A vacuum tube noise reduction thermal control device
Patent Information
- Application Number
- CN202522518437.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-26
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-11-26
AI Technical Summary
[0005]针对上述现有技术，为解决电子管因高温工作导致的热噪声显著、信噪比下降、寿命缩短的问题，本申请提供一种电子管静噪热控装置
1.通过构建由均温块、纳米导热涂层、扁平热导管与散热鳍片组成的高效导热路径，实现电子管工作温度显著降低(由约280°C降至180°C)，有效抑制热噪声与散射电流，使放大器信噪比提升(10-12dB)；
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Figure CN224789103U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of electronic audio equipment, and in particular to a vacuum tube noise reduction and thermal control device. Background Technology
[0002] Vacuum tube power amplifiers have always held an important position in the high-end audio field due to their unique harmonic characteristics and warm tone. However, their long-standing heat dissipation problems have severely limited further improvements in performance and reliability.
[0003] Traditional vacuum tube amplifiers generally rely on natural convection for heat dissipation. Their power tubes are typically mounted directly on the top plate of the amplifier housing or in dedicated internal sockets, without establishing an active and efficient heat conduction path. Under high-voltage operation, the surface temperature of the tube's casing often rises above 280°C. Excessive operating temperature causes multiple problems: firstly, high temperatures significantly increase internal thermal noise and reduce the stability of the scattered current, directly compromising the purity of the audio signal, resulting in sound distortion and increased background noise; secondly, prolonged exposure to high temperatures accelerates the aging of the tube components, significantly shortening its lifespan and increasing user costs and maintenance frequency.
[0004] Phase change heat pipe technology has matured and is widely used in high-efficiency heat dissipation applications such as computer central processing units. Utilizing the principle of fluid phase change heat transfer, its thermal conductivity far exceeds that of solid-state metals like aluminum and copper, enabling rapid heat transfer from the heat source. However, this highly efficient heat conduction technology has not yet been successfully introduced into the field of vacuum tube audio equipment. This is mainly due to the unique structure of vacuum tubes and the extremely high acoustic purity requirements of high-end audio equipment; any heat dissipation solution that might introduce wind noise, vibration, or electromagnetic interference is unacceptable. Utility Model Content
[0005] In view of the above-mentioned prior art, in order to solve the problems of significant thermal noise, reduced signal-to-noise ratio, and shortened lifespan caused by high-temperature operation of electron tubes, this application provides an electron tube noise reduction thermal control device.
[0006] This application provides a vacuum tube noise reduction and thermal control device, which adopts the following technical solution: A vacuum tube noise reduction thermal control device includes a heat spreader block, a flat heat pipe, and heat dissipation fins. The heat spreader block and the vacuum tube are both installed in the body of a power amplifier. The heat spreader block has a through hole for installing the vacuum tube, and the vacuum tube is installed in the hole. The heat dissipation fins are fixedly installed on one side of the power amplifier body, and the flat heat pipe connects the heat spreader block and the heat dissipation fins.
[0007] By adopting the above technical solution, a continuous and efficient heat conduction path from the electron tube to the external environment is constructed through a heat spreader block, a flat heat pipe, and heat dissipation fins. This effectively reduces the operating temperature of the electron tube, thereby suppressing thermal noise, improving the signal-to-noise ratio, and extending the service life of the electron tube.
[0008] Preferably, the end of the flat heat pipe near the heat exchange block is attached to the side wall of the heat exchange block, and the side of the heat exchange block that is attached to the flat heat pipe is provided with a nano-thermal conductive coating.
[0009] By adopting the above technical solution, the nano-thermal conductive coating fills the micro-gap between the heat exchange block and the heat pipe, which greatly reduces the interfacial thermal resistance and ensures that heat is efficiently and without damage transferred from the heat exchange block to the heat pipe.
[0010] Preferably, the nano-thermal conductive coating is made of a composite material of metal oxide and graphene.
[0011] By adopting the above technical solution, the extremely high thermal conductivity of the metal oxide and graphene composite material is utilized to further enhance the interfacial heat diffusion capability and improve the overall thermal conductivity efficiency.
[0012] Preferably, a high thermal conductivity silicone sheet is provided between the inner wall of the mounting hole of the temperature equalization block and the electron tube.
[0013] By adopting the above technical solution, the high thermal conductivity silicone sheet tightly fills the gap between the electron tube and the heat spreader, effectively eliminating air thermal resistance, realizing efficient thermal coupling from the electron tube to the heat spreader, and at the same time playing a buffering and protective role.
[0014] Preferably, the temperature equalization block is made of high thermal conductivity aluminum or copper.
[0015] By adopting the above technical solution, the heat generated by the electron tube is quickly absorbed and evenly distributed by utilizing the excellent thermal diffusion properties of high thermal conductivity metal.
[0016] Preferably, the flat heat pipe has a capillary structure and a heat-conducting liquid inside.
[0017] By adopting the above technical solution, the heat transfer efficiency is far higher than that of solid metal heat conduction by using the capillary structure to drive the heat-conducting liquid to carry out a continuous evaporation-condensation phase change cycle.
[0018] Preferably, the flat heat pipe is a phase change heat pipe commonly used for cooling computer CPUs.
[0019] By adopting the above technical solution, mature and reliable CPU heat pipe components are directly used, ensuring high system performance and stability while reducing R&D and manufacturing costs. Their flat shape also facilitates compact installation inside the amplifier.
[0020] In summary, this application includes at least one of the following beneficial technical effects: 1. By constructing an efficient heat conduction path consisting of a heat spreader, a nano-thermal conductive coating, a flat heat pipe, and heat dissipation fins, the operating temperature of the electron tube is significantly reduced (from about 280°C to 180°C), effectively suppressing thermal noise and scattered current, and improving the signal-to-noise ratio of the amplifier (10-12dB). 2. It adopts a fully passive, non-powered mechanical heat conduction method to eliminate wind noise and electromagnetic interference, perfectly meeting the stringent requirements of high-end audio equipment for acoustic purity; 3. By utilizing the extremely high thermal conductivity of the metal oxide and graphene composite material, the interfacial heat diffusion capability is further enhanced, thereby improving the overall thermal conductivity efficiency. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a top view of the present invention; Figure 3 This is a side view of the present invention; Figure 4 This utility model is a comparison chart showing the noise test results of a power amplifier.
[0022] Reference numerals: 1. Heat spreader; 11. Mounting hole; 2. Flat heat pipe; 3. Heat dissipation fins; 4. Nano-thermal conductive coating; 5. High thermal conductivity silicone pad. Detailed Implementation
[0023] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.
[0024] This application discloses a vacuum tube noise reduction thermal control device.
[0025] Reference Figure 1 A vacuum tube noise reduction thermal control device includes a heat spreader 1, a flat heat pipe 2, and a heat dissipation fin 3. The heat spreader 1 is installed on the outer wall of the vacuum tube and fixedly installed in the body of a power amplifier. The heat spreader 1 has a mounting hole 11 for installing the vacuum tube. The heat dissipation fin 3 is fixedly installed on one side of the power amplifier body. The flat heat pipe 2 is located between the heat spreader 1 and the heat dissipation fin 3. One end of the flat heat pipe 2 is attached to the heat dissipation fin 3, and the other end of the flat heat pipe 2 is attached to the side wall of the heat spreader 1.
[0026] Reference Figure 2 and Figure 3A nano-thermal conductive coating 4 is provided on the side wall where the heat spreader 1 is attached to the flat heat pipe 2; a nano-thermal conductive coating 4 is also provided on the side of the heat dissipation fin 3 that is attached to the flat heat pipe 2; in this embodiment, the nano-thermal conductive coating 4 is made of a composite material of metal oxide and graphene; the composite material of metal oxide and graphene has an extremely high thermal conductivity. The nano-thermal conductive coating 4 can fill the microscopic gaps at the contact surfaces between the heat spreader 1, the flat heat pipe 2 and the heat dissipation fin 3, reduce heat loss during the heat transfer process, and ensure that heat is efficiently and without loss transferred from the heat spreader 1 to the heat pipe, and finally to the heat dissipation fin 3.
[0027] A gap is left between the heat spreader 1 and the electron tube. A high thermal conductivity silicone pad 5 is installed in the gap between the heat spreader 1 and the electron tube. The high thermal conductivity silicone pad has good flexibility and filling properties, and can closely fit the irregular surface between the electron tube and the heat spreader 1, effectively eliminating air gaps and significantly reducing contact thermal resistance.
[0028] During installation, the heat spreader 1 is first installed in the designated position, and then the high thermal conductivity silicone pad 5 is installed in the mounting hole 11. Subsequently, the electron tube is slowly screwed into the mounting hole 11 along the axis. Utilizing the flexibility and filling properties of the high thermal conductivity silicone pad 5, it evenly wraps around the outer surface of the electron tube's corrugated shell, forming a tight thermally conductive contact without gaps. After installation, the electron tube, the high thermal conductivity silicone pad 5, and the heat spreader 1 form a stable and low thermal resistance thermal interface, laying the foundation for subsequent efficient heat conduction.
[0029] The heat spreader 1 is made of high thermal conductivity aluminum or copper, and its surface is anodized to enhance thermal conductivity and heat resistance. In this embodiment, the heat spreader 1 is made of high thermal conductivity aluminum. Dust, slight moisture, or trace amounts of corrosive gases generated by circuit components may exist inside the amplifier. Pure aluminum is easily oxidized to form a loose oxide layer, affecting thermal conductivity. The dense oxide film formed by anodizing completely isolates the aluminum substrate from the external environment, preventing oxidation and corrosion, ensuring that the heat spreader 1 maintains stable thermal conductivity over a long period, and avoiding a decrease in heat dissipation efficiency and an increase in tube noise due to material deterioration.
[0030] The flat heat pipe 2 is internally equipped with capillary structures and a heat-conducting liquid. It is a phase-change heat pipe commonly used in computer CPU cooling. Utilizing the principle of phase-change heat transfer (evaporation-condensation cycle of the heat-conducting liquid), it achieves efficiency far exceeding that of direct metal heat conduction, rapidly transferring heat from the electron tube via the heat spreader 1 and the nano-thermal conductive coating 4 to the external heat sink fins 3, effectively reducing the electron tube surface temperature from approximately 280°C to 180°C. Simultaneously, it reuses mature heat pipe technology from the computer CPU field, ensuring structural stability and adaptability without additional R&D. Its flat shape also fits the compact internal layout of the amplifier without requiring circuit modifications. Furthermore, this heat transfer process relies on phase change and capillary suction, eliminating the need for fans, pumps, or other power components, maintaining a fully mechanical heat conduction design, avoiding electromagnetic interference and wind noise. Ultimately, this helps reduce electron tube thermal noise and scattered current, improving the amplifier's signal-to-noise ratio by 10–12 dB, and is compatible with straight-bodied corrugated electron tubes such as KT90, 6550, EL34, and EL84.
[0031] Reference Figure 4 To illustrate the noise levels, noise spectrum comparisons were conducted using a testing instrument on devices with and without the thermal control device of this application. The horizontal axis represents frequency, and the vertical axis represents noise level, both in dBV. The upper blue curve represents the background noise spectrum without the device, which exhibits a higher noise level. The lower red curve represents the background noise spectrum with the device installed. It is evident that noise levels are comprehensively and significantly suppressed across the entire audio range, particularly in the mid-to-low frequency bands, where the noise peak reduction is more pronounced. The overall average noise level reduction across all frequency bands reaches 10-12 dBV, directly verifying the device's superior effect in suppressing thermal noise and improving audio signal purity through efficient heat dissipation.
[0032] The implementation principle of this application embodiment is as follows: the heat generated during the operation of the electron tube is first efficiently transferred to the temperature equalization block 1 through the high thermal conductivity silicone sheet 5, achieving initial heat diffusion and temperature equalization; subsequently, the heat is non-destructively introduced into the flat heat pipe 2 through the interface of the nano thermally conductive coating 4, and the heat energy is rapidly conducted to the outer heat dissipation fins 3 by relying on its internal capillary structure and the phase change cycle (evaporation-endothermic → condensation-exothermic) of the working fluid; finally, the heat is dissipated into the air by the fins through natural convection. This continuous and efficient thermal management path systematically reduces the operating temperature of the electron tube, suppresses thermal noise and current scattering, thereby significantly improving the signal-to-noise ratio and overall sound quality of the amplifier while maintaining circuit purity.
[0033] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A vacuum tube noise reduction and thermal control device, characterized in that, The amplifier includes a heat spreader (1), a flat heat pipe (2), and heat dissipation fins (3). The heat spreader (1) and the electron tube are both installed in the body of the power amplifier. The heat spreader (1) has a through hole (11) for installing the electron tube. The electron tube is installed in the hole (11). The heat dissipation fins (3) are fixedly installed on one side of the power amplifier body. The flat heat pipe (2) is connected between the heat spreader (1) and the heat dissipation fins (3).
2. The vacuum tube noise reduction and thermal control device according to claim 1, characterized in that, The flat heat pipe (2) is attached to the side wall of the heat exchange block (1) at one end near the heat exchange block (1). The side of the heat exchange block (1) that is attached to the flat heat pipe (2) is provided with a nano thermally conductive coating (4). The nano thermally conductive coating (4) is made of a composite material of metal oxide and graphene.
3. The vacuum tube noise reduction and thermal control device according to claim 1, characterized in that, A high thermal conductivity silicone sheet (5) is provided between the inner wall of the mounting hole (11) of the temperature equalization block (1) and the electron tube.
4. The vacuum tube noise reduction and thermal control device according to claim 3, characterized in that, The temperature equalization block (1) is made of high thermal conductivity aluminum or copper material.
5. The vacuum tube noise reduction and thermal control device according to claim 2, characterized in that, The flat heat pipe (2) is equipped with a capillary structure and a heat-conducting liquid inside.
6. The vacuum tube noise reduction and thermal control device according to claim 5, characterized in that, The flat heat pipe (2) is a phase change heat pipe commonly used for cooling computer CPUs.