Liquid cooling plate assembly and battery pack

Abstract

The application provides a liquid cooling plate assembly and a battery pack. The liquid cooling plate assembly comprises a base plate, the base plate is provided with a groove, the groove has an opening side; a liquid cooling pipe is embedded in the groove, the circumferential side of the liquid cooling pipe has an arc segment and a straight segment, the arc segment is matched with the inner wall of the groove, and the straight segment is located at the opening side. The application solves the problem of poor heat exchange effect of the battery module in the prior art.

Description

Technical Field

[0001] This application relates to the field of battery pack technology, and more specifically, to a liquid cooling plate assembly and a battery pack. Background Technology

[0002] Currently, liquid-cooled plate assemblies are commonly used to dissipate heat from battery packs. Existing liquid-cooled plate assemblies are generally made of extruded aluminum profiles or brazed plates, with liquid-cooled pipes embedded in the plates to achieve heat exchange. In this setup, the battery module typically has line contact or no contact with the liquid-cooled pipes during heat exchange, while it makes contact with the liquid-cooled plate. The refrigerant in the heat exchange pipes exchanges heat with the battery module through the liquid-cooled plate. Because the liquid-cooled plate acts as an intermediate heat transfer component, the overall heat exchange effect of the battery module is relatively poor. Utility Model Content

[0003] The main objective of this application is to provide a liquid cooling plate assembly and a battery pack to solve the problem of poor overall heat exchange performance of battery modules in the prior art.

[0004] To achieve the above objectives, according to one aspect of this application, a liquid cooling plate assembly is provided, comprising: a substrate having a groove on the substrate, the groove having an open side; and a liquid cooling pipe embedded in the groove, the liquid cooling pipe having an arc-shaped section and a straight section on its circumferential side, the arc-shaped section cooperating with the inner wall of the groove, and the straight section located on the open side.

[0005] Furthermore, the straight section is flush with the surface of the substrate where the opening side is located.

[0006] Furthermore, the depth of the groove is greater than 1 / 2 of the maximum diameter D of the liquid cooling tube.

[0007] Furthermore, the cross-section of the groove has a U-shaped structure.

[0008] Furthermore, the liquid cooling plate assembly also includes a first adhesive layer located between the liquid cooling pipe and the inner wall of the groove.

[0009] Furthermore, the first adhesive layer is a thermally conductive layer.

[0010] Furthermore, the liquid cooling plate assembly also includes a connecting surface and a second adhesive layer. The connecting surface includes the surface where the opening side of the substrate is located and a straight section. The second adhesive layer is located on the connecting surface, and the liquid cooling plate assembly is connected to the battery module through the second adhesive layer.

[0011] Furthermore, the second adhesive layer is a thermally conductive layer.

[0012] Furthermore, the liquid cooling plate assembly also includes a connector that is connected to the end of the liquid cooling pipe and is located outside the substrate; and / or the liquid cooling pipe extends along the surface of the substrate and has at least one S-shaped structure.

[0013] According to another aspect of this application, a battery pack is provided, including: a battery module and the above-mentioned liquid cooling plate assembly, wherein the battery module is connected to the liquid cooling plate assembly, and the battery module and the straight section of the liquid cooling pipe of the liquid cooling plate assembly are heat-transfer matched.

[0014] By applying the technical solution of this application, a liquid cooling pipe is embedded in a groove, and the straight section of the liquid cooling pipe is placed flush with the surface of the groove's opening side, thereby increasing the contact area between the liquid cooling pipe and the battery module and improving the heat dissipation effect of the liquid cooling plate assembly. Specifically, by limiting the groove depth to more than half the maximum diameter of the liquid cooling pipe and the groove's cross-section to U-shape, the structure is simple and low-cost, while ensuring convenient and reliable installation between the liquid cooling pipe and the groove. This ensures sufficient liquid cooling medium flow for the liquid cooling plate assembly while facilitating installation. Furthermore, the groove, being a continuous curved groove composed of straight sections and arc bends, has greater pressure resistance and lower flow resistance, further improving the heat exchange effect of the liquid cooling plate assembly. Moreover, by adding an adhesive layer that serves as a thermally conductive layer, the structural stability of the liquid cooling plate assembly is ensured while further enhancing the heat exchange effect. Attached Figure Description

[0015] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings: Figure 1 An exploded view of the liquid-cooled plate assembly of this application is shown; Figure 2 A front view of the liquid cooling plate assembly is shown; Figure 3 A side sectional view of the liquid cooling plate assembly is shown; Figure 4 A front view of the substrate is shown; Figure 5 A side sectional view of the substrate is shown; Figure 6 A front view of the liquid cooling pipe is shown; Figure 7 A side sectional view of the liquid cooling pipe along direction AA is shown; Figure 8 A schematic diagram of the battery pack of this application is shown.

[0016] The above figures include the following reference numerals: 10. Substrate; 11. Groove; 20. Liquid cooling pipe; 21. Curved section; 22. Straight section; 30. Connecting nozzle; 40. Battery module; 50. Housing. Detailed Implementation

[0017] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0018] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0019] In this application, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this application.

[0020] To address the issue of poor overall heat exchange performance in existing battery modules, this application provides a liquid cooling plate assembly and a battery pack.

[0021] like Figure 1-8 The liquid cooling plate assembly shown includes: a substrate 10 and a liquid cooling pipe 20. The substrate 10 has a groove 11 with an open side; the liquid cooling pipe 20 is embedded in the groove 11. The circumferential side of the liquid cooling pipe 20 has an arc section 21 and a straight section 22. The arc section 21 cooperates with the inner wall of the groove 11, and the straight section 22 is located on the open side.

[0022] In this embodiment, a straight section 22 is provided on the circumferential side of the liquid cooling pipe 20. When the liquid cooling pipe 20 is embedded in the groove 11, the straight section 22 faces the opening side. This allows the straight section 22 of the liquid cooling pipe 20 to form a surface-to-surface contact with the battery module 40 when the battery module 40 is mounted on the liquid cooling plate assembly. Heat transfer is achieved through this surface-to-surface contact, thereby improving the heat exchange effect between the liquid cooling pipe 20 and the battery module 40. The curved section 21 further ensures a tighter fit between the liquid cooling pipe 20 and the groove 11, guaranteeing the reliability of the liquid cooling pipe 20's mounting on the substrate 10. Because the above arrangement allows for direct heat exchange between the liquid cooling pipe 20 and the battery module 40, and the two are in surface-to-surface contact, effective heat exchange is achieved between the liquid cooling pipe 20 and the battery module 40, improving the heat exchange effect of the battery module 40.

[0023] By limiting the depth of the groove 11 to more than half the maximum diameter of the liquid cooling pipe 20 and ensuring that the cross-section of the groove 11 is U-shaped, sufficient flow of the liquid cooling medium within the liquid cooling pipe 20 can be guaranteed to ensure heat exchange efficiency. Furthermore, by adding an adhesive layer that serves as a thermally conductive layer, the heat exchange efficiency is further improved while ensuring the structural stability of the liquid cooling plate assembly.

[0024] In this embodiment, the straight section 22 is flush with the surface of the open side of the substrate 10, which means that the surface of the substrate 10 can form a flat straight surface without any unevenness or other structural features. As a result, when the battery module 40 is installed on the surface of the substrate 10, the straight section 22 can make tight and reliable contact with the battery module 40, which can ensure the reliability of the installation connection between the battery module 40 and the substrate 10, and also ensure the heat exchange effect between the liquid cooling pipe 20 and the battery module 40.

[0025] Of course, in addition to the above-mentioned flush setting, the straight section 22 can also be set slightly protruding from the opening side of the groove 11, so that the straight section 22 can directly contact the battery module 40, and there is a certain gap between the surface of the substrate 10 and the battery module 40. This gap can be filled by filling with structural adhesive, which helps to improve the connection strength between the battery module 40 and the substrate 10.

[0026] like Figure 5 and Figure 7 As shown, in this embodiment, the depth of the groove 11 is greater than half of the maximum diameter D of the liquid cooling pipe 20. This ensures, on the one hand, that the channel size of the liquid cooling pipe 20 is larger, allowing sufficient flow of the liquid cooling medium within the pipe 20 and further improving the heat dissipation effect of the liquid cooling plate assembly; on the other hand, it increases the contact area between the liquid cooling pipe 20 and the groove 11, improving the fixing strength of the liquid cooling pipe 20. It should be noted that the maximum diameter D of the liquid cooling pipe 20 mentioned in this embodiment refers to the maximum distance between two relative positions on the circumference of the liquid cooling pipe 20, which is the distance between two relative positions on the circumference of the arc segment 21, i.e., the diameter of the circle containing the arc segment 21. Due to the arrangement of the straight section 22, the diameter of the liquid cooling pipe 20 is not fixed, but its maximum diameter D is fixed and always equal to the diameter of the circle containing the arc segment 21. By setting the depth of the groove 11 to be greater than 1 / 2 of the maximum diameter D of the liquid cooling tube 20, the center of the arc segment 21 is located inside the groove 11 when the liquid cooling tube 20 is installed in the groove 11, thus leaving a large space inside the liquid cooling tube 20.

[0027] like Figure 5As shown, the cross-section of the groove 11 in this embodiment has a U-shaped structure. The reason for adopting the U-shaped structure is that the distance between the straight section 22 of the liquid cooling pipe 20 and the arc position opposite to the straight section 22 is greater than the radius and less than the diameter. Therefore, the cross-section of the liquid cooling pipe 20 has a shape in which the distance between the two sides first increases and then decreases. If the groove 11 also adopts this shape, it would be more difficult to install the liquid cooling pipe 20 into the groove 11. Therefore, in this embodiment, the groove 11 is set as a U-shaped structure. The distance between the two sides of the opening of the U-shaped structure is slightly greater than the diameter of the liquid cooling pipe 20, so that the liquid cooling pipe 20 can be easily embedded in the groove 11, ensuring the convenience and reliability of the installation between the liquid cooling pipe 20 and the groove 11. This ensures that the liquid cooling plate assembly has sufficient liquid cooling medium flow while facilitating installation.

[0028] In this embodiment, the liquid cooling pipe 20 and the substrate 10 are bonded together. However, other installation methods can be used as needed, such as using snap-fit ​​connections or limiting blocks for positioning and fixation. Based on the bonding method in this embodiment, the liquid cooling plate assembly also includes a first adhesive layer located between the liquid cooling pipe 20 and the inner wall of the groove 11. The first adhesive layer connects the liquid cooling pipe 20 to the inner wall of the groove 11, ensuring the structural stability of the liquid cooling pipe 20 assembly. The first adhesive layer can be made of structural adhesive as needed. During bonding, the structural adhesive is first filled into the groove 11 or applied to the arc-shaped section 21 of the liquid cooling pipe 20. Then, the liquid cooling pipe 20 is placed into the groove 11 and pressed into place, ensuring that the structural adhesive fully fills the gap between the groove 11 and the liquid cooling pipe 20, and that the straight section 22 remains flush with the surface of the substrate 10. After the structural adhesive solidifies, the liquid cooling pipe 20 is installed and fixed.

[0029] During the aforementioned pressing, external equipment such as a pressure device can be used to apply force to the liquid cooling tube 20. This allows the liquid cooling tube 20 to be machined into a cylindrical shape initially, with the straight section 22 subsequently formed by pressing. Specifically, structural adhesive is first filled into the groove 11 or applied to the curved section 21 of the liquid cooling tube 20. Then, the liquid cooling tube 20 is placed into the groove 11. At this point, the straight section 22 of the liquid cooling tube 20 on the opening side of the groove 11 is not planar but curved. Because the groove 11 is shallow, the liquid cooling tube 20 cannot be flush with the surface of the substrate 10; a portion will protrude from the groove 11. Therefore, external equipment such as a pressure device can be used to apply force to the protruding portion of the liquid cooling tube 20 to press the liquid cooling tube into the groove 11. While the arc-shaped section 21 of the tube 20 is tightly integrated with the groove 11, the part of the liquid cooling tube 20 protruding from the groove 11 is pressed into a flat shape, thereby forming a straight section 22. That is, the arc shape is transformed into a flat surface under force, so that the straight section 22 is flush with the surface of the substrate 10, ensuring that the liquid cooling tube 20 can be installed and fixed with the groove 11 under pressure. At the same time, the straight section 22 is processed to form a surface-to-surface contact with the battery module 40, and heat transfer is achieved through surface-to-surface contact, thereby improving the heat exchange effect between the liquid cooling tube 20 and the battery module 40.

[0030] In this embodiment, the liquid cooling pipe 20 is made of a material with high thermal conductivity to ensure good heat exchange between the liquid cooling pipe 20 and the battery module 40 and the substrate 10. The liquid cooling pipe 20 can be made of copper, aluminum, etc. Furthermore, the liquid cooling pipe 20 extends along the surface of the substrate 10 in a spiral, coiled manner. It can extend from one end to the second end along the length of the substrate 10, then turn and extend a short distance along the width direction, then turn again and extend back from the second end to the first end, then turn again and extend a short distance along the width direction, and then turn again and extend from the first end to the second end. This process can be repeated multiple times, the specific number of times depending on the needs, either once or multiple times. This gives the liquid cooling pipe 20 at least one S-shaped structure, improving the heat exchange between the liquid cooling pipe 20 and the substrate 10. The curvature at the bend of the liquid cooling pipe 20 can be set larger as needed to ensure smooth flow of the medium.

[0031] In this embodiment, the first adhesive layer is a thermally conductive layer. The first adhesive layer between the liquid cooling pipe 20 and the inner wall of the groove 11 is set as a thermally conductive layer, so that the substrate 10 also plays a heat exchange role. The heat of the battery module 40 can be transferred to the liquid cooling pipe 20 through the substrate 10, so that the arc section 21 of the liquid cooling pipe 20 also has a heat exchange effect, thereby improving the heat dissipation effect of the liquid cooling plate assembly.

[0032] This embodiment of the liquid cooling plate assembly also includes a connecting surface and a second adhesive layer. The connecting surface is used for mating with the battery module, and therefore includes two parts: the surface of the substrate 10 with the opening side and the straight section 22. Both parts face the battery module, allowing the battery module to be installed at the location of the connecting surface. The second adhesive layer is located on the surface of the connecting surface, allowing the liquid cooling plate assembly to be connected to the battery module 40 through the second adhesive layer, thus ensuring the structural stability of the liquid cooling pipe 20 assembly. The second adhesive layer can be made of structural adhesive as needed. During bonding, the structural adhesive is first applied to the connecting surface or applied to the surface of the battery module 40, and then the battery module 40 is placed on the connecting surface and pressed into place, so that the structural adhesive fully fills the gap between the connecting surface and the battery module 40, and the connecting surface and the battery module 40 remain flush. After the structural adhesive solidifies, the liquid cooling plate assembly can be installed and fixed.

[0033] In this embodiment, the second adhesive layer is a thermally conductive layer, so that the heat exchange effect between the liquid cooling plate assembly and the battery module 40 is not affected by the addition of the second adhesive layer, thus ensuring the structural stability of the liquid cooling plate assembly while maintaining a good heat exchange effect.

[0034] like Figure 2 As shown, the liquid cooling plate assembly in this embodiment also includes a connecting nozzle 30, which is connected to the end of the liquid cooling pipe 20. The connecting nozzle 30 enables communication and cooperation between the liquid cooling pipe 20 and an external liquid supply device, allowing the liquid supply device to deliver liquid cooling medium into the liquid cooling pipe 20 to ensure the heat exchange effect of the liquid cooling pipe 20 assembly. Furthermore, the liquid cooling medium can be periodically updated or replaced to further improve the heat exchange effect of the liquid cooling pipe 20 assembly. In this embodiment, the connecting nozzle 30 is located outside the substrate 10, that is, the end of the groove 11 extending along its length is located on the side of the substrate 10 and communicates with the side of the substrate 10 in the thickness direction. This allows the end of the liquid cooling pipe 20 to be located at the side of the thickness of the substrate 10 and to communicate externally. The connecting nozzle 30 can then be inserted into the end of the liquid cooling pipe 20, thereby achieving the effect of connecting the liquid cooling pipe 20 with the liquid supply device. Of course, in addition to externally mounting the connector 30, a separate mounting groove can also be provided on the substrate. The mounting groove is located at the end of the groove 11 and is connected to the groove 11. The size and shape of the mounting groove match the connector 30, so that the connector 30 can also be embedded on the substrate 10, so that the liquid cooling plate assembly has no protruding parts, the overall structure is more regular, and it is convenient to install it into the housing.

[0035] In this embodiment, the substrate 10 is made of a material with high thermal conductivity to ensure good heat dissipation when the heat of the battery module 40 is transferred to the liquid cooling pipe 20 through the substrate 10; the material can be aluminum alloy plate, aluminum plate, copper plate, etc. Specifically, the arc-shaped segment 21 of the liquid cooling pipe 20 is fixedly connected to the groove 11 of the substrate 10 through a heat-conducting layer. The liquid cooling pipe 20 exchanges heat with the substrate 10 through the heat-conducting layer. Ensuring the high thermal conductivity of the substrate 10 helps to further improve the heat exchange effect of the liquid cooling plate assembly. In addition, the surface of the open side of the substrate 10 and the straight segment 22 are fixedly connected to the battery module 40 through a heat-conducting layer. Except for the straight segment 22, the surface of the open side of the substrate 10 also exchanges heat with the battery module 40 and further with the liquid cooling pipe 20. Ensuring the high thermal conductivity of the substrate 10 helps to further improve the heat exchange effect of the liquid cooling plate assembly. In summary, the substrate 10 needs to exchange heat with the liquid cooling pipe 20 and the battery module 40. Therefore, ensuring the high thermal conductivity of the substrate 10 helps to further improve the heat exchange effect of the liquid cooling plate assembly.

[0036] In this embodiment, the substrate 10 is machined to form a groove 11 for mounting the liquid cooling pipe 20. During machining, the cross-section of the groove 11 should have a U-shaped structure, and the distance between the two sides of the opening of the U-shaped structure should be slightly larger than the diameter of the liquid cooling pipe 20. This allows the liquid cooling pipe 20 to be easily embedded in the groove 11, ensuring the convenience and reliability of the installation between the liquid cooling pipe 20 and the groove 11. This ensures sufficient liquid cooling medium flow for the liquid cooling plate assembly while facilitating installation. The machining process can be carried out by milling, turning, stamping, extrusion, or other forming methods. In addition, when the processing demand of the substrate 10 is large, molds can be designed and manufactured for mass production. The above processing methods can be flexibly selected according to the processing demand of the substrate 10, reducing the manufacturing cost. In summary, machining a groove 11 with a U-shaped cross-section on the substrate 10 to mount the liquid cooling pipe 20 is simple in structure and low in manufacturing cost, while ensuring the convenience and reliability of the installation between the liquid cooling pipe 20 and the groove 11.

[0037] In this embodiment, the groove 11 on the substrate 10 is a continuous curved groove composed of straight segments and arc-shaped bends. The shape of the curve can be serpentine, S-shaped, etc., and the arc-shaped bend can be a large-angle arc-shaped bend. Preferably, it can be a large-circular arc-shaped bend. Specifically, after the substrate 10 is processed to obtain the curved groove 11, the liquid cooling pipe 20 needs to be processed to a shape corresponding to the groove 11. The arc section 21 of the liquid cooling pipe 20 is then fixedly connected to the groove 11 with structural adhesive. The heat transfer between the liquid cooling pipe 20 and the substrate 10 is achieved through the flow of the liquid cooling medium in the liquid cooling pipe 20. When the liquid cooling medium flows in the liquid cooling pipe 20, if the arc bend is a small-angle arc bend, the liquid cooling medium will form large turbulence at the arc bend, resulting in a significant increase in flow resistance. A large-angle arc bend allows the liquid cooling medium to smoothly change its flow direction at the arc bend, reducing the formation of turbulence and thus reducing the flow resistance in the liquid cooling pipe 20. A large circular arc bend is preferred, as it can better reduce the formation of turbulence and further reduce the flow resistance in the liquid cooling pipe 20. The reduction in flow resistance can further improve the heat exchange effect of the liquid cooling plate assembly. Furthermore, the groove 11 on the substrate 10 is a continuous curved groove 11 composed of straight segments and arc bends, which can increase the overall pressure bearing capacity of the substrate 10. When the pressure is transmitted from one part to another along the curve, it can avoid the pressure from concentrating at a certain point or in a certain area, so that the pressure is dispersed and the pressure distribution range is expanded. Therefore, the pressure that the substrate 10 can withstand as a whole increases. In summary, the groove 11, which is a continuous curved groove 11 composed of straight segments and arc bends, has a greater pressure bearing capacity and lower flow resistance, which can further improve the heat exchange effect of the liquid cooling plate assembly.

[0038] like Figure 7 and Figure 8 As shown, this embodiment also includes a battery pack, including a battery module 40 and the liquid cooling plate assembly described above. The battery module 40 is connected to the liquid cooling plate assembly, and the battery module 40 is heat-transferringly engaged with the straight section 22 of the liquid cooling pipe 20 of the liquid cooling plate assembly.

[0039] The battery pack in this embodiment also includes a housing 50, and the connected battery module 40 and liquid cooling plate assembly are placed inside the housing 50 to obtain the battery pack as a whole.

[0040] It should be noted that "multiple" in the above embodiments refers to at least two.

[0041] As can be seen from the above description, the embodiments of this application achieve the following technical effects: 1. This solves the problem of poor heat dissipation performance of liquid cooling plate assemblies in existing technologies; 2. The straight section of the liquid cooling pipe is flush with the side surface of the groove opening, increasing the contact area with the battery module and further improving the heat dissipation effect; 3. An adhesive layer is provided, and the adhesive layer is a thermally conductive layer, which ensures the structural stability of the liquid cooling module while further improving the heat dissipation effect; 4. The groove is designed as a U-shaped structure, which is simple in structure and low in manufacturing cost. At the same time, it ensures the convenience and reliability of installation between the liquid cooling pipe and the groove, thereby ensuring sufficient liquid cooling medium flow for the liquid cooling plate assembly while facilitating installation. 5. The groove is a continuous curved groove composed of straight segments and arc bends, which has a greater pressure bearing capacity and lower flow resistance, and can further improve the heat exchange effect of the liquid cooling plate assembly.

[0042] Obviously, the embodiments described above are only some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort should fall within the scope of protection of this application.

[0043] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0044] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0045] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A liquid-cooled plate assembly, characterized in that, include: A substrate (10) is provided with a groove (11) and the groove (11) has an opening side; Liquid cooling tube (20) is embedded in the groove (11). The circumferential side of the liquid cooling tube (20) has an arc section (21) and a straight section (22). The arc section (21) cooperates with the inner wall of the groove (11), and the straight section (22) is located on the opening side.

2. The liquid-cooled plate assembly according to claim 1, characterized in that, The straight section (22) is flush with the surface of the substrate (10) where the opening side is located.

3. The liquid-cooled plate assembly according to claim 1, characterized in that, The depth of the groove (11) is greater than 1 / 2 of the maximum diameter D of the liquid cooling pipe (20).

4. The liquid-cooled plate assembly according to claim 1, characterized in that, The groove (11) has a U-shaped cross-section.

5. The liquid-cooled plate assembly according to claim 1, characterized in that, The liquid cooling plate assembly also includes a first adhesive layer located between the liquid cooling pipe (20) and the inner wall of the groove (11).

6. The liquid-cooled plate assembly according to claim 5, characterized in that, The first adhesive layer is a thermally conductive layer.

7. The liquid-cooled plate assembly according to claim 1, characterized in that, The liquid cooling plate assembly further includes a connecting surface and a second adhesive layer. The connecting surface includes the surface on the open side of the substrate (10) and the straight section (22). The second adhesive layer is located on the connecting surface. The liquid cooling plate assembly is connected to the battery module through the second adhesive layer.

8. The liquid-cooled plate assembly according to claim 7, characterized in that, The second adhesive layer is a thermally conductive layer.

9. The liquid-cooled plate assembly according to any one of claims 1 to 7, characterized in that, The liquid cooling plate assembly further includes a connector (30) that is connected to the end of the liquid cooling pipe (20) and is located outside the substrate (10); and / or The liquid cooling pipe (20) extends along the surface of the substrate (10), and the liquid cooling pipe (20) has at least one S-shaped structure.

10. A battery pack, characterized in that, The device includes a battery module (40) and a liquid-cooled plate assembly according to any one of claims 1 to 9, wherein the battery module (40) is connected to the liquid-cooled plate assembly, and the battery module (40) is in heat transfer cooperation with the straight section (22) of the liquid-cooled pipe (20) of the liquid-cooled plate assembly.

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