A quality traceability identification device for prestressed hollow slab beam production

Abstract

The utility model relates to building component quality traceability technical field discloses a kind of quality traceability identification device of prestressed hollow slab beam production, including shell, base plate and be located at the adhesive assembly of shell bottom, base plate is fixed in shell, chip is equipped on base plate, adhesive assembly includes side edge pre-adhesive layer and center main adhesive layer, side edge pre-adhesive layer is covered with outside release paper, center main adhesive layer is covered with center release paper, center release paper is connected with draw bar, adhesive assembly is connected with hollow slab beam, installation slot is set up on hollow slab beam, shell is installed in installation slot, and installation gap is formed between with installation slot. The utility model provides protection for internal chip by shell, cooperate with filling layer and buffer column, resist in transportation, construction, knock and vibration impact, through the composite bonding structure of side edge pre-adhesive layer and center main adhesive layer, combine the installation slot pre-set on hollow slab beam, realize the fixation of identification and slab beam, avoid destroying slab beam structure.

Description

Technical Field

[0001] This utility model belongs to the field of building component quality traceability technology, specifically, it relates to a quality traceability marking device for the production of prestressed hollow slab beams. Background Technology

[0002] As a core load-bearing component in infrastructure construction such as bridges and municipal roads, the production quality of prestressed hollow slab beams directly determines the safety and service life of the engineering structure. Therefore, it is necessary to accurately trace the quality information of the entire life cycle from raw material entry, production and processing to installation and service, so as to quickly obtain key data such as production batch, tensioning parameters, and maintenance records of the slab beams during later maintenance, fault diagnosis or quality verification, and ensure the long-term stable operation of the project.

[0003] However, the QR code stickers and spray-painted numbers currently in use are prone to blurring or even disappearing due to transportation bumps, construction cement pollution, outdoor rain erosion, and ultraviolet radiation, making long-term traceability impossible. Although steel stamps have better durability, they may damage the concrete structure of the beam surface and affect local strength when engraved, and the information capacity is limited, making it difficult to store detailed data of the entire life cycle of the beam.

[0004] In view of this, this utility model is proposed. Utility Model Content

[0005] To address the issues that QR code stickers and spray-painted numbers are prone to fading or disappearing due to transportation damage, cement contamination during construction, outdoor rain erosion, and UV exposure, making long-term traceability impossible, and that while steel stamps offer better durability, engraving them may damage the concrete structure of the beam surface, affecting local strength, and have limited information capacity, making it difficult to store detailed data for the entire lifecycle of the beam, the basic concept of this utility model is as follows: A quality traceability identification device for the production of prestressed hollow slab beams includes a shell, a substrate, and an adhesive assembly disposed at the bottom of the shell. The substrate is fixed inside the shell and a chip is disposed on the substrate. The adhesive assembly includes a side pre-adhesive layer and a central main adhesive layer. The side pre-adhesive layer is covered with an outer release paper, and the central main adhesive layer is covered with a central release paper. A pull strip is connected to the central release paper. The adhesive assembly is connected to a hollow slab beam, and an installation groove is formed on the hollow slab beam. The shell is installed in the installation groove, and an installation gap is formed between the shell and the installation groove.

[0006] In a preferred embodiment of this utility model, the substrate is a rectangular plate with a circular through hole. A buffer post passes through the through hole, with the upper end of the buffer post abutting against the inner top surface of the outer shell and the lower end of the buffer post abutting against the inner bottom surface of the outer shell.

[0007] In a preferred embodiment of this utility model, the outer shell is a rectangular thin shell structure, the upper surface of the substrate is provided with a groove, the chip is embedded in the groove, and the upper surface of the chip is flush with the upper surface of the substrate.

[0008] In a preferred embodiment of the present invention, a filling layer is provided between the outer shell and the substrate, and the upper and lower surfaces of the filling layer are respectively attached to the inner wall of the outer shell and the substrate.

[0009] In a preferred embodiment of this utility model, the mounting groove is a rectangular groove, and the bottom of the mounting groove is inclined.

[0010] In a preferred embodiment of this utility model, one end of the pull bar is connected to one side of the central release paper, and the other end extends through the installation gap to the outside of the hollow slab beam.

[0011] Compared with the prior art, the present invention has the following advantages: This invention provides protection for the internal chip through the outer shell, and together with the filling layer and buffer column, it resists the impact and vibration during transportation and construction. The device uses a composite bonding structure of side pre-adhesive layer and central main adhesive layer, combined with the pre-set installation groove on the hollow slab beam, to fix the sign to the slab beam. There is no need to carve steel stamps, which avoids damage to the slab beam structure. In addition, the inclined design of the bottom of the installation groove and the reserved installation gap reduce the impact of water accumulation on the bonding components and prevent the sign from falling off. This solves the problems of unstable fixation and easy damage of existing signs.

[0012] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0013] In the attached diagram: Figure 1 A schematic diagram of the installation of a quality traceability identification device for the production of prestressed hollow slab beams; Figure 2 A front view of a quality traceability identification device for the production of prestressed hollow slab beams; Figure 3 Rear view of a quality traceability identification device for the production of prestressed hollow slab beams; Figure 4 A cross-sectional view of a quality traceability identification device for the production of prestressed hollow slab beams; Figure 5 A quality traceability identification device for the production of prestressed hollow slab beams Figure 4 Enlarged view of point A in the middle; Figure 6 A partial cross-sectional view of a hollow slab beam for a quality traceability identification device in the production of prestressed hollow slab beams.

[0014] In the diagram: 1. Outer shell; 2. Substrate; 3. Chip; 4. Filler layer; 5. Buffer pillar; 6. Side pre-adhesive layer; 7. Outer release paper; 8. Central main adhesive layer; 9. Central release paper; 10. Tie bar; 11. Hollow core beam; 12. Mounting groove; 13. Mounting gap. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate this utility model.

[0016] like Figures 1 to 6 As shown, a quality traceability identification device for the production of prestressed hollow slab beams includes a housing 1, a substrate 2, and an adhesive assembly disposed at the bottom of the housing 1. The substrate 2 is fixed inside the housing 1, and a chip 3 is disposed on the substrate 2. The adhesive assembly includes a side pre-adhesive layer 6 and a central main adhesive layer 8. The side pre-adhesive layer 6 is covered with an outer release paper 7, and the central main adhesive layer 8 is covered with a central release paper 9. A pull strip 10 is connected to the central release paper 9. The adhesive assembly is connected to a hollow slab beam 11, and an installation groove 12 is provided on the hollow slab beam 11. The housing 1 is installed in the installation groove 12, and an installation gap 13 is formed between the housing 1 and the installation groove 12. In this configuration, the outer shell 1 provides an external protective space for the substrate 2 and the chip 3. The substrate 2 serves as the supporting base for the chip 3, ensuring that the chip 3 is stably positioned inside the outer shell 1. The bonding assembly achieves a fixed connection between the outer shell 1 and the mounting groove 12 on the hollow beam 11 through the cooperation of the side pre-adhesive layer 6 and the central main adhesive layer 8. The outer release paper 7 and the central release paper 9 respectively protect the side pre-adhesive layer 6 and the central main adhesive layer 8 from contamination or failure before installation. The pull strip 10 provides a force point for peeling off the central release paper 9. The installation gap 13 provides space for the insertion and operation of the pull strip 10, while also accommodating the assembly error between the outer shell 1 and the mounting groove 12.

[0017] like Figures 1 to 6 As shown in the specific embodiment, the substrate 2 is a rectangular plate with a circular through hole. A buffer pillar 5 passes through the through hole, with its upper end abutting against the inner top surface of the outer shell 1 and its lower end abutting against the inner bottom surface of the outer shell 1. In this configuration, after the buffer pillar 5 passes through the substrate 2, it forms an elastic support between the substrate 2 and the outer shell 1 by abutting against the inner top and inner bottom surfaces of the outer shell 1 at its upper and lower ends, respectively, thereby reducing the impact of vibration on the substrate 2 and the chip 3 on the substrate 2.

[0018] like Figures 1 to 6As shown, further, the outer shell 1 has a rectangular thin-shell structure, and a groove is formed on the upper surface of the substrate 2. The chip 3 is embedded in the groove, and the upper surface of the chip 3 is flush with the upper surface of the substrate 2. In this configuration, the chip 3 is embedded in the substrate 2 to avoid damage to the chip 3 due to protrusion by the inner wall of the outer shell 1 or the filling layer 4. At the same time, the design of the chip 3 being flush with the upper surface of the substrate 2 also facilitates the tight adhesion between the filling layer 4 and the substrate 2, ensuring the integrity of the protection.

[0019] like Figures 1 to 6 As shown, a filler layer 4 is further provided between the outer shell 1 and the substrate 2, and the upper and lower surfaces of the filler layer 4 are respectively attached to the inner wall of the outer shell 1 and the substrate 2. In this configuration, the filler layer 4 fills the gap between the outer shell 1 and the substrate 2, which not only fills the gap, but also buffers the impact force through its own material properties when the device is hit, further protecting the chip 3 from external damage.

[0020] like Figures 1 to 6 As shown, the mounting groove 12 is further defined as a rectangular groove with an inclined bottom. This inclined bottom design reduces water accumulation within the mounting groove 12, preventing prolonged immersion of the adhesive components at the bottom of the outer casing 1 and thus preventing moisture-induced reduction in adhesive strength.

[0021] like Figures 1 to 6 As shown, further, one end of the pull bar 10 is connected to one side of the central release paper 9, and the other end extends through the installation gap 13 to the outside of the hollow slab beam 11. In this configuration, the connection of one end of the pull bar 10 to the central release paper 9 allows the operator to pull the pull bar 10 to peel off the central release paper 9, thereby exposing the central main adhesive layer 8. The other end of the pull bar 10 extends through the installation gap 13 to the outside of the hollow slab beam 11, preventing the pull bar 10 from being obstructed by the outer shell 1 or the mounting groove 12, and allowing the operator to pull the pull bar 10 without disassembling the device after the device has been initially fixed.

[0022] The implementation principle of the quality traceability identification device for prestressed hollow slab beam production in this embodiment is as follows: During use, initial positioning is achieved first by relying on the pre-set mounting groove 12 on the hollow slab beam 11. The mounting groove 12 is a rectangular groove with an inclined bottom to reduce water accumulation. Before installation, the outer shell 1 of the device serves as an overall protective structure, with a base plate 2 already fixed inside. The base plate 2 is a rectangular plate with a buffer column 5 penetrating through a circular through hole. The upper end of the buffer column 5 abuts against the inner top surface of the outer shell 1, and the lower end abuts against the inner bottom surface of the outer shell 1. This buffer column 5, through a circular through hole, facilitates the installation of the device. The supporting and buffering function of the punch column 5 can reduce the impact of external vibration on the substrate 2 and the components on the substrate 2. The chip 3 is embedded in the groove opened on the upper surface of the substrate 2. The upper surface of the chip 3 is flush with the upper surface of the substrate 2, which can prevent the chip 3 from being damaged due to protrusion. At the same time, the filling layer 4 between the outer shell 1 and the substrate 2 has its upper and lower surfaces in contact with the inner wall of the outer shell 1 and the substrate 2, respectively, further protecting the chip 3 and reducing the damage to the chip 3 caused by collision and squeezing. The chip 3 stores the production quality information of the hollow plate beam 11 in advance, providing a data basis for subsequent traceability.

[0023] During installation, first, operate the outer release paper 7 in the bottom bonding assembly of the outer shell 1 to peel off the outer release paper 7 covering the side pre-adhesive layer 6, exposing the side pre-adhesive layer 6. Then, align the outer shell 1 with the mounting groove 12 of the hollow slab beam 11, so that the side pre-adhesive layer 6 contacts and initially bonds with the bottom of the mounting groove 12, achieving initial fixation of the device to the hollow slab beam 11. At this time, the installation gap 13 formed between the outer shell 1 and the mounting groove 12 provides space for the subsequent operation of the pull rod 10. After the initial fixation is completed, pull the pull rod 10 connected to one side of the central release paper 9. The other end of the pull rod 10 extends through the installation gap 13 to the outside of the hollow slab beam 11, making it easy for the operator to apply force. As the pull rod 10 is pulled, the central release paper 9 covering the central main adhesive layer 8 is peeled off, exposing the central main adhesive layer 8 and bonding it tightly to the bottom of the mounting groove 12. Together with the side pre-adhesive layer 6, it firmly fixes the device in the mounting groove 12, completing the overall installation of the device.

[0024] In subsequent use of the device, when it is necessary to trace the production quality of the hollow slab beam 11, the information stored in the chip 3 on the substrate 2 can be read by approaching the outer casing 1 with a dedicated reading device.

Claims

1. A quality traceability and identification device for the production of prestressed hollow slab beams, comprising a shell (1), a base plate (2), and an adhesive assembly disposed at the bottom of the shell (1), characterized in that, The outer shell (1) has a substrate (2) fixed inside, and a chip (3) is provided on the substrate (2). The bonding assembly includes a side pre-adhesive layer (6) and a central main adhesive layer (8). The side pre-adhesive layer (6) is covered with an outer release paper (7). The central main adhesive layer (8) is covered with a central release paper (9). A pull strip (10) is connected to the central release paper (9). The bonding assembly is connected with a hollow plate beam (11). An installation groove (12) is provided on the hollow plate beam (11). The outer shell (1) is installed in the installation groove (12), and an installation gap (13) is formed between the outer shell (1) and the installation groove (12).

2. The quality traceability and identification device for the production of prestressed hollow slab beams according to claim 1, characterized in that, The substrate (2) is a rectangular plate with a circular through hole. A buffer column (5) passes through the through hole. The upper end of the buffer column (5) abuts against the inner top surface of the outer shell (1), and the lower end of the buffer column (5) abuts against the inner bottom surface of the outer shell (1).

3. The quality traceability and identification device for the production of prestressed hollow slab beams according to claim 1, characterized in that, The outer shell (1) is a rectangular thin shell structure. The upper surface of the substrate (2) is provided with a groove. The chip (3) is embedded in the groove. The upper surface of the chip (3) is flush with the upper surface of the substrate (2).

4. The quality traceability and identification device for the production of prestressed hollow slab beams according to claim 1, characterized in that, A filler layer (4) is filled between the outer shell (1) and the substrate (2), and the upper and lower surfaces of the filler layer (4) are respectively attached to the inner wall of the outer shell (1) and the substrate (2).

5. A quality traceability and identification device for the production of prestressed hollow slab beams according to claim 1, characterized in that, The mounting groove (12) is a rectangular groove, and the bottom of the mounting groove (12) is inclined.

6. The quality traceability and identification device for the production of prestressed hollow slab beams according to claim 1, characterized in that, One end of the tie rod (10) is connected to one side of the central release paper (9), and the other end extends through the installation gap (13) to the outside of the hollow slab beam (11).

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