board 2. The lower polarizer 61 faces the optical functional film 54, and the upper polarizer 62 is disposed on the side of the color filter substrate 72 away from the lower polarizer 61. The printed circuit board 2 is vertically disposed on the side of the metal frame 3 other than the light guide plate 52, and is electrically connected to the driver chip 8 through the second flexible circuit board 42 and the traces (not shown) in the TFT array substrate 71 to drive the display panel 12 to operate.

[0033] In traditional designs, printed circuit boards (PCBs) are typically laid out horizontally, requiring significant space to accommodate fixing structures (such as screw mounting areas and backlight metal frame openings), thus limiting the width of the bottom bezel. This application, however, by vertically mounting the PCB 2, not only effectively utilizes vertical space and reduces its projected area in the horizontal direction, but also avoids the structural encroachment on the bottom bezel area by traditional fixing methods. This design directly frees up layout space for the LCM's bottom bezel, significantly reducing the bezel width and achieving a narrow bezel or even a "borderless" visual effect. Furthermore, the reduced bottom bezel size not only improves the product's aesthetics and screen-to-body ratio but also optimizes the overall structural layout, facilitating thinner and lighter device designs. Simultaneously, it reduces the risk of accumulated assembly tolerances due to excessively wide bezels, further improving LCM assembly precision and display consistency.

[0034] One specific embodiment is that the printed circuit board 2 has a first surface 21 and a second surface 22 arranged opposite to each other in the Z direction, and the distance between the first surface 21 and the second surface 22 is a height h; the distance from the surface of the metal frame 3 away from the printed circuit board 2 to the surface of the driving chip 8 away from the metal frame 3 is d; the value of d is in the range that h > d.

[0035] Understandably, this application, by designing the printed circuit board 2 as a barrier structure and precisely adjusting its Z-direction height h to be higher than the driver chip 8 and TFT array substrate 71 in the Z-direction, effectively buffers and disperses external pressure, thus providing crucial protection for the driver chip 8 and TFT array substrate 71. Specifically, when external pressure is applied to the LCM module, the printed circuit board 2, acting as the first barrier, first bears the external force and guides it to an area with higher structural strength, preventing the pressure from directly acting on the driver chip 8 and TFT array substrate 71, thereby significantly reducing the risk of cracking of the driver chip 8 and TFT array substrate 71 due to localized stress concentration. Furthermore, the barrier design of the printed circuit board 2 can further improve the uniformity of force distribution by optimizing the edge shape and support angle, preventing warping or micro-cracks in the driver chip 8 and TFT array substrate 71 during compression. Through a reasonable layout of structural height, this application achieves physical isolation and mechanical protection for sensitive electronic components, effectively solving the technical problem of damage to the driver chip 8 and TFT array substrate 71 caused by external pressure in traditional designs, and improving the overall mechanical reliability and service life of the liquid crystal display module.

[0036] In one specific embodiment, the printed circuit board 2 is connected to the metal frame 3 by a plug-in connection.

[0037] Understandably, by eliminating the traditional metal frame tongue opening design and instead using a plug-in method to fix the printed circuit board 2 to the metal frame 3, not only is the structural design optimized, but significant improvements are also achieved in several key performance aspects and effects. Specifically, the plug-in method replaces the original screw fastening and tongue opening process with precise mechanical cooperation, fundamentally avoiding the light leakage problem caused by the opening damaging the integrity of the metal frame. At the same time, it effectively prevents dust and foreign objects from entering the backlight module through the opening area, thereby significantly improving the uniformity of the display effect and the long-term reliability of the product.

[0038] During the LCM temperature cycling reliability test (TST, -20℃ to 65℃, 30 minutes per stage, 100 cycles in total), in the traditional design, the light guide plate shrinks at low temperatures, causing the flexible circuit board to deform. This results in localized bulging of the flexible circuit board at the openings, leading to misalignment between the light source and the light guide plate, causing significant uneven light emission. However, with the plug-in method, the printed circuit board 2 and the metal frame 3 form a stable support through a tight plug-in structure, significantly reducing the deformation of the printed circuit board 2 under temperature changes. This ensures that the light source 51 and the light guide plate 52 maintain precise alignment at all times, effectively solving the problem of uneven light emission after the low-temperature cycling test.

[0039] In addition, the plug-in method simplifies the assembly process, reduces the number of screw fastening steps, lowers production costs and assembly error risks, and provides space optimization for reducing the size of the LCM bottom bezel, helping to achieve a narrower bezel design and improving the product's aesthetics and screen-to-body ratio.

[0040] One specific embodiment is that the metal frame 3 includes a horizontal portion 31, a first folding portion 32 and a second folding portion 33, the first folding portion 32 being perpendicular to the horizontal portion 31 and the second folding portion 33 being perpendicular to the first folding portion 32; at least one protrusion 34 is provided in the X direction of the horizontal portion 31 and the first folding portion 32 of the metal frame 3, and the printed circuit board 2 is inserted into the protrusion 34.

[0041] One specific embodiment is that at least one latching part 23 is provided in the Z direction of the printed circuit board 2, and at least one slot 24 is provided on the second surface 22 of the latching part 23, and the slot 24 is inserted into the protrusion 34 of the metal frame 3.

[0042] In one specific embodiment, the projected area of ​​the protrusion 34 of the printed circuit board 2 in the XZ direction is smaller than the projected area of ​​the first folded portion 32 in the XZ direction.

[0043] It is understood that in the above embodiments, by providing a slot 24 on the second surface 22 of the snap-fit ​​portion 23 of the printed circuit board 2, and forming an insertion engagement with the protrusion 34 of the metal frame 3, rapid positioning and fixation between the printed circuit board 2 and the metal frame 3 are achieved. However, in order to meet the higher requirements for fixing strength, assembly accuracy and spatial layout in different application scenarios, the design of the insertion method can be further expanded and optimized.

[0044] Specifically, to enhance the robustness and reliability of the plug-in structure, the following two main methods can be adopted: First, by increasing the number or distribution density of slots 24 and protrusions 34, the printed circuit board 2 and the metal frame 3 can form multi-point plug-in connections at multiple locations, thereby dispersing the force and improving the overall vibration and impact resistance. For example, multiple slots 24 are arranged at intervals along the length or width direction on the second surface 22 of the latching part 23 of the printed circuit board 2, and a matching array of protrusions is designed on the surface of the protrusions 34 of the metal frame 3 to achieve multi-point plug-in fixation, effectively preventing the printed circuit board 2 from shifting or loosening under dynamic loads.

[0045] Secondly, the form of the plug-in structure can be optimized. For example, a slot can be provided on the surface of the protrusion 34 of the metal frame 3, while a protrusion can be provided on the second surface 22 of the latching part 23 of the printed circuit board 2. The plug-in function is achieved through the nesting cooperation between the protrusion and the slot. The advantage of this design is that the rigid structure of the metal frame 3 can be used as the main stress point, reducing the risk of assembly failure caused by deformation of the printed circuit board 2 under stress. At the same time, it is easy to achieve a more compact layout, especially suitable for narrow bezel designs with limited space. In addition, the guidance and self-locking ability of the plug-in process can be further improved by setting guide slopes, inverted structures or elastic latches in the protrusions or slots, ensuring assembly accuracy and stability in long-term use.

[0046] Furthermore, to adapt to different material properties and process requirements, the plug-in structure can be combined with other auxiliary fixing methods, such as adding adhesive, screw fastening, or welding to the plug-in connection, forming a hybrid structure of "plug-in + auxiliary fixing" to balance assembly efficiency and long-term reliability. For example, based on the plug-in structure, thermally conductive adhesive can be applied to the contact surface between the printed circuit board 2 and the metal frame 3, which can enhance the fixing strength and improve heat dissipation performance, making it suitable for high-power or high-density integrated display modules.

[0047] In summary, by flexibly designing the number, distribution, shape, and mating method of the slots and protrusions 34, and combining them with auxiliary fixing methods, the plug-in structure can be fully optimized in terms of strength, precision, space utilization, and process adaptability, thereby meeting the diverse needs of the connection structure between the printed circuit board 2 and the metal frame 3 in different application scenarios.

[0048] In one specific embodiment, the printed circuit board 2 is adhered to the metal frame 3 on the side away from the light guide plate 52.

[0049] One specific embodiment is that the printed circuit board 2 is adhered to the metal frame 3 by any one of liquid adhesive, UV adhesive, or double-sided adhesive 9.

[0050] Understandably, please refer to Figure 4 In another embodiment of this application, an adhesive method is used to connect and fix the printed circuit board 2 (PCB) to the metal frame 3. This method has significant advantages in structural design and process implementation. Compared with traditional plug-in or screw-locking methods, adhesive fixation also ensures the integrity of the metal frame 3 and the sealing of the display module, avoiding misalignment of the light source and light guide plate caused by openings or structural deformation, effectively solving the problem of uneven light emission caused by mechanical stress concentration, thereby significantly improving display uniformity. In addition, by dispersing external forces, the adhesive method reduces the stress transmission from the fixed area of ​​the printed circuit board 2 to the glass monolayer area (TFT array substrate 71), effectively mitigating the risk of breakage of the driver chip 8 and TFT array substrate 71 under pressure, and enhancing the overall mechanical reliability of the LCM.

[0051] Specifically, in terms of material selection, this solution can flexibly use adhesion materials such as double-sided tape, UV adhesive, or liquid adhesive: double-sided tape is easy to use and cures quickly, making it suitable for high-precision bonding requirements; UV adhesive cures rapidly under ultraviolet light, providing high bonding strength and no volatiles, which helps improve process cleanliness; liquid adhesive can achieve precise local application through dispensing, adapting to the bonding needs of complex structures, while also possessing excellent anti-aging and temperature resistance properties. In summary, the adhesion and fixing method not only simplifies the assembly process and reduces the cost of opening holes and metal processing, but also achieves a dual improvement in optical stability and structural strength through optimized material properties, providing an efficient solution for narrow bezel designs and high-reliability display modules.

[0052] One specific embodiment includes: an optical functional film 54, which is located above the light guide plate 52; A TFT array substrate 71 is disposed above the metal frame 3 and the optical functional film 54, and the driving chip 8 is disposed on the TFT array substrate 71.

[0053] The display device provided in this embodiment includes the liquid crystal display module of the display device described above.

[0054] In the embodiments of this application, the display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, or laptop computer.

[0055] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A liquid crystal display module, characterized in that, include: A metal frame, within which a light source and a light guide plate are disposed; A driver chip is disposed above the metal frame; A printed circuit board, which is vertically disposed on the side of the metal frame that is different from the light guide plate.

2. The liquid crystal display module according to claim 1, characterized in that, The printed circuit board has a first surface and a second surface that are arranged opposite to each other in the Z direction, and the distance between the first surface and the second surface is the height h; The distance d between the surface of the metal frame away from the printed circuit board and the surface of the driver chip away from the metal frame; The range of values ​​for d satisfies h > d.

3. The liquid crystal display module according to claim 2, characterized in that, The printed circuit board is connected to the metal frame by a plug-in connection.

4. The liquid crystal display module according to claim 3, characterized in that, The metal frame includes a horizontal portion, a first folded portion, and a second folded portion, wherein the first folded portion is perpendicular to the horizontal portion, and the second folded portion is perpendicular to the first folded portion; At least one protrusion is provided in the horizontal part of the metal frame and in the X direction of the first folding part, and the printed circuit board is inserted into the protrusion.

5. The liquid crystal display module according to claim 4, characterized in that, At least one snap-fit ​​portion is provided in the Z direction of the printed circuit board, and at least one slot is provided on the second surface of the snap-fit ​​portion, the slot being inserted into the protrusion of the metal frame.

6. The liquid crystal display module according to claim 4, characterized in that, The projected area of ​​the protrusion of the printed circuit board in the XZ direction is smaller than the projected area of ​​the first folded part in the XZ direction.

7. The liquid crystal display module according to claim 2, characterized in that, The printed circuit board is adhered to the metal frame on the side away from the light guide plate.

8. The liquid crystal display module according to claim 7, characterized in that, The printed circuit board is adhered to the metal frame using any one of liquid adhesive, UV adhesive, or double-sided adhesive.

9. The liquid crystal display module according to claim 1, Its features are, Includes: an optical functional film, the optical functional film being located above the light guide plate; A TFT array substrate is disposed above the metal frame and the optical functional film, and the driving chip is disposed on the TFT array substrate.

10. A display device, characterized in that, Includes the liquid crystal display module as described in any one of claims 1 to 9.

Images