Modular intelligent power device housing

Abstract

The application relates to the technical field of intelligent power supplies, and discloses a modular intelligent power supply device shell which comprises a box body, a plurality of cavities are formed in the box body, a box door is arranged on each cavity, the plurality of cavities correspond to high-voltage switch modules, power distribution transformer modules and low-voltage power distribution modules respectively, a heat dissipation plate is arranged on the box body, the heat dissipation plate is arranged above the box door, a plurality of first heat dissipation holes are formed in the heat dissipation plate, and heat generated in the box body can be discharged to the outside of the box body through the plurality of first heat dissipation holes. When the modular intelligent power supply device works, the plurality of first heat dissipation holes formed in the heat dissipation plate can discharge the heat in the box body, the heat in the box body can be better dissipated, the situation that the high temperature in the box body affects the function of the power supply device is reduced, and the heat dissipation performance of the modular intelligent power supply device is further improved.

Description

Technical Field

[0001] This application relates to the technical field of smart power supplies, and in particular to a modular smart power supply device housing. Background Technology

[0002] Modular intelligent power supply equipment is a type of power supply equipment that integrates high-voltage switchgear, distribution transformers, and low-voltage distribution devices. It has multiple functions and a modular design, and is widely used in various fields such as education, experimentation, industry, and data centers.

[0003] In related technologies, modular intelligent power supply equipment includes a cabinet with multiple chambers inside, each with a door. The multiple chambers correspond to a high-voltage switch module, a distribution transformer module, and a low-voltage distribution module, respectively.

[0004] Because modular intelligent power supply devices generate a lot of heat during operation, and the enclosure is usually in a sealed state, the overall heat dissipation inside the enclosure is poor, and most of the heat is concentrated inside the enclosure. Excessive temperature inside the enclosure may affect the function of the power supply device. Utility Model Content

[0005] To improve the heat dissipation of modular intelligent power supply devices, this application provides a modular intelligent power supply device housing.

[0006] This application provides a modular intelligent power supply device housing, which adopts the following technical solution: A modular intelligent power supply device housing includes a box body with multiple chambers inside. Each chamber has a door. The multiple chambers correspond to a high-voltage switch module, a distribution transformer module, and a low-voltage distribution module, respectively. A heat dissipation plate is provided on the box body and is located above the door. The heat dissipation plate has multiple first heat dissipation holes, through which the heat generated inside the box body can be discharged to the outside of the box body.

[0007] By adopting the above technical solution, when the modular intelligent power supply device is working, multiple first heat dissipation holes are opened on the heat dissipation plate, so that the heat inside the box can be discharged from the multiple first heat dissipation holes, so that the heat inside the box can be better dissipated, reducing the occurrence of excessive temperature inside the box affecting the function of the power supply device, and further improving the heat dissipation of the modular intelligent power supply device.

[0008] Optionally, the box body is provided with a top plate, and the top plate has a plurality of second heat dissipation holes. A heat dissipation channel is formed between the top plate and the surface of the box body away from the ground, and the plurality of second heat dissipation holes are all connected to the heat dissipation channel.

[0009] By adopting the above technical solution, a heat dissipation channel is formed between the top plate and the surface of the box that is away from the ground, and the second heat dissipation hole is connected to the heat dissipation channel. This allows the heat inside the box to enter the heat dissipation channel at the top and then be released to the outside air through the second heat dissipation hole, allowing the heat inside the box to circulate in more directions, thereby enhancing the overall heat dissipation of the equipment.

[0010] Optionally, the housing has multiple through holes and a heat dissipation mesh, which is fixedly connected to the surface of the housing with the through holes and is used to cover the through holes.

[0011] By adopting the above technical solution, the heat dissipation mesh is fixedly connected to the surface of the housing with through holes. The heat dissipation mesh can cover multiple through holes, which not only allows heat in the heat dissipation channel to be dissipated through the heat dissipation mesh, but also reduces the possibility of external impurities entering the housing, thereby enhancing the overall heat dissipation performance of the equipment. Optionally, the enclosure is coated with black heat-dissipating paint.

[0012] By adopting the above technical solution, the black heat-dissipating paint sprayed on the cabinet allows the surface of the cabinet to absorb heat from the inside of the cabinet, enabling better heat dissipation. This is beneficial for cooling down the electrical components inside the cabinet, reducing heat accumulation, and thus enhancing the overall heat dissipation of the equipment.

[0013] Optionally, a limiting block is provided on the outer surface of the housing, and a limiting groove is provided on the limiting block for the heat dissipation mesh to be inserted. A sliding block is slidably connected to the housing, and the sliding block is used to drive the heat dissipation mesh to move towards the limiting groove. A protrusion is provided on the sliding block, and the protrusion is located on the movement path of the heat dissipation mesh leaving the housing. When the heat dissipation mesh is inserted into the limiting groove, the heat dissipation mesh is fixed on the housing.

[0014] By adopting the above technical solution, since the heat dissipation mesh is exposed to the air for a long time, dust or other impurities are easily allowed to enter the holes of the heat dissipation mesh. The staff needs to clean the impurities remaining on the heat dissipation mesh regularly. When the staff needs to disassemble the heat dissipation mesh, the staff first slides the sliding block away from the limiting groove so that the heat dissipation mesh can be disengaged from the limiting groove and slide down. Since the box is generally tall, the installation or disassembly of the heat dissipation mesh by manipulating the sliding block can reduce the height restriction of the staff and make it easier for the staff to install or disassemble the heat dissipation mesh.

[0015] Optionally, the sliding block is provided with a locking block, and the housing is provided with a sliding groove for the locking block to slide in, and the groove wall of the sliding groove is provided with a slot for the locking block to be inserted into; when the locking block is inserted into the slot, the sliding block is fixed to the housing.

[0016] By adopting the above technical solution, a slot for inserting a card block is provided on the groove wall of the sliding block. The operator first drives the sliding block to insert the heat dissipation mesh into the limiting groove, and then inserts the card block on the sliding block into the slot to fix the sliding block, thereby allowing the heat dissipation mesh to be stably inserted into the limiting groove.

[0017] Optionally, the sliding block is provided with a magnet, and the heat dissipation mesh is provided with an iron sheet; when the magnet is attracted to the iron sheet, the heat dissipation mesh is fixed to the sliding block.

[0018] By adopting the above technical solution, the heat dissipation mesh can be fixed on the sliding block by being attracted to the iron sheet by a magnet. The operator can slide the heat dissipation mesh by driving the sliding block, which facilitates the installation or removal of the heat dissipation mesh and reduces the possibility of the heat dissipation mesh detaching from the box.

[0019] Optionally, a spring block is provided on the wall of the card slot, and the spring block is located on the moving path of the card block leaving the card slot; when the card block is inserted into the card slot, the spring block abuts against the surface of the card block away from the bottom wall of the card slot.

[0020] By adopting the above technical solution, the spring block is located on the moving path of the card block leaving the card slot, which can prevent the card block from leaving the card slot, reduce the possibility of the card block leaving the card slot without human intervention, and make the card block more stably fixed in the card slot, thereby making the heat dissipation mesh more secure.

[0021] In summary, this application includes at least one of the following beneficial technical effects: 1. When the modular intelligent power supply device is working, multiple primary heat dissipation holes are provided on the heat dissipation plate, allowing the heat inside the box to be discharged through these holes. This improves the heat dissipation of the box, reduces the possibility of the internal temperature becoming too high and affecting the function of the power supply device, and further enhances the heat dissipation performance of the modular intelligent power supply device.

[0022] 2. A heat dissipation channel is formed between the top plate and the surface of the enclosure that is away from the ground, and the second heat dissipation hole is connected to the heat dissipation channel. This allows the heat inside the enclosure to enter the heat dissipation channel at the top and then be released to the outside air through the second heat dissipation hole, allowing the heat inside the enclosure to circulate in more directions and thus enhancing the overall heat dissipation of the equipment. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of Example 1; Figure 2 This is a partial structural diagram of the top plate in Example 1; Figure 3 This is a structural schematic diagram of Example 2; Figure 4 yes Figure 3 An enlarged schematic diagram of part A in the middle; Figure 5 It is Example 2 Figure 3 Sectional view along line BB; Figure 6 yes Figure 5 An enlarged schematic diagram of section C.

[0024] Reference numerals: 1. Box body; 11. Chamber; 111. Box door; 12. Heat dissipation plate; 121. First heat dissipation hole; 13. Top plate; 131. Second heat dissipation hole; 132. Heat dissipation channel; 14. Mounting plate; 141. Through hole; 15. Heat dissipation mesh; 151. Limiting strip; 152. Iron sheet; 16. Limiting block; 161. Limiting groove; 17. Sliding block; 171. Protrusion; 172. Groove; 173. Locking block; 174. Magnet; 18. Sliding groove; 181. Locking slot; 182. Spring block. Detailed Implementation

[0025] The following is in conjunction with the appendix Figures 1-6 This application will be described in further detail.

[0026] Example 1 This embodiment discloses a modular intelligent power supply device housing. (Refer to...) Figure 1 and Figure 2 A modular intelligent power supply device housing includes a casing 1, within which multiple chambers 11 are formed, each chamber 11 having a rotatable door 111. The multiple chambers 11 correspond to a high-voltage switch module, a distribution transformer module, and a low-voltage distribution module, respectively. The high-voltage switch module includes a high-voltage incoming unit and a high-voltage outgoing unit. The high-voltage incoming unit receives and connects to an external high-voltage power supply, while the high-voltage outgoing unit distributes and safely transmits the high-voltage power to the high-voltage side of the distribution transformer module. The low-voltage distribution module includes an incoming cabinet, a generator access and distribution cabinet, a capacitor cabinet, an outgoing cabinet, a UPS uninterruptible power supply cabinet, and a UPS output distribution unit, etc.

[0027] Reference Figure 1 A heat dissipation plate 12 is installed on the outer surface of the enclosure 1, and the heat dissipation plate 12 is located directly above the enclosure door 111. The heat dissipation plate 12 has a plurality of first heat dissipation holes 121, which are arranged in a rectangular array. The heat generated inside the enclosure 1 can be discharged to the outside of the enclosure 1 through the plurality of first heat dissipation holes 121.

[0028] Reference Figure 2 A top plate 13 is fixedly connected inside the housing 1. Multiple second heat dissipation holes 131 are provided on the top plate 13. A heat dissipation channel 132 is formed between the top plate 13 and the surface of the housing 1 away from the ground, through which hot air passes. The multiple second heat dissipation holes 131 are all connected to the heat dissipation channel 132.

[0029] Reference Figure 2 A mounting plate 14 is fixedly connected to the outer surface of the enclosure 1. Multiple sets of through holes 141 are formed on the mounting plate 14, distributed along the length of the enclosure 1. Each set of through holes 141 contains multiple through holes 141, which are arranged in equilateral and inverted triangular configurations, alternating between the two. A heat dissipation mesh 15 is fixedly connected to the inner surface of the enclosure 1. The heat dissipation mesh 15 is installed on the inner surface of the enclosure 1 by welding, and it covers the multiple through holes 141. The heat dissipation mesh 15 not only allows hot air from inside the enclosure 1 to escape but also prevents external impurities from entering the enclosure 1.

[0030] Reference Figure 2 The outer surface of the enclosure 1 is coated with black heat-dissipating paint, which helps the enclosure 1 dissipate heat.

[0031] The implementation principle of Example 1 is as follows: When the modular intelligent power supply device is working, it will generate a lot of heat. Some of the heat flows from the first heat dissipation hole 121 to the outside air, and some of the heat enters the heat dissipation channel 132 from the second heat dissipation hole 131 and then flows out from the heat dissipation mesh 15, so that the heat inside the box 1 can be discharged.

[0032] Example 2 Reference Figure 3 and Figure 4 The difference between this embodiment and Embodiment 1 is that a limiting strip 151 is fixedly connected to the outer surface of the heat dissipation mesh 15, and the limiting strip 151 surrounds the heat dissipation mesh 15 circumferentially. A limiting block 16 is fixedly connected to the outer surface of the housing 1, and a limiting groove 161 for the heat dissipation mesh 15 to be inserted is formed on the surface of the limiting block 16 near the ground. A sliding block 17 is slidably connected to the outer surface of the housing 1, and multiple sliding blocks 17 are provided. The multiple sliding blocks 17 are respectively located at both ends of the heat dissipation mesh 15, and the sliding blocks 17 can drive the heat dissipation mesh 15 to move towards the bottom wall of the limiting groove 161.

[0033] Reference Figure 4 A protruding strip 171 is fixedly connected to the surface of the sliding block 17 away from the ground. The protruding strip 171 is located on the moving path of the heat dissipation mesh 15 away from the housing 1, and a groove 172 is formed between the protruding strip 171 and the housing 1 for the heat dissipation mesh 15 to be inserted. When the limiting strip 151 is in the groove 172, the protruding strip 171 can abut against the surface of the sliding block 17 away from the housing 1. The operator drives the sliding block 17 to insert the heat dissipation mesh 15 into the limiting groove 161, thereby fixing the heat dissipation mesh 15 to the housing 1.

[0034] Reference Figure 4A locking block 173 is fixedly connected to the surface of the sliding block 17 near the box body 1. Multiple sliding grooves 18 are opened on the outer surface of the box body 1. The sliding grooves 18 extend along the height direction of the box body 1. Each locking block 173 is slidably connected to the corresponding sliding groove 18.

[0035] Reference Figure 4 and Figure 5 The sliding groove 18 has a slot 181 for inserting the card block 173. The operator first moves the sliding block 17 to drive the heat dissipation mesh 15 to slide along the sliding groove 18 toward the bottom wall of the limiting groove 161, so that the heat dissipation mesh 15 is inserted into the limiting groove 161. At this time, the card block 173 can be inserted into the slot 181 to fix the sliding block 17 on the box 1.

[0036] Reference Figure 6 A magnet 174 is fixedly connected to the surface of the sliding block 17 near the limiting block 16, and an iron sheet 152 is fixedly connected to the surface of the limiting strip 151 near the sliding block 17. The worker fixes the heat dissipation mesh 15 to the sliding block 17 by the mutual attraction of the magnet 174 and the iron sheet 152, so that the worker can move the heat dissipation mesh 15 by the sliding block 17.

[0037] Reference Figure 4 A spring block 182 is fixedly connected to the groove wall of the slot 181 near the ground. The spring block 182 is located on the movement path of the card block 173 as it disengages from the slot 181. When the card block 173 is inserted into the slot 181, the spring block 182 abuts against the surface of the card block 173 away from the bottom wall of the slot 181, and the spring block 182 can prevent the card block 173 from disengaging from the slot 181.

[0038] The implementation principle of Example 2 is as follows: When the staff needs to disassemble the heat dissipation mesh 15 for cleaning, the staff first drives the sliding block 17 to make the card block 173 pass through the restriction of the spring block 182 and disengage from the card slot 181. Then, the sliding block 17 slides towards the ground so that the heat dissipation mesh 15 can disengage from the limiting slot 161. The staff can then disassemble the heat dissipation mesh 15. Compared with the welding and fixing method, this provides greater convenience for the staff to disassemble and install the heat dissipation mesh 15.

[0039] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," "third," and similar terms used in this application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. The terms "an" or "a" and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including" and similar terms mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. "Above," "below," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0040] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the design concept of this application should be included within the protection scope of this application.

Claims

1. A modular intelligent power supply device housing, comprising a casing (1), wherein the casing (1) has multiple chambers (11) therein, each chamber (11) having a door (111), and the multiple chambers (11) respectively corresponding to a high-voltage switch module, a distribution transformer module and a low-voltage distribution module, characterized in that: The box (1) is provided with a heat dissipation plate (12), which is located above the box door (111). The heat dissipation plate (12) has multiple first heat dissipation holes (121) and the heat generated inside the box (1) can be discharged to the outside of the box (1) through the multiple first heat dissipation holes (121).

2. The modular intelligent power supply device housing according to claim 1, characterized in that: The box (1) is provided with a top plate (13), and a plurality of second heat dissipation holes (131) are provided on the top plate (13). A heat dissipation channel (132) is formed between the top plate (13) and the surface of the box (1) away from the ground. The plurality of second heat dissipation holes (131) are all connected to the heat dissipation channel (132).

3. The modular intelligent power supply device housing according to claim 1, characterized in that: The box (1) has multiple through holes (141) and a heat dissipation mesh (15) is provided on the box (1). The heat dissipation mesh (15) is fixedly connected to the surface of the box (1) with through holes (141) and is used to cover the through holes (141).

4. The modular intelligent power supply device housing according to claim 1, characterized in that: The enclosure (1) is coated with black heat-dissipating paint.

5. The modular intelligent power supply device housing according to claim 1, characterized in that: The outer surface of the housing (1) is provided with a limiting block (16), and the limiting block (16) is provided with a limiting groove (161) for inserting the heat dissipation mesh (15). A sliding block (17) is slidably connected to the housing (1). The sliding block (17) is used to drive the heat dissipation mesh (15) to move towards the limiting groove (161). The sliding block (17) is provided with a protrusion (171), and the protrusion (171) is located on the moving path of the heat dissipation mesh (15) leaving the housing (1). When the heat dissipation mesh (15) is inserted into the limiting groove (161), the heat dissipation mesh (15) is fixed on the housing (1).

6. The modular intelligent power supply device housing according to claim 5, characterized in that: The sliding block (17) is provided with a locking block (173), and the box body (1) is provided with a sliding groove (18) for the locking block (173) to slide. The groove wall of the sliding groove (18) is provided with a slot (181) for the locking block (173) to be inserted. When the locking block (173) is inserted into the slot (181), the sliding block (17) is fixed on the box body (1).

7. A modular intelligent power supply device housing according to claim 5, characterized in that: The sliding block (17) is provided with a magnet (174), and the heat dissipation mesh (15) is provided with an iron sheet (152); when the magnet (174) is attracted to the iron sheet (152), the heat dissipation mesh (15) is fixed on the sliding block (17).

8. A modular intelligent power supply device housing according to claim 6, characterized in that: The slot (181) has a spring block (182) on its wall. The spring block (182) is located on the moving path of the card block (173) as it leaves the slot (181). When the card block (173) is inserted into the slot (181), the spring block (182) abuts against the surface of the card block (173) away from the bottom wall of the slot (181).

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