An OPS computer motherboard with specific heat dissipation and interface layout

Abstract

The utility model belongs to computer hardware technical field discloses a OPS computer mainboard with specific heat dissipation and interface layout, aims at solving the technical problem that existing OPS mainboard is difficult to give consideration to high -performance processor heat dissipation and rich interface configuration, including PCB board, the CPU socket of setting in the middle, the heat dissipation module of covering it, the memory slot of CPU socket one side, the OPS standard interface of setting along a long side and the rear I / O interface area along opposite long side, the heat dissipation module contains a centrifugal fan, its air outlet is towards rear I / O interface area, and the processor heat is directedly discharged from this side after the fin stack, forms efficient heat dissipation air duct. The utility model through the optimized component layout and directional heat dissipation design, effectively solved the heat dissipation problem of high -performance processor in compact OPS space, guaranteed the stable release of system performance, has realized the high degree of functional integration simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of computer hardware technology, and more particularly to a computer motherboard, and more specifically, to a computer motherboard with a specific heat dissipation and interface layout for use in an Open Pluggable Standard (OPS) computer. Background Technology

[0002] Open Pluggable Specification (OPS) is a standardized digital signage application interface specification introduced by Intel. It allows a microcomputer to be easily integrated into compatible display devices as a pluggable module. This design simplifies the installation, maintenance, and upgrade of devices and has been widely used in education, conferencing, advertising, and retail.

[0003] However, traditional OPS computer modules often compromise on performance to accommodate their compact size. In particular, as processor performance continues to improve, power consumption and heat generation also increase significantly. Providing sufficient and efficient heat dissipation for a high-performance processor within the limited internal space of the OPS module has become a huge technical challenge. Existing OPS motherboard layouts often struggle to meet the heat dissipation requirements of high-performance processors and the rich interface expandability, which can easily lead to processor throttling due to overheating, failing to achieve full performance, and even affecting the long-term stability of the system.

[0004] Therefore, optimizing the component layout and heat dissipation structure of OPS computer motherboards to ensure that they can accommodate high-performance processors and guarantee their stable operation while meeting standard size limitations, and to provide comprehensive interface configurations, is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0005] The purpose of this utility model is to solve the problems mentioned in the background art and provide an OPS computer motherboard with a specific heat dissipation and interface layout. This motherboard achieves effective heat dissipation of high-performance processors in a compact space through optimized component layout and directional heat dissipation airflow design, while taking into account the richness of interfaces and the rationality of the layout.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: An OPS computer motherboard with a specific heat dissipation and interface layout includes: a PCB board; a CPU socket disposed in the central area of ​​the PCB board for mounting a mobile processor; a heat dissipation module covering the CPU socket, the heat dissipation module including a heat sink, at least one heat pipe, fin stack and centrifugal fan; at least two memory slots arranged parallel to one edge of the CPU socket; an OPS standard interface disposed along one long side of the PCB board; and a rear I / O interface area densely arranged along another long side opposite to the OPS standard interface.

[0007] The centrifugal fan of the heat dissipation module has its exhaust port facing the side where the rear I / O interface area is located, and the fin stack is arranged on the exhaust path, so that the heat generated by the processor can be directionally discharged from the rear I / O interface area.

[0008] As a further optimization of this invention, the length direction of the memory slot is perpendicular to the length direction of the OPS standard interface. This layout makes full use of the PCB board space, maintaining a certain distance between the main heat-generating components and temperature-sensitive components.

[0009] As a further optimization of this utility model, an M.2 solid-state drive interface is also provided on the PCB board. The M.2 solid-state drive interface is located between the memory slot and the CPU socket. This layout allows the high-speed solid-state drive to utilize part of the airflow brought by the CPU cooling fan for auxiliary heat dissipation.

[0010] As a further optimization of this utility model, the rear I / O interface area includes, from one end to the other, a power indicator light, a hard drive indicator light, at least two USB 3.2 ports, at least two USB 2.0 ports, a network port, a Type-C port, a DP port, an HDMI port, and an audio port along the long side of the PCB board. This arrangement conforms to user habits and reasonably separates high-speed interfaces from conventional interfaces.

[0011] Compared with the prior art, this utility model has the following advantages: 1. This utility model places the CPU socket in the middle of the motherboard and covers it with a specially designed heat dissipation module with a centrifugal fan. At the same time, the fan exhaust is directed towards the rear I / O area, forming a clear and directional heat dissipation channel. This allows the waste heat generated by the high-performance processor to be quickly and directly discharged outside the module, effectively preventing heat from accumulating inside the chassis. This ensures that the processor can operate stably under high load and will not reduce its frequency due to overheating.

[0012] 2. This utility model features meticulous spatial planning of components, rationally arranging key components such as memory slots, M.2 interfaces, OPS interfaces, and rear I / O interfaces around the high-performance CPU. This high-density layout design allows the motherboard to integrate high-speed interfaces such as DDR5 memory and NVMe solid-state drives while adhering to the OPS standard size, resulting in powerful and comprehensive functionality.

[0013] 3. The perpendicular layout of the memory slots and OPS interfaces in this utility model, as well as the relative positions of each interface, not only optimizes electrical wiring but also provides convenience for user installation and maintenance. The overall layout takes into account heat dissipation, signal integrity, and physical space utilization, reflecting a highly optimized engineering design concept. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of an OPS computer motherboard after the centrifugal fan has been removed, according to an embodiment of this utility model. Figure 2 This is a schematic diagram of the overall structure of an OPS computer motherboard after a centrifugal fan is installed, according to an embodiment of this utility model. Figure 3 This is a schematic diagram of the external structure of the rear I / O interface area provided in an embodiment of this utility model.

[0015] In the diagram: 1-PCB board, 2-CPU socket, 3-heat dissipation module, 31-centrifugal fan, 4-memory slot, 5-OPS standard interface, 6-rear I / O interface area, 7-M.2 solid-state drive interface, 8-M.2 wireless network card interface, 9-SATA interface. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1 and 2 As shown, this utility model provides an OPS computer motherboard with a specific heat dissipation and interface layout, which includes a PCB board 1.

[0018] In the middle part of the PCB board 1, a CPU socket 2 is provided in a region slightly off to one side. In this embodiment, the CPU socket 2 is used to install high-performance mobile processors such as Intel Core 12 / 13 / 14th generation HX series processors. These processors have powerful performance, but also generate relatively high heat.

[0019] To effectively solve the heat dissipation problem, a customized heat dissipation module 3 is completely covered and installed above the CPU socket 2. The heat dissipation module 3 includes a heat sink base that is in close contact with the processor core, a heat pipe connecting the base and the fin stack, a fin stack, and a centrifugal fan 31.

[0020] The air inlet of the centrifugal fan 31 is located at the top of the fan, while the air outlet is located on its side. Centrifugal fans are also called turbine fans or blowers. Figure 1 As shown by the middle arrow, the air outlet of the centrifugal fan 31 is designed to face the long side where the rear I / O interface area 6 is located.

[0021] When the fan spins, cool air is drawn in from above, passes through the fin stack, absorbs heat to form hot air, and is forced and directed towards the rear I / O interface area 6, and finally exhausted from the heat dissipation holes of the OPS computer module. This design forms a short and efficient heat dissipation airflow from the inside of the motherboard to the outside.

[0022] On one side of the CPU socket 2, two memory slots 4 are arranged in parallel. In this embodiment, these two memory slots 4 are DDR5 SO-DIMM slots, which support high-frequency dual-channel memory and provide sufficient data bandwidth for high-performance processors. The length direction of the memory slots 4 is approximately perpendicular to the length direction of the OPS standard interface 5, which will be described in the following article. This layout can shorten the wiring length between the CPU and the memory, which is beneficial to the stability of high-speed signal transmission.

[0023] On the other long side of PCB board 1, there is an OPS standard interface 5. In this embodiment, the interface is a JATEX 25-80Pin pluggable gold finger interface, which carries power supply, video signals such as DP and HDMI, USB signals, network signals and other functions. It is a bridge connecting the motherboard and the display device.

[0024] The other long side, opposite the OPS standard interface 5, is densely packed with rear I / O interface areas 6. Please refer to the relevant documentation. Figure 3 As shown, this area provides users with a wealth of external device connectivity capabilities.

[0025] In this embodiment, arranged from left to right are: a power switch button, power and hard drive status indicator lights, two USB 3.2 Gen 2 ports, two USB 2.0 ports, one RJ45 Gigabit Ethernet port, one Type-C port supporting video output and data transmission, one DP 1.4a port, one HDMI 2.0 port, and a set of audio input / output ports, such as MIC+LINE-IN. This rich interface configuration meets the demanding requirements of modern digital signage and interactive whiteboard applications.

[0026] To provide high-speed storage and wireless connectivity, the motherboard also integrates multiple expansion interfaces, including an M.2 solid-state drive interface 7 located between the CPU socket 2 and the memory slot 4. The M.2 solid-state drive interface supports the NVMe protocol specification 2280.

[0027] This location not only makes high space utilization, but also benefits to some extent from the airflow generated by the heat dissipation module 3. In addition, between the CPU socket 2 and the OPS standard interface 5, there is an M.2 wireless network card interface 8. The specific specification of the M.2 wireless network card interface is 2230, which is used to install WiFi and Bluetooth modules.

[0028] Meanwhile, the motherboard also retains a SATA 9 interface and a corresponding hard drive power supply interface, making it possible to connect traditional 2.5-inch hard drives.

[0029] In summary, this utility model uses a high-performance CPU and its directional heat dissipation module as the core of the layout, and scientifically arranges functional modules such as memory, storage, OPS standard interface and rear I / O around it. It successfully creates a computer motherboard with powerful performance, reliable heat dissipation and complete interfaces within a limited OPS size, effectively solving the pain points of the prior art.

[0030] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An OPS computer motherboard with a specific heat dissipation and interface layout, characterized in that, include: A PCB board (1); The CPU socket (2) located in the middle area of ​​the PCB board (1) is used to install a mobile processor; A heat dissipation module (3) covering the CPU socket (2) includes a heat sink, at least one heat pipe, a fin stack and a centrifugal fan (31); at least two memory slots (4) arranged parallel to one side edge of the CPU socket (2); An OPS standard interface (5) is provided along one long side of the PCB board (1). The rear I / O interface area (6) is densely arranged along another long side opposite to the OPS standard interface (5). The centrifugal fan (31) of the heat dissipation module (3) has its air outlet facing the side where the rear I / O interface area (6) is located, and the fin stack is arranged on the air outlet path so that the heat generated by the processor can be directionally discharged from the side of the rear I / O interface area (6).

2. An OPS computer motherboard with a specific heat dissipation and interface layout according to claim 1, characterized in that, The length direction of the memory slot (4) is perpendicular to the length direction of the OPS standard interface (5).

3. An OPS computer motherboard with a specific heat dissipation and interface layout according to claim 1, characterized in that, The PCB board (1) is also provided with an M.2 solid-state drive interface (7), which is located between the memory slot (4) and the CPU socket (2).

4. An OPS computer motherboard with a specific heat dissipation and interface layout according to claim 1, characterized in that, The PCB board (1) is also provided with an M.2 wireless network card interface (8), which is located between the CPU socket (2) and the OPS standard interface (5).

5. An OPS computer motherboard with a specific heat dissipation and interface layout according to claim 1, characterized in that, The rear I / O interface area (6) includes, from one end to the other along the long side of the PCB board (1), a power indicator light, a hard disk indicator light, at least two USB 3.2 interfaces, at least two USB 2.0 interfaces, a network interface, a Type-C interface, a DP interface, an HDMI interface, and an audio interface.

6. An OPS computer motherboard with a specific heat dissipation and interface layout according to claim 1, characterized in that, The memory slot (4) is a slot suitable for DDR5 SO-DIMM memory modules.

7. An OPS computer motherboard with a specific heat dissipation and interface layout according to claim 1, characterized in that, The OPS standard interface (5) is a JATEX 25-80Pin pluggable interface.

8. An OPS computer motherboard with a specific heat dissipation and interface layout according to claim 3, characterized in that, The PCB board (1) also includes a SATA hard drive interface (9) and a hard drive power supply interface located near the M.2 solid-state drive interface (7).

9. An OPS computer motherboard with a specific heat dissipation and interface layout according to claim 1, characterized in that, The CPU socket (2) is used to install Intel Core 12 / 13 / 14th generation HX series mobile processors.

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