A CMOS refrigeration device

Abstract

The application discloses a CMOS refrigerating device, and relates to the field of camera heat dissipation, which comprises a shell, a PCB plate fixedly installed in the shell, a CMOS sensor fixedly installed on the back of the PCB plate, a through hole arranged on the PCB plate at a region corresponding to the back of the CMOS sensor, a refrigerating assembly connected with the back of the CMOS sensor, at least part of the refrigerating assembly being located in the through hole, the refrigerating assembly comprising a semiconductor refrigerator, a first heat-conducting block and a second heat-conducting block, the semiconductor refrigerator having a cold end face and a hot end face in the thickness direction, the cold end face being in contact with the back of the CMOS sensor through the first heat-conducting block, and the hot end face being in contact with the inner wall face of the shell through the second heat-conducting block. The CMOS refrigerating device provided in the specification can form a local low-temperature region in the region where the CMOS sensor is located, and meets the requirement of use in a high-temperature environment.

Description

Technical Field

[0001] This manual relates to the field of camera heat dissipation technology, and in particular to a CMOS cooling device. Background Technology

[0002] The description in this section provides only background information relevant to the disclosure in this specification and does not constitute prior art.

[0003] Machine vision refers to the process of converting the target object into an image signal using an image sensor, transmitting it to a dedicated image processing system to obtain the target's shape information, and converting it into a digital signal based on pixel distribution, brightness, color, and other information. The image system then performs various operations on these signals to extract the target's features for measurement or discrimination, and controls the on-site equipment actions and processes based on the discrimination results.

[0004] As the most widely used 3D line laser camera in machine vision, it is based on the principle of triangulation. Through a CMOS image sensor, it captures the laser line information projected by the laser generator onto the surface of the object, and obtains a surface cross-sectional profile image of the object being measured. By processing and extracting the contour from the image, the physical coordinate information of the contour is calculated. At the same time, through motion control, the continuous contour of the object can be obtained and synthesized to form a 3D point cloud of the object's appearance contour. It can perform real-time measurement and defect detection, and is widely used in consumer electronics, photovoltaics, lithium batteries, automobiles, semiconductors and other fields.

[0005] With the upgrading of Industry 4.0 and intelligent manufacturing, and the accompanying massive data acquisition and processing, new demands are being placed on the speed and efficiency of machine vision equipment, requiring higher frame rates and resolutions. This leads to larger photosensitive areas in CMOS sensors, higher power consumption, and higher temperatures. Research shows that for every 10°C increase in temperature, dark current increases approximately threefold; above 60°C, dark current increases exponentially, interfering with the true image information of the CMOS sensor and degrading image quality. Therefore, to ensure high sensitivity and high-quality imaging, temperature control of CMOS sensors is necessary. Advanced semiconductor manufacturing processes can appropriately reduce the heat accumulation of the CMOS sensor itself; however, under the condition of constant frame rate and resolution, according to the law of conservation of energy, the CMOS sensor will still generate a certain amount of heat, which needs to be dissipated to the outside.

[0006] 3D line laser cameras or other machine vision equipment, due to size and usage limitations, cannot use fans or liquid cooling. The high-power heat source is the FPGA chip, which, combined with the heat generated by the CMOS sensor, results in a significant temperature rise during camera operation. Because the FPGA chip is heat-resistant (junction temperature 125℃), the primary consideration is heat dissipation of the CMOS sensor. Existing solutions are as follows: 1. When the power consumption of the CMOS sensor is less than 1W, the traditional method is to lay as much copper as possible on the surface and inside the CMOS PCB to conduct the heat of the CMOS to the PCB, and then conduct it to the CMOS mounting block. The CMOS mounting block has heat dissipation slots for natural heat dissipation. At the same time, the CMOS mounting block is connected to the lens, and the lens is connected to the housing to conduct heat to the housing, thus achieving the purpose of heat dissipation. This solution can basically meet the heat dissipation requirements of CMOS when the ambient temperature is below 40℃, but the CMOS is not at its optimal operating temperature.

[0007] 2. When the CMOS sensor power consumption exceeds 1W (e.g., a high frame rate CMOS sensor consumes 1.8W), heat conduction through the PCB is insufficient to meet the heat dissipation requirements. The traditional method involves creating a rectangular hole through the PCB on the back of the CMOS photosensitive area, using a Z-shaped heat-conducting block to directly contact the back of the CMOS sensor and conduct heat to the outer casing for dissipation. This method can meet the requirements of normal room temperature environments. However, when the ambient temperature exceeds 35℃ or the casing has poor heat dissipation, the casing cannot dissipate heat effectively, and the CMOS core temperature can easily reach over 60℃. This leads to deterioration in camera image quality and decreased detection accuracy, failing to meet usage requirements.

[0008] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions in this specification and facilitating understanding by those skilled in the art. The fact that these solutions have been described in the background section of this specification should not be construed as meaning that the aforementioned technical solutions are known to those skilled in the art. Utility Model Content

[0009] In view of the shortcomings of the prior art, one object of this specification is to provide a CMOS cooling device that can form a local low temperature region in the area where the CMOS sensor is located, so as to meet the requirements of high temperature environment use.

[0010] To achieve the above objectives, this specification provides a CMOS cooling device, comprising: shell; A PCB board fixedly installed inside the housing; A CMOS sensor is fixedly mounted on the back of the PCB board; the PCB board has through holes in the area corresponding to the back of the CMOS sensor. A cooling assembly connected to the back of the CMOS sensor, at least a portion of which is located within the through-hole; the cooling assembly includes a semiconductor cooler, a first heat-conducting block, and a second heat-conducting block, the semiconductor cooler having a cold end face and a hot end face in the thickness direction; the cold end face is in contact with the back of the CMOS sensor through the first heat-conducting block; the hot end face is in contact with the inner wall of the housing through the second heat-conducting block.

[0011] In a preferred embodiment, the projected shape of the semiconductor cooler is rectangular in a plane perpendicular to the thickness direction; the cold end face and the hot end face are both rectangular in shape and equal in size.

[0012] In a preferred embodiment, in a plane perpendicular to the thickness direction, the projection of the first heat-conducting block coincides with the cold end face, and the projection of the through hole is rectangular with an area larger than the projected area of ​​the first heat-conducting block.

[0013] In a preferred embodiment, the thickness of the first heat-conducting block is greater than the thickness of the through hole in the thickness direction.

[0014] In a preferred embodiment, a thermal pad is provided between the first thermal block and the back of the CMOS sensor, and the thickness of the thermal pad is less than the thickness of the through hole.

[0015] In a preferred embodiment, in a plane perpendicular to the thickness direction, the projection of the second heat-conducting block covers the hot end face, and the projected area of ​​the second heat-conducting block is larger than the area of ​​the hot end face.

[0016] In a preferred embodiment, a mounting base is also fixedly provided inside the housing, and the PCB board is fixedly mounted on the mounting base.

[0017] In a preferred embodiment, a mounting base is also fixedly provided inside the housing, and the mounting seat is fixedly installed on the mounting base. A lens is fixedly provided on the side of the mounting base opposite to the mounting base.

[0018] In a preferred embodiment, the first heat-conducting block and the cold end face are fixedly connected by thermally conductive structural adhesive, and the second heat-conducting block and the hot end face are fixedly connected by thermally conductive structural adhesive.

[0019] In a preferred embodiment, the thermoelectric cooler is connected to a power supply cable, which is used to connect the thermoelectric cooler to the control board. Beneficial effects

[0020] The CMOS cooling device provided in this embodiment includes a housing, a PCB board, a CMOS sensor, and a cooling assembly. The PCB board has through holes in the area corresponding to the back of the CMOS sensor, allowing the cooling assembly to be mounted on the back of the CMOS sensor. The cooling assembly includes a thermoelectric cooler, a first heat-conducting block, and a second heat-conducting block. The heat generated by the CMOS sensor is conducted to the cold end face of the thermoelectric cooler through the first heat-conducting block, and then from the hot end face of the thermoelectric cooler to the housing through the second heat-conducting block. This creates a localized low-temperature region in the area where the CMOS sensor is located, meeting the requirements for use in high-temperature environments.

[0021] Specific embodiments of the present invention are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of the present invention can be employed. It should be understood that the scope of the embodiments of the present invention is not limited thereto.

[0022] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0023] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a cross-sectional structural diagram of a CMOS cooling device provided in this embodiment; Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of the AA surface in the middle; Figure 3 This is a three-dimensional structural diagram of a refrigeration component provided in this embodiment.

[0026] Explanation of reference numerals in the attached figures: 1. Housing; 2. PCB board; 21. Through hole; 3. CMOS sensor; 4. Mounting bracket; 5. Fixing bracket; 6. Cooling assembly; 61. Semiconductor cooler; 611. Cold end face; 612. Hot end face; 62. First heat conduction block; 63. Second heat conduction block; 64. Thermal pad; 65. Thermally conductive structural adhesive; 66. Power supply cable; X, thickness direction. Detailed Implementation

[0027] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0028] It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or may be interposed with another element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or may be interposed with another element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] Please see Figures 1 to 3 This application provides a CMOS cooling device, including: a housing 1, a PCB board 2, a CMOS sensor 3, and a cooling assembly 6.

[0031] The housing 1 provides a mounting base and a heat dissipation path. The PCB board 2 is fixedly mounted inside the housing 1. The back of the CMOS sensor 3 is fixedly mounted on the PCB board 2. The PCB board 2 has a through-hole 21 in the area corresponding to the back of the CMOS sensor 3. The front of the CMOS sensor 3 is the working area, while the side area is too small, so heat dissipation can only be achieved through the back of the CMOS sensor 3. The CMOS sensor 3 is soldered onto the PCB board 2, and the through-hole 21 is made in the central area of ​​the PCB board 2 corresponding to the CMOS sensor 3, avoiding the pad area. This allows the back of the CMOS sensor 3 to be exposed through the through-hole 21 for easy heat dissipation.

[0032] like Figure 1 and Figure 2 As shown, the cooling component 6 is connected to the back of the CMOS sensor 3. At least a portion of the cooling component 6 is located within the through-hole 21. Figure 3 As shown, the cooling assembly 6 includes a semiconductor cooler 61, a first heat-conducting block 62, and a second heat-conducting block 63. The semiconductor cooler 61 has a cold end face 611 and a hot end face 612 in the thickness direction X. The cold end face 611 is in contact with the back surface of the CMOS sensor 3 through the first heat-conducting block 62. The hot end face 612 is in contact with the inner wall surface of the housing 1 through the second heat-conducting block 63.

[0033] The CMOS cooling device provided in this embodiment includes a housing 1, a PCB board 2, a CMOS sensor 3, and a cooling assembly 6. The PCB board 2 has a through hole 21 in the area corresponding to the back of the CMOS sensor 3, so that the cooling assembly 6 can be mounted on the back of the CMOS sensor 3. The cooling assembly 6 includes a semiconductor cooler 61, a first heat-conducting block 62, and a second heat-conducting block 63. The heat generated by the CMOS sensor 3 is conducted to the cold end face 611 of the semiconductor cooler 61 through the first heat-conducting block 62, and then from the hot end face 612 of the semiconductor cooler 61 through the second heat-conducting block 63 to the housing 1. The heat can be dissipated from the housing 1, thereby forming a local low-temperature area in the area where the CMOS sensor 3 is located, to meet the requirements of high-temperature environment use.

[0034] Semiconductor refrigeration, also known as thermoelectric refrigeration, works on the Peltier effect in thermoelectric effects: when current flows through a junction formed by two different conductors, heat release and heat absorption occur at the junction, and the magnitude of heat release or heat absorption is determined by the magnitude of the current. This is the Peltier effect, which is also the basic working principle of semiconductor refrigeration 61.

[0035] It should be noted that the shape and size of the first heat-conducting block 62, the second heat-conducting block 63, and the semiconductor cooler 61 can be changed according to the needs of specific embodiments.

[0036] In this embodiment, the projected shape of the thermoelectric cooler 61 is rectangular in a plane perpendicular to the thickness direction X. Both the cold end face 611 and the hot end face 612 are rectangular in shape and of equal size. That is, the thermoelectric cooler 61 has a cuboid structure, which is simple to manufacture, low in cost, convenient to install, and has a large heat dissipation area.

[0037] Correspondingly, in the plane perpendicular to the thickness direction X, the projection of the first heat-conducting block 62 roughly coincides with the cold end surface 611, that is, the shape of the first heat-conducting block 62 is cuboid, which can maximize heat conduction. In the plane perpendicular to the thickness direction X, the projection of the through hole 21 is rectangular and its area is larger than the projected area of ​​the first heat-conducting block 62. Thus, the through hole 21 can be used to accommodate the first heat-conducting block 62, and the rectangular shape of the through hole 21 is easy to manufacture, which can reduce the difficulty of drilling and does not damage other structures on the PCB board 2.

[0038] In this embodiment, the thickness of the first heat-conducting block 62 is greater than the thickness of the through hole 21 in the thickness direction X, so that the first heat-conducting block 62 protrudes from the through hole 21, which allows the semiconductor cooler 61 to be located outside the through hole 21, so as not to affect the connection of the semiconductor cooler 61 to the power supply cable 66.

[0039] like Figure 3 As shown, the thermoelectric cooler 61 is connected to a power supply cable 66, which connects the thermoelectric cooler 61 to the control board. The control board can control whether the thermoelectric cooler 61 is powered on and the amount of power supplied. When the control board detects that the temperature of the CMOS sensor 3 has reached a specified temperature, it starts to supply power to the thermoelectric cooler 61, thereby cooling the CMOS sensor 3 and dissipating heat through the casing 1.

[0040] Specifically, a thermal pad 64 is provided between the first heat-conducting block 62 and the back of the CMOS sensor 3. The thickness of the thermal pad 64 is less than the thickness of the through hole 21. In addition to transferring heat to the first heat-conducting block 62, the thermal pad 64 also protects the CMOS sensor 3 from compression, eliminating manufacturing and assembly tolerances. The CMOS sensor 3 is cooled by the thermal pad 64 and the appropriately shaped cooling assembly 6.

[0041] like Figure 1 and Figure 3 As shown, in a plane perpendicular to the thickness direction X, the projection of the second heat-conducting block 63 covers the hot end face 612. The projected area of ​​the second heat-conducting block 63 is greater than the area of ​​the hot end face 612. That is, the volume (or area) of the second heat-conducting block 63 is greater than the volume (or area) of the first heat-conducting block 62, which can improve the heat dissipation effect.

[0042] In this embodiment, the first heat-conducting block 62 and the second heat-conducting block 63 can be made of copper or other suitable thermally conductive materials. During installation, the cold end face 611 contacts the back of the CMOS sensor 3 through copper and the thermal pad 64, and the hot end face 612 contacts the housing 1 through copper.

[0043] Specifically, the first heat-conducting block 62 and the cold end face 611 are fixedly connected by thermally conductive structural adhesive 65, and the second heat-conducting block 63 and the hot end face 612 are fixedly connected by thermally conductive structural adhesive 65. The thermally conductive structural adhesive 65 can connect and fix the two heat-conducting blocks and the semiconductor cooler 61.

[0044] In this embodiment, a mounting base 4 is also fixedly provided inside the outer casing 1, and the PCB board 2 is fixedly mounted on the mounting base 4. That is, the mounting base 4 can provide a mounting position for the PCB board 2.

[0045] Furthermore, a mounting base 5 is fixedly provided inside the outer casing 1 to provide an installation position for the mounting base 4. The mounting base 5 is fixedly connected to the outer casing 1, and the mounting base 4 is fixedly installed on the mounting base 5. A lens is fixedly provided on the side of the mounting base 5 opposite to the mounting base 4. The mounting base 5 can be used to fix and adjust the lens and the mounting base 4.

[0046] In a specific application scenario, the PCB board 2 containing the CMOS sensor 3 is first mounted on the mounting base 4, then the mounting base 4 is mounted on the fixing base 5, and the lens is also mounted on the fixing base 5. The entire fixing base 5 is then installed inside the housing 1, and then the thermal pad 64 is mounted on the cooling assembly 6. Finally, the cooling assembly 6 is installed in the housing 1, so that the thermal pad 64 is connected to the back of the CMOS sensor 3 through the through hole 21.

[0047] In a comparative example of existing technology, at an ambient temperature of 40°C, using a traditional Z-shaped heatsink, the measured temperature of the CMOS temperature sensor easily exceeds 60°C, causing the image acquisition software to alarm for high temperature.

[0048] In contrast, in one embodiment of this application, thermal simulation shows that the point temperature of the CMOS temperature sensor is 52°C, the lowest temperature of the photosensitive area is 45.1°C, the average temperature of the CMOS sensor 3 drops by more than 10°C, and the temperature of the housing 1 only rises by 1.3°C compared to the traditional Z-shaped heat sink. A local low-temperature region is formed in the area where the CMOS sensor 3 is located, which meets the requirements for use in harsh environments. The measured temperature also matches the simulation data.

[0049] By using the performance parameters and performance curves of the semiconductor cooler 61, thermal simulation software is used to perform thermal simulation verification on the entire device. This confirms the temperature of the CMOS sensor 3, identifies the optimal operating voltage and current of the semiconductor cooler 61, and uses these as design parameters for the control board. Finally, these design parameters are used for practical verification and design correction to determine the final design data. This application, through this series of calculations, simulations, structural devices, and verifications, can control the temperature of the CMOS sensor 3 within a suitable temperature range.

[0050] The CMOS cooling device provided in this application can be applied to 3D line laser cameras, as well as other 2D and 3D cameras, such as high-speed cameras and structured light cameras. As long as the temperature of the CMOS sensor 3 is controlled, the CMOS cooling device provided in this application can be used.

[0051] It should be noted that in the description of this specification, the terms "first," "second," etc., are used only for descriptive purposes and to distinguish similar objects; there is no order between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of this specification, unless otherwise stated, "a plurality of" means two or more.

[0052] Any numerical values ​​cited herein include all values ​​ranging from a lower limit to an upper limit, increasing by one unit, with at least two units between any lower and any higher value. For example, if the quantity of a component or the value of a process variable (e.g., temperature, pressure, time, etc.) is described as being from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, the purpose is to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly listed in this specification. For values ​​less than 1, a unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1, etc. These are merely examples intended for explicit expression, and it can be assumed that all possible combinations of values ​​listed between the minimum and maximum values ​​are explicitly described in this specification in a similar manner.

[0053] Unless otherwise stated, all ranges include the endpoints and all numbers between them. The terms "approximately" or "about" used with ranges apply to both endpoints of the range. Thus, "approximately 20 to 30" is intended to cover "approximately 20 to approximately 30," including at least the specified endpoints.

[0054] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for various purposes. The term “substantially constitutes…” used to describe a combination should include the identified elements, components, parts, or steps, as well as other elements, components, parts, or steps that do not substantially affect the essential novelty of the combination. The use of the terms “comprising” or “including” to describe combinations of elements, components, parts, or steps herein also contemplates embodiments substantially constituted by such elements, components, parts, or steps. The use of the term “may” herein is intended to indicate that any described attribute included by “may” is optional.

[0055] Multiple elements, components, parts, or steps can be provided by a single integrated element, component, part, or step. Alternatively, a single integrated element, component, part, or step can be divided into multiple separate elements, components, parts, or steps. The use of "a" or "an" to describe an element, component, part, or step does not imply the exclusion of other elements, components, parts, or steps.

[0056] It should be understood that the above description is for illustrative purposes and not for limitation. Many embodiments and applications beyond the provided examples will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of this teaching should not be determined by reference to the above description, but rather by reference to the appended claims and the full scope of their equivalents. For purposes of completeness, all articles and references, including patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended as a waiver of that subject matter, nor should it be construed as an indication that the inventors have not considered that subject matter as part of the disclosed utility model subject matter.

Claims

1. A CMOS cooling device, characterized in that, include: shell; A PCB board fixedly installed inside the housing; A CMOS sensor is fixedly mounted on the PCB board from the back. The PCB board has through holes in the area corresponding to the back of the CMOS sensor. A cooling assembly connected to the back of the CMOS sensor, at least a portion of which is located within the through-hole; the cooling assembly includes a semiconductor cooler, a first heat-conducting block, and a second heat-conducting block, wherein the semiconductor cooler has a cold end face and a hot end face in the thickness direction; the cold end face is in contact with the back of the CMOS sensor through the first heat-conducting block; The hot end face is in contact with the inner wall of the outer shell through the second heat-conducting block.

2. The CMOS cooling device according to claim 1, characterized in that, In a plane perpendicular to the thickness direction, the projected shape of the semiconductor cooler is rectangular; the cold end face and the hot end face are both rectangular in shape and equal in size.

3. The CMOS cooling device according to claim 2, characterized in that, In a plane perpendicular to the thickness direction, the projection of the first heat-conducting block coincides with the cold end face, and the projection of the through hole is rectangular with an area larger than the projected area of ​​the first heat-conducting block.

4. The CMOS cooling device according to claim 3, characterized in that, In the thickness direction, the thickness of the first heat-conducting block is greater than the thickness of the through hole.

5. The CMOS cooling device according to claim 4, characterized in that, A thermal pad is provided between the first thermal block and the back of the CMOS sensor, and the thickness of the thermal pad is less than the thickness of the through hole.

6. The CMOS cooling device according to claim 2, characterized in that, In a plane perpendicular to the thickness direction, the projection of the second heat-conducting block covers the hot end face, and the projected area of ​​the second heat-conducting block is larger than the area of ​​the hot end face.

7. The CMOS cooling device according to claim 1, characterized in that, The housing is also fixedly provided with a mounting base, and the PCB board is fixedly mounted on the mounting base.

8. The CMOS cooling device according to claim 7, characterized in that, The housing is also fixedly provided with a mounting base, and the mounting seat is fixedly installed on the mounting base. The lens is fixedly provided on the side of the mounting base opposite to the mounting base.

9. The CMOS cooling device according to claim 1, characterized in that, The first heat-conducting block and the cold end face are fixedly connected by thermally conductive structural adhesive, and the second heat-conducting block and the hot end face are fixedly connected by thermally conductive structural adhesive.

10. The CMOS cooling device according to claim 1, characterized in that, The semiconductor cooler is connected to a power supply cable, which is used to connect the semiconductor cooler to the control board.

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