High frequency load sheet with centrally located conductive paste inside cover

Abstract

The utility model discloses a kind of high-frequency load sheets of central point placement conductive glue in lid, including ceramic substrate, lead and lid, the positive side of the ceramic substrate is printed with load sheet pad, positive conductor and resistance, the lead is welded together with the load sheet pad, resistance is printed with glass protective film layer, black protective film layer is printed on the positive circuit of the ceramic substrate, a circle of white epoxy resin glue is point glued on the black protective film layer, the center of the epoxy resin glue is hollow, conductive silver glue is spot-welded in the center hollow of the epoxy resin glue, ground silver paste is printed on the both sides of the ceramic substrate, whole-face conductor is printed on the back of the ceramic substrate, the conductive silver glue is contacted with the positive conductor, the lid is bonded on the epoxy resin glue. The high-frequency load sheet of central point placement conductive glue in lid can meet the need of high requirement standing wave, realize small size high power requirement.

Description

Technical Field

[0001] This utility model relates to the field of microwave technology, and in particular to a high-frequency load sheet with conductive adhesive placed at the center of the cover. Background Technology

[0002] As an indispensable component in communication circuit terminals, most communication base stations currently use high-power ceramic load plates to absorb the reverse input power in communication components.

[0003] In microstrip isolators, high frequencies are used, up to 18GHz. As customers demand higher isolation levels from isolators, the requirements for voltage standing wave ratio (VSWR) of power loads are also increasing. Currently, the mainstream characteristic in the market is a VSWR of 1.5:1 Max at frequencies from DC to 18GHz. When RF signals encounter impedance abrupt changes in the transmission line, reflected waves are generated, leading to a deterioration of the VSWR and failing to meet the required VSWR. Furthermore, microstrip isolators are small in size and require the use of small-size, high-power products, which current power load chips cannot meet. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a high-frequency load sheet with conductive adhesive placed in the center of the cover, which can meet the high requirements of standing wave ratio and achieve high power in small size.

[0005] The technical solution of this utility model is: A high-frequency load cell with conductive adhesive dotted in the center of the cover includes a ceramic substrate, leads, and a cover. The front side of the ceramic substrate is printed with load cell pads, a front conductor, and a resistor. The leads are soldered to the load cell pads. A glass protective film layer is printed on the resistor. A black protective film layer is printed on the front circuit of the ceramic substrate. A ring of white epoxy resin adhesive is dotted on the black protective film layer. The center of the epoxy resin adhesive is hollow. Conductive silver paste is dotted into the hollow center of the epoxy resin adhesive. Grounding silver paste is printed on both sides of the ceramic substrate. A full-surface conductor is printed on the back of the ceramic substrate. The conductive silver paste is in contact with the front conductor. The cover is bonded to the epoxy resin adhesive.

[0006] Furthermore, the front conductor has three locations on the front end and the middle of the ceramic substrate, and the three front conductors are connected by the resistor.

[0007] Furthermore, the load pad is connected to the front conductor located in the middle of the ceramic substrate.

[0008] Furthermore, the conductive silver paste is located above the center of the front conductor in the middle of the ceramic substrate.

[0009] Furthermore, the ceramic substrate is a beryllium oxide ceramic substrate.

[0010] Furthermore, the lead wire is a pure silver lead wire.

[0011] Furthermore, the lid is a white aluminum oxide lid.

[0012] Furthermore, the conductive silver paste has a diameter of 0.4~0.6mm and a thickness of 60~120um, and is a low-ion silver paste with an ion concentration ≤10 ppm.

[0013] The beneficial technical effects of this utility model are: the high-frequency load sheet with conductive adhesive placed in the center of the cover can increase the low-resistance path in the high-resistance area through conductive silver paste, introduce inductive / capacitive components at specific positions, change the electromagnetic field distribution, and adjust the current path. Its power can reach 20W, achieving the requirement of small size and high power. At the same time, the product characteristics meet DC~18GHz, and the voltage standing wave ratio reaches 1.35:1Max, meeting the high requirements of standing wave ratio. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the front structure of the ceramic substrate in this utility model; Figure 2 This is a schematic diagram of the high-frequency load sheet with conductive adhesive placed at the center of the cover of this utility model. Figure 3 This is a side view of the ceramic substrate in this utility model. Figure 4 This is a schematic diagram of the back structure of the ceramic substrate in this utility model. Detailed Implementation

[0015] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0016] The following specific embodiments describe in detail a high-frequency load sheet with conductive adhesive placed in the center of the cover as described in this application, including a ceramic substrate 1, leads 8, and a cover 10. The front side of the ceramic substrate is printed with load sheet pads 12, a front conductor 2, and a resistor 3. The leads are soldered to the load sheet pads. A glass protective film layer 4 is printed on the resistor. A black protective film layer 6 is printed on the front circuit of the ceramic substrate. A ring of white epoxy resin adhesive 9 is applied to the black protective film layer. The center of the epoxy resin adhesive is hollow. Conductive silver paste 7 is applied to the hollow center of the epoxy resin adhesive. Grounding silver paste 5 is printed on both sides of the ceramic substrate. A full-surface conductor is printed on the back side of the ceramic substrate. The conductive silver paste is in contact with the front conductor. The cover is bonded to the epoxy resin adhesive.

[0017] The front conductor has three locations, one at each end and one in the middle of the front side of the ceramic substrate, and the three front conductors are connected by the resistor.

[0018] The load pad is connected to the front conductor located in the middle of the ceramic substrate.

[0019] The conductive silver paste is located above the center of the front conductor in the middle of the ceramic substrate.

[0020] The ceramic substrate is a beryllium oxide ceramic substrate.

[0021] The leads are made of pure silver.

[0022] The lid is a white aluminum oxide lid.

[0023] The conductive silver paste has a diameter of 0.4~0.6mm and a thickness of 60~120um. The conductive silver paste is a low-ion type silver paste with an ion concentration ≤10 ppm.

[0024] The high-frequency load sheet with conductive adhesive dotted in the center of the cover can increase the low-resistance path in the high-resistance region through conductive silver paste, introduce inductive / capacitive components at specific locations, change the electromagnetic field distribution, and adjust the current path. Impedance fine-tuning is achieved through capacitive coupling mechanism: the conductive adhesive dots form a small capacitor with the underlying circuit, changing the local impedance characteristics and achieving precise matching. This design forms a special "sandwich" structure of internal circuitry on a ceramic substrate + black protective insulating layer + conductive silver paste by dotting conductive silver paste on an epoxy resin protective film. Low-ion conductive silver paste eliminates the risk of ion migration, and its impedance value is stable after curing, unaffected by the environment. Its low dielectric loss characteristics do not introduce additional radio frequency attenuation. At the same time, the impedance value of the dispensing area is controllable and repeatable, and the impedance change is small under high temperature environment. Low-ion conductive silver paste ensures the formation of a stable and accurate impedance compensation point in the dispensing area, making the voltage standing wave ratio optimization effect durable and reliable.

[0025] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A high-frequency load sheet with conductive adhesive placed at the center inside the cover, characterized in that: The device includes a ceramic substrate, leads, and a cover. The front side of the ceramic substrate is printed with a load pad, a front conductor, and a resistor. The leads are soldered to the load pads. A glass protective film is printed on the resistor. A black protective film is printed on the front circuit of the ceramic substrate. A ring of white epoxy resin is applied to the black protective film. The center of the epoxy resin is hollow. Conductive silver paste is applied to the hollow center of the epoxy resin. Grounding silver paste is printed on both sides of the ceramic substrate. A full-surface conductor is printed on the back of the ceramic substrate. The conductive silver paste is in contact with the front conductor. The cover is bonded to the epoxy resin.

2. The high-frequency load sheet with conductive adhesive centrally placed inside the cover according to claim 1, characterized in that: The front conductor has three locations, one at each end and one in the middle of the front side of the ceramic substrate, and the three front conductors are connected by the resistor.

3. The high-frequency load sheet with conductive adhesive centrally placed inside the cover according to claim 2, characterized in that: The load pad is connected to the front conductor located in the middle of the ceramic substrate.

4. A high-frequency load sheet with conductive adhesive centrally placed inside the cover according to claim 3, characterized in that: The conductive silver paste is located above the center of the front conductor in the middle of the ceramic substrate.

5. A high-frequency load sheet with conductive adhesive centrally placed inside the cover according to claim 1, characterized in that: The ceramic substrate is a beryllium oxide ceramic substrate.

6. The high-frequency load sheet with conductive adhesive centrally placed inside the cover according to claim 1, characterized in that: The leads are made of pure silver.

7. A high-frequency load sheet with conductive adhesive centrally placed inside the cover according to claim 1, characterized in that: The lid is a white aluminum oxide lid.

8. A high-frequency load sheet with conductive adhesive centrally placed inside the cover according to claim 1, characterized in that: The conductive silver paste has a diameter of 0.4~0.6mm and a thickness of 60~120um. The conductive silver paste is a low-ion type silver paste with an ion concentration ≤10 ppm.

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