Clamping structure and computer equipment

Abstract

The utility model discloses a clamping structure and computer equipment, clamping structure includes apron, heat dissipation subassembly and heat pipe, apron is located on the upper end surface of CPU mainboard of immersion type liquid cooling system, and the space between CPU mainboard and the lower end surface of apron is used to accommodate and clamp the CPU chip corresponding to different CPU platform, all structures or partial structure of heat dissipation subassembly are located on the upper end surface of apron, heat pipe is located in one side of heat dissipation subassembly and is connected with heat dissipation subassembly, computer equipment includes aforementioned clamping structure, and CPU chip is clamped in clamping structure, apron, heat dissipation subassembly and heat pipe are all immersed in the cooling liquid when being in the cooling liquid of immersion type liquid cooling system under liquid cooling environment. The apron in the clamping structure in the embodiment of the utility model not only can assist different platform fastener clamping and fixed CPU chip in liquid cooling system, but also can expand the contact heat dissipation area and realize better heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the technical field of immersion liquid cooling systems, specifically to clamping structures and computer equipment. Background Technology

[0002] With the rapid development of the internet and information technology, computers and servers have become indispensable. Moreover, servers are being updated and iterated at an increasingly rapid pace, leading to ever-increasing demands on their heat dissipation, making liquid cooling the mainstream solution. Immersion liquid cooling involves submerging the entire server in liquid, requiring a change in the CPU (Central Processing Unit) cooling method. CPU coolers previously used in air cooling systems also need to be updated to suit the environment. Air cooling CPU coolers, which are directly fixed in place, not only have poor heat dissipation performance but also come in a wide variety of types and occupy significant space.

[0003] Therefore, it is particularly important to design a tool that can assist in clamping the CPU in an immersion liquid cooling environment and effectively exert heat dissipation capabilities in an immersion environment. Utility Model Content

[0004] This utility model provides a clamping structure and computer equipment, aiming to solve the problem that in the prior art, computer equipment uses air-cooled heat sinks to directly fix the CPU chip, which not only has poor heat dissipation effect, but is also not suitable for auxiliary fasteners to clamp the CPU chip in an immersion liquid cooling environment.

[0005] In a first aspect, this utility model proposes a clamping structure for use in an immersion liquid cooling system, comprising a cover plate, a heat dissipation assembly, and a heat pipe; the cover plate is disposed on the upper end face of the CPU motherboard of the immersion liquid cooling system, and the space between the CPU motherboard and the lower end face of the cover plate is used to accommodate and clamp CPU chips corresponding to different CPU platforms; all or part of the structure of the heat dissipation assembly is disposed on the upper end face of the cover plate; the heat pipe is disposed on one side of the heat dissipation assembly and connected to the heat dissipation assembly; the cover plate, the heat dissipation assembly, and the heat pipe are all immersed in the coolant in the liquid cooling environment of the immersion liquid cooling system.

[0006] Furthermore, the heat dissipation assembly includes a first fin and a second fin, the first fin being disposed on the upper end face of the cover plate, and the second fin being located on one side of the cover plate and connected to the first fin through the heat pipe.

[0007] Furthermore, the CPU motherboard includes an upper motherboard and a base plate; the studs on the base plate pass through the upper motherboard and the cover plate in sequence and are screwed to the fixing nut to connect the CPU motherboard and the cover plate.

[0008] Furthermore, the upper motherboard is snapped onto the cover plate via a first snap-fit ​​structure.

[0009] Furthermore, the heat dissipation assembly includes a water chamber structure and a water chamber cover plate, the water chamber cover plate is disposed on the upper end face of the cover plate, and the space between the water chamber cover plate and the cover plate is provided with the water chamber structure; wherein, the water chamber structure is provided with a third fin.

[0010] Furthermore, the heat pipe is disposed on the cover plate and connected to the third fin within the water chamber structure, and the cover plate is screwed onto the CPU motherboard.

[0011] Furthermore, the heat dissipation component is a heat dissipation fin, and the heat pipe is provided on the side wall of the heat dissipation component.

[0012] Furthermore, the outer edge of the cover plate is provided with a plurality of second snap-fit ​​structures, and the plurality of second snap-fit ​​structures are snapped onto the CPU motherboard.

[0013] Furthermore, the cover plate is screwed onto the CPU motherboard via multiple connecting nuts.

[0014] Secondly, this utility model proposes a computer device, including a clamping structure as described in the first aspect and any of its embodiments, wherein a CPU chip is clamped to the clamping structure.

[0015] Compared with existing technologies, this utility model provides a clamping structure and a computer device. The clamping structure includes a cover plate, a heat dissipation assembly, and a heat pipe. The cover plate is located on the upper surface of the CPU motherboard in the immersion liquid cooling system, and the space between the CPU motherboard and the lower surface of the cover plate is used to accommodate and clamp CPU chips corresponding to different CPU platforms. All or part of the structure of the heat dissipation assembly is located on the upper surface of the cover plate. The heat pipe is located on one side of the heat dissipation assembly and connected to the heat dissipation assembly. The computer device includes the aforementioned clamping structure, and the CPU chip is clamped in the clamping structure. The cover plate, heat dissipation assembly, and heat pipe are all immersed in the coolant in the immersion liquid cooling system. In the embodiments of this utility model, the cover plate in the clamping structure not only assists in clamping and fixing the CPU chip with different platform fasteners in the liquid cooling system, but also expands the contact heat dissipation area and achieves better heat dissipation effect. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic structural diagram of the first embodiment of the clamping structure provided by this utility model;

[0018] Figure 2 An exploded schematic structural diagram of the first embodiment of the clamping structure provided by this utility model;

[0019] Figure 3 A schematic structural diagram of a second embodiment of the clamping structure provided by this utility model;

[0020] Figure 4 A partially exploded schematic structural diagram of the second embodiment of the clamping structure provided by this utility model;

[0021] Figure 5 An exploded schematic structural diagram of the second embodiment of the clamping structure provided by this utility model;

[0022] Figure 6 A schematic structural diagram of a third embodiment of the clamping structure provided by this utility model;

[0023] Figure 7 This is an exploded schematic structural diagram of the third embodiment of the clamping structure provided by this utility model.

[0024] Explanation of reference numerals in the attached figures:

[0025] In the diagram: 10, CPU motherboard; 11A, upper motherboard; 11A1, first snap-fit ​​structure; 12A, base plate; 20, cover plate; 21, second snap-fit ​​structure; 22, connecting nut; 30, heat dissipation assembly; 31A, first fin; 31B, water chamber structure; 32A, second fin; 32B, water chamber cover plate; 40, heat pipe; 50, fixing nut; 100, CPU chip. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] The directional terms used in this invention, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are merely for reference to the accompanying drawings. Therefore, the directional terms used are for explanation and understanding of this invention, and not for limiting it. Furthermore, in the accompanying drawings, structures that are similar or identical are indicated by the same reference numerals.

[0028] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0029] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0030] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0031] Please see Figure 1 , Figure 1 This is a schematic structural diagram of a first embodiment of the clamping structure provided by this utility model. Figure 1 As shown, the clamping structure provided in this embodiment of the present invention includes: a cover plate 20, a heat dissipation assembly 30, and a heat pipe 40; the cover plate 20 is disposed on the upper end surface of the CPU motherboard 10 of the immersion liquid cooling system, and the space between the CPU motherboard 10 and the lower end surface of the cover plate 20 is used to accommodate and clamp CPU chips 100 corresponding to different CPU platforms; all or part of the structure of the heat dissipation assembly 30 is disposed on the upper end surface of the cover plate 20; the heat pipe 40 is disposed on one side of the heat dissipation assembly 30 and connected to the heat dissipation assembly 30; when the immersion liquid cooling system is in the coolant under liquid cooling environment, the cover plate, the heat dissipation assembly, and the heat pipe are all immersed in the coolant.

[0032] In this embodiment, to assist in clamping CPU chips 100 corresponding to different CPU platforms (such as Intel, AMD, and Hygon platforms) in the liquid cooling system using this clamping structure, and to effectively exert heat dissipation capabilities in an immersion environment, the CPU chip 100 can first be mounted on the upper surface of the CPU motherboard 10. Then, a cover plate with a heat dissipation component 30 already provided on the upper surface is connected to the CPU motherboard 10, so that the space between the CPU motherboard 10 and the lower surface of the cover plate 20 can accommodate and clamp the CPU chip 100. Because the heat dissipation component 30 is also provided on the cover plate 20 and is connected to the heat dissipation component 30, when the entire clamping device clamps the CPU chip 100 and immerses it in the liquid cooling environment, it can not only assist the clamping and fixing of the CPU chip with different platform fasteners, but also expand the contact heat dissipation area and achieve better heat dissipation effect.

[0033] In one embodiment, such as Figure 1 and Figure 2 As shown, in a first embodiment of the clamping structure, the heat dissipation assembly 30 includes a first fin 31A and a second fin 32A. The first fin 31A is disposed on the upper end surface of the cover plate 20, and the second fin 32A is located on one side of the cover plate 20 and is connected to the first fin 31A through the heat pipe 40.

[0034] In this embodiment, when a heat dissipation assembly with the above structure is used (i.e., the first embodiment of the heat dissipation assembly), the first fin 31A, being directly disposed on the upper surface of the cover plate 20, can first dissipate heat from the CPU chip 100 through it. When the coolant in the liquid cooling system undergoes a phase change, the heat pipe 40 can conduct some of the heat to the second fin 32A, which serves as a heat dissipation enhancement structure, to further enhance heat dissipation.

[0035] In one embodiment, such as Figure 1 and Figure 2 As shown, the CPU motherboard 10 includes an upper motherboard 11A and a base plate 12A; the studs on the base plate 12A pass through the upper motherboard 11A and the cover plate 20 in sequence and are screwed to the fixing nut 50 to connect the CPU motherboard 10 and the cover plate 20.

[0036] In this embodiment, when the CPU motherboard 10 is configured as described above, the upper motherboard 11A is used to fix and mount the CPU chip 100 (such as a CPU chip of the first type platform, more specifically, a CPU chip of the Intel platform), and the base plate 12A can serve as a connector connecting the upper motherboard 11A and the cover plate 20. When the studs on the base plate 12A located below the upper motherboard 11A pass through the upper motherboard 11A and the cover plate 20 in sequence and are screwed to the fixing nut 50 located above the cover plate 20, the upper motherboard 11A and the cover plate 20 can be stably fixed. Moreover, the fasteners in the liquid cooling system can be connected to the base plate 12A through snap-fit, so as to more effectively fix the CPU chip, ensure its stable operation, and provide strong protection for the normal operation of computer equipment (such as servers) using this clamping structure in a liquid cooling environment.

[0037] In one embodiment, such as Figure 1 and Figure 2 As shown, the upper motherboard 11A is snapped onto the cover plate 20 via the first snap-fit ​​structure 11A1.

[0038] In this embodiment, in order to achieve a more stable connection between the upper motherboard 11A and the cover plate 20, a first snap-fit ​​structure 11A1 can be provided on the upper motherboard 11A, and a snap-hook fixing groove adapted to the first snap-fit ​​structure 11A1 can be provided on the cover plate 20. When the upper motherboard 11A is snapped into the snap-hook fixing groove on the cover plate 20 through the first snap-fit ​​structure 11A1, a further fixed connection between the two is achieved.

[0039] In one embodiment, such as Figures 3 to 5 As shown, in a second embodiment of the clamping structure, the heat dissipation assembly 30 includes a water chamber structure 31B and a water chamber cover plate 32B. The water chamber cover plate 32B is disposed on the upper end face of the cover plate 20, and the space between the water chamber cover plate 32B and the cover plate 20 is provided with the water chamber structure 31B; wherein, the water chamber structure 31B is provided with a third fin.

[0040] In this embodiment, the second embodiment of the heat dissipation component differs from the first embodiment in that it includes a water chamber structure 31B and a water chamber cover plate 32B, and a third fin (such as...) is provided within the water chamber structure 31B. Figure 4 In this structure, the upper part of the water chamber structure 31B can be considered as the third fin, serving as a heat dissipation structure. When the coolant from the liquid cooling system enters the fins inside the water chamber cover plate 32B, the third fin increases the heat dissipation area and improves the heat dissipation effect.

[0041] In one embodiment, such as Figures 3 to 5 As shown, the heat pipe 40 is disposed on the cover plate 20 and connected to the fins in the water chamber structure 31B, and the cover plate 20 is screwed onto the CPU motherboard 10.

[0042] In this embodiment, when the heat pipe 40 is placed on the cover plate 20 as a buried heat pipe, it can also be connected to the fins located in the water chamber structure 31B. When the coolant in the liquid cooling system undergoes a phase change, the heat pipe 40 can enhance heat dissipation. Furthermore, by screwing the cover plate 20 onto the CPU motherboard 10 (specifically, by screwing it onto the CPU motherboard 10 with multiple nuts 50), a stable connection between the cover plate and the CPU motherboard can be achieved, and the CPU chip fixed therein can be fixed more securely.

[0043] Furthermore, the clamps in the liquid cooling system can be connected to the CPU motherboard via snap-fit ​​mechanisms, more effectively securing the CPU chip and ensuring its stable operation. This provides strong support for the normal operation of computer equipment (such as servers) using this clamping structure in a liquid-cooled environment. The clamping structure described above is suitable for clamping and securing CPU chips on second-type platforms, more specifically, CPU chips on AMD platforms.

[0044] In one embodiment, such as Figure 6 and Figure 7 As shown, in the third embodiment of the clamping structure, the heat dissipation component 30 is a heat dissipation fin, and the heat pipe 40 is provided on the side wall of the heat dissipation component 30.

[0045] In this embodiment, the third embodiment of the heat dissipation component differs from the first embodiment in that the heat pipe 40 is directly inserted into the side wall of the heat dissipation component 30 for heat dissipation, instead of being mounted on the cover plate 20 and connected to the heat dissipation component 30. However, it is similar to the first embodiment in that the heat dissipation component 30 still uses heat dissipation fins to dissipate heat from the CPU chip. When the coolant in the liquid cooling system undergoes a phase change, the heat pipe 40 can serve as a heat dissipation enhancement structure to strengthen heat dissipation.

[0046] In one embodiment, such as Figure 6 and Figure 7 As shown, the outer edge of the cover plate 20 is provided with a plurality of second snap-fit ​​structures 21, and the plurality of second snap-fit ​​structures 21 are snapped onto the CPU motherboard 10.

[0047] In this embodiment, in order to achieve a more stable connection between the cover plate 20 and the CPU motherboard 10, a plurality of second snap-fit ​​structures 21 can be provided on the outer edge of the cover plate 20. The CPU chip can be effectively fixed by the plurality of second snap-fit ​​structures 21 on the CPU motherboard 10, so as to ensure its stable operation.

[0048] In one embodiment, such as Figure 6 and Figure 7 As shown, the cover plate 20 is also screwed onto the CPU motherboard 10 by a plurality of connecting nuts 22.

[0049] In this embodiment, in order to achieve a more stable connection between the cover plate 20 and the CPU motherboard 10, the cover plate 20 is also screwed onto the CPU motherboard 10 by a plurality of connecting nuts 22. The cover plate 20 is provided with a nut mounting seat corresponding to the plurality of connecting nuts 22 one by one, and each of the plurality of connecting nuts 22 passes through the nut mounting seat and is screwed into the corresponding screw hole on the CPU motherboard 10.

[0050] Furthermore, the clamps in the liquid cooling system can be connected to the CPU motherboard via snap-fit ​​mechanisms, more effectively securing the CPU chip and ensuring its stable operation. This provides strong support for the normal operation of computer equipment (such as servers) using this clamping structure in a liquid-cooled environment. The clamping structure described above is suitable for clamping and securing CPU chips on third-type platforms, more specifically, CPU chips on the Hygon platform.

[0051] This utility model embodiment also provides a computer device, which includes the clamping structure described in any of the foregoing embodiments, and the CPU chip is clamped to the clamping structure.

[0052] In this embodiment, the computer device is a personal computer, server, or similar device. The clamping structure is used inside the computer device's chassis, and the CPU chip is clamped to the clamping structure. Simultaneously, the computer device's chassis is immersed in coolant and serves as the object to be cooled by the liquid cooling system.

[0053] like Figure 1 and Figure 2 As shown, when the computer device adopts this clamping structure, in order to assist in clamping the CPU chip 100 in the liquid cooling system and effectively exert heat dissipation in the immersion environment, the CPU chip 100 can first be installed on the upper surface of the CPU motherboard 10. Then, a cover plate with a heat dissipation component 30 on its upper surface is connected to the CPU motherboard 10, so that the space between the CPU motherboard 10 and the lower surface of the cover plate 20 can accommodate and clamp the CPU chip 100. Because the heat dissipation component 30 is also provided on the cover plate 20 and a heat pipe 40 is connected to the heat dissipation component, when the entire clamping device clamps the CPU chip 100 and immerses it in the liquid cooling environment, it can not only assist different platform fasteners in clamping and fixing the CPU chip, but also expand the contact heat dissipation area and achieve better heat dissipation effect.

[0054] This invention provides a clamping structure and a computer device. The clamping structure includes a cover plate, a heat dissipation assembly, and a heat pipe. The cover plate is located on the upper surface of the CPU motherboard in an immersion liquid cooling system, and the space between the CPU motherboard and the lower surface of the cover plate is used to accommodate and clamp CPU chips corresponding to different CPU platforms. All or part of the structure of the heat dissipation assembly is located on the upper surface of the cover plate. The heat pipe is located on one side of the heat dissipation assembly and connected to it. The computer device includes the aforementioned clamping structure, and the CPU chip is clamped within the clamping structure. The cover plate, heat dissipation assembly, and heat pipe are all immersed in the coolant in the immersion liquid cooling system. In the embodiments of this invention, the cover plate in the clamping structure not only assists in clamping and fixing the CPU chip with different platform fasteners in the liquid cooling system, but also expands the contact area for heat dissipation and achieves better heat dissipation.

[0055] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A clamping structure applied to an immersion liquid cooling system, characterized in that, The system includes a cover plate, a heat dissipation assembly, and heat pipes. The cover plate is located on the upper surface of the CPU motherboard of the immersion liquid cooling system, and the space between the CPU motherboard and the lower surface of the cover plate is used to accommodate and clamp CPU chips corresponding to different CPU platforms. All or part of the structure of the heat dissipation assembly is located on the upper surface of the cover plate. The heat pipe is located on one side of the heat dissipation assembly and connected to the heat dissipation assembly. When the immersion liquid cooling system is in the coolant under liquid cooling conditions, the cover plate, the heat dissipation assembly, and the heat pipes are all immersed in the coolant.

2. The clamping structure according to claim 1, characterized in that, The heat dissipation assembly includes a first fin and a second fin. The first fin is disposed on the upper end face of the cover plate, and the second fin is located on one side of the cover plate and connected to the first fin through the heat pipe.

3. The clamping structure according to claim 1, characterized in that, The CPU motherboard includes an upper motherboard and a base plate; studs on the base plate pass through the upper motherboard and the cover plate in sequence and are screwed to a fixing nut to connect the CPU motherboard and the cover plate.

4. The clamping structure according to claim 3, characterized in that, The upper motherboard is snapped onto the cover plate via a first snap-fit ​​structure.

5. The clamping structure according to claim 1, characterized in that, The heat dissipation assembly includes a water chamber structure and a water chamber cover plate. The water chamber cover plate is disposed on the upper end face of the cover plate, and the space between the water chamber cover plate and the cover plate is provided with the water chamber structure; wherein, the water chamber structure is provided with a third fin.

6. The clamping structure according to claim 5, characterized in that, The heat pipe is disposed on the cover plate and connected to the third fin in the water chamber structure, and the cover plate is screwed onto the CPU motherboard.

7. The clamping structure according to claim 1, characterized in that, The heat dissipation component is a heat dissipation fin, and the heat pipe is provided on the side wall of the heat dissipation component.

8. The clamping structure according to claim 1, characterized in that, The outer edge of the cover plate is provided with multiple second snap-fit ​​structures, and the multiple second snap-fit ​​structures are snapped onto the CPU motherboard.

9. The clamping structure according to claim 1, characterized in that, The cover plate is also screwed onto the CPU motherboard by multiple connecting nuts.

10. A computer device, characterized in that, Includes the clamping structure as described in any one of claims 1-9, and the CPU chip is clamped to the clamping structure.

Images