Server with liquid cold plate

Abstract

The application discloses a server with a liquid cooling plate, comprising a cabinet, the cabinet has a containing groove, in the direction from the front window to the rear window of the cabinet, at least two adjacent containing areas in the containing groove are respectively used for containing a first module and a second module, and the second module is located downstream of the first module, and the heat generated by the first module is greater than that generated by the second module; the liquid cooling plate of the server is located at least between the first module and the second module, and the liquid cooling plate has a heat exchange area and an avoidance area. The application at least solves the problem that in the related art, the upstream power consumption of the server is large, a large amount of heat is generated, the inlet air temperature of the downstream is large, the device at the downstream area cannot work in a normal temperature environment, the device fails, and even the server cannot work normally.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and more particularly to a server with a liquid cooling plate. Background Technology

[0002] Server heat dissipation has always been a key aspect of design and technology optimization. With the increasing power consumption of electronic components, heat dissipation methods in related technologies usually involve increasing the number of fans or increasing airflow speed to achieve the purpose of heat dissipation. However, the above-mentioned heat dissipation methods are difficult to effectively dissipate heat from areas where heat accumulates inside the server.

[0003] The aforementioned heat accumulation is mainly due to the excessive power consumption of upstream devices, leading to severe preheating in downstream areas. This results in excessively high intake air temperatures in downstream areas, further causing excessively high operating temperatures for downstream devices, especially sensitive devices located downstream of the heat source, such as power supply units (PSUs), hard drives (HDDs), and rear PCIe cards. These devices have strict requirements for operating temperature; excessively high temperatures will not only severely affect the performance of these devices but also shorten their lifespan and even cause them to malfunction, preventing the server from operating normally. These problems cannot be solved simply by adding or optimizing heat sinks, nor can they be improved by increasing airflow. Utility Model Content

[0004] This application provides a server with a liquid cooling plate to at least solve the problem in the related art where the upstream power consumption of the server is large and generates a lot of heat, resulting in a large downstream air inlet temperature, which causes the downstream devices to fail to work in a normal temperature environment, or even causes the server to fail to operate normally.

[0005] This application provides a server with a liquid cooling plate, including a chassis with a receiving slot. The receiving slot has multiple receiving areas along the direction from the front window to the rear window of the chassis. At least two adjacent receiving areas are used to receive a first module and a second module, respectively, with the second module located downstream of the first module. The heat generated by the first module is greater than the heat generated by the second module. The server also includes a liquid cooling plate, which is located at least between the first and second modules and connected to the chassis. The liquid cooling plate has a heat exchange area and a clearance area. The heat exchange area is used for heat exchange with the airflow flowing through the liquid cooling plate, and the airflow after heat exchange flows through the clearance area into the receiving area containing the second module to reduce the operating ambient temperature of the second module.

[0006] In one exemplary embodiment, there are at least two liquid cooling plates, which are connected in series and parallel to each other, and are spaced apart between the first module and the second module along the direction from the front window to the rear window of the chassis.

[0007] In an exemplary embodiment, the liquid cooling plate includes a hollow shell with a liquid cooling channel and an inlet and an outlet communicating with the liquid cooling channel. The hollow shell also has multiple clearance holes that penetrate both sides of the hollow shell in the thickness direction and are spaced apart in the length and width directions of the hollow shell to form clearance areas. The clearance holes are not connected to the liquid cooling channel, allowing the liquid cooling channel to extend along the outer periphery of the hollow shell to form a heat exchange area.

[0008] In one exemplary embodiment, the cross-sectional shapes of the multiple bypass through holes are all the same; or, at least two of the cross-sectional shapes of the multiple bypass through holes are different; or, the cross-sectional areas of the multiple bypass through holes are all the same; or, at least two of the cross-sectional areas of the multiple bypass through holes are different.

[0009] In one exemplary embodiment, the inlet and outlet are located on the same side of the hollow shell along its length.

[0010] In an exemplary embodiment, the liquid cooling plate further includes heat dissipation fins, which are disposed on at least one side surface of the hollow shell in the thickness direction and are disposed to avoid the through holes; wherein there are multiple heat dissipation fins, and the heights of the multiple heat dissipation fins are not the same; and the height of each heat dissipation fin is in the range of 0.3 to 2 mm.

[0011] In an exemplary embodiment, the plurality of accommodating regions include at least a first accommodating region and a second accommodating region, with the second accommodating region located downstream of the first accommodating region; the first module includes at least a central processing unit, and the second module includes at least a power supply module; wherein the first accommodating region is used to accommodate the central processing unit at least, the second accommodating region is used to accommodate the power supply module at least, and the liquid cooling plate is located between the central processing unit and the power supply module.

[0012] In an exemplary embodiment, the second accommodating region has a first sub-region and a second sub-region connected in the width direction of the chassis; the plurality of accommodating regions include at least the first accommodating region and the second accommodating region, and the second accommodating region is located downstream of the first accommodating region; the first module includes at least two central processing units (CPUs), and the second module includes at least a power supply module and a rear hard disk module; the first accommodating region is at least used to accommodate the CPUs, and the rear hard disk module and the power supply module are located in the first sub-region and the second sub-region, respectively; wherein, at least one liquid cooling plate is disposed between the first CPU and the power supply module, and at least one liquid cooling plate is disposed between the second CPU and the rear hard disk module; or, a liquid cooling plate is disposed between the rear hard disk module, the power supply module and the two CPUs.

[0013] In an exemplary embodiment, the liquid cooling plate includes a hollow shell, an inlet pipe, and an outlet pipe. The hollow shell has a liquid cooling channel and an inlet and an outlet communicating with the liquid cooling channel. A first end of the inlet pipe is connected to the inlet, and a second end of the inlet pipe is connected to an external coolant storage area. A first end of the outlet pipe is connected to the outlet, and a second end of the outlet pipe is connected to an external coolant heat exchange area. At least a portion of the inlet pipe and at least a portion of the outlet pipe are arranged side by side between a first sub-region and a second sub-region.

[0014] In an exemplary embodiment, the server further includes a control module, a first temperature sensor, a second temperature sensor, and a third temperature sensor. The first temperature sensor is disposed in a receiving area in front of the liquid cooling plate to acquire a first temperature value 'a' in the receiving area in front of the liquid cooling plate. The second temperature sensor is disposed on the liquid cooling plate to acquire a second temperature value 'b' of the liquid cooling plate. The third temperature sensor is disposed in a receiving area behind the liquid cooling plate to acquire a third temperature value 'c' in the receiving area behind the liquid cooling plate. The first, second, and third temperature sensors are all signal-connected to the control module. The control module is controllably connected to the liquid inlet valve of the liquid cooling plate to control the opening and closing of the liquid inlet valve according to the first temperature value 'a', the second temperature value 'b', and the third temperature value 'c'.

[0015] This application provides a server with a liquid cooling plate, including a chassis with a receiving slot. The receiving slot has multiple receiving areas along a direction from the front window to the rear window of the chassis. At least two adjacent receiving areas are used to receive a first module and a second module, respectively, with the second module located downstream of the first module. The heat generated by the first module is greater than the heat generated by the second module. The server also includes a liquid cooling plate, located at least between the first and second modules and connected to the chassis. The liquid cooling plate has a heat exchange area and a clearance area. The heat exchange area is used for heat exchange with the airflow flowing through the liquid cooling plate, and the airflow after heat exchange flows through the clearance area into the receiving area containing the second module to reduce the operating ambient temperature of the second module.

[0016] By setting the liquid cooling plate at least between the first module and the second module and connecting it to the chassis, and by having a heat exchange area and a clearance area, the liquid cooling plate is used to exchange heat with the airflow flowing through the liquid cooling plate, and the airflow after heat exchange is used to flow into the housing area containing the second module through the clearance area, so as to reduce the working environment temperature of the second module and thus ensure the operational reliability of the second module.

[0017] This application introduces a liquid cooling plate between the heat source and the sensitive device, which not only effectively reduces the preheating phenomenon of airflow, but also optimizes the thermal management of the entire server. Compared with related technologies that dissipate heat by increasing airflow or insulation, this application achieves more precise temperature control and more efficient heat exchange without significantly increasing the overall complexity and cost of the server.

[0018] Furthermore, the liquid cooling plate utilizes the circulating flow of coolant to absorb heat from the airflow and remove it through the coolant, thereby reducing the airflow temperature and minimizing the preheating effect. In terms of effectiveness, the technology in this application significantly reduces the inlet air temperature of downstream components, effectively improving the heat dissipation performance of the second module for temperature-sensitive components, reducing the risk of overheating, and enhancing the operational stability and efficiency of the server. In other embodiments, the heat exchange efficiency can be further optimized by adjusting the material, thickness, and type of coolant of the liquid cooling plate, addressing heat dissipation challenges in specific environments. Attached Figure Description

[0019] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the internal layout of a server chassis provided for an embodiment of this application;

[0021] Figure 2 This is a schematic diagram of the liquid cooling plate of the server provided in Embodiment 1 of this application;

[0022] Figure 3 This is a schematic diagram of the liquid cooling plate of the server provided in Embodiment 2 of this application;

[0023] Figure 4 This is a schematic diagram of the liquid cooling plate of the server provided in Embodiment 3 of this application;

[0024] Figure 5 This is a schematic diagram of the liquid cooling plate of the server provided in Embodiment 4 of this application;

[0025] Figure 6 This is a schematic diagram of the control flow of the server control module provided in an embodiment of this application.

[0026] The above figures include the following reference numerals:

[0027] 10. Chassis; 11. Receiving slot; 111. Receiving area; 1111. First receiving area; 1112. Second receiving area;

[0028] 20. First module; 21. Central processing unit;

[0029] 30. Second module; 31. Power supply module; 32. Rear hard drive module;

[0030] 40. Liquid cooling plate; 41. Hollow shell; 411. Liquid inlet; 412. Liquid outlet; 413. Clearance hole; 42. Heat dissipation fins; 43. Liquid inlet pipe; 44. Liquid outlet pipe;

[0031] 50. Front hard drive module; 60. Fan module. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0033] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] The embodiments of this application provide a server with a liquid cooling plate. The device is described in detail in conjunction with the structure and working principle of the server with the liquid cooling plate (the technical terms involved must be explained).

[0036] like Figures 1 to 6As shown, the server with a liquid cooling plate includes a chassis 10, which has a receiving slot 11. In the direction from the front window to the rear window of the chassis 10, the receiving slot 11 has multiple receiving areas 111. At least two adjacent receiving areas 111 are used to receive a first module 20 and a second module 30, respectively. The second module 30 is located downstream of the first module 20, and the heat generated by the first module 20 is greater than the heat generated by the second module 30. The server also includes a liquid cooling plate 40, which is located at least between the first module 20 and the second module 30 and connected to the chassis 10. The liquid cooling plate 40 has a heat exchange area and a clearance area. The heat exchange area is used to exchange heat with the airflow flowing through the liquid cooling plate 40, and the airflow after heat exchange flows through the clearance area into the receiving area 111 containing the second module 30 to reduce the operating temperature of the second module 30.

[0037] By configuring the liquid cooling plate 40 to be located at least between the first module 20 and the second module 30 and connected to the chassis 10, and by having a heat exchange area and a clearance area, the liquid cooling plate 40 is configured to exchange heat with the airflow flowing through the liquid cooling plate 40, and the airflow after heat exchange flows into the accommodating area 111 containing the second module 30 through the clearance area, so as to reduce the operating environment temperature of the second module 30 and thus ensure the operational reliability of the second module 30.

[0038] This application introduces a liquid cooling plate 40 between the first heat source module 20 and the second sensitive device module 30, which not only effectively reduces the preheating phenomenon of airflow, but also optimizes the thermal management of the entire server. Compared with related technologies that dissipate heat by increasing airflow or insulation, this application achieves more precise temperature control and more efficient heat exchange without significantly increasing the overall complexity and cost of the server.

[0039] Furthermore, the liquid cooling plate 40 utilizes the circulating flow of coolant to absorb heat from the airflow and remove it through the coolant, thereby reducing the airflow temperature and minimizing the preheating effect. In terms of effectiveness, the technology in this application significantly reduces the inlet air temperature of downstream components, effectively improving the heat dissipation performance of the second module 30 for temperature-sensitive components, reducing the risk of overheating, and enhancing the operational stability and efficiency of the server. In other embodiments, the heat exchange efficiency can be further optimized by adjusting the material, thickness, and type of coolant of the liquid cooling plate 40 to address heat dissipation challenges in specific environments.

[0040] It should be noted that in this application, there are at least two liquid cooling plates 40, which are connected in series and parallel to each other. These two liquid cooling plates 40 are spaced apart between the first module 20 and the second module 30 along the direction from the front window to the rear window of the chassis 10. This allows the number of liquid cooling plates 40 to be flexibly adjusted according to the heat distribution and space constraints inside the server. The combined use of at least two liquid cooling plates 40 can more effectively cover the preheating area and enhance heat exchange capacity. Increasing the number of liquid cooling plates 40 can provide a larger heat exchange area, thereby improving cooling efficiency. The technology in this application can significantly reduce airflow temperature and improve the thermal management of the server by increasing the number of liquid cooling plates 40 according to specific heat dissipation requirements. In other embodiments, the number of liquid cooling plates 40 can be rationally configured by accurately calculating the heat load and airflow path to solve heat dissipation problems in complex systems.

[0041] like Figures 2 to 5 As shown, the liquid cooling plate 40 includes a hollow shell 41, which has a liquid cooling channel and an inlet 411 and an outlet 412 communicating with the liquid cooling channel. The hollow shell 41 is also provided with a plurality of clearance through holes 413, which penetrate both sides of the hollow shell 41 in the thickness direction. The plurality of clearance through holes 413 are spaced apart in the length and width directions of the hollow shell 41 to form a clearance area. The clearance through holes 413 are not communicating with the liquid cooling channel, so that the liquid cooling channel extends along the hollow shell 41 located at the outer periphery of the clearance through holes 413 to form a heat exchange area.

[0042] Furthermore, the liquid cooling plate 40 has variable opening forms and shapes. This diversity allows designers to customize the design according to actual heat dissipation requirements and airflow characteristics to achieve optimal heat exchange. Different opening designs can affect airflow distribution and speed, thus impacting heat exchange efficiency. This flexibility enables the liquid cooling plate 40 to adapt to various server architectures, improving the versatility and adaptability of the heat dissipation solution. In other embodiments, the impact of different opening designs on heat dissipation performance can be experimentally tested to select the optimal solution and address heat dissipation problems in specific scenarios.

[0043] Furthermore, the shape and number of liquid cooling plates 40 are designed to increase the heat exchange area and intensity. The shape and number of liquid cooling plates 40 directly affect their heat exchange capacity and the overall heat dissipation performance of the system. An optimized liquid cooling plate 40 design can better match the airflow path, increase the contact area between the airflow and the coolant, thereby improving heat exchange efficiency. The technology in this application effectively alleviates the preheating problem inside the server by increasing the heat exchange area and intensity, reduces the temperature of key components, and improves the overall operating efficiency and stability of the server. In other embodiments, the layout and shape of the liquid cooling plates 40 can be further optimized through simulation analysis to solve the heat dissipation bottleneck of the server in high-power mode.

[0044] It should be noted that in this application, the liquid cooling plate 40 is designed to adapt to changes in heat generation and airflow within the system. The design of the liquid cooling plate 40 must take into account both the heat distribution and airflow dynamics characteristics inside the server. Through detailed thermodynamic analysis and airflow simulation, it is ensured that the liquid cooling plate 40 can achieve optimal heat dissipation under various operating conditions. The technology in this application can effectively cope with dynamic changes in heat and airflow inside the server, maintain stable heat dissipation performance, and ensure that the server can still operate normally under high load or fluctuating ambient temperature. In other embodiments, the design parameters of the liquid cooling plate 40 can be dynamically adjusted by real-time monitoring of the heat distribution and airflow conditions inside the server to address the heat dissipation needs of the server under different operating modes.

[0045] In an embodiment not shown, the cross-sectional shapes of the multiple bypass through holes 413 are all identical.

[0046] like Figures 2 to 5 As shown, at least two of the cross-sectional shapes of the through holes 413 are inconsistent.

[0047] In one embodiment not shown, the cross-sectional areas of the multiple clearance holes 413 are all the same.

[0048] like Figures 2 to 5 As shown, at least two of the cross-sectional areas of the perforated through holes 413 are inconsistent.

[0049] like Figures 2 to 5 As shown, the liquid inlet 411 and the liquid outlet 412 are located on the same side along the length of the hollow housing 41. This helps to ensure the overall structural compactness within the housing slot 11 of the chassis 10, thereby ensuring the miniaturization design of the server.

[0050] like Figure 4In one embodiment shown, the liquid cooling plate 40 further includes a plurality of snap-fit ​​structures located on both sides of the hollow housing 41 in the width direction, for connecting the liquid cooling plate 40 to the chassis 10 via the plurality of snap-fit ​​structures.

[0051] like Figure 5 As shown, the liquid cooling plate 40 also includes heat dissipation fins 42, which are disposed on at least one surface of the hollow shell 41 in the thickness direction, and are arranged to avoid the through hole 413. There are multiple heat dissipation fins 42, and the heights of the multiple heat dissipation fins 42 are all different; the height of each heat dissipation fin 42 ranges from 0.3 to 2 mm. In this way, the arrangement of the heat dissipation fins 42 further increases the heat dissipation area.

[0052] Preferably, the height of each heat dissipation fin 42 is within the range of 1 mm. This design of the heat dissipation fin height 42 needs to consider the balance between airflow resistance and heat exchange efficiency. A 1 mm height of the heat dissipation fin 42 ensures sufficient heat exchange area without excessively obstructing airflow, ensuring smooth airflow through the liquid cooling plate 40 for efficient heat dissipation. The technology in this application can maximize heat exchange efficiency and effectively reduce airflow temperature while ensuring smooth airflow. In other embodiments, the height of the heat dissipation fin 42 can be adjusted according to actual heat dissipation requirements and airflow conditions to achieve the best heat dissipation effect.

[0053] Furthermore, the arrangement of the heat dissipation fins 42 increases the contact area between the liquid cooling plate 40 and the airflow, thereby improving the heat exchange rate. The presence of the heat dissipation fins 42 increases the heat exchange surface area between the airflow and the coolant, making it easier for heat to be transferred from the airflow to the coolant. The technology in this application effectively improves the heat dissipation performance of the liquid cooling plate 40, maintaining good cooling performance even under high power consumption environments, extending hardware lifespan, and improving system stability. In other embodiments, the heat exchange efficiency can be further optimized by changing the size, shape, and arrangement of the heat dissipation fins 42, thus solving the heat dissipation problem of high-density servers.

[0054] like Figure 1 As shown, the plurality of accommodating regions 111 include at least a first accommodating region 1111 and a second accommodating region 1112, and the second accommodating region 1112 is located downstream of the first accommodating region 1111; the first module 20 includes at least a central processing unit 21, and the second module 30 includes at least a power supply module 31; wherein, the first accommodating region 1111 is used to accommodate the central processing unit 21, the second accommodating region 1112 is used to accommodate the power supply module 31, and the liquid cooling plate 40 is located between the central processing unit 21 and the power supply module 31.

[0055] like Figure 1As shown, the second accommodating area 1112 has a first sub-area and a second sub-area that are connected in the width direction of the chassis 10; the plurality of accommodating areas 111 include at least the first accommodating area 1111 and the second accommodating area 1112, and the second accommodating area 1112 is located downstream of the first accommodating area 1111; the first module 20 includes at least two central processing units 21, and the second module 30 includes at least a power supply module 31 and a rear hard disk module 32; the first accommodating area 1111 is used to accommodate at least the central processing unit 21, and the rear hard disk module 32 and the power supply module 31 are located in the first sub-area and the second sub-area, respectively; wherein, at least one liquid cooling plate 40 is disposed between the first central processing unit 21 and the power supply module 31, and at least one liquid cooling plate 40 is disposed between the second central processing unit 21 and the rear hard disk module 32; or, a liquid cooling plate 40 is disposed between the rear hard disk module 32, the power supply module 31 and the two central processing units 21.

[0056] It should be noted that in this application, the liquid cooling plate 40 is applicable to specific types of components in front of rear-mounted components within a server system. The application of the liquid cooling plate 40 must consider the heat dissipation requirements and space constraints of the rear-mounted components. The design of the liquid cooling plate 40 matches the thermal characteristics of the rear-mounted components, ensuring that it can effectively reduce the impact of preheating. The technology in this application is particularly suitable for components sensitive to inlet air temperature, such as the power supply module 31 and the rear hard disk module 32, and can significantly improve the heat dissipation efficiency and stability of these components. In other embodiments, the liquid cooling plate 40 can also be applied to other temperature-sensitive internal server components to solve the heat dissipation problems of specific components.

[0057] Furthermore, the installation position of the liquid cooling plate 40 relative to the rear-mounted components within the server chassis optimizes the cooling effect. The installation position of the liquid cooling plate 40 requires careful consideration to ensure it can intercept preheating airflow without affecting normal airflow. Through fluid dynamics analysis, the optimal placement position of the liquid cooling plate 40 is determined, maximizing heat exchange efficiency without impacting the overall airflow of the server. The technology in this application can significantly improve the internal thermal environment of the server, reduce the temperature of rear-mounted components, and improve the server's operating efficiency and stability. In other embodiments, the cooling effect can also be optimized by adjusting the distance between the liquid cooling plate 40 and the rear-mounted components, solving the heat dissipation problems caused by the internal space layout of the server.

[0058] like Figures 1 to 5As shown, the liquid cooling plate 40 includes a hollow shell 41, an inlet pipe 43, and an outlet pipe 44. The hollow shell 41 has a liquid cooling channel and an inlet 411 and an outlet 412 communicating with the channel. The first end of the inlet pipe 43 is connected to the inlet 411, and the second end is connected to an external coolant storage area. The first end of the outlet pipe 44 is connected to the outlet 412, and the second end is connected to an external coolant heat exchange area. At least a portion of the inlet pipe 43 and at least a portion of the outlet pipe 44 are arranged side-by-side between a first sub-region and a second sub-region. This liquid circulation system design of the liquid cooling plate 40 ensures efficient coolant circulation. An efficient liquid circulation system is fundamental to the normal operation of the liquid cooling plate 40. By optimizing the layout of the inlet pipe 43 and the outlet pipe 44, the coolant flows rapidly within the liquid cooling plate 40, effectively removing heat. The technology in this application guarantees the heat dissipation performance of the liquid cooling plate 40, reduces maintenance costs, and improves the reliability and lifespan of the server. In other embodiments, a dual-circulation system can be used to more precisely control the distribution of coolant for high heat density and low heat density areas, thereby solving the problem of local overheating inside the server. In addition, by arranging at least a portion of the inlet pipe 43 and at least a portion of the outlet pipe 44 side by side between the first sub-region and the second sub-region, it is beneficial to remove the heat of the airflow between the first sub-region and the second sub-region.

[0059] It should be noted that in this application, the preheating mitigation design of the liquid cooling plate 40 includes the assessment and monitoring of the preheating degree. Accurate assessment of the preheating degree is a prerequisite for optimizing the design of the liquid cooling plate 40. By establishing a thermal model and analyzing temperature changes along the airflow path, the area with the most severe preheating is identified, guiding the placement and design of the liquid cooling plate 40. The technology in this application can specifically alleviate preheating problems, improve thermal balance within the server, and reduce the risk of localized overheating. In other embodiments, thermal imaging technology can also be introduced to visually display the temperature distribution inside the server, helping designers to more accurately locate preheating problems and solve thermal management challenges in complex systems.

[0060] like Figure 1 As shown, the server also includes a front hard disk module 50 and a fan module 60.

[0061] In one embodiment of this application (not shown), the server further includes a control module, a first temperature sensor, a second temperature sensor, and a third temperature sensor. The first temperature sensor is located in the receiving area 111 in front of the liquid cooling plate 40 to acquire a first temperature value 'a' within the receiving area 111 in front of the liquid cooling plate 40. The second temperature sensor is located on the liquid cooling plate 40 to acquire a second temperature value 'b' of the liquid cooling plate 40. The third temperature sensor is located in the receiving area 111 behind the liquid cooling plate 40 to acquire a third temperature value 'c' within the receiving area 111 behind the liquid cooling plate 40. The first, second, and third temperature sensors are all signal-connected to the control module. The control module is controllably connected to the inlet valve of the liquid inlet 411 of the liquid cooling plate 40 to control the opening and closing of the inlet valve based on the first temperature value 'a', the second temperature value 'b', and the third temperature value 'c'. Thus, by placing different first, second, and third temperature sensors at key locations, the temperature values ​​at these key locations can be read. Precise deployment of temperature sensors is fundamental to intelligent thermal management. Temperature sensors can monitor real-time temperature changes within the server, providing decision-making support for the control module. The technology in this application enables timely feedback of internal server temperature information, allowing the control module to respond quickly, adjust cooling strategies, and ensure the server operates within a safe temperature range. In other embodiments, wireless temperature sensors can also be used, reducing wiring complexity and addressing the challenge of limited internal server space.

[0062] Furthermore, the details of the control module's logical calculations involve the processing of temperature sensor data. The BMC's logical calculation capabilities determine the accuracy and response speed of its thermal management. By analyzing the temperature sensor data, the control module identifies areas of abnormal temperature and calculates corresponding coolant flow adjustment strategies. The technology in this application can accurately determine the internal thermal condition of the server, intelligently adjust the cooling system, and avoid overheating and resource waste. In other embodiments, AI algorithms can also be introduced, enabling the control module to predict future temperature trends and take proactive measures to address the server's heat dissipation problems under high loads.

[0063] It should be noted that, in this application, if Figure 6 As shown, the following two formulas are used to determine the flow rate: ab > x, cb > y, where x represents the first preset value and y represents the second preset value. When either of these conditions is met, the water flow rate is increased by one level. If the above conditions are still met after five minutes, the water flow rate continues to increase; otherwise (if neither condition is met), the water flow rate is decreased. There are also upper and lower limits for the water flow rate, i.e., the maximum value to which the water flow rate is increased and the minimum value to which it is decreased.

[0064] Furthermore, the control module controls the coolant flow rate based on the read temperature values ​​at key locations and logical calculations. By monitoring the temperature values ​​at key locations in real time and dynamically adjusting the coolant flow rate, the control module achieves intelligent thermal management. Based on the first temperature value 'a', second temperature value 'b', and third temperature value 'c' obtained from the first, second, and third temperature sensors respectively, the control module calculates the required coolant flow rate using a built-in logical algorithm to adapt to changes in the server's internal temperature. The technology in this application can automatically respond to fluctuations in the server's internal temperature and precisely control the coolant supply, ensuring both heat dissipation efficiency and avoiding resource waste. In other embodiments, machine learning algorithms can be introduced to allow the control module to predict future temperature trends and adjust cooling strategies in advance, solving heat dissipation problems under sudden high load conditions.

[0065] In one exemplary embodiment, the control module can decide whether to turn on or increase the coolant supply. The control module not only controls the coolant flow rate but also intelligently decides whether to turn the cooling system on or off based on the actual operating status of the server. When the temperature is detected to exceed the safe range, the control module automatically starts or increases the coolant supply; conversely, it reduces or shuts it off to maintain the internal temperature of the server within the ideal range. The technology in this application achieves automated management of the cooling system, improving the server's operating efficiency and reliability. In other embodiments, temperature thresholds and early warning mechanisms can be set to allow the control module to take preventative measures when the temperature is about to exceed the limit, avoiding overheating risks and solving the server's heat dissipation problems in extreme environments.

[0066] It should be noted that in this application, the control module is the BMC control unit, that is, the technical term is Baseboard Manager Controller (BMC).

[0067] It should be noted that in this application, the liquid cooling plate 40 is detachably connected to the chassis 10. This ensures the ease of installation and removal of the liquid cooling plate 40.

[0068] It should be noted that in this application, the liquid cooling plate 40 is installed between the first module 20 and the second module 30. Installing the liquid cooling plate 40 between the first module 20 and the second module 30 allows for direct preheating and heat relief for two temperature-sensitive components (rear hard drive module 32 and power supply module 31) of the second module 30. The liquid cooling plate 40 absorbs heat from the hot airflow transmitted from the first module 20 upstream of the central processing unit 21, reducing the airflow temperature reaching the rear hard drive module 32 and power supply module 31. The technology in this application can significantly reduce the inlet air temperature of the rear hard drive module 32 and power supply module 31, improving their heat dissipation performance, extending hardware lifespan, and enhancing the server's operational reliability and efficiency. In other embodiments, the optimal installation position of the liquid cooling plate 40 between the first module 20 and the second module 30 can be determined through experimental verification to solve the heat dissipation problem in high-heat-density areas inside the server.

[0069] The technical solution of this application relates to the working process. Specifically, during operation, the server system generates a large amount of heat, especially near high-power components such as the CPU. Hot air flows backward along the airflow path, preheating downstream components such as the power supply module 31 and the rear hard drive module 32. At this time, the preheating mitigation design of the liquid cooling plate 40 comes into play. The liquid cooling plate 40 exchanges heat with the airflow through its internal coolant, absorbing heat from the airflow and reducing its temperature. Simultaneously, the control module monitors the temperature values ​​at key locations in real time and intelligently adjusts the coolant flow rate through logical calculations, ensuring that the heat dissipation effect of the liquid cooling plate 40 is always at its optimal state. The entire working process demonstrates the synergistic effect of the liquid cooling plate 40 and the control module, realizing intelligent and efficient internal thermal management of the server, effectively solving the preheating problem, and ensuring the stable operation of the server.

[0070] The above provides a detailed description of a server with a liquid-cooled plate provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A server with a liquid-cooled plate, characterized in that, include: The chassis (10) has a receiving slot (11) in the direction from the front window to the rear window of the chassis (10), and the receiving slot (11) has a plurality of receiving areas (111). At least two adjacent accommodating regions (111) of the plurality of accommodating regions (111) are respectively used to accommodate the first module (20) and the second module (30), and the second module (30) is located downstream of the first module (20), and the heat generated by the first module (20) is greater than the heat generated by the second module (30); The server also includes: A liquid cooling plate (40) is located at least between the first module (20) and the second module (30) and connected to the chassis (10). The liquid cooling plate (40) has a heat exchange area and a clearance area. The heat exchange area is used to exchange heat with the airflow flowing through the liquid cooling plate (40), and the airflow after heat exchange is used to flow into the accommodating area (111) with the second module (30) through the avoidance area, so as to reduce the working environment temperature of the second module (30).

2. The server according to claim 1, characterized in that, There are at least two liquid cooling plates (40), which are connected in series and parallel to each other. The liquid cooling plates (40) are spaced apart between the first module (20) and the second module (30) along the direction from the front window to the rear window of the chassis (10).

3. The server according to claim 1, characterized in that, The liquid cooling plate (40) includes: Hollow shell (41), the hollow shell (41) has a liquid cooling channel and a liquid inlet (411) and a liquid outlet (412) communicating with the liquid cooling channel. The hollow shell (41) is also provided with a plurality of clearance through holes (413), which penetrate both sides of the hollow shell (41) in the thickness direction, and the plurality of clearance through holes (413) are spaced apart in the length and width directions of the hollow shell (41) to form the clearance area; The clearance through hole (413) is not connected to the liquid cooling channel, so that the liquid cooling channel extends along the hollow shell (41) located on the outer periphery of the clearance through hole (413) to form the heat exchange area.

4. The server according to claim 3, characterized in that, The cross-sectional shapes of the multiple clearance through holes (413) are all identical; or, At least two of the cross-sectional shapes of the clearance through holes (413) are inconsistent; or, The cross-sectional areas of the multiple clearance through holes (413) are all the same; or, At least two of the cross-sectional areas of the clearance through holes (413) are inconsistent.

5. The server according to claim 3, characterized in that, The inlet (411) and the outlet (412) are located on the same side of the length direction of the hollow shell (41).

6. The server according to claim 3, characterized in that, The liquid cooling plate (40) also includes: Heat dissipation fins (42) are disposed on at least one side surface of the hollow shell (41) in the thickness direction, and the heat dissipation fins (42) are disposed away from the clearance through hole (413). There are multiple heat dissipation fins (42), and the heights of the multiple heat dissipation fins (42) are not the same; The height of each heat dissipation fin (42) ranges from 0.3 to 2 mm.

7. The server according to claim 6, characterized in that, The plurality of accommodating regions (111) include at least a first accommodating region (1111) and a second accommodating region (1112), and the second accommodating region (1112) is located downstream of the first accommodating region (1111); The first module (20) includes at least a central processing unit (21), and the second module (30) includes at least a power supply module (31). The first accommodating area (1111) is used to accommodate the central processing unit (21) at least, the second accommodating area (1112) is used to accommodate the power supply module (31) at least, and the liquid cooling plate (40) is located between the central processing unit (21) and the power supply module (31).

8. The server according to claim 7, characterized in that, The second accommodating area (1112) has a first sub-region and a second sub-region that are connected in the width direction of the chassis (10); The first module (20) includes at least two central processing units (21), and the second module (30) includes at least a power supply module (31) and a rear hard disk module (32). The first accommodating area (1111) is at least used to accommodate the central processing unit (21), and the rear hard disk module (32) and the power module (31) are located in the first sub-area and the second sub-area, respectively; Wherein, at least one liquid cooling plate (40) is disposed between the first central processing unit (21) and the power supply module (31), and at least one liquid cooling plate (40) is disposed between the second central processing unit (21) and the rear hard disk module (32); or, A liquid cooling plate (40) is provided between the rear hard disk module (32), the power supply module (31) and the two central processing units (21).

9. The server according to claim 8, characterized in that, The liquid cooling plate (40) includes: The liquid inlet pipe (43) and the liquid outlet pipe (44) are connected. The first end of the liquid inlet pipe (43) is connected to the liquid inlet (411), and the second end of the liquid inlet pipe (43) is connected to the external coolant storage area. The first end of the liquid outlet pipe (44) is connected to the liquid outlet (412), and the second end of the liquid outlet pipe (44) is connected to the external coolant heat exchange area. At least a portion of the inlet pipe (43) and at least a portion of the outlet pipe (44) are arranged side by side between the first sub-region and the second sub-region.

10. The server according to any one of claims 1 to 6, characterized in that, The server also includes: Control module; A first temperature sensor is disposed in a receiving area (111) in front of the liquid cooling plate (40) to obtain a first temperature value a in the receiving area (111) in front of the liquid cooling plate (40). A second temperature sensor is disposed on the liquid cooling plate (40) for obtaining a second temperature value b of the liquid cooling plate (40); A third temperature sensor is disposed in the receiving area (111) behind the liquid cooling plate (40) to obtain a third temperature value c in the receiving area (111) behind the liquid cooling plate (40). The first temperature sensor, the second temperature sensor, and the third temperature sensor are all signal-connected to the control module. The control module is connected to the inlet valve of the liquid inlet (411) of the liquid cooling plate (40) for controlling the opening and closing of the inlet valve according to the first temperature value a, the second temperature value b, and the third temperature value c.

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