An EML laser and optical module

Abstract

The utility model relates to an EML laser and optical module, and the optical module comprises an EML control circuit, a light emitting assembly and a light receiving assembly, the light emitting assembly and the light receiving assembly are connected with a digital signal processing circuit respectively, the digital signal processing circuit is connected with an electric interface circuit, the light emitting assembly comprises an EML laser, the input end of the EML control circuit is connected with a main control circuit, the output end of the EML control circuit is connected with the EML laser of the light emitting assembly, the main control circuit is connected with the electric interface circuit, the EML laser comprises a carrier, a modulator and a laser, the modulator and the laser are arranged on the surface of the carrier, the carrier is provided with a first lug on one side of the modulator, the surface of the first lug is provided with radio frequency tracks for transmitting high-speed modulation electric signal, the carrier is provided with a second lug on the other side of the modulator, the surface of the second lug is provided with a matching resistance, the modulator is electrically connected with the radio frequency tracks through a first gold wire, and the modulator is electrically connected with the matching resistance through a second gold wire.

Description

Technical Field

[0001] This utility model belongs to the field of optical communication technology, specifically relating to an EML laser and optical module. Background Technology

[0002] 800G optical modules will be used for backhaul in 5G. The current mainstream design for 800G 10km optical modules uses an 8-channel 100G PAM4 transmission method, and the entire module has the following characteristics:

[0003] (1) Eight EML lasers are required, namely two sets of CWDM4 lasers. Each set of lasers requires a TEC controller to ensure the laser operating temperature in order to obtain the best performance. The power consumption is high.

[0004] (2) Two OMUXs are required on the optical path of the transmitter to combine eight lasers into two lasers for transmission; eight PIN detectors and two TIAs are required on the receiver. Two ODEMUXs are required on the optical path to divide the two optical signals (each with four wavelengths) into eight independent optical signals for subsequent circuit processing. The optical path is complex and the cost is high.

[0005] (3) The structure adopts a 2-way transmit and 2-way receive optical interface, which makes the structural design more complex and further increases the cost;

[0006] (4) The eight lasers and detectors make the optical device coupling process complex, the module yield is low, and mass production requires higher production process and high production cost.

[0007] (5) The failure rate of lasers is relatively high. Using more lasers means a significant increase in the overall failure rate of the module.

[0008] (6) See Figure 1 Traditional EML lasers (laser ceramic carriers) have long laser bonding wires and large parasitic inductance. Utility Model Content

[0009] The purpose of this invention is to overcome at least one defect in the prior art and to provide an EML laser and optical module.

[0010] In a first aspect, this utility model discloses an EML laser, including a carrier, a modulator, and a DFB laser. The modulator and the DFB laser are disposed on the surface of the carrier. The carrier has a first protrusion on one side of the modulator, and the surface of the first protrusion is provided with radio frequency traces for transmitting high-speed modulated electrical signals. The carrier has a second protrusion on the other side of the modulator, and the surface of the second protrusion is provided with a matching resistor. The modulator is electrically connected to the radio frequency traces through a first gold wire, and the modulator is electrically connected to the matching resistor through a second gold wire.

[0011] In some embodiments, the carrier is a ceramic carrier.

[0012] Secondly, this utility model also discloses an optical module, including an optical emitting component, wherein the optical emitting component includes an EML laser as described in the first aspect.

[0013] In some embodiments, the optical module of this utility model further includes a power supply circuit, an electrical interface circuit, a digital signal processing circuit, a main control circuit, an EML control circuit, and an optical receiving component. The power supply circuit provides power to the entire optical module. The optical emitting component and the optical receiving component are respectively connected to the digital signal processing circuit. The digital signal processing circuit and the main control circuit are connected to the electrical interface circuit. The input terminal of the EML control circuit is connected to the main control circuit, and the output terminal of the EML control circuit is connected to the EML laser of the optical emitting component.

[0014] In some embodiments, the optical module of this invention further includes a receiving optical power sampling circuit, wherein the input terminal of the receiving optical power sampling circuit is connected to the optical receiving component, and the output terminal of the receiving optical power sampling circuit is connected to the main control circuit.

[0015] In some embodiments, the optical emitting assembly includes an emitting optical element and a multi-channel EML laser, wherein the emitting optical element is used to combine and collimate the optical signals output by the multi-channel EML laser and transmit them into an optical fiber;

[0016] And / or,

[0017] The light emitting component is equipped with a semiconductor cooler;

[0018] The optical module also includes a TEC driving circuit, the input of which is connected to the main control circuit, and the output of which is connected to the semiconductor cooler in the optical emitting component.

[0019] In some embodiments, the optical receiving component includes a receiving optical element, a multi-channel detector, and a multi-channel transimpedance amplifier. The receiving optical element is used to receive light input from the optical fiber and split it into multiple different beams. The multi-channel detector is used to receive multiple different beams of light respectively and convert the optical signal into a current signal. The transimpedance amplifier is used to convert the current signal into a voltage signal and amplify it before transmitting it to a digital signal processing circuit.

[0020] In some embodiments, the digital signal processing circuit includes a transmit clock recovery circuit, a receive clock recovery circuit, a digital core processing circuit, a laser driver circuit, a signal output circuit, a transmit speed generator for aggregating 2N channels of 100G PAM4 signals into N channels of 200G PAM4 signals, and a receive speed generator for restoring N channels of 200G PAM4 signals into 2N channels of 100G PAM4 signals. The input terminal of the transmit clock recovery circuit is connected to the electrical interface circuit, the output terminal of the transmit clock recovery circuit is connected to the input terminal of the transmit speed generator, the output terminal of the transmit speed generator is connected to the first input terminal of the digital core processing circuit, the first output terminal of the digital core processing circuit is connected to the input terminal of the laser driver circuit, the output terminal of the laser driver circuit is connected to the optical emitting component, the input terminal of the receive clock recovery circuit is connected to the optical receiving component, the output terminal of the receive clock recovery circuit is connected to the input terminal of the receive speed generator, the output terminal of the receive speed generator is connected to the second input terminal of the digital core processing circuit, the second output terminal of the digital core processing circuit is connected to the input terminal of the signal output circuit, and the output terminal of the signal output circuit is connected to the electrical interface circuit, where N is a positive integer.

[0021] In some embodiments, the digital signal processing circuit includes a DSP chip, and the transmit clock recovery circuit, receive clock recovery circuit, digital core processing circuit, laser drive circuit, signal output circuit, transmit speed changer and receive speed changer are integrated within the DSP chip.

[0022] And / or,

[0023] It also includes a crystal oscillator circuit, which is connected to the digital signal processing circuit.

[0024] In some embodiments, the optical module of this utility model further includes a voltage regulator circuit, which includes a DC-DC boost circuit and an LDO buck circuit. The input terminal of the DC-DC boost circuit is connected to the module power supply, the output terminal of the DC-DC boost circuit is connected to the input terminal of the LDO buck circuit, and the output terminal of the LDO buck circuit is connected to the optical receiving component to supply power to the optical receiving component.

[0025] This utility model has at least the following beneficial effects:

[0026] 1. This utility model optimizes the laser carrier structure, shortens the laser bonding wire length, reduces parasitic inductance, and increases the bandwidth of the optical component. This utility model can increase the bandwidth of the optical component from 30GHz to 55GHz, meeting the requirements of single-channel 200G applications.

[0027] 2. The 800G LR4 product of this utility model adopts a 4-channel 200G PAM4 transmission method, which only requires 4 EML lasers and 4 PIN detectors. The number of optical devices and optical components is reduced by half, the optical path is simpler, and the cost is lower. It effectively solves the pain points of high power consumption, high cost and low yield of existing 800G 2xLR4 optical modules, and has lower requirements for production process, making it suitable for mass production. The 800G LR4 optical module with 4x200G solution is of great significance.

[0028] 3. Furthermore, the optical module of this utility model adopts QSFP-DD packaging to develop an 800G optical module that is compatible with the future 1.6T packaging requirements, enabling equipment manufacturers and operators to smoothly transition from 800G to 1.6G without changing the interface design, thereby reducing design and modification costs. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of a traditional EML laser (laser ceramic carrier);

[0031] Figure 2 This is a schematic diagram of an EML laser (laser ceramic carrier) from one perspective of the present invention.

[0032] Figure 3 This is a schematic diagram of an EML laser (laser ceramic carrier) from another perspective of this utility model;

[0033] Figure 4 This is a three-dimensional schematic diagram of a laser ceramic carrier according to the present invention;

[0034] Figure 5 A schematic block diagram of the optical module provided in this embodiment of the utility model;

[0035] Figure 6 This is a schematic block diagram of a DSP circuit provided in one embodiment of the present invention.

[0036] In the attached diagram, 1 is the carrier, 11 is the first bump, 12 is the second bump, 2 is the first gold wire, 3 is the second gold wire, 4 is the RF trace, and 5 is the matching resistor. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0038] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0039] The current 800G 2xLR4 10km optical module is mainly an 8x100G solution, which uses 8 EML lasers and 8 PIN detectors. The corresponding optical components are numerous and the optical path is complex, resulting in low module yield and high cost, making it unsuitable for large-scale mass production.

[0040] The 800G LR4 uses a 4x200G solution, requiring only 4 EML lasers and 4 PIN detectors. This reduces the number of optical devices and components by half. While maintaining the same transmission distance, it offers lower cost and power consumption, and a higher yield, making it suitable for mass production. It is the mainstream solution for future 800G optical modules, effectively addressing the pain points of high power consumption, high cost, and low yield of existing 800G 2xLR4 optical modules. Furthermore, it has lower requirements for manufacturing processes, making it suitable for mass production. The 800G LR4 optical module using the 4x200G solution is of great significance.

[0041] Therefore, researching 800G LR4 optical modules in QSFP-DD packaging based on the IEEE 802.3dj standard will effectively address the pain points of high cost, high power consumption, and low yield of current 800G optical modules based on 8 channels, which is of great significance.

[0042] In view of this, it is necessary to develop a miniaturized QSFP-DD packaged 800G (4x200G) 10km optical module based on a single-channel 200G, with an electrical interface supporting 8*100G PAM4 mode, 4-channel wavelengths meeting IEEE Std802.3dj requirements, a maximum transmission distance of 10km, an operating temperature of 0~70℃, and a power consumption of <15W, for application in 5G and next-generation 6G mobile backhaul network scenarios.

[0043] See Figures 2 to 4This utility model provides an EML laser, including a carrier 1, a modulator, and a DFB laser. The modulator and the DFB laser are disposed on the surface of the carrier 1. The carrier 1 has a first protrusion 11 on one side of the modulator. The surface of the first protrusion 11 is provided with radio frequency traces for transmitting high-speed modulated electrical signals. The carrier 1 has a second protrusion 12 on the other side of the modulator. The surface of the second protrusion 12 is provided with a matching resistor 5. The modulator is electrically connected to the radio frequency trace 4 through a first gold wire 2 and to the matching resistor 5 through a second gold wire 3.

[0044] In some embodiments, the carrier 1 is a ceramic carrier.

[0045] In some embodiments, the surface of the first bump 11 is further provided with a grounding region, which is separated from the radio frequency trace. The purpose of providing a grounding region on the surface of the first bump is to improve high-frequency performance.

[0046] See Figure 5 and Figure 6 This utility model embodiment also provides an optical module, including an optical emitting assembly (TOSA), which includes an EML laser as described in any of the above embodiments.

[0047] In some embodiments, the EML is a single-ended driver.

[0048] In some embodiments, the optical module of this utility model further includes a power supply circuit, an electrical interface circuit (gold finger), a digital signal processing circuit, a main control circuit, an EML control circuit, and an optical receiver assembly (ROSA). The power supply circuit provides power to the entire optical module. The optical transmitter assembly and the optical receiver assembly are respectively connected to the digital signal processing circuit. The digital signal processing circuit and the main control circuit are connected to the electrical interface circuit. The input terminal of the EML control circuit is connected to the main control circuit, and the output terminal of the EML control circuit is connected to the EML laser of the optical transmitter assembly.

[0049] The EML control circuit is used to provide the laser bias current and the modulator DC bias. Existing EML control circuits can be used for this purpose.

[0050] In some embodiments, the electrical interface circuit (gold finger) is a QSFP-DD electrical interface circuit.

[0051] In some embodiments, the power supply circuit includes a soft-start circuit and a power management circuit. The input terminal of the soft-start circuit is connected to the electrical interface circuit, and the output terminal of the soft-start circuit is connected to the input terminal of the power management circuit. The output terminal of the power management circuit is connected to the digital signal processing circuit and the main control circuit to supply power to them. The power management circuit controls the power supply to the DSP and the voltage of the laser drive circuit. The electrical interface circuit provides the input voltage to the soft-start circuit, which is then connected to each power supply unit after the soft-start process. The function of the soft-start circuit is to prevent large inrush currents from affecting the module during power-on and power-off. The soft-start time can be modified by adjusting the resistance and capacitance values ​​of the external circuit.

[0052] The power management circuit includes a first power management circuit and a second power management circuit. The first power management circuit reduces the input voltage to 0.75V and 0.9V respectively through two step-down DC-DC converters to power the DSP circuit. The second power management circuit stabilizes the input voltage at 3.3V through a DC-DC converter to power the laser drive circuit, preventing input voltage fluctuations from affecting the laser performance.

[0053] The power management circuit consists of three step-down DC-DC converters and external circuitry, which convert the voltage input from the soft-start circuit into stable 0.75V, 0.9V, and 0.72V to power the DSP circuit.

[0054] In some embodiments, the optical transmitting assembly (TOSA) and the optical receiving assembly (ROSA) transmit signals to the PCB board via gold wire bonding.

[0055] In some embodiments, the main controller circuit is used to implement digital diagnostics, register configuration, automatic optical power control, information storage, and control power management circuitry.

[0056] In some embodiments, the main controller circuit includes an MCU and an analog DAC circuit. This design uses an STM32L451RBI3 MCU. Since its DAC pin count is insufficient for the design requirements, a single PWM pin is used to simulate the DAC output for controlling related circuits. The MCU connects to the QSFP-DD electrical interface circuit via an IIC interface, providing relevant digital diagnostic signals to the QSFP-DD electrical interface circuit according to protocol requirements. It reads and writes the internal registers of the DSP and DC-DC converter via the analog host IIC. It connects to the EN pin of the DC-DC converter via an I / O port to control the power-on timing of the DSP and laser, as well as the implementation of LPMODE mode. A sampling circuit monitors the TOSA temperature, module temperature, module operating voltage, optical power of the four transmitters, optical power of the four receivers, and TEC current. A PID algorithm controls the TEC drive output current to stabilize the laser temperature.

[0057] In some embodiments, the optical module of this invention further includes a receiving optical power sampling circuit. The input terminal of the receiving optical power sampling circuit is connected to the optical receiving component, and the output terminal of the receiving optical power sampling circuit is connected to the main control circuit. The receiving optical power sampling circuit is used to convert optical signals into electrical signals, perform signal conditioning, and then transmit them to the MCU of the main control circuit.

[0058] In some embodiments, the output of the optical power sampling circuit is connected to the VADC of the MCU.

[0059] In some embodiments, the optical emitting assembly includes an emitting optical element and a multi-channel EML laser. The emitting optical element is used to combine and collimate the optical signals output from the multi-channel EML laser and transmit them into the optical fiber. The optical signals emitted by the multi-channel EML laser are converged into a beam of light after passing through the optical element and then transmitted into the optical fiber.

[0060] In some embodiments, the optical emitting assembly includes a 4-channel 200G EML laser, a thermoelectric cooler (TEC), and optical elements. The modulated optical signal, after passing through the optical elements, is converged from four beams into one beam and transmitted into the optical fiber; the optical signal rate is 4 × 200G PAM4. The thermoelectric cooler (TEC) is used to control the temperature of the laser, keeping the laser temperature and performance stable.

[0061] In some embodiments, the optical emission assembly (TOSA) is COB packaged and internally includes a 4-channel 200G EML laser, a thermoelectric cooler (TEC), and optical components. The DSP-integrated 4-channel EML linear laser drive circuit converts the input signal and drives the 4-channel 200G EML laser to convert the electrical signal into an optical signal. The bias current and modulation amplitude of the four laser channels can be controlled by external analog signals. The center values ​​of the four wavelengths emitted by the 4-channel 200G EML laser are 1295.56nm, 1300.05nm, 1304.58nm, and 1309.14nm. The thermoelectric cooler (TEC) controls the laser temperature, ensuring the module operates within 0~70℃ and the laser wavelength remains stable within ±1nm, meeting transmission standards. The optical components combine and collimate the optical signals output from the four lasers and transmit them into the optical fiber, enabling high-speed transmission of four wavelengths via a single-fiber LC interface at the transmitting end.

[0062] In some embodiments, the light emitting component includes a semiconductor cooler.

[0063] In some embodiments, the optical module further includes a TEC driving circuit, the input of which is connected to the main control circuit, and the output of which is connected to a semiconductor cooler within the optical emitting component.

[0064] In some embodiments, the optical receiving component includes a receiving optical element, a multi-channel detector, and a multi-channel transimpedance amplifier. The receiving optical element is used to receive light input from the optical fiber and split it into multiple different beams. The multi-channel detector is used to receive multiple different beams of light respectively and convert the optical signal into a current signal. The transimpedance amplifier is used to convert the current signal into a voltage signal and amplify it before transmitting it to a digital signal processing circuit.

[0065] In some embodiments, the optical receiving assembly internally includes a 4-channel 200G PIN detector, a 4-channel transimpedance amplifier (TIA), and optical elements. Light entering from the optical fiber is split into four different beams after passing through the optical elements, each beam entering one of the four detectors. The detectors convert the optical signal into a current signal, the transimpedance amplifier converts the current signal into a voltage signal, amplifies it, and then transmits the signal to the DSP circuit for processing via gold wires. An external voltage regulator circuit provides four stable 3.3V power supplies, ensuring that the operation of the four PIN channels is unaffected by fluctuations in the module's power supply.

[0066] In some embodiments, the optical receiver assembly (ROSA) is packaged in a COB package and internally includes a 4-channel 200G avalanche detector, a 4-channel transimpedance amplifier (TIA), and optical elements. The input optical signal is split into four different beams after passing through the optical elements and enters the avalanche detector. The detector converts the received optical signal into an electrical signal, and the transimpedance amplifier circuit amplifies the signal and outputs it to the DSP circuit.

[0067] In some embodiments, see Figure 6 The digital signal processing circuit includes a transmit clock recovery circuit, a receive clock recovery circuit, a digital core processing circuit, a laser driver circuit, a signal output circuit, a transmit speed generator for aggregating 2N channels of 100G PAM4 signals into N channels of 200G PAM4 signals, and a receive speed generator for restoring N channels of 200G PAM4 signals into 2N channels of 100G PAM4 signals. The input terminal of the transmit clock recovery circuit is connected to the electrical interface circuit, the output terminal of the transmit clock recovery circuit is connected to the input terminal of the transmit speed generator, the output terminal of the transmit speed generator is connected to the first input terminal of the digital core processing circuit, the first output terminal of the digital core processing circuit is connected to the input terminal of the laser driver circuit, the output terminal of the laser driver circuit is connected to the optical emitting component, the input terminal of the receive clock recovery circuit is connected to the optical receiving component, the output terminal of the receive clock recovery circuit is connected to the input terminal of the receive speed generator, the output terminal of the receive speed generator is connected to the second input terminal of the digital core processing circuit, the second output terminal of the digital core processing circuit is connected to the input terminal of the signal output circuit, and the output terminal of the signal output circuit is connected to the electrical interface circuit. N is a positive integer.

[0068] In some embodiments, N is 4.

[0069] In some embodiments, the laser driving circuit employs a 4-channel EML driving circuit.

[0070] In some embodiments, the receive clock recovery circuit is mainly used to recover the electrical signal output from the transimpedance amplifier inside the optical receiver component. The digital core processing circuit is responsible for processing the recovered signal and outputting it to the electrical interface circuit through the signal output circuit. The transmit clock recovery circuit is mainly used to recover the electrical signal input from the electrical interface circuit. After being processed by the digital core processing circuit, the recovered electrical signal is output to the 4-channel EML linear laser drive circuit integrated inside the chip through the signal output circuit. The 4-channel EML linear laser drive circuit converts the input signal and drives a 4-channel 200G EML laser to convert the electrical signal into an optical signal. The crystal oscillator circuit is mainly used to provide a clock reference for the DSP chip.

[0071] Specifically, the transmit clock recovery circuit restores the clock speed of the 8×100G PAM4 electrical signals input from the electrical interface circuit. The DSP's internal speed changer converts the 8 100G signals into 4 200G signals. After signal processing by the digital core processing circuit, the laser driver circuit outputs the PAM4 electrical signals to the laser. Throughout the signal processing phase, parameters including, but not limited to, CTLE, OFFSET / SLA, Swing, De-emphasis, and LOOP Bandwidth can be configured by reading and writing the values ​​of the DSP's internal registers to optimize the signal quality output to the laser.

[0072] Specifically, the receive clock recovery circuit restores the clock speed of the electrical signals output by the optical receiving component. After signal processing by the digital core processing circuit, the DSP's internal speed changer converts the four 200G signals into eight 100G signals, which are then output as 8×100G PAM4 electrical signals to the electrical interface circuit. Throughout the signal processing phase, the values ​​of the DSP's internal registers can be read and written to adjust the receiver's equalization, SLA, and output amplitude to ensure that the relevant signal parameters meet protocol requirements. Furthermore, the DSP can implement LOS indication via hardware pins and can also output hardware LOL and INTL signals to the MCU for functions such as photoelectric signal detection. Simultaneously, the DSP integrates a four-channel 200G EML laser driver, driving four lasers to output modulated optical signals.

[0073] In some embodiments, the digital signal processing circuit includes a DSP chip. The transmit clock recovery circuit, receive clock recovery circuit, digital core processing circuit, laser driver circuit, signal output circuit, and transmit and receive speed changers are integrated within the DSP chip. In this example, the DSP chip is the Broadcom BCM85822A0, which integrates a transmit clock recovery circuit, a receive clock recovery circuit, a digital signal processing circuit, a 4-channel linear EML driver circuit, etc. Its internal registers can adjust the quality of the output signal, supporting 8 channels of 100G PAM4 signal input and output, meeting different application scenarios. Of course, this invention is not limited to the above embodiment; other types of DSP chips can also be used in this embodiment.

[0074] In some embodiments, the optical module of this invention further includes a crystal oscillator circuit, which is connected to the digital signal processing circuit. The external crystal oscillator circuit consists of a 312.5MHz crystal oscillator chip and peripheral circuitry, providing an accurate clock frequency for the DSP chip.

[0075] In some embodiments, the optical module of this utility model further includes a voltage regulator circuit. The input terminal of the voltage regulator circuit is connected to the module power supply, the control terminal of the voltage regulator circuit is connected to the main control circuit, and the output terminal of the voltage regulator circuit is connected to the optical receiving component to supply power to the optical receiving component.

[0076] In some embodiments, the voltage regulator circuit includes a DC-DC boost circuit and an LDO buck circuit. The input terminal of the DC-DC boost circuit is connected to the module power supply, and the output terminal of the DC-DC boost circuit is connected to the input terminal of the LDO buck circuit. The output terminal of the LDO buck circuit is connected to the optical receiving component to supply power to the optical receiving component. The EN pin of the DC-DC boost circuit and / or the LDO buck circuit is connected to the main control circuit.

[0077] In some embodiments, the voltage regulator circuit employs a 3.3V voltage regulator circuit. The DC-DC boost circuit raises the module power supply to 3.6V, and the LDO further stabilizes the 3.6V input power supply at a 3.3V output, preventing fluctuations in the module power supply from causing unstable reception performance.

[0078] The module is powered by the main control circuit.

[0079] This invention provides an EML-based optical module in a QSFP-DD package (integrated 4-channel 800G QSFP-DD package), operating at 0~70 degrees Celsius, with a transmission rate of 800G (4x200G) and a transmission distance of 10km, applicable to scenarios such as 5G mobile backhaul. This invention employs a DSP chip for clock recovery and compensation of high-speed signals, ensuring that the electrical signals input to the laser and output to the electrical interface meet the transmission requirements specified in the protocol. By integrating the laser driver, the transmission distance is shortened, and signal distortion caused by reflection is reduced. This invention utilizes four lasers and four detectors to achieve a lower cost, lower power consumption, and higher reliability, making it a superior solution suitable for mass production.

[0080] The TOSA and ROSA of the optical module of this utility model adopt COB packaging and can share the same process and equipment as the current mature 400G LR4 products, which reduces the cost of new equipment, fixture mold opening cost and time cost of process exploration, and shortens the product development cycle.

[0081] This invention's optical module uses a DSP chip for signal processing. Besides the clock recovery function provided by a CDR, it can also perform dispersion compensation, noise removal, and nonlinear interference correction. It supports high-order modulation formats to improve spectral efficiency, addressing device and channel transmission effects, and handling signal-to-noise ratio issues, resulting in more stable system transmission performance. Furthermore, the DSP chip integrates a 4-channel linear EML driver, saving cost and PCB layout space compared to external drivers.

[0082] The optical module of this invention adopts QSFP-DD packaging to develop an 800G optical module that is compatible with the future 1.6T packaging requirements, enabling equipment manufacturers and operators to smoothly transition from 800G to 1.6G without changing the interface design, thus reducing design and modification costs.

[0083] The solution adopted in this invention has significant advantages over the current mainstream 800G 10km optical modules in terms of cost, power consumption, yield, and manufacturing process. This is because the current mainstream 800G 10km optical modules use an 8-channel design, doubling the number of optical devices and components, and requiring higher manufacturing capabilities, resulting in higher costs.

[0084] This invention optimizes the laser carrier structure, shortens the laser bonding wire length, reduces parasitic inductance, and increases the optical component bandwidth from 30GHz to 55GHz, meeting the requirements of single-channel 200G applications.

[0085] Example embodiments have been disclosed herein, and while specific terminology has been used, it is for illustrative purposes only and should be construed as such, and is not intended to be limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of the invention as set forth in the appended claims.

Claims

1. An EML laser, characterized in that: The device includes a carrier, a modulator, and a DFB laser. The modulator and the DFB laser are disposed on the surface of the carrier. The carrier has a first protrusion on one side of the modulator, and the surface of the first protrusion has radio frequency traces for transmitting high-speed modulated electrical signals. The carrier has a second protrusion on the other side of the modulator, and the surface of the second protrusion has a matching resistor. The modulator is electrically connected to the radio frequency traces through a first gold wire, and the modulator is electrically connected to the matching resistor through a second gold wire.

2. The EML laser as described in claim 1, characterized in that: The carrier is a ceramic carrier.

3. An optical module, comprising an optical emitting component, characterized in that: The optical emitting component includes the EML laser as described in claim 1 or 2.

4. The optical module as described in claim 3, characterized in that: It also includes a power supply circuit, an electrical interface circuit, a digital signal processing circuit, a main control circuit, an EML control circuit, and an optical receiving component. The power supply circuit provides power to the entire optical module. The optical transmitting component and the optical receiving component are respectively connected to the digital signal processing circuit. The digital signal processing circuit and the main control circuit are connected to the electrical interface circuit. The input terminal of the EML control circuit is connected to the main control circuit, and the output terminal of the EML control circuit is connected to the EML laser of the optical transmitting component.

5. The optical module as described in claim 4, characterized in that: It also includes a receiving optical power sampling circuit, the input of which is connected to the optical receiving component, and the output of which is connected to the main control circuit.

6. The optical module as described in claim 3 or 4, characterized in that: The optical emission assembly includes an emitting optical element and a multi-channel EML laser. The emitting optical element is used to combine and collimate the optical signals output by the multi-channel EML laser and transmit them into the optical fiber. And / or, The light emitting component is equipped with a semiconductor cooler; The optical module also includes a TEC driving circuit, the input of which is connected to the main control circuit, and the output of which is connected to the semiconductor cooler in the optical emitting component.

7. The optical module as described in claim 4, characterized in that: The optical receiving component includes a receiving optical element, a multi-channel detector, and a multi-channel transimpedance amplifier. The receiving optical element is used to receive light input from the optical fiber and split it into multiple different beams. The multi-channel detector is used to receive multiple different beams of light respectively and convert the optical signal into a current signal. The transimpedance amplifier is used to convert the current signal into a voltage signal and amplify it before transmitting it to the digital signal processing circuit.

8. The optical module as described in claim 4, characterized in that: The digital signal processing circuit includes a transmit clock recovery circuit, a receive clock recovery circuit, a digital core processing circuit, a laser driver circuit, a signal output circuit, a transmit speed generator for aggregating 2N channels of 100G PAM4 signals into N channels of 200G PAM4 signals, and a receive speed generator for restoring N channels of 200G PAM4 signals into 2N channels of 100G PAM4 signals. The input terminal of the transmit clock recovery circuit is connected to the electrical interface circuit, the output terminal of the transmit clock recovery circuit is connected to the input terminal of the transmit speed generator, the output terminal of the transmit speed generator is connected to the first input terminal of the digital core processing circuit, the first output terminal of the digital core processing circuit is connected to the input terminal of the laser driver circuit, the output terminal of the laser driver circuit is connected to the optical emitting component, the input terminal of the receive clock recovery circuit is connected to the optical receiving component, the output terminal of the receive clock recovery circuit is connected to the input terminal of the receive speed generator, the output terminal of the receive speed generator is connected to the second input terminal of the digital core processing circuit, the second output terminal of the digital core processing circuit is connected to the input terminal of the signal output circuit, and the output terminal of the signal output circuit is connected to the electrical interface circuit. N is a positive integer.

9. The optical module as described in claim 4 or 8, characterized in that: The digital signal processing circuit includes a DSP chip, a transmit clock recovery circuit, a receive clock recovery circuit, a digital core processing circuit, a laser drive circuit, a signal output circuit, and a transmit speed changer and a receive speed changer integrated within the DSP chip. And / or, It also includes a crystal oscillator circuit, which is connected to the digital signal processing circuit.

10. The optical module as described in claim 3 or 4, characterized in that: It also includes a voltage regulator circuit, which includes a DC-DC boost circuit and an LDO buck circuit. The input of the DC-DC boost circuit is connected to the module power supply, the output of the DC-DC boost circuit is connected to the input of the LDO buck circuit, and the output of the LDO buck circuit is connected to the optical receiving component to supply power to the optical receiving component.

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