Power module, motor controller, electric drive assembly, vehicle

Abstract

The application discloses a power module, a motor controller, an electric drive assembly and a vehicle, which can reduce the risk of current sensor collision, do not need to set a protective cover, and reduce the cost. The power module provided by the application comprises a shell and at least one current sensor, and the at least one current sensor is nested in the shell.

Description

Technical Field

[0001] This application relates to the technical field of vehicle drive control, and in particular to a power module, a motor controller, an electric drive assembly, and a vehicle. Background Technology

[0002] The power module has AC side connection terminals and is generally equipped with a magnetic core and a current sensor to detect the current at the AC side connection terminals. The current sensor and circuit board are connected as a single component, which is then connected to the main body of the power module. During transportation and assembly, the current sensor and circuit board assembly is susceptible to damage from impacts, so a protective cover is used to enclose the current sensor, which increases its cost. Utility Model Content

[0003] The purpose of this application is to provide a power module, motor controller, electric drive assembly, or vehicle that can reduce the risk of current sensors being knocked off course, thereby eliminating the need for a protective cover and reducing costs.

[0004] To address the aforementioned technical problems, this application provides a power module, which includes a housing and at least one current sensor, wherein the at least one current sensor is nested within the housing.

[0005] Optionally, the power module further includes at least one AC side connection terminal, and the at least one AC side connection terminal is provided with the current sensor;

[0006] At least one of the AC side connection terminals is partially nested within the housing; and / or at least one of the current sensors is partially nested within the housing.

[0007] Optionally, at least one of the AC side connection terminals is provided with one of the current sensors;

[0008] At least a portion of each of the AC side connection terminals is nested within the housing; and / or at least a portion of each of the current sensors is nested within the housing.

[0009] Optionally, the power module further includes at least one magnetic core, at least one of the current sensors is provided with the magnetic core, and at least one of the magnetic cores is nested in the housing.

[0010] Optionally, the magnetic core has a receiving cavity in which a portion of the current sensor and a portion of the AC side connection terminal are located.

[0011] Optionally, at least a portion of each of the AC-side connection terminals is nested within the housing; and / or;

[0012] Each of the current sensors is at least partially nested within the housing; and / or;

[0013] At least a portion of each of the magnetic cores is nested within the housing.

[0014] Optionally, at least a portion of each of the AC side connection terminals and at least a portion of each of the current sensors, as well as all the magnetic cores, are nested within the housing.

[0015] Optionally, the current sensor includes a body and a connection portion for connection to a circuit board, wherein the body is located in the receiving cavity of the magnetic core, the body is nested within the housing, and at least a portion of the connection portion protrudes from the housing.

[0016] Optionally, the housing is injection molded.

[0017] Optionally, the AC side connection terminal includes a plurality of terminals, at least one of the AC side connection terminals is respectively provided with at least one magnetic core, and the number of AC side connection terminals is greater than the number of magnetic cores;

[0018] and / or;

[0019] At least one of the AC side connection terminals is provided with a through hole, through which the body of the current sensor passes.

[0020] Optionally, the AC side connection terminals include multiple terminals, with at least one AC side connection terminal corresponding to at least one magnetic core, and the number of AC side connection terminals is the same as the number of magnetic cores.

[0021] Optionally, the housing includes a first side and a second side disposed opposite to each other. The first side is provided with the current sensor and the AC side connection terminal, and the second side is provided with the DC side connection terminal. The housing also includes a reinforcing rib that extends along the direction from the first side to the second side.

[0022] Optionally, the power module includes at least two power sub-modules, and the reinforcing ribs are provided between at least some of the adjacent power sub-modules.

[0023] Optionally, the power module includes a power module body, and at least two power sub-modules constitute the power module body. The power module body includes a drive module for connecting to a drive motor and a power generation module for connecting to a generator motor.

[0024] Optionally, the power generation module includes multiple power sub-modules, and at least two of the power sub-modules share the same liner.

[0025] Optionally, the power module includes a power module body, and at least two power sub-modules constitute the power module body. The power module body includes a drive module for connecting to a drive motor and a power generation module for connecting to a generator motor.

[0026] The reinforcing rib is provided between the power submodule of the drive module and the power submodule of the power generation module, and the reinforcing rib is provided between the power submodules of the drive module.

[0027] Optionally, the power module includes a heat sink, and the drive module and the power generation module share the same heat sink.

[0028] This application also provides a motor controller, including the power module as described in any of the preceding claims.

[0029] This application also provides an electric drive assembly, including the motor controller described above.

[0030] This application also provides a vehicle including the electric drive assembly described above.

[0031] In this application's technical solution, the current sensor is nested within the power module's housing. This protects the current sensor from damage during assembly and transportation. Furthermore, the relative position of the current sensor remains stable, ensuring effective connection to the circuit board and accurate current detection. This eliminates the need for a protective cover, reducing the overall design cost of the power module and optimizing space layout.

[0032] In one specific embodiment, the current sensor can be equipped with a magnetic core. Since the protective cover is no longer needed, the distance between the current sensor and the magnetic core is reduced. On the one hand, this can reduce magnetic leakage and improve the detection accuracy of the current sensor. On the other hand, it is conducive to the miniaturization of the power module.

[0033] The motor driver, electric drive assembly, and vehicle provided in this application have the same technical effects. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the topology of a range-extended electric vehicle.

[0035] Figure 2 This is a schematic diagram of the power module structure in one embodiment of this application;

[0036] Figure 3 for Figure 2 A schematic diagram of the medium power module after removing the cover plate;

[0037] Figure 4 for Figure 1The end view in the image is taken from the side of the AC side connection terminal.

[0038] Figure 5 for Figure 4 Enlarged diagram of part A in the middle;

[0039] Figure 6 for Figure 5 A schematic diagram showing the relative positions of the magnetic core, AC side connection terminals, and current sensor;

[0040] Figure 7 This is a schematic diagram of the power module structure in another embodiment of this application;

[0041] Figure 8 for Figure 7 Enlarged diagram of part B in the middle;

[0042] Figure 9 A flowchart illustrating a method for calculating the relationship between the power generation efficiency and chip area of ​​a power generation module provided in an embodiment of this application;

[0043] Figure 10 Figure (a) shows the relationship between the on-state current and voltage drop of the active switching chip. Figure 10 (b) shows a linear fit between the on-current and voltage drop of the active switching chip;

[0044] Figure 11 (a), (b), and (c) in the figure show the amplification factors of coefficients a, b, and c, respectively;

[0045] Figure 12 (a), (b), (c), and (d) in the figure represent the coefficients a, b, c, and d, respectively. fwd b fwd a rvs and b rvs Relationship with chip area;

[0046] Figure 13 Figures (a) and (b) show the relationship between power generation efficiency and chip area calculated based on actual operating conditions.

[0047] The annotations in the attached figures are explained as follows:

[0048] 10-Power Module;

[0049] 101-Power generation module; 1011-Backing plate; 10a-Power submodule; 10aa-Active switching chip; 10ab-Passive freewheeling chip; 10a1-Upper half-bridge; 10a2-Lower half-bridge; 102-Drive module;

[0050] 201-AC side connection terminal; 201a-Through hole; 202-DC side connection terminal;

[0051] 30 - Magnetic core; 30a - Receiving cavity; 30a1 - Open structure; 30a2 - Through hole in the middle;

[0052] 40 - Current sensor; 401 - Pin;

[0053] 50 - Circuit board;

[0054] 60 - Cooling components;

[0055] 70 - Cover plate;

[0056] 80-Shell; 801-Frame; 8011-Column; 8011a-Connecting hole; 802-Reinforcing rib. Detailed Implementation

[0057] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0058] The ordinal numbers used in this article, such as first and second, are used to distinguish different parts with the same name and do not indicate a specific order or primary / secondary relationship.

[0059] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the topology of a range-extended vehicle.

[0060] Taking range-extended electric vehicles as an example, a range-extended electric vehicle is a type of hybrid vehicle, and its topology is as follows: Figure 1 As shown, the electric drive assembly of a range-extended electric vehicle includes a generator motor 53, a drive motor 2, a motor controller 51, an inverter 3, an engine 52, a reducer and differential 1, and a power battery 4. The engine 52, generator motor 53, and generator controller 51 constitute the range extender 5. Its main function is to activate the range extender when the power battery 4's charge drops to a certain level, allowing the engine 52 to drive the generator motor 53 to generate electricity.

[0061] The motor controller 51 includes a power module, such as Figure 2 and Figure 3 As shown, Figure 2 This is a schematic diagram of the power module structure in one embodiment of this application; Figure 3 for Figure 2 A schematic diagram of the medium power module after removing the cover plate 70, to illustrate the structure of the main body 10 of the power module.

[0062] The power module provided in this embodiment includes a power module body 10, which performs AC-DC conversion using semiconductors such as diodes, IGBTs, and SiC. Specifically, in this embodiment, the power module body 10 includes at least two power sub-modules, each power sub-module being a bridge arm corresponding to a phase. The power module body 10 includes a drive module 102 for connection to a drive motor and a generator module 101 for connection to a generator motor; that is, the drive module 102 and the generator module 101 are integrated into a single power module body 10. The drive module 102 is configured to invert or rectify power according to the driving state of the hybrid vehicle. The drive module 102 can convert the DC power output from the power battery 4 into AC power to drive the drive motor 2, providing torque to rotate the wheels. It can also generate electricity; for example, when the vehicle needs to decelerate, the drive motor 2 switches to generator mode, and the drive module 102 rectifies the AC power into DC power. The power generation module 101 is used to rectify or invert the output current of the hybrid vehicle's power generation equipment, such as the aforementioned generator motor 53. It can convert the AC power output from the generator motor 53 into DC power to charge the power battery 4 or provide power to the drive motor 2. It should be understood that the hybrid vehicle in this application includes range-extended electric vehicles and dual-mode intelligent hybrid vehicles (DMI).

[0063] The power module in this embodiment can be more specifically used in three-phase full-bridge modules, four-phase full-bridge modules, six-phase full-bridge modules, etc., of the motor controller 51. Taking a three-phase full-bridge as an example, the three-phase full-bridge includes three power sub-modules 10a, or three half-bridges, or three bridge arms. Each power sub-module 10a includes an upper half-bridge 10a1 and a lower half-bridge 10a2. The upper half-bridge 10a1 and the lower half-bridge 10a2 each include a first chip and a second chip connected in reverse parallel with it. The first chip can be an active switching chip 10aa, and the second chip can be a passive freewheeling chip 10ab. The active switching chip 10aa includes a metal-oxide-semiconductor field-effect transistor (MOSFET), an insulated-gate bipolar transistor (IGBT), a silicon carbide field-effect transistor (SiC MOSFET), a gallium nitride field-effect transistor (GaN FET), or a bipolar junction transistor (BJT). In some alternative embodiments, the passive freewheeling chip 10ab includes a diode, such as an FRD or a Schottky diode. It should be understood that the diode provided in the embodiments of this application can be a silicon diode or a silicon carbide diode.

[0064] like Figure 2 As shown, the power module includes AC-side connection terminals 201 and DC-side connection terminals 202. Multiple AC-side connection terminals 201 are connected to one side of the power module body 10, and multiple DC-side connection terminals 202 are connected to the opposite side. The DC-side connection terminals 202 can be connected to capacitors, for example. Both the power generation module 101 and the drive module 102 are connected to multiple AC-side connection terminals 201, the number of which is determined according to phase requirements. Figure 2 Both are three-phase full-bridge modules. Correspondingly, the power generation module 101 and the drive module 102 are each connected to three AC-side connection terminals 201. Both the AC-side connection terminals 201 and the DC-side connection terminals 202 are, for example, copper busbar structures. The AC-side connection terminals 201 and the DC-side connection terminals 202 are distributed on different sides of the corresponding power module body 10. The distribution direction of the DC-side connection terminals 202 and the AC-side connection terminals 201 can be defined as the Y-direction. The drive module 102 and the power generation module 101 can be distributed along the X-direction. The multiple power sub-modules 10a of the drive module 102 and the power generation module 101 are also distributed along the X-direction. The Y-direction and the X-direction can be perpendicular to each other.

[0065] Please continue to refer to this. Figures 4 to 6 , Figure 4 for Figure 1 The end view in the image is taken from one side of the AC side connection terminal 201. Figure 5 for Figure 4 Enlarged diagram of part A in the middle; Figure 6 for Figure 5 A schematic diagram showing the relative positions of the magnetic core 30, the AC side connection terminal 201, and the current sensor 40.

[0066] The power module in this embodiment also includes a magnetic core 30 and a current sensor 40. At least one AC-side connection terminal 201 may be equipped with a current sensor 40, and at least one current sensor 40 may be equipped with a magnetic core 30. Here, "equipped with" can mean connected or disposed. Specifically, in this embodiment, each AC-side connection terminal 201 may be equipped with a magnetic core 30 and a current sensor 40. The magnetic core 30 is specifically a ring-shaped structure with an opening 30a. The magnetic core 30 can be sleeved on the outside of the AC-side connection terminal 30, meaning a portion of the AC-side connection terminal 30 is located inside the magnetic core 30. Figure 5 As shown, the opening 30a of the magnetic core 30 is used to accommodate a portion of the current sensor 40, through which the current in the AC side connection terminal 201 can be detected.

[0067] It is worth noting that the power module in this embodiment also includes a housing 80, and all the magnetic cores 30, current sensors 40, and AC-side connection terminals 201 of the power module are nested and connected to the housing 80. The housing 80 can be an integral injection molded part, or it can be an injection molded part formed together with at least one of the current sensors 40, magnetic cores 30, and AC-side connection terminals 201, thereby forming a nested connection relationship. For example, the housing 80 can injection mold and connect all the magnetic cores 30, current sensors 40, and AC-side connection terminals 201 together. Alternatively, the housing 80 can be a separately injection molded part, and the magnetic cores 30, current sensors 40, and AC-side connection terminals 201 can be nested separately with the housing 80.

[0068] In this embodiment, the magnetic core 30 has a receiving cavity 30a. Figure 6The magnetic core 30 is a ring structure, and the receiving cavity 30a includes a central through hole 30a2 in the ring structure. Moreover, the ring structure of the magnetic core 30 has an opening structure 30a1, so that the ring structure is not a closed ring, but a notched ring. The opening structure 30a1 connects to the central through hole 30a2, and the receiving cavity 30a includes the opening structure 30a1. In this embodiment, a portion of the AC-side connection terminal 201 is located within the receiving cavity 30a. Specifically, the magnetic core 30 includes two opposing sidewalls, i.e., two sidewalls distributed along the X direction. A portion of the AC-side connection terminal 201 is located between the two sidewalls of the magnetic core 30. A portion of the current sensor 40 is located within the opening structure 30a1, preferably in the middle of the opening structure 30a1, i.e., the distance between it and the two sidewalls of the magnetic core 30 is equal to improve the detection accuracy. The current sensor 40 is, for example, a Hall sensor. When there is a changing current in the AC-side connection terminal 201, the change in the magnetic field can be sensed by the current sensor 40, thus detecting the magnitude of the current in the AC-side connection terminal 201. The magnetic core 20 can strengthen the magnetic field to improve the detection accuracy.

[0069] Figure 4 The Z-axis is also defined, which is the height direction of the power module. The Z-axis is perpendicular to the Y and X axes. The motor controller includes a circuit board 50, which and the power module body 10 are distributed along the Z-axis. The current sensor 40 can be set along the Z-axis, perpendicular to the circuit board 50, to facilitate connection with the circuit board 50. In this embodiment, the power module may also include a cooling component 60, such as a water-cooled plate. The cooling component 60 and the circuit board 50 are distributed on different sides of the power module body 10 along the Z-axis. The cooling component 60 facilitates cooling the power module body 10.

[0070] In this embodiment, all AC-side connection terminals 201, magnetic core 30, and current sensor 40 in the power module are injection molded together, achieving the following technical advantages:

[0071] First, the current sensor 40 is protected by the housing 80, making it less prone to misalignment during assembly and transportation. Furthermore, its relative position to the magnetic core 30 and the AC side connection terminal 201 remains stable, thus ensuring effective connection with the circuit board 50 and accurate current detection. This eliminates the need for a protective cover, reducing the overall design cost of the power module and optimizing space layout. Therefore, to improve the protection of the current sensor 40, it is sufficient for at least one current sensor 40 to be at least partially nested within the power module housing 80. Of course, if each current sensor 40 is at least partially nested within the housing 80, the protection will be more comprehensive.

[0072] Secondly, all the AC-side connection terminals 201, magnetic cores 30, and current sensors 40 are injection molded together. This allows for control over the spacing and height between the current sensors 40, facilitating accurate simultaneous connection of multiple current sensors 40 to a single circuit board 50. This effect is particularly noticeable for the integrated power module body 10 in this embodiment. It is understandable that traditional power module bodies 10 are generally independent power generation modules 10 or power drive modules 10, with a limited number of AC side connection terminals 201. However, the power module body 10 in this embodiment is an integrated module, including a drive module 102 and a power generation module 101, which increases the number of AC side connection terminals 201 on one power module body 10. For example, when both sub-modules are three-phase full-bridge modules, the number of AC side connection terminals 201 on one power module body 10 increases from three to six. The change in the number of AC side connection terminals 201 is significant. Correspondingly, the number of current sensors 40 and magnetic cores 30 that are matched with the AC side connection terminals 201 will also increase significantly. When the number is large, it is still difficult to align and connect multiple current sensors 40 with the circuit board 50. However, by pre-molding and connecting all current sensors 40 with the magnetic core 30 and AC side connection terminals 201 as one unit, the relative positions of multiple current sensors 40 are unified, the assembly tolerance is smaller, and the accuracy and reliability of the docking connection with the circuit board 50 are improved. Similarly, the above-mentioned technical effects can be achieved to a certain extent as long as at least one AC side connection terminal 201 is nested in the housing 80, or at least one magnetic core 30 is nested in the housing 80.

[0073] When the housing 80 is injection molded, at least one AC side connection terminal 201, at least one current sensor 40 and at least one magnetic core 30 can be nested inside the housing 80 by injection molding.

[0074] Furthermore, such as Figure 6 As shown, since the current sensor 40 and the AC side connection terminal 201 are injection molded together, a protective cover is no longer needed. Therefore, the distance between the current sensor 40 and the magnetic core 30 is reduced. In the prior art, the distance D is relatively large, for example, greater than 6 mm. However, in this embodiment, since a protective cover is no longer required, the distance D can be reduced to less than 6 mm, or even no more than 4 mm. On the one hand, this reduces magnetic leakage and improves the detection accuracy of the current sensor 40. On the other hand, it facilitates the miniaturization of the power module body 10, shortening the dimension in the X direction. Moreover, since the positions of multiple current sensors 40 are unified, assembly errors are reduced, and the distance D can be further reduced, further facilitating the miniaturization design of the power module body 10.

[0075] Furthermore, the power generation module 101 in this embodiment includes a full-bridge unit, which includes a substrate 1011 and a full-bridge circuit disposed on one side surface of the substrate 1011. Specifically, all three bridge arms are arranged on one substrate 1011, i.e., sharing the same substrate 1011, and each bridge arm corresponds to one target phase. The full-bridge circuit is configured as a rectifier bridge for rectifying the output current of the power generation equipment of the hybrid vehicle. Compared to the drive module 102, the power generation module 101 has a higher integration and occupies a smaller volume. Figure 2 It can be seen that at least one of the magnetic core 30, AC side connection terminal 201, and current sensor 40 in the power generation module 101 can be set to be smaller in size, at least in the X direction, to match the size reduction of the power generation module 101. Under this premise, injection molding all the magnetic core 30, AC side connection terminal 201, and current sensor 40 together is more conducive to ensuring the installation accuracy of the small-sized structure.

[0076] The current sensor 40 in this embodiment includes a body and a connection part that connects to the circuit board 50. The connection part refers to the part that directly contacts and connects to the circuit board 50. For example, the current sensor 40 is plugged into or glued to the circuit board 50. In this case, the connection part is the pin 401 or a part of the pin 401 that the current sensor 40 is inserted into or glued to the circuit board 50. The current sensor 40 and the circuit board 50 can also be soldered together. In this case, the connection part is the pin 401 or a part of the pin 401 of the current sensor 40 used for soldering. Of course, the connection part can also be a structure in which it is inserted into the circuit board 50 and then soldered. This connection is more reliable. In this embodiment, since multiple current sensors 40 are connected to the circuit board 50 at the same time, the circuit board 50 can be provided with corresponding mounting holes. The pin 401 or a part of the pin 401 can be inserted into the mounting holes and then soldered to fix it.

[0077] In this embodiment, the body of the current sensor 40 can be located in the receiving cavity 30a of the magnetic core 30, specifically in the opening structure 30a1. The body is also nested in the housing 80, and at least part of the connection of the current sensor 40 protrudes from the housing 80.

[0078] like Figure 6 As shown, when the housing 80 is formed by injection molding, the injection molding material fills the receiving cavity 30a. In this embodiment, the housing 80 covers at least a part of the current sensor 40, specifically covering the parts other than the connecting part. For example, only the pin 401 or a part of the pin 401 is exposed. In this way, the housing 80 can cover as much of the current sensor 40 as possible, that is, the current sensor 40 is more nested in the housing 80, which more comprehensively protects the current sensor 40, makes its position stable, and does not affect the connection with the circuit board 50.

[0079] like Figure 4 As shown in the diagram, the housing 80 is indicated by a dashed box. The housing 80 can also cover a portion of the AC-side connection terminal 201 and at least a portion of the magnetic core 30. Since the AC-side connection terminal 201 needs to connect to the power module body 10 and external devices, it is not advisable to cover it completely; covering only a portion is sufficient. The housing 80 can completely cover the magnetic core 30, which better ensures the positional stability of the magnetic core 30, the AC-side connection terminal 201, and the current sensor 40, and also better protects the magnetic core 30 from damage.

[0080] In this embodiment, the housing 80 may include a frame 801, such as Figure 2 As shown, the frame 801 is stacked on the power module body 10 along its height direction (i.e., the Z-direction), and the frame 801 is connected to the edge portion of the power module body 10. The frame 801 is generally arranged around the drive module 102 and the power generation module 101. The frame 801 can be located on one side of the power module body 10 along its height direction, between the power module body 10 and the circuit board 50. The frame 801 and the power module body 10 can be fixed with adhesive, and can also be fixed with screws to increase the reliability of the connection. Figure 2 As shown, the power module body 10 is roughly rectangular, and therefore the frame 801 is also roughly rectangular. Since the AC side connection terminal 201 is located on one side of the power module body 10 in the Y direction, the frame 801, correspondingly, is injection molded to connect the magnetic core 30, current sensor 40, and AC side connection terminal 201 to the side of the frame 801 closest to the AC side connection terminal 201. The frame 801 may also include multiple columns 8011, each with a first connection hole 8011a. The height of the column 8011 can be higher than the power generation module 101 and the drive module 102. Thus, it can be fixedly connected to the circuit board 50 by fasteners inserted into the first connection hole 8011a of the column 8011 and the second connection hole on the circuit board 50. The fasteners, such as screws, are for example. Before being fixed to the circuit board 50, a cover plate 70 can be provided between the circuit board 50 and the housing 80 for further protection. Furthermore, the frame 801 and the circuit board 50 are fixedly connected, thus keeping their positions fixed and making the connection between the current sensor 40, which is injection molded on the frame 801, and the circuit board 50 more reliable.

[0081] More specifically, the frame 801 includes a first side and a second side arranged opposite each other along the Y direction. The first side is injection molded to connect the magnetic core 30, the current sensor 40, and the AC side connection terminal 201. The second side extends approximately to the position on the power module body 10 where it connects to the DC side connection terminal 202. That is, the housing 80 includes a first side and a second side arranged opposite each other. The first side is provided with the current sensor 40 and the AC side connection terminal 201, and the second side is provided with the DC side connection terminal. The housing 80 may also include a reinforcing rib 802. Figure 2 (Illustrated by dashed lines) The reinforcing rib 802 extends from the first side to the second side, with one end of the reinforcing rib 802 connected to the first side of the frame 801 and the other end connected to the second side of the frame 801. The reinforcing rib 802 can improve the strength of the frame 801.

[0082] As previously described, the power module includes at least two power sub-modules, and the reinforcing ribs 802 are provided between at least some of the adjacent power sub-modules. The drive module 102 of the power module body 10 includes multiple power sub-modules 10a, which are distributed along the X-direction. At least a portion of the reinforcing ribs 802 of the frame 801 can be located between two adjacent power sub-modules 10a of the drive module 102, and between the drive module 102 and the power generation module 101. Multiple reinforcing ribs 802 can be provided, with one reinforcing rib 802 corresponding to each pair of adjacent power sub-modules 10a of the drive module 102. The power generation module 101 includes multiple power sub-modules, and at least two power sub-modules share the same liner. Since the power generation module 101 is relatively small in this embodiment, and the full-bridge circuit is arranged on one liner 1011, there are no corresponding reinforcing ribs 802 between the power sub-modules of the power generation module 101. This arrangement strengthens the housing 80 without interfering with the power sub-modules.

[0083] You can continue to refer to this. Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of the power module structure in another embodiment of this application; Figure 8 for Figure 7 Enlarged diagram of part B in the middle.

[0084] In the above embodiments, the AC-side connection terminal 201 may include multiple terminals, with at least one AC-side connection terminal 201 corresponding to at least one magnetic core 30. The number of AC-side connection terminals 201 and the number of magnetic cores 30 are the same. That is, each AC-side connection terminal 201 is equipped with a magnetic core 30 to enhance the magnetic field. Figure 7In this embodiment, some AC-side connection terminals 201 are not equipped with magnetic cores 30, but only with current sensors 40. That is, there may be multiple AC-side connection terminals 201, with at least one AC-side connection terminal 201 corresponding to at least one magnetic core 30, and the number of AC-side connection terminals 201 is greater than the number of magnetic cores 30. In this case, for AC-side connection terminals 201 that do not have corresponding magnetic cores 30, during injection molding, the housing 80 only connects the AC-side connection terminal 201 and the current sensor 40. For AC-side connection terminals 201 equipped with magnetic cores 30, the current can be detected by a current sensor with a magnetic core; for AC-side connection terminals 201 without magnetic cores 30, the current in the AC-side connection terminal 201 can be detected by a current sensor without a magnetic core. At least one AC-side connection terminal 201 without a magnetic core may have a through-hole 201a, and the body of the current sensor 40 may be located in the through-hole 201a, i.e., inserted into or penetrating the through-hole 201a, thereby enhancing the sensed magnetic field and improving detection accuracy.

[0085] This embodiment of the application can also compensate for the current detection results of the current sensor 40 without a magnetic core by using the current detection results of the current sensor 40 equipped with a magnetic core 30, thereby improving the current detection accuracy and precision of the current sensor 40 without a magnetic core. It is understood that when some current sensors 40 are not equipped with a magnetic core 30, the advantages of the current sensors 40 with magnetic cores and the current sensors 40 without magnetic cores can be mutually compensated for, reducing cost and product size while meeting current detection performance requirements. It is understood that at least one current sensor 40 needs to be equipped with a magnetic core 30, or even all current sensors 40 can be without a magnetic core 30.

[0086] This embodiment also provides a method for manufacturing a power module, including the following steps:

[0087] At least one current sensor 40 is nested within the housing 80 by injection molding. This includes the case where only the current sensor 40 and the housing 80 are nested together.

[0088] This embodiment also provides a method for manufacturing a power module, including the following steps:

[0089] At least one AC-side connection terminal 201 and at least one current sensor 40 are nested within the housing 80 by injection molding. This includes cases where both the current sensor 40 and the AC-side connection terminal 201 are nested within the housing 80.

[0090] This embodiment also provides a method for manufacturing a power module, including the following steps:

[0091] At least one AC-side connection terminal 201, at least one current sensor 40, and at least one magnetic core 30 are injection molded and nested within the housing 80. This includes cases where the current sensor 40, AC-side connection terminal 201, and magnetic core 30 are all nested within the housing 80.

[0092] The motor controller includes a power module and a circuit board 50. The power module includes the aforementioned power module body 10, AC side connection terminals 201, a magnetic core 30, and a current sensor 40. The assembly method of the motor controller includes:

[0093] S1. The AC side connection terminal 201, magnetic core 30 and current sensor 40 are injection molded together to form an injection molded assembly;

[0094] It can be seen that during the injection molding process, the magnetic core 30, the AC side connection terminal 201, and the current sensor 40 can be used as inserts for injection molding. That is, the magnetic core 30, the AC side connection terminal 201, and the current sensor 40 are fixed in the required positions using a mold, and then injection molding material is injected. After curing, the magnetic core 30, the AC side connection terminal 201, and the current sensor 40 are injection molded together to form a single injection molded assembly. Figure 5 It can be seen that before injection molding, the current sensor 40, the magnetic core 30, and the AC side terminal all have gaps between them. During injection molding, the injection molding compound can fill these gaps, and the housing 80, which fills the gaps, reliably connects the current sensor 40, the magnetic core 30, and the AC side terminal together. It can be understood that when the magnetic core 30 is not provided, the injection molding is performed using only the AC side connection terminal 201 and the current sensor 40 as inserts.

[0095] S2. Connect the AC side connection terminal 201 of the injection molding assembly to the power module body 10, and connect the current sensor 40 of the injection molding assembly to the circuit board 50.

[0096] In a traditional power module body 10, the current sensor 40 is typically connected to the circuit board 50 first, and then connected to the AC side connection terminal 201 and magnetic core 30 mounted on the power module body 10. In this embodiment, the current sensor 40 is first injection molded to the AC side connection terminal 201 and magnetic core 30, and then connected to the circuit board 50. This makes the current sensor 40 less prone to misalignment during transportation and assembly, ensuring a relatively stable position and a more reliable connection to the circuit board 50. Other technical advantages can be understood by referring to the effects of the power module described above, and will not be repeated here.

[0097] Furthermore, in this embodiment, the injection-molded assembly is first connected to the power module body 10. After connection, the current sensor 40 in the injection-molded assembly is calibrated before being connected to the circuit board 50. In contrast, for a conventional power module body 10, the current sensor 40 is first connected to the circuit board 50 before being assembled with the power module body 10, the magnetic core 30, and the AC side connection terminal 201. In this case, the calibration of the current sensor 40 is performed after assembly. If any current sensor 40 fails to calibrate successfully, it could lead to the risk of the entire motor controller needing to be reworked or scrapped.

[0098] In this embodiment, since calibration is performed before the current sensor 40 and circuit board 50 are connected, offline testing can be performed immediately after the injection-molded assembly is assembled into the power module body 10. Specifically, the pulse testing principle can be used to directly self-calibrate the current sensor 40, without needing to assemble it into a relatively complete motor controller before calibration. The calibration of the current sensor 40 involves first allowing a known current to flow through the AC side connection terminal 201, then reading the value of the current sensor 40. The known current is compared with the actual detected current to calibrate the current sensor 40. For example, a correction coefficient can be set to ensure that the output current value matches the actual current flowing, thus guaranteeing the accuracy of the current sensor 40's detection.

[0099] Therefore, the assembly method of the motor controller in this embodiment allows for the calibration of the current sensor 40 before connection to the circuit board 50. This prevents the entire motor controller from being scrapped if the calibration of the current sensor 40 fails, thus reducing the cost of calibration failure. Furthermore, the power module body 10, AC side connection terminal 201, and current sensor 40 can be assembled in a single process. Calibration can also be performed after assembly, for example, at the manufacturer of the power module body 10. The calibrated power module is then connected to the circuit board 50. This saves production and assembly time for the motor controller and conserves its self-calibration resources.

[0100] The power generation module 101 and drive module 102 of the aforementioned power module body 10 are integrated together, and the full-bridge circuit of the power generation module 101 is arranged on a single substrate. The reason why this integrated design is possible, and why the integrated size is further reduced, will be explained in detail below.

[0101] Taking a power module (either a standalone power generation module or a drive module) employing an Insulated Gate Bipolar Transistor (IGBT) as an example, it includes an IGBT chip and a Fast Recovery Diode (FRD) chip. When the IGBT chip acts as an active switch, it incurs switching losses and conduction losses. At this time, there are no losses for the IGBT itself, but the FRD incurs conduction losses and reverse recovery losses. For the drive module, the primary consideration is output current capability. Based on the loss distribution under different operating conditions, the IGBT loss accounts for approximately 70%, and the FRD loss accounts for approximately 30%. For the power generation module, while meeting the output current capability, power generation efficiency must also be considered. Under power generation conditions, the IGBT loss accounts for 30%, and the FRD loss accounts for 70%. This leads to different design requirements for the drive module and the power generation module in different application scenarios. The inventors discovered that the wide operating condition coverage and high dynamic load requirements of the drive module make its miniaturization more difficult. In contrast, the power generation module has a single driving condition, pursues steady-state output, and has lower dynamic response requirements. Therefore, miniaturization of the power generation module is key to integrating the drive module and the power generation module. In this embodiment, the power module body 10 includes a drive module 102 and a miniaturized power generation module 101.

[0102] The power generation module 101 includes a first number of active switching chips 10aa and a second number of passive freewheeling chips 10ab paired with at least a portion of the active switching chips 10aa. The area ratio of at least one pair of paired passive freewheeling chips 10ab to the active switching chips 10aa satisfies a first preset ratio to reduce rectifier bridge losses, thereby allowing the first number of active switching chips 10aa and the second number of passive freewheeling chips 10ab to be integrated into a smaller space. Figure 2 As shown, the drive module 102 and the power generation module 101 can be arranged side by side along the X direction. It should be noted that the first and second quantities are determined by actual design requirements. Optionally, the first quantity is equal to the second quantity. Optionally, the first quantity is greater than the second quantity. Also optionally, the first quantity is less than the second quantity.

[0103] According to embodiments of this application, the first quantity and the second quantity are determined by the number of phases required by the power generation module 101. In some optional embodiments, the second quantity is equal to the first quantity. In some optional embodiments, based on requirements such as increased power level and redundancy design, the second quantity is less than the first quantity. Figure 3 As shown, the active switching chip 10aa and the passive freewheeling chip 10ab are arranged in pairs. For example, as... Figure 3As shown, the drive module 102 includes three independent power submodules 10a, corresponding to the U-phase, V-phase, and W-phase from left to right, respectively. See also Figure 3 Each power submodule 10a has an upper half-bridge 10a1 including a 2x2 chip array positioned higher, and a lower half-bridge 10a2 including a 2x2 chip array positioned lower. In this embodiment, the layout positions of the upper half-bridge 10a1 and the lower half-bridge 10a2 can be staggered in the X direction to reduce parasitic inductance.

[0104] The inventors of this application have unexpectedly discovered that the area ratio of the active switching chip 10aa to the passive freewheeling chip 10ab in the power generation module 101 has a significant impact on the power generation efficiency of the power generation device. In traditional power generation modules, the area of ​​the active switching chip is twice that of the passive freewheeling chip. Because the area of ​​the active switching chip is larger than that of the passive freewheeling chip, the power generation efficiency is relatively low. However, the inventors of this application have found that increasing the chip area does not necessarily lead to a continuous increase in power generation efficiency; a balance needs to be struck between chip area and power generation efficiency. Based on calculations of power generation operating conditions, stalled operating conditions, and actual application scenario requirements, it can be found that under the same operating conditions, when the area ratio of the active switching chip to the passive freewheeling chip meets the reference range, the power generation efficiency is significantly improved. In other words, compared with existing power generation modules, at the same power generation efficiency, when the area ratio of the active switching chip to the passive freewheeling chip meets the reference range, the area of ​​the power generation module 101 provided in this application embodiment can be smaller. Figure 9 The calculation method shown calculates the area relationship between passive freewheeling chips and active switching chips. Figure 9 A flowchart illustrating a method for calculating the relationship between the power generation efficiency of the power generation module 101 and the chip area is provided for embodiments of this application. The detailed calculation process is as follows:

[0105] According to the efficiency calculation formula:

[0106] η = P out / P in =(P in -P loss ) / P in (1)

[0107] Where η is the power generation efficiency, P in For input power, P out For output power, P loss This represents the total electrical control losses.

[0108] P loss =P1+P2+P cu (2)

[0109] Where P1 is the total loss of the active switching chip, P2 is the total loss of the passive freewheeling chip, and P... cuThis refers to copper busbar losses.

[0110]

[0111] Among them, P con1 For the conduction loss of the active switching chip, P swon For the turn-on loss of the active switching chip, P swoff This refers to the turn-off loss of the active switching chip.

[0112]

[0113] Among them, P con2 For the conduction loss of the passive freewheeling chip, P swrec This refers to the reverse recovery loss of the passive freewheeling chip.

[0114] Therefore, the total electronic control loss can be obtained:

[0115]

[0116] Taking one electrical cycle as an example, during the positive half-cycle of the current, the active switching chip of the upper bridge is a hard switch, incurring switching losses, while the active switching chip of the lower bridge is a zero-voltage switch, incurring no switching losses. During the negative half-cycle of the current: the active switching chip of the lower bridge is a hard switch, and the active switching chip of the upper bridge is a zero-voltage switch. Therefore, integrating the switching losses over half an electrical cycle and averaging over the entire electrical cycle yields the average switching loss. The formula for calculating the average switching loss is as follows:

[0117]

[0118] Among them, P sw V is the average switching loss over one electrical cycle. DC I is the bus voltage. D For, T j The junction temperature of the active switching chip is T0, the cycle time is E. sw For, f sw This represents the switching frequency.

[0119] The switching loss of an active switching chip can be expressed as:

[0120]

[0121] Where P swon Factor Vdcon b1 represents the turn-on loss voltage coefficient of the active switching chip. on b2 is the coefficient of the first term in the relationship between the turn-on energy coefficient and current of the active switching chip. on b3 represents the quadratic coefficient of the relationship between the turn-on energy coefficient and current for an active switching chip. onI is the coefficient of the cubic term in the relationship between the turn-on energy coefficient and current of the active switching chip. p It represents electric current.

[0122]

[0123] Where P swoff Factor Vdcoff b1 represents the turn-off loss voltage coefficient of the active switching chip. off b2 is the coefficient of the first term in the relationship between the turn-off energy coefficient and current of the active switching chip. off b3 represents the coefficient of the quadratic term in the relationship between the turn-off energy coefficient and current of an active switching chip. off I is the coefficient of the cubic term in the relationship between the turn-off energy coefficient and current of an active switching chip. p It represents electric current.

[0124] The reverse recovery loss of a passive freewheeling chip can be expressed as:

[0125]

[0126] Where P swrec Factor is used to reverse recover losses in passive freewheeling chips. Vdcrec b1 represents the reverse recovery loss voltage coefficient of the passive freewheeling chip. rec b2 is the coefficient of the first term in the relationship between the reverse recovery energy coefficient and current of a passive freewheeling chip. rec b3 represents the quadratic coefficient of the reverse recovery energy coefficient versus current relationship in a passive freewheeling chip. rec Ip is the coefficient of the cubic term in the relationship between the reverse recovery energy coefficient and the current of the passive freewheeling chip, where Ip is the current.

[0127] Copper busbar losses can be expressed as

[0128] P cu =I dc 2 *0.0002*2+I ac 2 *0.0001*6+I c 2 *0.0006 (10)

[0129] Among them, I dc For input DC current, I ac For the output phase current, I c This is the capacitor ripple current.

[0130] Furthermore, taking one electrical cycle as an example, during the positive half-cycle of the current, when the upper bridge active switch chip is turned on, the current flowing through the active switch chip generates forward conduction loss. When the active switch chip is turned off, the current flows through the lower bridge passive freewheeling chip. During the negative half-cycle of the current, when the lower bridge active switch chip is turned on, the current flowing through the active switch chip generates forward conduction loss. When the active switch chip is turned off, the current flows through the upper bridge passive freewheeling chip. Therefore, without considering the dead time, within one electrical cycle, the active switch chip only generates forward conduction loss according to the corresponding half-cycle of the current cycle. Therefore, by integrating the loss over one current cycle according to the duty cycle and averaging, the average conduction loss can be obtained. The fitting result for the upper bridge is as follows:

[0131]

[0132] Conduction loss refers to the loss of an active switching chip after it is turned on. When the active switching chip is turned on, its internal resistance changes with current and temperature; for example... Figure 10 As shown in (a) in the figure, I c and V ce The relationship is not linear; for example... Figure 10 As shown in (b) above, R 2 R is the square of the linear fit R. 2 The closer the value is to 1, the better the fit. It can be seen that when expressed in polynomial form, the fit is higher and closer to reality. At this point, the conduction loss of the active switching chip can be expressed as:

[0133]

[0134] Where m is the modulation index and D is the duty cycle.

[0135] The duty cycle D can be expressed as:

[0136]

[0137] Where θ = ωt, ω is the angular frequency, t is time; and φ is the phase difference between voltage and current.

[0138] Therefore, the result of integrating the conduction loss of the active switching chip is:

[0139]

[0140] Where a fwd b is the coefficient of the quadratic term in the voltage drop versus current relationship of the active switching chip. fwd c is the coefficient of the first term in the relationship between voltage drop and current of an active switching chip. fwd p is the constant term coefficient in the relationship between voltage drop and current of an active switching chip. f The power factor.

[0141] Similarly, the conduction loss of a passive freewheeling chip can be expressed as:

[0142]

[0143] Among them, a rvs b is the coefficient of the quadratic term in the relationship between voltage drop and current of a passive freewheeling chip. rvs c is the coefficient of the first term in the relationship between voltage drop and current of a passive freewheeling chip. rvs This is the constant coefficient of the relationship between voltage drop and current in a passive freewheeling chip.

[0144] Since changes in the integrated circuit area have no effect on the switching losses of active switching chips and passive freewheeling chips, the switching losses of active switching chips, the reverse recovery losses of passive freewheeling chips, and the copper busbar losses can be simplified as follows:

[0145] P swon =E swon (I p U dc T j (16)

[0146] P swoff =E swoff (I p U dc T j (17)

[0147] P swrec =E swrec (I p U dc T j (18)

[0148] P cu =I p *R cu (19)

[0149] Therefore, the total dynamic loss P can be unified. sw :

[0150] P sw =P swon +P swoff +P swrec +P cu (20)

[0151] Therefore, the total electronic control loss can be further expressed as:

[0152] P loss =P con1 +P con2 +P sw(twenty one)

[0153] As can be seen from the above, the analysis Figure 10 Combining (a) and (b) with formulas (12) and (14), it is found that the conduction loss is mainly related to the power factor p. f The modulation index m is related to the polynomial coefficients (a, b, c); the power factor p f The modulation index m is mainly affected by the motor. Specifically, for the total loss of the active switching chip, the coefficient a is (1440 + 770 * m * p). f -355*m*p f 3 The coefficient b is (764 + 1829 * m * p). f -221*m*p f 3 The coefficient c is (2160 + 1957 * m * p). f For the total loss of the passive freewheeling chip, the coefficient a is (1440-770*m*p). f +355*m*p f 3 The coefficient b is (764-1829*m*p). f +21*m*p f 3 The coefficient c is (2160-1957*m*p). f ).

[0154] Based on the operating condition evaluation of range-extended new energy vehicles, the power factor p f Under power generation conditions, the regulation system m determines the power factor p. f The main operating conditions are above -0.9; the regulation value m is mainly in the range of 0.3 to 0.7. Therefore, for the analysis of these special operating conditions, formulas (12) and (14) can be compared with p as follows. f The parameters related to m are divided into amplification factors of a, b, and c, and the analysis is based on the actual parameter values. For example... Figure 11 As shown, using FRD chips and IGBT chips as examples, the amplification factors of coefficients a, b, and c of the FRD chip are much greater than those of the IGBT chip. From... Figure 11 It is easy to see that under power generation conditions, the conduction loss Pcon2 of the FRD (passive freewheeling chip) is greater than the conduction loss Pcon1 of the IGBT (active switching chip). Therefore, to improve power generation efficiency, the conduction loss can be further reduced, and reducing the loss of the passive freewheeling chip will yield greater benefits.

[0155] Combining formulas (14) and (15), a fwd and a rvs A negative number indicates that the smaller the area of ​​the active switching chip, the higher the power generation efficiency; b fwd and brvs The value is negative; the larger the area of ​​the passive freewheeling chip, the higher the power generation efficiency. Figure 12 (a), (b), (c), and (d) in the figure show the coefficient a. fwd b fwd a rvs and b rvs Relationship with chip area. Figure 13 This illustrates the relationship between power generation efficiency and chip area, calculated based on actual operating conditions of range-extended vehicles. (See also...) Figure 13 The power generation efficiency increases with the area ratio of the passive freewheeling chip and the active switching chip, but the growth trend gradually slows down after the area ratio exceeds 1.2. Therefore, under the premise of meeting the output current capability, with the same chip area, the larger the area of ​​the passive freewheeling chip, the higher the power generation efficiency. When the output current capability is fixed, keeping the area of ​​the active switching chip constant, increasing the area of ​​the passive freewheeling chip further improves the power generation efficiency. Therefore, for hybrid vehicles, controlling the ratio of the passive freewheeling chip and the active switching chip area to meet the first preset ratio can reduce the rectifier bridge loss, thereby reducing the loss of the power generation module. Therefore, the heat dissipation requirements of the power generation module 101 can be reduced, and the volume of the power generation module 101 can be reduced, so that the active switching chip 10aa and the passive freewheeling chip 10ab can be integrated into a smaller space.

[0156] For range-extended electric vehicles, based on power generation conditions, stall conditions, and actual vehicle application scenarios, calculations show that when the area ratio of the passive freewheeling chip 10ab to the active switching chip 10aa in the power generation module 101 is greater than or equal to 0.6 and less than or equal to 2, a good balance is achieved between power generation efficiency and chip area. This allows the first number of active switching chips 10aa and the second number of passive freewheeling chips 10ab to be integrated onto the same substrate 1011 with a smaller area. Specifically, the area ratio of the passive freewheeling chip 10ab to the active switching chip 10aa can be less than or equal to 1.25. Figure 13 (a) is a low-voltage operating condition, such as 400V. Figure 13 (b) is a high-voltage operating condition, such as 800V.

[0157] This minimizes the required heat dissipation area while ensuring output current capability and power generation efficiency. Alternatively, such as... Figure 13As shown, the area ratio of at least one passive freewheeling chip 10ab to its corresponding active switching chip 10aa is greater than or equal to 0.6. For example, for the rectifier bridge of the power generation module 101, the area ratio of at least one passive freewheeling chip 10ab to its corresponding active switching chip 10aa is greater than or equal to 0.6 and less than or equal to 1.25. Also for example, the ratio of the total area of ​​the passive freewheeling chips 10ab to the total area of ​​the active switching chips 10aa in the rectifier bridge of the power generation module 101 is greater than or equal to 0.6 and less than or equal to 1.25. In other words, as long as there exists at least one passive freewheeling chip 10ab and its corresponding active switching chip 10aa whose area ratio satisfies the first preset ratio, the power generation efficiency can be maximized while minimizing the area of ​​the liner 1011.

[0158] According to the embodiments of this application, the area ratio of the passive freewheeling chip 10ab and the active switching chip 10aa connected in parallel in each power submodule 10a of the control power generation module 101 satisfies a first preset ratio, thereby reducing the loss of the rectifier bridge. Consequently, for the same operating conditions and design requirements, the total number of chips required is also reduced accordingly. For example, in the prior art, each phase of a three-phase power generation module includes six active switching chips and six passive freewheeling chips in its corresponding bridge arm. However, as... Figure 3 As shown, in the power generation module 101 provided in this application embodiment, each phase of the power sub-module 10a requires only two active switching chips 10aa and two passive freewheeling chips 10ab.

[0159] Based on a similar principle, controlling the area ratio of the passive freewheeling chip 10ab to the corresponding active switching chip 10aa in the drive module 102 can also reduce the losses of the drive module 102, thereby achieving miniaturization and integration of the drive module 102. For example, the drive module 102 includes an inverter bridge used for inverting / rectifying power according to the driving state of the hybrid vehicle. Wherein, the area ratio of at least one passive freewheeling chip 10ab in at least one power submodule 10a in the inverter bridge to the active switching chip 10aa connected in parallel with it satisfies a second preset ratio, which can reduce the losses of the entire inverter bridge, thus allowing the drive module 102 to be integrated into a smaller space; for example, multiple arms of the drive module 102 can be mounted on a single substrate. Taking a three-phase drive module 102 as an example, controlling the area ratio of the passive freewheeling chip 10ab to the active switching chip 10aa connected in parallel with it in the power submodule 10a corresponding to each phase of the inverter bridge to satisfy the second preset ratio can reduce the total number of chips required for the drive module 102. For example, in existing technologies, each power submodule in the drive module requires six active switching chips and six passive freewheeling chips, while... Figure 3As shown, each power submodule 10a of the drive module 102 provided in this application only requires four active switching chips 10aa and four passive freewheeling chips 10ab.

[0160] It should be noted that the inverter bridge in the drive module 102 can also function as a rectifier bridge under certain operating conditions. For example, when a hybrid vehicle performs kinetic energy recovery, the inverter bridge in the drive module 102 converts the AC power generated by the drive motor into DC power to replenish the power battery.

[0161] This embodiment also provides an electric drive assembly, including the aforementioned motor controller. This application embodiment also includes a vehicle, including the aforementioned electric drive assembly. The motor controller, electric drive assembly, and vehicle all have the same technical effects as in the above embodiments, and will not be discussed again.

[0162] For example, new energy vehicles include electric drive systems that use electricity to propel the vehicle. Range-extended electric vehicles (REEVs) offer several advantages. Essentially, a range-extended topology is a pure electric drive system. In daily urban commuting, REEVs can operate on pure electric power with zero emissions, reducing exhaust pollution and meeting environmental requirements. Furthermore, electric drive is more energy-efficient than gasoline drive, reducing energy consumption and operating costs. REEVs are equipped with an engine that acts as a range extender. When the battery is low, the engine can start generating electricity to provide continuous power to the vehicle, avoiding the range anxiety associated with limited range in pure electric vehicles and making long-distance travel more convenient. In addition, REEVs offer the following advantages in driving experience: First, pure electric drive. The driving power of the vehicle is entirely provided by the drive motor. The engine does not directly participate in driving the vehicle but plays the role of generating electricity. When the battery is low, it starts to convert fuel into electricity to power the drive motor or charge the battery. This pure electric drive method ensures a single and pure power source for the vehicle, consistent with the drive mechanism of pure electric vehicles, fundamentally guaranteeing driving comfort. Secondly, the power response is rapid. The characteristics of the drive motor allow it to output maximum torque instantly. In range-extended electric vehicles, when the driver presses the accelerator pedal, the drive motor responds immediately, quickly delivering powerful output for rapid start-up and acceleration. This instantaneous power response is far superior to traditional gasoline vehicles, providing drivers with a more direct and rapid push-back feeling. Whether in the frequent start-stop situations of city driving or overtaking maneuvers on highways, it handles everything with ease, delivering a smooth driving experience. Thirdly, there is no power interruption. During the operation of a range-extended vehicle, since it is always driven by the drive motor, there is no power interruption problem as seen in traditional gasoline vehicles during gear shifts. Whether driving at low or high speeds, the power output remains continuous and stable. Even when the power battery is low and the engine starts generating electricity, the system can ensure that the power output of the drive motor is not affected through a precise control strategy, without any jerking or power interruption, thus providing the driver with a consistently stable driving experience and improving driving comfort and safety.

[0163] This application provides a power module, which includes a power module body 10, an AC side connection terminal 201, and a current sensor 40. The power module body 10 is connected to a plurality of AC side connection terminals 201, and each AC side connection terminal 201 is equipped with the current sensor 40.

[0164] The power module also includes an injection molding section 80, and all the current sensors 40 and the AC side connection terminals 201 of the power module are injection molded to the injection molding section 80.

[0165] In one specific embodiment, the power module further includes a magnetic core 30, at least one current sensor 40 is disposed on the magnetic core 30, a portion of the current sensor 40 and a portion of the AC side connection terminal 201 are located in the magnetic core 30, and all the magnetic cores 30 and the injection molding part 80 are injection molded together.

[0166] In one specific embodiment, the injection-molded portion 80 encloses a portion of the AC-side connection terminal 201 and at least a portion of the magnetic core 30.

[0167] In one specific embodiment, the AC side connection terminal 201 without the magnetic core 30 is provided with a through hole 201a, and a portion of the current sensor 40 is located in the through hole 201a.

[0168] In one embodiment, the current sensor 40 includes a connection portion for connecting to a circuit board 50 of a motor controller, and the injection-molded portion 80 covers the other parts of the current sensor 40 except for the connection portion.

[0169] In one specific embodiment, the injection molding part 80 includes an injection molding frame 801, which is stacked on the power module body 10 along the height direction of the power module body 10, and the injection molding frame 801 is connected to the edge portion of the power module body 10; the current sensor 40 and the AC side connection terminal 201 are injection molded to one side of the injection molding frame 801.

[0170] In one specific embodiment, the injection-molded frame 801 includes a first side and a second side disposed opposite to each other. The first side is injection-molded to connect the current sensor 40 and the AC side connection terminal 201. The injection-molded part 80 includes a reinforcing rib 802, one end of which is connected to the first side of the injection-molded frame 801, and the other end of which is connected to the second side of the injection-molded frame 801.

[0171] In one specific embodiment, the power module body 10 includes a plurality of power sub-modules 10a, and the reinforcing ribs 802 are arranged between at least some of the adjacent power sub-modules 10a.

[0172] In one specific embodiment, the power module body 10 includes an integrated drive module 102 and a power generation module 101. The drive module 102 is configured to perform inversion or rectification according to the driving state of the hybrid vehicle, and the power generation module 101 is used to rectify the output current of the power generation equipment of the hybrid vehicle.

[0173] This application embodiment also provides a method for assembling a motor controller, the motor controller including a circuit board 50 and the power module described in any of the above claims; the assembly method includes:

[0174] Injection molding to form an injection molded assembly, the insert of which includes all of the AC side connection terminals 201 and the current sensor 40;

[0175] Connect the AC side connection terminal 201 of the injection molding assembly to the power module body 10, and connect the current sensor 40 of the injection molding assembly to the circuit board 50.

[0176] In one specific embodiment, the power module further includes a magnetic core 30, with all the AC side connection terminals 201, the magnetic core 30, and the current sensor 40 as inserts to form the injection-molded assembly.

[0177] In one specific embodiment, the AC side connection terminal 201 of the injection molding assembly is first connected to the power module body 10, then the current sensor 40 is calibrated, and then connected to the circuit board 50.

[0178] This application also provides a motor controller, including a circuit board 50 and the power module described in any of the above claims, wherein the current sensor 40 is connected to the circuit board 50.

[0179] This application also provides an electric drive assembly, including the motor controller described above.

[0180] This application also provides a vehicle including the electric drive assembly described above.

[0181] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A power module, characterized in that, The power module includes a housing (80), at least one current sensor (40), a heat sink, a drive module (102), and a power generation module (101). At least one of the current sensors (40) is nested in the housing (80), and the drive module (102) and the power generation module (101) share the same heat sink.

2. The power module according to claim 1, characterized in that, The power module further includes at least one AC side connection terminal (201), and at least one AC side connection terminal (201) is provided with the current sensor (40). At least one of the AC side connection terminals (201) is at least partially nested in the housing (80); and / or, at least one of the current sensors (40) is at least partially nested in the housing (80).

3. The power module according to claim 2, characterized in that, At least one of the AC side connection terminals (201) is provided with one of the current sensors (40). At least a portion of each of the AC side connection terminals (201) is nested within the housing (80); and / or at least a portion of each of the current sensors (40) is nested within the housing (80).

4. The power module according to any one of claims 2-3, characterized in that, The power module further includes at least one magnetic core (30), at least one of the current sensors (40) is provided with the magnetic core (30), and at least a portion of the magnetic core (30) is nested in the housing (80).

5. The power module according to claim 4, characterized in that, The magnetic core (30) has a receiving cavity (30a) in which a portion of the current sensor (40) and a portion of the AC side connection terminal (201) are located.

6. The power module according to claim 4, characterized in that, At least a portion of each of the AC-side connection terminals (201) is nested within the housing (80); and / or; Each of the current sensors (40) is at least partially nested within the housing (80); and / or; At least a portion of each of the magnetic cores (30) is nested within the housing (80).

7. The power module according to claim 6, characterized in that, At least a portion of each of the AC side connection terminals (201) and at least a portion of each of the current sensors (40), as well as all the magnetic cores (30), are nested in the housing (80).

8. The power module according to claim 4, characterized in that, The current sensor (40) includes a body and a connection portion for connection to a circuit board, wherein the body is located in the receiving cavity (30a) of the magnetic core (30), the body is nested in the housing (80), and at least a portion of the connection portion protrudes from the housing (80).

9. The power module according to any one of claims 1-8, characterized in that, The housing (80) is formed by injection molding.

10. The power module according to any one of claims 2-7, characterized in that, The AC side connection terminal (201) includes a plurality of terminals, and at least one AC side connection terminal (201) is respectively provided with at least one magnetic core (30). The number of AC side connection terminals (201) is greater than the number of magnetic cores (30). and / or; At least one of the AC side connection terminals (201) is provided with a through hole (201a), through which the body of the current sensor (40) passes.

11. The power module according to any one of claims 2-7, characterized in that, The AC side connection terminal (201) includes a plurality of terminals, and at least one AC side connection terminal (201) is respectively provided with at least one magnetic core (30). The number of AC side connection terminals (201) and magnetic cores (30) is the same.

12. The power module according to any one of claims 2-7, characterized in that, The housing (80) includes a first side and a second side disposed opposite to each other. The first side is provided with the current sensor (40) and the AC side connection terminal (201), and the second side is provided with the DC side connection terminal. The housing (80) also includes a reinforcing rib (802) that extends along the direction from the first side to the second side.

13. The power module according to claim 12, characterized in that, The power module includes at least two power sub-modules, and the reinforcing ribs (802) are provided between at least some of the adjacent power sub-modules.

14. The power module according to any one of claims 1-13, characterized in that, The power module includes a power module body (10), and at least two power sub-modules constitute the power module body (10). The power module body (10) includes a drive module (102) for connection with a drive motor and a power generation module (101) for connection with a generator motor.

15. The power module according to any one of claims 1-14, characterized in that, The power generation module (101) includes multiple power sub-modules, and at least two of the power sub-modules share the same liner.

16. The power module according to claim 12, characterized in that, The power module includes a power module body (10), and at least two power sub-modules constitute the power module body (10). The power module body (10) includes a drive module (102) for connection with a drive motor and a power generation module (101) for connection with a generator motor. The reinforcing rib (802) is provided between the power sub-module of the drive module (102) and the power sub-module of the power generation module (101), and the reinforcing rib (802) is provided between the power sub-modules of the drive module (102).

17. A motor controller, characterized in that, Includes the power module as described in any one of claims 1-16.

18. An electric drive assembly, characterized in that, Includes the motor controller described in claim 17.

19. A vehicle, characterized in that, Includes the electric drive assembly described in claim 18.

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