Silicon-based liquid crystal display packaging structure

Abstract

This invention provides a silicon-based liquid crystal display packaging structure, comprising: a substrate with a groove within it; a chip fixed within the groove; a flexible circuit board attached to the substrate and extending from the groove onto the upper surface of the substrate; the chip connected to the flexible circuit board via leads; and optical glass covering the substrate to form a sealed cavity, with the chip located within the sealed cavity. This invention optimizes the chip packaging structure by designing the substrate as a groove-type structure based on the flexible circuit board structure. Optical glass is then added to the dam surrounding the groove-type substrate for sealing, improving water and vapor resistance while maintaining the original structure encapsulated on the flexible circuit board. This not only enhances the reliability of the product under high temperature and high humidity conditions but also effectively controls production costs.

Description

Technical Field

[0001] This utility model belongs to the field of liquid crystal display technology, specifically relating to a silicon-based liquid crystal display packaging structure. Background Technology

[0002] Silicon-based liquid crystal display panels are a type of reflective liquid crystal micro-panel. They use semiconductor silicon crystal technology to control liquid crystals and thus "project" color images. They have the characteristics of high light utilization efficiency, small size, high aperture ratio, and mature manufacturing technology. They can easily achieve high resolution and full color performance.

[0003] Currently, silicon-based liquid crystal (LCD) packaging typically involves mounting the display chip onto a PCB substrate or a flexible circuit board substrate. The chip is directly exposed to the environment and relies solely on its own strength to withstand the harsh conditions required for reliability. However, with the increasing use of silicon-based LCD panels in the automotive market, the reliability requirements are becoming increasingly stringent, especially regarding high temperature and humidity. The chip's inherent strength alone is insufficient to meet these ever-higher reliability demands. Utility Model Content

[0004] The purpose of this invention is to provide a silicon-based liquid crystal display packaging structure. It optimizes the chip packaging structure by designing the substrate as a groove type based on the flexible circuit board structure, i.e., a groove is set in the substrate. Optical glass is added to the dam of the groove substrate for sealing and encapsulation. This not only improves the waterproof and vapor-proof capability but also maintains the original structure of the packaging on the flexible circuit board. This not only improves the reliability of the product under high temperature and high humidity but also effectively controls the production cost.

[0005] This utility model provides a silicon-based liquid crystal display packaging structure, including:

[0006] A substrate, wherein a groove is provided within the substrate;

[0007] The chip is fixed within the groove;

[0008] A flexible circuit board, wherein the flexible circuit board is attached to the substrate and extends from the groove out of the upper surface of the substrate; the chip is connected to the flexible circuit board via leads;

[0009] An optical glass is used to cover the substrate to form a sealed cavity, and the chip is located within the sealed cavity.

[0010] Furthermore, the bottom surface of the groove, the sidewall of the groove, and the upper surface of the base form steps; the corner between the bottom surface of the groove and the sidewall of the groove is chamfered; the corner between the sidewall of the groove and the upper surface of the base is also chamfered.

[0011] Furthermore, the flexible circuit board is bonded to the step location on the substrate by a first adhesive.

[0012] Furthermore, the optical glass is bonded and sealed to the upper surface of the substrate using a second colloid.

[0013] Furthermore, the material of the second colloid includes epoxy thermosetting materials or epoxy UV materials.

[0014] Furthermore, a third colloid is formed at the junction of the side of the optical glass and the flexible circuit board.

[0015] Furthermore, the substrate may be made of any one of ceramic, glass, reinforcing steel sheet or quartz.

[0016] Furthermore, the chip includes a silicon-based liquid crystal chip, which includes a substrate and a plurality of pixel electrodes arrayed on the substrate.

[0017] Furthermore, the lead wire includes any one of gold wire, aluminum wire, or copper wire.

[0018] Furthermore, viewed from above, the groove is roughly square or rectangular.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] This invention provides a silicon-based liquid crystal display packaging structure, comprising: a substrate with a groove within it; a chip fixed within the groove; a flexible circuit board attached to the substrate and extending from the groove onto the upper surface of the substrate; the chip connected to the flexible circuit board via leads; and optical glass covering the substrate to form a sealed cavity, with the chip located within the sealed cavity. This invention optimizes the chip packaging structure by designing the substrate as a groove-type structure based on the flexible circuit board structure. Optical glass is then added to the dam surrounding the groove-type substrate for sealing, improving water and vapor resistance while maintaining the original structure encapsulated on the flexible circuit board. This not only enhances the reliability of the product under high temperature and high humidity conditions but also effectively controls production costs. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the silicon-based liquid crystal display packaging structure according to an embodiment of the present invention.

[0022] Figure 2 This is a schematic diagram of the substrate and flexible circuit board in the silicon-based liquid crystal display packaging structure of this utility model embodiment.

[0023] Figure 3 This is a schematic diagram of the substrate step portion in the silicon-based liquid crystal display packaging structure according to an embodiment of the present invention.

[0024] The reference numerals in the attached figures are as follows:

[0025] 10-Substrate; 20-Chip; 30-Flexible circuit board; 40-Optical glass; 50-Lead wire; 61-First colloid; 62-Second colloid; 63-Third colloid. Detailed Implementation

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0027] For ease of description, some embodiments of this application may use spatially relative terms such as “above,” “below,” “top,” and “under” to describe the relationship between one element or component and another (or more) elements or components as shown in the accompanying drawings. It should be understood that, in addition to the orientations described in the drawings, spatially relative terms are also intended to include different orientations of the device during use or operation. For example, if the device in the drawings is flipped, it is described as an element or component “below” or “under” other elements or components, and will subsequently be positioned “above” or “on” other elements or components. The terms “first,” “second,” etc., used below are used to distinguish between similar elements and are not necessarily used to describe a particular order or temporal sequence. It should be understood that these terms, as used, may be replaced where appropriate.

[0028] This utility model embodiment provides a silicon-based liquid crystal display packaging structure, such as Figures 1 to 3 As shown, it includes:

[0029] Base 10, with a groove provided inside the base 10;

[0030] Chip 20, chip 20 is fixed in the groove;

[0031] Flexible circuit board 30 is attached to substrate 10 and extends from the groove to the upper surface of substrate 10; chip 20 is connected to flexible circuit board 30 via lead wire 50.

[0032] Optical glass 40 covers the substrate 10 to form a sealed cavity, and chip 20 is located in the sealed cavity.

[0033] Specifically, the substrate 10 may be made of any of the following materials: ceramic (e.g., alumina), glass, reinforcing steel sheet, or quartz. The chip 20 may be a silicon-based liquid crystal chip, which includes a substrate and multiple pixel electrodes arrayed on the substrate. A silicon-based liquid crystal chip is a reflective liquid crystal display chip that uses the same silicon substrate as integrated circuits to fabricate the liquid crystal panel and utilizes CMOS-like processes to create the specific device structure. Silicon-based liquid crystal chips integrate display devices and driving circuits, thereby achieving high-density and high-resolution display panels.

[0034] A groove is provided within the substrate 10; the bottom surface of the groove, the sidewalls of the groove, and the upper surface of the substrate 10 form a step; the corner between the bottom surface of the groove and the sidewalls of the groove is chamfered; the corner between the sidewalls of the groove and the upper surface of the substrate is also chamfered. The flexible circuit board 30 is bonded to the step of the substrate 10 by a first adhesive 61. The chamfered design at the step improves the adhesion between the flexible circuit board 30 and the substrate 10, achieving a better sealing effect. The first adhesive 61 is, for example, an adhesive, and the material of the first adhesive 61 can be an epoxy thermosetting material. The chip 20 is connected to the flexible circuit board 30 by a lead 50. The optical glass 40 is bonded and sealed to the upper surface of the substrate 10 by a second adhesive 62, which can be, for example, an epoxy thermosetting material or an epoxy UV material. A third colloid 63 is formed at the interface between the side of the optical glass 40 and the flexible circuit board 30. The third colloid 63 can be, for example, an epoxy thermosetting material, and it protects the flexible circuit board 30. The leads 50 include any one of gold, aluminum, or copper wires, as well as other suitable materials. The flexible circuit board 30 is a highly reliable and extremely flexible printed circuit board made with polyimide or polyester film as a substrate. During use, because the flexible circuit board 30 has poor rigidity and load-bearing capacity, it is easily damaged. Therefore, the flexible circuit board 30 is bonded to the substrate 10 to improve its strength.

[0035] In summary, this utility model provides a silicon-based liquid crystal display packaging structure, comprising: a substrate with a groove within it; a chip fixed within the groove; a flexible circuit board attached to the substrate and extending from the groove onto the upper surface of the substrate; the chip connected to the flexible circuit board via leads; and optical glass covering the substrate to form a sealed cavity, with the chip located within the sealed cavity. This utility model optimizes the chip packaging structure by designing the substrate as a groove type based on the flexible circuit board structure, i.e., a groove within the substrate; and by adding optical glass to the dam surrounding the groove-type substrate for sealing encapsulation. This improves water and vapor resistance while maintaining the original structure encapsulated on the flexible circuit board, thereby enhancing the product's reliability under high temperature and humidity conditions, improving product quality, and effectively controlling production costs.

[0036] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. The methods disclosed in the embodiments are described simply because they correspond to the devices disclosed in the embodiments; relevant details can be found in the method section.

[0037] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model. Any person skilled in the art can make possible changes and modifications to the technical solution of the present utility model by using the methods and techniques disclosed above without departing from the spirit and scope of the present utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model shall fall within the protection scope of the technical solution of the present utility model.

Claims

1. A silicon-based liquid crystal display packaging structure, characterized in that, include: A substrate, wherein a groove is provided within the substrate; The chip is fixed within the groove; A flexible circuit board, wherein the flexible circuit board is attached to the substrate and extends from the groove out of the upper surface of the substrate; The chip is connected to the flexible circuit board via leads; An optical glass is used to cover the substrate to form a sealed cavity, and the chip is located within the sealed cavity.

2. The silicon-based liquid crystal display packaging structure as described in claim 1, characterized in that, The bottom surface of the groove, the sidewall of the groove, and the upper surface of the base form steps; the corner between the bottom surface of the groove and the sidewall of the groove is chamfered; the corner between the sidewall of the groove and the upper surface of the base is also chamfered.

3. The silicon-based liquid crystal display packaging structure as described in claim 2, characterized in that, The flexible circuit board is bonded to the step location on the substrate by a first adhesive.

4. The silicon-based liquid crystal display packaging structure as described in claim 1, characterized in that, The optical glass is bonded and sealed to the upper surface of the substrate by a second colloid.

5. The silicon-based liquid crystal display packaging structure as described in claim 4, characterized in that, The material of the second colloid includes epoxy thermosetting materials or epoxy UV materials.

6. The silicon-based liquid crystal display packaging structure as described in claim 1, characterized in that, A third colloid is formed at the junction of the side of the optical glass and the flexible circuit board.

7. The silicon-based liquid crystal display packaging structure as described in claim 1, characterized in that, The substrate material includes any one of ceramic, glass, reinforcing steel sheet or quartz.

8. The silicon-based liquid crystal display packaging structure as described in claim 1, characterized in that, The chip includes a silicon-based liquid crystal chip, which includes a substrate and a plurality of pixel electrodes arrayed on the substrate.

9. The silicon-based liquid crystal display packaging structure as described in claim 1, characterized in that, The lead wire includes any one of gold wire, aluminum wire, or copper wire.

10. The silicon-based liquid crystal display packaging structure as described in claim 1, characterized in that, Viewed from above, the groove is roughly square or rectangular.

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