An OPS computer motherboard with double M.2 solid state disk interfaces

Abstract

The utility model relates to computer hardware field discloses a kind of OPS computer mainboard with double M.2 solid state disk interface, it aims at solving the technical problem that the number of high-speed storage interface is insufficient due to space restriction of existing OPS computer module, including a PCB board with front and back, CPU socket, memory slot and first M.2 solid state disk interface are arranged on the front of PCB board, second M.2 solid state disk interface is also arranged on the back of PCB board. Through this kind of front and back layout, two high-speed M.2 solid state disk interfaces are successfully integrated in the standard OPS size of this mainboard, greatly improve storage capacity and performance, while two heat sources are physically separated, which is beneficial to system heat dissipation and stable operation.

Description

Technical Field

[0001] This utility model relates to the field of computer motherboard technology, and in particular to a computer motherboard with dual M.2 solid-state drive interfaces for use in open pluggable standard OPS computer modules. Background Technology

[0002] Open pluggable (OPS) computer modules have gained widespread application in fields such as interactive whiteboards, digital signage, and video conferencing systems due to their standardization, ease of integration, and maintenance. OPS modules require the integration of a complete computer system within an extremely compact and standardized size.

[0003] With the increasing demand for high-definition video processing and complex software applications, the market has placed higher demands on the storage performance and capacity of OPS modules. M.2 NVMe solid-state drives, with their extremely high read and write speeds, have become key components for improving system responsiveness and data processing capabilities.

[0004] However, due to the extremely small PCB area of ​​OPS motherboards, traditional layout solutions can usually only provide one M.2 solid-state drive interface. This presents users with a dilemma: either install a large-capacity hard drive, which is costly, or install a small-capacity hard drive as a system drive, but the data storage space is limited. If storage needs to be expanded, users can only rely on the slower traditional SATA interface, which cannot meet the demand for high-performance storage.

[0005] How to provide two or more high-speed M.2 solid-state drive interfaces for OPS computer modules within a limited PCB space to enable advanced applications such as storage expansion, disk array construction, or separation of system disk and data disk is a significant technical challenge in this field. Summary of the Invention

[0006] The purpose of this invention is to solve the problem of insufficient storage expansion capability of OPS motherboards mentioned in the background art, and to provide an OPS computer motherboard with dual M.2 solid-state drive interfaces. This motherboard creatively utilizes the space on both sides of the PCB board to achieve the integration of dual high-speed solid-state drives without changing the standard OPS dimensions.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: An OPS computer motherboard with dual M.2 solid-state drive interfaces includes a PCB board limited to the OPS standard size, the PCB board having a front and a back; a CPU socket disposed on the front of the PCB board; at least one memory slot disposed on the front of the PCB board; and an OPS standard interface disposed along a long side of the PCB board. Its core innovation lies in that the motherboard further includes: a first M.2 solid-state drive interface disposed on the front of the PCB board, located between the CPU socket and the memory slot; and a second M.2 solid-state drive interface disposed on the back of the PCB board.

[0008] As a further optimization of this utility model, the first M.2 solid-state drive interface is compatible with both NVMe and SATA, two mainstream transmission protocols, and the mode can be switched by a jumper switch on the front of the PCB board, which greatly enhances the compatibility with different types of M.2 solid-state drives.

[0009] As a further optimization of this utility model, the second M.2 solid-state drive interface is dedicated to supporting the high-performance NVMe transmission protocol to ensure the ultimate data read and write speed.

[0010] As a further optimization of this utility model, the projection positions of the first M.2 solid-state drive interface and the second M.2 solid-state drive interface on the PCB board are staggered to avoid physical interference with the front components after the solid-state drive is installed, and to facilitate heat dissipation.

[0011] As a further optimization of this utility model, the CPU socket is covered with a heat sink, which includes heat dissipation fins and an axial fan. The airflow direction of the axial fan is perpendicular to the surface of the PCB board to efficiently dissipate heat from the processor.

[0012] As a further optimization of this utility model, the front side of the PCB board is also provided with an M.2EKey interface for installing a wireless communication module to expand the wireless communication function of the motherboard.

[0013] As a further optimization of this utility model, the PCB board is also provided with an SD card reader slot.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. This utility model innovatively designs the second M.2 solid-state drive interface on the back of the PCB board. This layout completely breaks the space limitation of the traditional single-sided layout, making it possible to integrate two M.2 high-speed hard drives within the standard OPS size, doubling the storage capacity and performance. It can easily support system and data separation, or build RAID0 / 1 to improve speed or data security.

[0015] 2. This utility model arranges two M.2 solid-state drives, which are the main heat sources, on the front and back sides of the PCB board respectively, which effectively avoids the high concentration of heat. The solid-state drive on the back can dissipate heat by utilizing the gap between it and the inner wall of the OPS chassis, forming a physical isolation with the solid-state drive on the front, reducing the cross-influence of heat, thereby improving the stability of the entire system under high load.

[0016] 3. The first M.2 interface on the front of this utility model can flexibly support solid-state drives of both NVMe and SATA protocols through a jumper design, providing great convenience to users. Whether using an old SATA hard drive or an NVMe hard drive that pursues ultimate performance, it can be well supported. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the front structure of the OPS computer motherboard provided in this embodiment of the utility model; Figure 2 This is a schematic diagram of the structure of the back of the OPS computer motherboard provided in this embodiment of the utility model.

[0018] In the diagram: 10-PCB board, 11-PCB board front, 12-PCB board back, 20-CPU socket, 30-Memory slot, 40-OPS standard interface, 50-First M.2 SSD interface, 60-Second M.2 SSD interface, 70-Jump switch, 80-Rear I / O interface area. Detailed Implementation

[0019] The technical solution of this utility model will now be clearly and completely described in conjunction with the accompanying drawings.

[0020] Please see Figure 1 The core carrier of this utility model is a PCB board 10, whose overall dimensions strictly follow the OPS specification. Figure 1 The image shown is the front side 11 of the PCB board 10, which is the mounting surface for the main electronic components. On the front side 11, there is a CPU socket 20 for mounting Intel Core series mobile processors; on one side of the CPU socket 20, there are two DDR4 SO-DIMM memory slots 30.

[0021] In this embodiment, the CPU socket 20 is covered with a heat sink, which includes heat dissipation fins and an axial fan. The airflow direction of the axial fan is perpendicular to the surface of the PCB board 10 to quickly dissipate the heat generated by the processor and ensure stable operation of the processor under high load.

[0022] The design feature of this utility model lies in the layout of the storage interface. On the front side 11 of the PCB board 10, in the area between the CPU socket 20 and the memory slot 30, a first M.2 solid-state drive interface 50 is set. This interface is of the MKey2280 specification.

[0023] To provide maximum flexibility, the first M.2 interface 50 is designed to support both NVMe and SATA transmission protocols. Users can manually select the operating mode of the interface through the jumper switch 70 on the board, thus making it compatible with almost all M.2 solid-state drives on the market.

[0024] Please see now Figure 2 , Figure 2 The back 12 of the PCB board 10 is shown. In traditional designs, the back of the motherboard usually only has solder joints and a few surface-mount components. However, this invention creatively opens up space on the back 12 of the PCB board 10 to set up a second M.2 solid-state drive interface 60. This interface is also of the MKey2280 specification and is dedicated to supporting high-performance NVMe protocol solid-state drives.

[0025] As can be seen from the figure, the projection positions of the second M.2 solid-state drive interface 60 and the first M.2 solid-state drive interface 50 on the PCB board 10 are staggered. This can avoid physical interference with the front components after the solid-state drive is installed, and it is also beneficial for heat dissipation.

[0026] By setting an M.2 solid-state drive interface on each of the front and back sides of the PCB board 10, this invention successfully doubles the number of high-speed storage channels without increasing the motherboard's surface area.

[0027] See also Figure 1 On one long side of the PCB board 10, there is a standard JATEX 25-80 Pin OPS interface 40 for signal and power connection with the display device. On the opposite long side, there is a rich rear I / O interface area 80, including USB 3.2, USB 2.0, RJ45 network port, Type-C, DP, HDMI and audio port, to meet the connection needs of various external devices.

[0028] The embodiments of this utility model also integrate other practical functions, such as an onboard SD card reader slot and an M.2EKey interface for installing wireless communication modules such as WiFi / Bluetooth, further enhancing the overall performance and convenience of the product.

[0029] In summary, this utility model, by innovatively arranging an M.2 solid-state drive interface on each side of the PCB of the OPS motherboard and combining it with a flexible protocol switching design, perfectly solves the bottleneck problem of high-performance storage scalability of the OPS module, and has extremely high practical value.

[0030] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, various improvements and modifications can be made to these embodiments without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. An OPS computer motherboard with dual M.2 solid-state drive interfaces, characterized in that, include: A PCB board (10) limited to the standard size of OPS, the PCB board (10) having a front side (11) and a back side (12). CPU socket (20) is provided on the front (11) of the PCB board (10). At least one memory slot (30) is provided on the front (11) of the PCB board (10); An OPS standard interface (40) is provided along one long side of the PCB board (10). The first M.2 solid-state drive interface (50) is disposed on the front (11) of the PCB board (10) and located between the CPU socket (20) and the memory slot (30). The second M.2 solid-state drive interface (60) is located on the back (12) of the PCB board (10).

2. An OPS computer motherboard with dual M.2 solid-state drive interfaces according to claim 1, characterized in that, The first M.2 solid-state drive interface (50) is compatible with NVMe and SATA transmission protocols.

3. An OPS computer motherboard with dual M.2 solid-state drive interfaces according to claim 2, characterized in that, The front (11) of the PCB board (10) is also provided with a jumper switch (70) for switching the first M.2 solid-state drive interface (50) to work in NVMe transmission protocol or SATA transmission protocol.

4. An OPS computer motherboard with dual M.2 solid-state drive interfaces according to claim 1, characterized in that, The second M.2 solid-state drive interface (60) supports the NVMe transmission protocol.

5. An OPS computer motherboard with dual M.2 solid-state drive interfaces according to claim 1, characterized in that, The projection positions of the first M.2 solid-state drive interface (50) and the second M.2 solid-state drive interface (60) on the PCB board (10) are staggered.

6. An OPS computer motherboard with dual M.2 solid-state drive interfaces according to claim 1, characterized in that, The CPU socket (20) is covered with a heat sink, which includes heat dissipation fins and an axial fan. The airflow direction of the axial fan is perpendicular to the surface of the PCB board (10).

7. An OPS computer motherboard with dual M.2 solid-state drive interfaces according to claim 1, characterized in that, The front side (11) of the PCB board (10) is also provided with an M.2EKey interface for installing a wireless communication module.

8. An OPS computer motherboard with dual M.2 solid-state drive interfaces according to claim 1, characterized in that, The PCB board (10) is also provided with an SD card reader slot.

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