Transmission structure of waveguide and radio frequency module

Abstract

The application discloses a waveguide transmission structure and a radio frequency module. The waveguide transmission structure applied to the radio frequency module comprises a conversion block provided with a first waveguide channel and a second waveguide channel; the first waveguide channel is located in a first area of the conversion block and penetrates through the conversion block; and the second waveguide channel is located in a second area of the conversion block and is a counterbore. The disclosure can be compatible with both signal vertical direction and parallel direction waveguide transmission requirements, so that the signal path can be output from the bottom or changed to be output from the side, and has great flexibility. The radio frequency module is comprehensively improved in functional flexibility, performance stability and application economy, and can be widely adapted to signal transmission requirements in different scenes.

Description

Technical Field

[0001] This application relates to the technical field of waveguide transmission, and more particularly to a waveguide transmission structure and radio frequency module. Background Technology

[0002] With the rapid development of satellite communication, flat panel antennas and phased array antennas have been rapidly diversified, resulting in a flourishing industry. This has led to diverse requirements for signal input port shapes, and different manufacturers design their flat panel antenna systems differently. Some antenna systems require the RF module to be placed horizontally on the antenna to achieve a minimum height design (e.g., Figure 1 Some require stacking on the back of the antenna to achieve a minimum area design with a small height (e.g.) Figure 2 ).

[0003] Because rectangular waveguides have high power capacity and low loss, they are commonly used as signal interconnect interfaces for modules in high-power microwave bands. When the RF module is required to be placed flat on the antenna module, the waveguide port of the RF module must be side-out, such as... Figure 1 When stacking on the back of the antenna to achieve a minimum area, the waveguide ports of the RF module must be bottom-mounted, such as... Figure 2 .

[0004] Currently, because rectangular waveguides are mechanical rigid structures without installation flexibility, different output structures need to be designed for different installation methods in order to match different planar antenna systems, thus making it impossible to achieve compatibility for multiple application scenarios. Utility Model Content

[0005] The purpose of this utility model embodiment is to provide a waveguide transmission structure and radio frequency module that can solve the above-mentioned problems existing in the prior art.

[0006] To achieve the above objectives, this application adopts the following technical solution: On the one hand, a waveguide transmission structure is provided for use with a radio frequency module, which includes: The conversion block has a first waveguide channel and a second waveguide channel; The first waveguide channel is located in the first region of the conversion block and extends through the conversion block; The second waveguide channel is located in the second region of the conversion block, and the second waveguide channel is a countersunk hole.

[0007] Preferably, the conversion block includes a first connecting surface and a second connecting surface that are parallel to each other, and the axis of the first waveguide channel is perpendicular to the first connecting surface.

[0008] Preferably, the second waveguide channel is formed on the second connecting surface, and a positioning groove is sunken at the bottom of the countersunk hole of the second waveguide channel; A positioning step is maintained between the edge of the positioning groove and the countersunk hole of the second waveguide channel.

[0009] Preferably, at least one positioning hole is provided on the conversion block.

[0010] Preferably, at least one connection hole is provided on the conversion block.

[0011] On the other hand, a radio frequency module including any of the waveguides described above is provided, comprising: The first substrate has a mounting groove for connecting a conversion block. A first through hole for connecting a first waveguide channel and a second through hole for connecting a second waveguide channel are provided at the bottom of the mounting groove. The other opening of the second through hole is located on the side of the first substrate. The second substrate is fixedly connected to the bottom of the substrate, and a signal output port is provided on the second substrate; The signal output port may correspond to either the first waveguide channel or the second waveguide channel.

[0012] Preferably, the conversion block can be connected to the mounting slot via a first connection method or a second connection method; In the first connection method, the first connection surface is fitted to the bottom of the mounting groove, and the signal output port corresponds to the first waveguide channel; and In the second connection method, the second connection surface is attached to the bottom of the mounting groove, and the signal output port corresponds to the second waveguide channel.

[0013] Preferably, it also includes a first filler block that can be filled between the first waveguide channel and the signal output port.

[0014] Preferably, it also includes a second filler block that can be filled between the second waveguide channel and the signal output port.

[0015] Preferably, a protrusion is provided on the second filling block, which allows it to be engaged in the positioning groove within the second positioning channel.

[0016] The beneficial effects of this application are as follows: 1. Through the differentiated design of the first waveguide channel and the second waveguide channel, and with the two connection methods of the conversion block, bidirectional output of signal top transmission and side transmission can be directly realized.

[0017] 2. The second filler block achieves gapless assembly with the second waveguide channel through precise engagement between the protrusion and the positioning groove, and a tight fit between the outer edge of the protrusion and the positioning step, preventing signal leakage from gaps. The first waveguide channel is a vertical through-hole, with a short and bend-free path, reducing signal path loss within the channel. Both channels are structurally designed to prevent filler block misalignment, thus preventing signal reflection caused by waveguide impedance mismatch.

[0018] 3. The first substrate and the second substrate adopt a layered structure with fixed connection between the top and bottom. The signal output port is integrated on the second substrate, and the waveguide channel is integrated on the conversion block. The whole is vertically stacked rather than horizontally laid out, which significantly reduces the space occupied in the plane. This achieves a comprehensive improvement in the functional flexibility, performance stability and application economy of the RF module, and can be widely adapted to the signal transmission needs in different scenarios. Attached Figure Description

[0019] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.

[0020] Figure 1 A schematic diagram of the waveguide-side structure for the installation design of existing device modules and antennas; Figure 2 A schematic diagram of the waveguide bottom structure for the installation design of existing device modules and antennas; Figure 3 This is a schematic diagram of the planar structure of the conversion block of the radio frequency module according to an embodiment of this application; Figure 4 This is a three-dimensional structural diagram of the conversion block of the radio frequency module described in one embodiment of this application; Figure 5 This is a schematic diagram of the structure of the first substrate of the radio frequency module described in one embodiment of this application; Figure 6 This is a schematic diagram of the first mounting method of the conversion block of the radio frequency module according to an embodiment of this application; Figure 7 This is an enlarged structural diagram of the internal portion of the conversion block of the radio frequency module in a first mounting configuration according to an embodiment of this application; Figure 8 This is a cross-sectional view of the first mounting method of the conversion block of the radio frequency module described in one embodiment of this application; Figure 9 This is a schematic diagram of the second mounting method of the conversion block of the radio frequency module according to an embodiment of this application; Figure 10 This is an enlarged structural diagram of the internal portion of the conversion block of the radio frequency module in a second mounting configuration according to an embodiment of this application; Figure 11This is an enlarged structural diagram of the internal portion of the radio frequency module described in a second mounting method according to an embodiment of this application.

[0021] In the picture: 10. Radio frequency module; 100. Transformer block; 101. First connecting surface; 102. Second connecting surface; 1001. First region; 1002. Second region; 110. First waveguide channel; 111. First filling block; 120. Second waveguide channel; 1201. Positioning groove; 1202. Positioning step; 121. Second filling block; 1210. Protrusion; 130. Positioning hole; 140. Connecting hole; 210, First substrate; 211, Mounting groove; 2110, First through hole; 2111, Second through hole; 220, Second substrate; 2201, Signal output port; 230, Partition. Detailed Implementation

[0022] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] like Figures 1 to 11As shown, this embodiment provides a radio frequency (RF) module 10, which includes a signal transmission port. A waveguide transmission structure is connected to the RF module 10, and the signal enters the external environment through the waveguide transmission structure after passing through the signal transmission port. The waveguide transmission structure provided in this disclosure allows the signal to be emitted from either the side or the top of the RF module 10.

[0026] Specifically, the waveguide transmission structure provided in this disclosure includes a conversion block 100 for connecting to the radio frequency module 10. The conversion block 100 has a first waveguide channel 110 and a second waveguide channel 120, and a first filling block 111 can be filled in the first waveguide channel 110, and a second filling block 121 can be filled in the second waveguide channel 120.

[0027] Furthermore, in one embodiment, the conversion block 100 may adopt a rectangular structure, and the edges of the conversion block 100 are provided with rounded corners. The conversion block 100 includes a first connecting surface 101 and a second connecting surface 102, which are parallel to each other. Simultaneously, it is permissible to divide the conversion block 100 into a first region 1001 and a second region 1002 along its centerline, with the first waveguide channel 110 located in the first region 1001 and the second waveguide channel 120 located in the second region 1002.

[0028] The first waveguide channel 110 adopts a through-hole structure, which penetrates the conversion block 100 along a direction perpendicular to the first connecting surface 101. The second waveguide channel 120 adopts a countersunk hole, and the second waveguide channel 120 is formed on the second connecting surface 102. It should be noted that the bottom of the countersunk hole of the second waveguide channel 120 has a positioning groove 1201, which is used to connect the second filler block 121.

[0029] For example, a protrusion 1210 is provided on the second filler block 121, and the shape of the protrusion 1210 matches that of the positioning groove 1201, allowing the second filler block 121 to be snapped into the positioning groove 1201. It is understood that a positioning step 1202 is provided between the edge of the positioning groove 1201 and the countersunk hole of the second waveguide channel 120. Therefore, when the second filler block 121 is placed in the second waveguide channel 120, the outer edge of the protrusion 1210 of the second filler block 121 can be allowed to fit against the positioning step 1202. Through the precise snapping of the protrusion 1210 with the positioning groove 1201 and the tight fit between the outer edge of the protrusion 1210 and the positioning step 1202, the second filler block 121 achieves gapless assembly with the channel, preventing signal leakage from gaps and reducing leakage loss. Simultaneously, it prevents waveguide impedance mismatch caused by filler block misalignment, reducing signal reflection loss.

[0030] Understandably, the first waveguide channel 110 is a through-hole perpendicular to the first connecting surface 101, which can directly guide signals from the top of the RF module 10 into the external environment, adapting to scenarios requiring direct upward signal transmission. The second waveguide channel 120 is a countersunk hole on the second connecting surface 102, which can guide signals from the side of the RF module 10, adapting to scenarios with narrow internal space and top obstructions. Therefore, without replacing the entire RF module 10 or the waveguide conversion block 100, the signal output direction can be selected according to the actual installation layout, significantly reducing the application scenario limitations of the RF module 10 and improving the flexibility of device integration.

[0031] In one embodiment, the radio frequency module 10, which includes a waveguide transmission structure, further includes a first substrate 210 and a second substrate 220. The first substrate 210 and the second substrate 220 are connected to each other, and a partition 230 is provided between the first substrate 210 and the second substrate 220.

[0032] Specifically, the first substrate 210 has a mounting groove 211 for connecting the conversion block 100. A first through hole 2110 for connecting the first waveguide channel 110 and a second through hole 2111 for connecting the second waveguide channel 120 are formed at the bottom of the mounting groove 211. The other opening of the second through hole 2111 is located on the side of the first substrate 210. The second substrate 220 is fixedly connected to the bottom of the first substrate 210, and a signal output port 2201 is provided on the second substrate 220.

[0033] It should be noted that the converter block 100 can be connected to the mounting slot 211 via either a first connection method or a second connection method. In the first connection method, the first connecting surface 101 is attached to the bottom of the mounting slot 211, and the signal output port 2201 corresponds to the first waveguide channel 110. In the second connection method, the second connecting surface 102 is attached to the bottom of the mounting slot 211, and the signal output port 2201 corresponds to the second waveguide channel 120.

[0034] Understandably, the first connection method and the second connection method allow the conversion block 100 to be connected to the first substrate 210 in two different ways. Simultaneously, this corresponds to two different signal transmission methods: transmission along the side of the first substrate 210 and transmission along the top of the first substrate 210.

[0035] Specifically, for the signal transmission requirements of the equipment, whether there are components stacked on top, only gaps on the side, or the side is blocked and direct transmission from the top is required, there is no need to modify the overall structure of the RF module 10, nor is it necessary to purchase two modules with different orientations. The requirements can be met simply by adjusting the installation method of the conversion block 100.

[0036] Meanwhile, the first substrate 210 and the second substrate 220 adopt a layered structure with fixed vertical connection, and the signal output port 2201 is integrated into the second substrate 220, while the waveguide channel is integrated into the conversion block 100. The overall structure is vertically stacked rather than horizontally laid out, occupying less planar space and better meeting the current development needs of miniaturization of electronic devices.

[0037] It should be noted that the conversion block 100 is processed in a coplanar manner with the first substrate 210 of the RF module 10 to ensure that the conversion block 100 and the first substrate 210 of the RF module 10 are completely coplanar. This ensures that the RF module 10 fits well with the mounting plane and ensures good heat dissipation.

[0038] In one embodiment, to improve the connection between the converter block 100 and the mounting slot 211, at least one positioning hole 130 and at least one connecting hole 140 may be provided on the converter block 100. A positioning pin and a threaded hole are correspondingly provided on the mounting slot 211. The positioning hole 130 on the converter block 100 connects with the positioning pin, and the converter block 100 is locked into the mounting slot 211 by screws. For example, two positioning pins with a diameter of 2 mm and a machining accuracy of ±0.03 mm may be provided to ensure high-precision interconnection between the converter block 100 and the RF module 10 substrate.

[0039] Understandably, in one embodiment, six countersunk screws can be used to ensure good contact between the substrate and the first substrate 210. Specifically, after the countersunk screws are tightened, the highest point of the screw is 0.1mm lower than the first substrate 210 of the RF module 10, ensuring that the countersunk screws do not interfere with the interconnection between the RF module 10 and the mounting plane, and do not affect heat dissipation. When the default mounting method is the first mounting method, to switch to the second mounting method, the six countersunk screws can be removed, the conversion block 100 can be rotated 180 degrees and installed, and the six countersunk screws can be tightened again to convert the first mounting method to the second mounting method. Similarly, the same conversion method can be used to convert the second mounting method to the first mounting method.

[0040] Furthermore, the first and second installation methods can be switched at any time according to the needs of the field application scenario to realize the installation requirements of horizontal interconnection or vertical interconnection between the RF module 10 and the subsequent antenna module.

[0041] In summary, this disclosure provides a waveguide transmission structure and an RF module. Through the differentiated design of the first waveguide channel 110 and the second waveguide channel 120, and with the two connection methods of the conversion block 100, bidirectional output of signal top transmission and side transmission can be directly realized.

[0042] The second filler block 121 achieves gapless assembly with the second waveguide channel 120 through a precise engagement between the protrusion 1210 and the positioning groove 1201, and a tight fit between the outer edge of the protrusion 1210 and the positioning step 1202, thus preventing signal leakage from gaps. The first waveguide channel 110 is a vertical through-hole, with a short and bend-free path, reducing signal path loss within the channel. Both channels are structurally designed to prevent filler block misalignment and signal reflection caused by waveguide impedance mismatch.

[0043] The first substrate 210 and the second substrate 220 adopt a layered structure with fixed connection between the top and bottom. The signal output port 2201 is integrated on the second substrate 220, and the waveguide channel is integrated on the conversion block 100. The whole is vertically stacked rather than horizontally laid out, which significantly reduces the space occupied in the plane and realizes a comprehensive improvement in the functional flexibility, performance stability and application economy of the RF module 10. It can be widely adapted to the signal transmission needs in different scenarios.

[0044] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no special meaning.

[0045] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0046] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0047] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. A waveguide transmission structure applied to a radio frequency module (10), characterized in that, include: The conversion block (100) has a first waveguide channel (110) and a second waveguide channel (120). The first waveguide channel (110) is located in the first region (1001) of the conversion block (100) and extends through the conversion block (100). The second waveguide channel (120) is located in the second region (1002) of the conversion block (100), and the second waveguide channel (120) is a countersunk hole.

2. The waveguide transmission structure according to claim 1, characterized in that, The conversion block (100) includes a first connecting surface (101) and a second connecting surface (102) that are parallel to each other, and the axis of the first waveguide channel (110) is perpendicular to the first connecting surface (101).

3. The waveguide transmission structure according to claim 2, characterized in that, The second waveguide channel (120) is opened on the second connecting surface (102), and a positioning groove (1201) is sunken at the bottom of the countersunk hole of the second waveguide channel (120). There is a positioning step (1202) between the edge of the positioning groove (1201) and the countersunk hole of the second waveguide channel (120).

4. The waveguide transmission structure according to claim 3, characterized in that, At least one positioning hole (130) is provided on the conversion block (100).

5. The waveguide transmission structure according to claim 4, characterized in that, At least one connection hole (140) is provided on the conversion block (100).

6. A radio frequency module comprising a transmission structure of the waveguide according to any one of claims 1 to 5, characterized in that, include: The first substrate (210) has a mounting groove (211) for connecting the conversion block (100). The bottom of the mounting groove (211) has a first through hole (2110) for connecting the first waveguide channel (110) and a second through hole (2111) for connecting the second waveguide channel (120). The other opening of the second through hole (2111) is located on the side of the first substrate (210). The second substrate (220) is fixedly connected to the bottom of the substrate, and a signal output port (2201) is provided on the second substrate (220). The signal output port (2201) may correspond to the first waveguide channel (110) or the second waveguide channel (120).

7. The radio frequency module according to claim 6, characterized in that, The conversion block (100) can be connected to the mounting slot (211) via a first connection method or a second connection method; In the first connection method, the first connection surface (101) is attached to the bottom of the mounting groove (211), and the signal output port (2201) corresponds to the first waveguide channel (110); and In the second connection method, the second connection surface (102) is attached to the bottom of the mounting groove (211), and the signal output port (2201) corresponds to the second waveguide channel (120).

8. The radio frequency module according to claim 7, characterized in that, It also includes a first filler block (111) that can be filled between the first waveguide channel (110) and the signal output port (2201).

9. The radio frequency module according to claim 7, characterized in that, It also includes a second filler block (121) that allows filling between the second waveguide channel (120) and the signal output port (2201).

10. The radio frequency module according to claim 9, characterized in that, A protrusion (1210) is provided on the second filling block (121), the protrusion (1210) being able to engage with the positioning groove (1201) in the second positioning channel.

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