An impedance matching device for an antenna and an antenna testing apparatus
Patent Information
- Application Number
- CN202522553132.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-01
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-12-01
AI Technical Summary
（1）调试不便：当需要调整天线性能（如谐振点、带宽）时，必须重新设计或飞线修改主板上的匹配电路，过程繁琐、周期长、成本高；
本申请的阻抗匹配装置通过将匹配网络从主板分离并集成到独立的基板上，实现了天线调试的模块化和标准化。由于采用了基板与匹配网络的分离式设计，并在基板上设置了专门的第一连接部、信号传输部和匹配网络，使得工程师可以在不修改主板的情况下，通过更换或调整基板上的匹配网络来适配不同天线，极大简化了调试流程。
Smart Images
Figure CN224789930U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to wireless communication, and in particular to an impedance matching device for antennas and an antenna testing device. Background Technology
[0002] In the research, development, testing, and production of wireless communication devices such as IoT terminals and smartphones, it is often necessary to replace different antennas to evaluate their performance. In traditional designs, antennas, matching circuits, and RF connectors are usually designed directly and fixed on the same test main circuit board (PCB).
[0003] This integrated design has the following significant drawbacks: (1) Inconvenient debugging: When it is necessary to adjust the antenna performance (such as resonant point and bandwidth), the matching circuit on the motherboard must be redesigned or modified by flying wires, which is cumbersome, time-consuming and costly. (2) Lack of versatility: One antenna size or structure usually corresponds to one motherboard design, which cannot be quickly adapted to other antenna sizes, resulting in a lack of flexibility in the research and development and production process; (3) Unreliable connection: In the test, the existing technology often uses spring pins or conductive foam for temporary connection, which has problems such as unstable contact impedance and easy loosening, affecting the accuracy of the test results.
[0004] Therefore, there is an urgent need in this field for an impedance matching device to quickly adapt to different antennas, simplify the debugging process of antenna matching circuits, improve debugging efficiency and connection reliability, and at the same time ensure the transmission quality of radio frequency signals.
[0005] It should be noted that the information disclosed in the background section above is only for understanding the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention
[0006] The technical problem this invention aims to solve is "how to achieve high efficiency, flexibility, and reliability in antenna impedance matching and debugging." To address this problem, this application provides an impedance matching device and an antenna testing equipment.
[0007] To achieve the above objectives, the present invention adopts the following technical solution: This application provides an impedance matching device for an antenna, including a substrate, a matching network disposed on the substrate, and a grounding mechanism. The substrate has a first connection portion disposed on a first surface, which is used to electrically connect to the feed point of the antenna. The substrate includes a signal transmission portion, one end of which is electrically connected to the first connection portion and the other end of which is electrically connected to the input terminal of the matching network. The matching network is used to achieve impedance matching. The grounding mechanism is electrically connected to the signal transmission portion for grounding.
[0008] In some embodiments, the system further includes an RF connector disposed on the substrate, wherein the input end of the RF connector is electrically connected to the output end of the matching network, and the output end of the RF connector is used for electrical connection to an external test instrument.
[0009] In some embodiments, a second connection portion is provided on the second surface of the substrate, a signal transmission portion penetrates the substrate in the thickness direction, a matching network is provided on the second surface of the substrate, and the signal transmission portion is electrically connected to the matching network through the second connection portion.
[0010] In some embodiments, the grounding mechanism penetrates the substrate in the thickness direction and is disposed around the signal transmission section.
[0011] In some embodiments, the first connection portion includes a first welding pad for welding to the feed point of the antenna.
[0012] In some embodiments, the signal transmission section includes a metallized via, the second connection section includes a second bonding pad, the metallized via penetrates the substrate in the thickness direction, and its two ends are electrically connected to the first bonding pad and the second bonding pad respectively, and the mating network is bonded to the second bonding pad.
[0013] In some embodiments, the grounding mechanism includes a grounding via that penetrates the substrate in the thickness direction and is disposed around the metallized via.
[0014] In some embodiments, the planar projection size of the substrate is larger than the projection size of the antenna.
[0015] In some embodiments, impedance matching can be adjusted by soldering selected RC inductors and / or zero-ohm resistors into the matching network.
[0016] Another party to this application also provides an antenna testing device, including the impedance matching device of this application.
[0017] This utility model has the following beneficial effects: The impedance matching device of this application achieves modularity and standardization in antenna debugging by separating the matching network from the motherboard and integrating it onto an independent substrate. Due to the separate design of the substrate and the matching network, and the dedicated first connection part, signal transmission part, and matching network on the substrate, engineers can adapt different antennas by replacing or adjusting the matching network on the substrate without modifying the motherboard, greatly simplifying the debugging process.
[0018] Furthermore, this application, as an independent impedance matching device, is soldered to antennas of different models and sizes via its first connection part, and connected to external test instruments or standard motherboard interfaces via its RF connector. This modular design allows the impedance matching device of this application to quickly adapt to various antennas by configuring different matching networks, greatly improving the flexibility of R&D and production processes and simplifying material management. It solves the problem of lack of versatility and flexibility in traditional integrated designs.
[0019] Furthermore, the impedance matching device of this application fixes and electrically connects the antenna feed point to the first connection part on the substrate by welding, eliminating unstable temporary connection methods such as spring pins and conductive foam. This robust connection ensures the stability and consistency of the signal transmission path, guarantees the accuracy of test data, and allows the debugging device to be directly used for small-batch production, solving the problems of unreliable connection and unstable contact impedance during testing.
[0020] Furthermore, the impedance matching device of this application achieves a vertical transition of the signal in the substrate thickness direction through the signal transmission section. Simultaneously, by setting a grounding shield structure composed of a grounding mechanism and surrounding the signal transmission section, a controllable impedance transmission channel is formed. This combined design effectively suppresses parasitic inductance introduced by vias, reduces signal reflection, and provides a low-loss, high-integrity transmission path for high-frequency radio frequency signals, effectively ensuring the transmission quality and integrity of high-frequency radio frequency signals.
[0021] Furthermore, the impedance matching device of this application provides sufficient process margins and safety clearances for soldering operations by designing the planar projection size of the substrate to be larger than the projection size of the connected antenna. This not only facilitates alignment operations during assembly but also effectively prevents solder paste overflow and the formation of solder balls during reflow soldering, avoiding potential short-circuit risks. It also helps maintain the integrity of the ground plane, ensuring impedance continuity and improving assembly reliability and process yield.
[0022] In summary, the impedance matching device of this application, based on the synergistic effect of the above-mentioned technical features, ultimately achieves a revolutionary improvement in debugging efficiency, reducing high-frequency PCB design problems to simple component selection and soldering operations, greatly lowering the debugging threshold and time cost, while ensuring connection reliability and signal transmission quality. Attached Figure Description
[0023] Figure 1 It is a three-dimensional structural diagram of the impedance matching device for antenna tuning and the antenna in a split-up state, viewed from below. Figure 2 yes Figure 1 A magnified view of a portion of point A in the middle; Figure 3This is a top-down three-dimensional structural diagram of the impedance matching device for antenna tuning and the antenna in its split-up state. Figure 4 yes Figure 3 A magnified view of a portion of point B in the middle. Detailed Implementation
[0024] The embodiments of this utility model are described in detail below. It should be emphasized that the following description is merely exemplary and not intended to limit the scope and application of this utility model.
[0025] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as "connected to" another component, it can be directly connected to or indirectly connected to that other component. Furthermore, a connection can be used for fixing, coupling, or communication.
[0026] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0028] The first aspect of this application provides an impedance matching device for an antenna, including a substrate 11 and a matching network 12 disposed on the substrate 11. The substrate 11 has a first connection portion 111 disposed on a first surface 101. The first connection portion 111 is used to electrically connect to the feed point of an antenna 21. The substrate 11 includes a signal transmission portion 112. One end of the signal transmission portion 112 is electrically connected to the first connection portion 111, and the other end is electrically connected to the input terminal of the matching network 12. The matching network 12 is used to achieve impedance matching.
[0029] In some embodiments, the substrate 11 can be an independent printed circuit board, and the antenna 21 can be a PCB antenna, an FPC antenna, or an LDS antenna, etc. An RF connector 13 is also provided on the substrate 11. The input end of the RF connector 13 is electrically connected to the output end of the matching network 12. The output end of the RF connector 13 can be electrically connected to external test instruments via other interfaces such as IPEX or SMA interfaces. During testing, the RF signal received or transmitted by the antenna is conducted to the substrate 11 through the first connection part 111, and then transmitted to the matching network 12 via the signal transmission part 112 for impedance matching to achieve impedance matching for antenna tuning. Finally, the signal is output to external test instruments through the RF connector 13 to achieve antenna performance evaluation.
[0030] Through the above setup, this application separates the matching network from the traditional test motherboard and integrates it onto an independent substrate, achieving modularization and standardization of antenna debugging. Due to the separate design of the substrate and matching network, and the dedicated first connection section, signal transmission section, and matching network on the substrate, engineers can adapt different antennas by replacing or adjusting the matching network on the substrate without modifying the motherboard, greatly simplifying the debugging process.
[0031] Furthermore, this application, as an independent impedance matching device, connects to antennas of different models and sizes via its first connection part, and connects to external test instruments or motherboard standard interfaces via its RF connector 13. This modular design allows the impedance matching device of this application to quickly adapt to various antennas by configuring different matching networks, greatly improving the flexibility of R&D and production processes and simplifying material management. It solves the problem of lack of versatility and flexibility in traditional integrated designs.
[0032] In some embodiments, the first connection portion 111 of this application may be a first welding pad, and the antenna may be provided with an antenna metallization via 22. An antenna welding pad 23 corresponding to the first welding pad is provided at the antenna metallization via 22. By welding the first welding pad to the antenna welding pad, the first connection portion 111 is electrically connected to the antenna feed point.
[0033] With the above-described configuration, the impedance matching device of this application fixes and electrically connects the antenna feed point to the first connection portion on the substrate 11 by welding, eliminating the need for unstable temporary connections such as traditional spring pins and conductive foam. This robust connection ensures the stability and consistency of the signal transmission path, guarantees the accuracy of test data, and allows the debugging device to be directly used for small-batch production, solving the problems of unreliable connections and unstable contact impedance during testing.
[0034] In some embodiments, the substrate 11 is further provided with a second connection portion 113 on the second surface 102, the signal transmission portion 112 penetrates the substrate 11 in the thickness direction, the matching network 12 is disposed on the second surface of the substrate 11, the signal transmission portion 112 is electrically connected to the matching network 12 through the second connection portion 113, the substrate 11 further includes a grounding mechanism 114 for grounding, the grounding mechanism 114 penetrates the substrate 11 in the thickness direction, and the grounding mechanism 114 is disposed around the signal transmission portion 112.
[0035] In some preferred embodiments, the signal transmission section 112 includes a metallized via, the second connection section 113 includes a second solder pad, the metallized via penetrates the substrate 11 in the thickness direction, and its two ends are electrically connected to the first solder pad and the second solder pad, respectively. The mating network 12 is soldered to the second solder pad, and the grounding mechanism 114 includes a grounding via penetrating the substrate 11 in the thickness direction and surrounding the metallized via. Optionally, the grounding vias can be arranged at specific intervals in one or more loops, and these grounding vias form an electrical connection with the grounding copper foil 115 on both sides of the substrate 11.
[0036] Through the above-described configuration, the impedance matching device of this application achieves a vertical transition of the signal in the substrate thickness direction via the signal transmission section. Simultaneously, by setting a grounding shield structure composed of a grounding mechanism array and arranging it around the signal transmission section 112, a controllable impedance transmission channel is formed. This combined design effectively suppresses parasitic inductance introduced by vias, reduces signal reflection, and provides a low-loss, high-integrity transmission path for high-frequency radio frequency signals, effectively ensuring the transmission quality and integrity of high-frequency radio frequency signals.
[0037] In some embodiments, the planar projection size of the substrate 11 is larger than the projection size of the antenna. Optionally, the length and width of the substrate 11 are 2 mm and 0.5 mm larger than those of the antenna 21, respectively. This configuration provides sufficient layout area for the first solder pad of the substrate, enabling it to form an effective and reliable solder connection with the antenna solder pad 23 on the back of the antenna. Furthermore, this configuration creates a safe distance between the first solder pad and the edge of the substrate 11, preventing solder paste overflow and the formation of solder balls during reflow soldering, avoiding potential short circuit risks, and facilitating assembly alignment. Furthermore, this configuration also maintains the integrity of the antenna metallized vias and the ground plane around the metallized vias of the substrate 11, ensuring the impedance continuity of the RF signal transmission path and contributing to signal integrity.
[0038] With the above-described configuration, the impedance matching device of this application designs the planar projection size of the substrate 11 to be larger than the projection size of the connected antenna, providing sufficient process margins and safety clearance for soldering operations. This not only facilitates alignment operations during assembly but also effectively prevents solder paste overflow and the formation of solder balls during reflow soldering, avoiding potential short-circuit risks. Furthermore, it helps maintain the integrity of the ground plane, ensuring impedance continuity and improving assembly reliability and process yield.
[0039] In some embodiments, the impedance matching of the matching network 12 is adjustable, specifically by soldering selected RC inductors and / or zero-ohm resistors. The matching network 12 includes Π-type and / or T-type matching networks.
[0040] In some embodiments, a microstrip line can be led out from the second bonding pad on the second surface of the substrate 11 and connected to a Π-type matching network consisting of two capacitors C1 and C2 and an inductor L1. The specific component values of the matching network 12, such as 0402 or 0201 packaged surface mount components, can be designed and adjusted according to the target frequency band of the antenna. For example, when used as an antenna module with a center frequency of 8 GHz, the values of C1, C2, and L1 can be set to 0.5 pF, 0.3 pF, and 0.3 nH, respectively, to form the impedance matching corresponding to the antenna module.
[0041] With the above settings, this application only needs to solder or replace resistors, capacitors and inductors of different values on the matching network 12 to adjust the impedance matching of the matching network 12, thereby achieving fast and low-cost impedance matching debugging for antennas of different specifications.
[0042] The second aspect of this application provides an antenna testing device that employs the impedance matching device of this application to achieve performance evaluation of the antenna.
[0043] In summary, the impedance matching device and antenna testing equipment of this application, based on the synergistic effect of the aforementioned technical features, ultimately achieve a revolutionary improvement in debugging efficiency, reducing high-frequency PCB design problems to simple component selection and soldering operations, greatly lowering the debugging threshold and time cost, while ensuring connection reliability and signal transmission quality.
[0044] The background section of this utility model may include background information about the problems or environment of this utility model, and is not necessarily a description of the prior art. Therefore, the content included in the background section does not constitute an admission of the prior art by the applicant.
[0045] The above description, in conjunction with specific / preferred embodiments, provides a further detailed explanation of the present invention and should not be construed as limiting the specific implementation of the present invention to these descriptions. For those skilled in the art, various substitutions or modifications can be made to these described embodiments without departing from the concept of the present invention, and all such substitutions or modifications should be considered within the protection scope of the present invention. In the description of this specification, the reference to terms such as "an embodiment," "some embodiments," "preferred embodiment," "example," "specific example," or "some examples," etc., indicates that the specific features, structures, materials, or characteristics described in connection with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples. Without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification and the features of different embodiments or examples. Although embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations may be made herein without departing from the scope of protection of the patent application.
Claims
1. An impedance matching device for an antenna, characterized in that, The device includes a substrate (11), a matching network (12) disposed on the substrate (11), and a grounding mechanism (114). The substrate (11) has a first connection portion (111) on a first surface (101). The first connection portion (111) is used to electrically connect to the feed point of the antenna. The substrate (11) includes a signal transmission portion (112). One end of the signal transmission portion (112) is electrically connected to the first connection portion (111), and the other end is electrically connected to the input end of the matching network (12). The matching network (12) is used to achieve impedance matching. The grounding mechanism (114) is electrically connected to the signal transmission portion (112) for grounding.
2. The impedance matching device for an antenna according to claim 1, characterized in that, It also includes an RF connector (13) disposed on the substrate (11), the input end of the RF connector (13) being electrically connected to the output end of the matching network (12), and the output end of the RF connector (13) being used for electrical connection with external test instruments.
3. The impedance matching device for an antenna according to claim 1, characterized in that, The substrate (11) has a second connection portion (113) on its second surface (102). The signal transmission portion (112) penetrates the substrate (11) in the thickness direction. The matching network (12) is disposed on the second surface of the substrate (11). The signal transmission portion (112) is electrically connected to the matching network (12) through the second connection portion (113).
4. An impedance matching device for an antenna according to claim 3, characterized in that, The grounding mechanism (114) penetrates the substrate (11) in the thickness direction and is arranged around the signal transmission section (112).
5. An impedance matching device for an antenna according to claim 4, characterized in that, The first connection part (111) includes a first welding pad for welding to the feed point of the antenna.
6. An impedance matching device for an antenna according to claim 5, characterized in that, The signal transmission section (112) includes a metallized via, and the second connection section (113) includes a second solder pad. The metallized via penetrates the substrate (11) in the thickness direction, and its two ends are electrically connected to the first solder pad and the second solder pad, respectively. The matching network (12) is soldered to the second solder pad.
7. An impedance matching device for an antenna according to claim 6, characterized in that, The grounding mechanism (114) includes a grounding via that penetrates the substrate (11) in the thickness direction and is disposed around the metallized via.
8. An impedance matching device for an antenna according to claim 5, characterized in that, The planar projection size of the substrate (11) is larger than the projection size of the antenna.
9. An impedance matching device for an antenna according to claim 1, characterized in that, The matching network (12) can be adjusted for impedance matching by welding selected RC inductance and / or zero-ohm resistors.
10. An antenna testing device, characterized in that, Includes the impedance matching device as described in any one of claims 1-9 above.