Lna, radio frequency circuit, and electronic device
Patent Information
- Application Number
- CN202522340860.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-04
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-11-04
AI Technical Summary
[0006]但是，这会导致LNA中的信号通路较为冗长，且存在电源噪声通过寄生耦合进入射频信号的问题，降低LNA的通信稳定性
[0035]综上，本申请提供的LNA、射频电路及电子设备，LNA中的信号通路与电源通路之间，沿信号流向呈线性排列，从而基于对LNA的信号通路与电源通路在版图上的物理路径优化，通过将信号通路与电源通路的布局方向与信号流向一致化设计，使LNA中各模块之间布局更为紧凑化，缩短信号通路与电源通路中的信号传输路径长度并降低寄生参数影响，同时实现信号通路与电源通路的空间隔离，减少电源噪声对射频信号的干扰。
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Figure CN224790613U_ABST
Abstract
Description
Technical Field
[0001] This application relates to radio frequency technology, and more particularly to a low noise amplifier (LNA), radio frequency circuits, and electronic devices. Background Technology
[0002] In the radio frequency circuits of electronic devices, the low noise amplifier (LNA) is a key module of the radio frequency front end, which undertakes the function of high gain and low noise amplification of received signals and is widely used in smartphones, base stations, automotive radar, satellite communications and other scenarios.
[0003] With the trend of communication technology evolving towards higher frequencies and higher gains, LNAs need to achieve higher performance within a smaller chip area while meeting the stringent cost control requirements of chip manufacturing processes.
[0004] LNA designs generally face challenges such as performance loss due to excessively long signal paths, power supply noise interference, and wasted chip area, and urgently need to achieve a balance between performance and cost through layout optimization.
[0005] In existing technologies, LNAs typically employ a distributed layout strategy during implementation, with core units such as RF input modules, amplification modules, active load modules, and bias circuits independently distributed across different areas of the chip.
[0006] However, this results in a longer signal path in the LNA, and there is a problem that power supply noise enters the radio frequency signal through parasitic coupling, reducing the communication stability of the LNA. Summary of the Invention
[0007] This application provides an LNA, radio frequency circuit, and electronic device. While taking into account the performance of the LNA, it rationally allocates the signal paths between the modules and optimizes the layout structure of the LNA, so that the layout has the minimum area and the radio frequency signal path has the shortest path. While reducing the area and cost of the chip where the LNA is located, it improves the performance of the LNA and ensures the communication effect and stability of the LNA.
[0008] The first aspect of this application provides an LNA, comprising:
[0009] Multiple signal processing modules form a signal path for transmitting radio frequency signals;
[0010] Multiple power processing modules form a power path for transmitting power signals;
[0011] The signal path and the power path are arranged linearly along the signal flow direction to reduce the path length of the signal path and the power path.
[0012] A capacitive coupling module is also provided between adjacent modules of the signal path and the power path to block noise propagation.
[0013] In one embodiment of the first aspect of this application,
[0014] The plurality of signal processing modules sequentially include: a radio frequency input module, an input coupling module, a first amplification module, a first active load stage module, a load capacitor module, and a load resistor module;
[0015] The plurality of power processing modules sequentially include: a load inductor module, an output load module, a second active load stage module, a second amplification module, and an input load module;
[0016] A first capacitive coupling module is provided between the first amplification module and the second amplification module, and a second capacitive coupling module is provided between the first active load stage module and the second active load stage module.
[0017] In one embodiment of the first aspect of this application,
[0018] The plurality of signal processing modules sequentially include: an input load module, a third amplification module, a third active load stage module, and an output load module;
[0019] The plurality of power processing modules sequentially include: a load inductor module, a fourth active load stage module, a third amplification module, and an RF input module;
[0020] A third capacitive coupling module is provided between the third amplification module and the fourth amplification module, and a fourth capacitive coupling module is provided between the third active load stage module and the fourth active load stage module.
[0021] In one embodiment of the first aspect of this application,
[0022] The multiple signal processing modules and the multiple power processing modules are all modular structures, and the LNA provides a reserved standard interface and installation position for each module.
[0023] In one embodiment of the first aspect of this application,
[0024] The first adjustment structure is used to adjust the distance between the first amplification module and the second amplification module;
[0025] The second adjustment structure is used to adjust the distance between the first active load stage module and the second active load stage module.
[0026] In one embodiment of the first aspect of this application,
[0027] The third adjustment structure is used to adjust the distance between the third amplification module and the fourth amplification module;
[0028] The fourth adjustment structure is used to adjust the distance between the third active load stage module and the fourth active load stage module.
[0029] In one embodiment of the first aspect of this application,
[0030] The multiple signal processing modules are arranged in a hierarchical manner to utilize the vertical space between the signal processing modules and shorten the path length of the signal path.
[0031] And / or, the plurality of power processing modules are arranged in a layered manner to utilize the vertical space between the power processing modules and shorten the path length of the power path.
[0032] In one embodiment of the first aspect of this application, among the plurality of signal processing modules and the plurality of power processing modules, at least one target module is provided with a heat dissipation structure for heat dissipation treatment of the at least one target module.
[0033] A second aspect of this application provides a radio frequency circuit including an LNA as described in any of the first aspects of this application.
[0034] A third aspect of this application provides an electronic device including the radio frequency circuit described in the second aspect of this application.
[0035] In summary, the LNA, RF circuit, and electronic equipment provided in this application have signal paths and power paths arranged linearly along the signal flow direction in the LNA. Based on the optimization of the physical paths of the signal paths and power paths in the LNA layout, the layout direction of the signal paths and power paths is designed to be consistent with the signal flow direction, making the layout between the modules in the LNA more compact, shortening the signal transmission path length in the signal paths and power paths and reducing the influence of parasitic parameters. At the same time, spatial isolation between the signal paths and power paths is achieved, reducing the interference of power supply noise on RF signals.
[0036] Furthermore, since there are some adjacent modules between the signal path and the power path, a capacitive coupling module is also provided between the signal path and the power path to isolate them and block noise propagation, thereby achieving noise isolation between modules and improving signal integrity between the signal path and the power path. Attached Figure Description
[0037] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0038] Figure 1 A schematic diagram of the structure of an embodiment of the LNA provided in this application;
[0039] Figure 2 A structural schematic diagram of one layout of the LNA provided in this application;
[0040] Figure 3 A schematic diagram of another LNA layout provided in this application.
[0041] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation
[0042] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0043] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0044] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein.
[0045] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.
[0046] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. In the following description relating to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements.
[0047] The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application.
[0048] Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0049] This application applies to the field of radio frequency technology. With the rapid development of communication technology and the popularization of the Internet of Things and mobile communication devices, the performance of the radio frequency front-end module, as a core component of wireless communication devices, directly affects the overall communication quality of the device.
[0050] In the radio frequency circuits of electronic devices, the low noise amplifier (LNA) is a key module of the radio frequency front end, which undertakes the function of high gain and low noise amplification of received signals and is widely used in smartphones, base stations, automotive radar, satellite communications and other scenarios.
[0051] With the trend of communication technology evolving towards higher frequencies and higher gains, LNAs need to achieve higher performance within a smaller chip area while meeting the stringent cost control requirements of chip manufacturing processes.
[0052] LNA designs generally face challenges such as performance loss due to excessively long signal paths, power supply noise interference, and wasted chip area, and urgently need to achieve a balance between performance and cost through layout optimization.
[0053] In existing technologies, LNAs typically employ a distributed layout strategy during implementation, meaning that core units such as RF input modules, amplification modules, active load modules, and bias circuits are independently distributed across different areas of the chip.
[0054] However, this results in a longer signaling path in the LNA.
[0055] For example, radio frequency signals need to be transmitted over long distances between multiple modules, which can lead to increased signal loss and the introduction of additional noise, affecting the noise figure and gain stability of the LNA.
[0056] Furthermore, the spatial intersection between the power supply path and the radio frequency signal path of the LNA can cause power supply noise to enter the radio frequency signal through parasitic coupling, reducing the communication stability of the LNA.
[0057] It can be seen that the layout structure of the LNA provided in the existing technology does not fully consider the signal flow and functional correlation between modules. This results in a loose chip layout, increases the area required for the chip to implement the LNA, and brings problems such as performance loss and power supply noise interference, affecting the communication effect and stability of the LNA.
[0058] Based on this, this application provides an LNA, a radio frequency circuit, and an electronic device. While taking into account the performance of the LNA, it rationally allocates the signal paths between the modules and optimizes the layout structure of the LNA, so that the layout has the minimum area and the radio frequency signal path has the shortest path. While reducing the area and cost of the chip where the LNA is located, it improves the performance of the LNA and ensures the communication effect and stability of the LNA.
[0059] The technical solutions of this application will be described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.
[0060] Figure 1 A schematic diagram of the structure of an embodiment of the LNA provided in this application is shown below. Figure 1 The LNA shown includes:
[0061] Multiple signal processing modules form signal path A for transmitting radio frequency (RF) signals. This application does not limit the specific implementation of the RF signal transmitted through signal path A; for example, it could be a Wi-Fi signal.
[0062] In one implementation, the signal path A includes multiple modules that can be categorized by function as: input module, amplification module, load module, etc.
[0063] Multiple power processing modules form power path B, which is used to transmit power signals.
[0064] In one implementation, the power path B includes multiple modules that can be categorized by function as: inductor module, load module, and grounding module, etc.
[0065] Specifically, in the LNA provided in this application embodiment, the signal path A and the power path B are arranged linearly along the signal flow direction. Based on the physical path optimization of the signal path A and the power path B in the LNA layout, by aligning the layout direction of the signal path A and the power path B with the signal flow direction, the layout between the modules in the LNA is made more compact, the signal transmission path length in the signal path A and the power path B is shortened and the influence of parasitic parameters is reduced. At the same time, spatial isolation between the signal path A and the power path B is achieved, reducing the interference of power supply noise on the radio frequency signal.
[0066] Meanwhile, in the LNA provided in this application embodiment, since there are some adjacent modules between signal path A and power path B, a capacitive coupling module is also provided between signal path A and power path B to play an isolation role, thereby blocking noise propagation and realizing noise isolation and signal integrity improvement between modules between signal path A and power path B.
[0067] More specifically, Figure 2 A schematic diagram of the structure of one layout of the LNA provided in this application, as shown below. Figure 2 The LNA shown illustrates as follows Figure 1 The LNA shown is a specific implementation method, specifically, as follows: Figure 2 The LNA shown specifically includes:
[0068] The radio frequency input module, located in area number 1, is used to receive radio frequency signals and serves as the starting point of the signal path.
[0069] The output load module is located in area number 2.
[0070] The input coupling module, located in area number 3, is used to isolate DC signals through capacitors and transmit only radio frequency signals.
[0071] The amplification module, located in area number 4, contains MOS transistors and other components to amplify, freewheel, and isolate signals.
[0072] Input the load module and set it in area number 5.
[0073] The filter capacitor module is located in area number 6.
[0074] The active load stage module, located in area number 7, works in conjunction with the amplification module to provide load current.
[0075] The load capacitor module is located in area number 8, and the load resistor module is located in area number 9. The load capacitor module and the load resistor module are used together to convert the load current into a voltage signal.
[0076] The load inductor module, located in area number 10, adopts a spiral wound coil structure to achieve input matching and reduce area occupation.
[0077] The bias circuit module, located in area number 11, is used to provide a stable bias voltage.
[0078] It should be noted that, as Figure 2 This application only shows the layout, area, and interconnection relationship of each module in the specific physical structure of the LNA. The specific circuit implementation of each module is not limited in this application embodiment.
[0079] Then as Figure 2 The multiple signal processing modules shown specifically include: RF input module (located in area 1) → input coupling module (located in area 3) → first amplification module (located in area 4) → active load stage module (located in area 7) → load capacitor module (located in area 8) → load resistor module (located in area 9), forming signal path A.
[0080] The multiple power processing modules specifically include: load inductor module (located in area 10) → output load module (located in area 2) → second active load stage module (located in area 7) → second amplification module (located in area 4) → input load module (located in area 5) → grounding module (not shown in the figure), forming power path B.
[0081] In order to isolate adjacent modules between signal path A and power path B, a first capacitive coupling module is provided between the first amplification module and the second amplification module in region 4, and a second capacitive coupling module is provided between the first active load stage module and the second active load stage module in region 7.
[0082] It can be seen that, in such Figure 2 In the LNA shown, signal path A and power path B are physically adjacent to each other. The two main signal paths are close to each other, and the coupling between them is small. The module layout is distributed according to the signal flow direction.
[0083] The area through which the two signals flow is the core of the LNA, namely the MOS transistor. Adjacent modules can be isolated using capacitive coupling modules, which also filter the signal to ensure noise performance.
[0084] Therefore, as Figure 2 The LNA shown adopts a module layout method that can save the layout area required by the LNA while ensuring its performance. In the actual implementation process, it reduces the physical size of the LNA and the electronic device it is located in, thereby reducing the implementation cost and making it more conducive to the application and promotion of the LNA.
[0085] Figure 3 A schematic diagram of another LNA layout provided in this application is shown below. Figure 3 The LNA shown illustrates as follows Figure 1 Another specific implementation of LNA shown is, specifically, as follows: Figure 3 The LNA shown specifically includes:
[0086] The radio frequency input module, located in area number 1, is used to receive radio frequency signals.
[0087] Input the load module and set it in area number 2.
[0088] The input coupling module, located in area number 3, isolates DC signals.
[0089] The amplification module is located in area number 4, where MOS transistors amplify the signal.
[0090] The output load module, located in area number 5, converts the load current into a voltage signal.
[0091] The output load inductor is set in area number 6 to achieve output matching.
[0092] The active load stage module is located in area number 7 and works in conjunction with the amplification module.
[0093] The bias circuit module, located in area number 8, provides the bias voltage.
[0094] It should be noted that, as Figure 3 This application only shows the layout, area, and interconnection relationship of each module in the specific physical structure of the LNA. The specific circuit implementation of each module is not limited in this application embodiment.
[0095] Then as Figure 3 The multiple signal processing modules shown specifically include: RF input module (located in area 2) → third amplification module (located in area 4) → third active load stage module (located in area 7) → output load module (located in area 5), forming signal path A.
[0096] The multiple power processing modules specifically include: output load inductor (located in area 6) → fourth active load stage module (located in area 7) → fourth amplification module (located in area 4) → input load module (located in area 1) → grounding module (not shown in the figure), forming power path B.
[0097] In order to isolate adjacent modules between signal path A and power path B, a third capacitive coupling module is provided between the third amplification module and the fourth amplification module in region 4, and a fourth capacitive coupling module is provided between the third active load stage module and the fourth active load stage module in region 7.
[0098] It can be seen that, in such Figure 2 In the LNA shown, signal path A and power path B are physically adjacent. The two main signal paths are close to each other and reduce path redundancy by sharing nodes. The modules are arranged linearly along the signal flow direction, and the spatial intersection of power path B and signal path A is isolated by capacitive coupling to reduce interference.
[0099] Therefore, as Figure 3 The LNA shown adopts a module layout method that can save the layout area required by the LNA while ensuring its performance. In the actual implementation process, it reduces the physical size of the LNA and the electronic device it is located in, thereby reducing the implementation cost and making it more conducive to the application and promotion of the LNA.
[0100] Furthermore, since the LNA provided in this application offers different layout options, altering the existing LNA layout strategy, multiple signal processing modules and multiple power processing modules can be arranged in a modular structure. On the circuit board housing the LNA, each module can have a reserved standard interface and mounting position. Each module is designed as a standard pluggable module; for example, the mechanical interface uses a standardized slot and rail design. This allows LNA providers or users to flexibly select and combine different functional modules according to specific application requirements. Moreover, when a functional module malfunctions or a newer, higher-performance version becomes available, the old module can be easily removed and the new module inserted, enabling rapid LNA upgrades and improving the LNA's competitiveness and lifespan.
[0101] In the foregoing embodiments of this application, adjacent modules between signal path A and power path B are isolated by capacitive coupling modules. In some cases, if the distance between signal path A and power path B is still too small and the mutual interference cannot be effectively removed by capacitive coupling, this application also provides a physical adjustment structure for adjusting the spatial distance between adjacent modules between signal path A and power path B. This achieves the adjustment of the distance between modules in a simpler and more direct way, and can effectively adjust the distance between modules even if the LNA has been manufactured.
[0102] For example, this application may provide:
[0103] First adjustment structure: used to adjust the distance between the first amplification module and the second amplification module;
[0104] Second adjustment structure: used to adjust the distance between the first active load stage module and the second active load stage module;
[0105] The third adjustment structure is used to adjust the distance between the third amplification module and the fourth amplification module.
[0106] The fourth adjustment structure is used to adjust the distance between the third active load stage module and the fourth active load stage module.
[0107] More specifically, the aforementioned adjustment structure can be achieved through a mechanical adjustment mechanism. For example, a slide rail can be installed between the mounting bases of the two modules. The slide rail can be in the form of a linear guide rail. One module is fixed to a slider on the slide rail, and the other module is fixed to the base. The slider can slide freely along the slide rail. When the appropriate distance is reached, a locking mechanism is used to fix the slider on the slide rail to prevent the module from moving.
[0108] For example, an electric motor can be used as the power source, connected to a lead screw via a coupling. A nut on the lead screw is fixedly connected to one of the modules. When the motor rotates, it drives the lead screw to rotate, causing the nut to move along the axial direction of the lead screw, thereby moving the module and adjusting the distance between the two modules. The movement distance and direction of the modules can be precisely controlled by controlling the rotation angle and direction of the motor.
[0109] Furthermore, when constructing a pluggable modular hierarchical expansion architecture, based on designing each functional module of the LNA as a standard pluggable module, multiple signal processing modules can be hierarchically set up to utilize the vertical space between signal processing modules and shorten the path length of the signal path.
[0110] For example, multiple signal processing modules can be functionally classified and their electromagnetic characteristics analyzed. For instance, modules with high signal sensitivity requirements and susceptible to interference, such as RF input modules, input coupling modules, and amplification modules, can be planned in different layers within the same region.
[0111] And / or, multiple power processing modules can be arranged in a hierarchical manner to utilize the vertical space between the power processing modules and shorten the path length of the power path.
[0112] For example, power processing modules can be categorized, such as arranging power input modules, filtering modules, and voltage regulation modules in layers according to the power processing flow. Power input modules are typically located at the bottom layer for easy connection to external power supplies; filtering modules and voltage regulation modules are arranged sequentially in the upper layers to purify and stabilize the power supply step by step.
[0113] It can be seen that by layering the signal processing module and power processing module in the LNA, vertical space can be effectively utilized and the path length can be shortened, which can significantly improve the performance, stability and integration of the new LNA, and is more conducive to the application and promotion of LNA in various high-performance communication systems.
[0114] In one embodiment, in the LNA provided by this application, specifically among the multiple signal processing modules and multiple power processing modules, at least one target module is provided with a heat dissipation structure for heat dissipation treatment of at least one target module. The target module can be any one of the multiple signal processing modules and multiple power processing modules.
[0115] For example, heat sinks, heat pipe cooling systems, liquid cooling systems, etc., can be installed on the outside of the target modules to more effectively dissipate heat from these target modules, preventing temperature rise from affecting the stability of the modules and the LNA they are located in, and affecting their service life.
[0116] In one embodiment, among the multiple signal processing modules and multiple power processing modules, two adjacent target modules can share a heat dissipation structure.
[0117] For example, a heat sink is provided between the first amplification module and the second amplification module that are arranged adjacent to each other. One side of the heat sink is attached to the first amplification module and the other side is attached to the second amplification module. Thus, heat dissipation of multiple target modules can be achieved through a single heat dissipation structure, which reduces the structural complexity and cost of LNA while ensuring heat dissipation.
[0118] This application also provides a radio frequency circuit, including an LNA as provided in any embodiment of this application.
[0119] This application also provides an electronic device, including the radio frequency circuit as provided in any embodiment of this application. The electronic device may be a mobile phone, base station, router, smart wearable device, wireless sensor, smart home device, etc.
[0120] Furthermore, the division between modules and units in this application is merely a logical functional division. In actual implementation, there may be other division methods. For example, multiple modules or units may be combined or integrated into another system, or some features may be ignored or not executed. Another point is that the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.
[0121] The modules described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed in multiple places. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.
[0122] In addition, the functional modules in the various embodiments of the present invention can be integrated into one processing module, or each module can exist physically separately, or two or more modules can be integrated into one module.
[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that:
[0124] It is still possible to modify the technical solutions described in the foregoing embodiments, or to make equivalent substitutions for some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. An LNA, characterized in that, include: Multiple signal processing modules form a signal path for transmitting radio frequency signals; Multiple power processing modules form a power path for transmitting power signals; The signal path and the power path are arranged linearly along the signal flow direction to reduce the path length of the signal path and the power path. A capacitive coupling module is also provided between adjacent modules of the signal path and the power path to block noise propagation.
2. The LNA according to claim 1, characterized in that, The plurality of signal processing modules sequentially include: a radio frequency input module, an input coupling module, a first amplification module, a first active load stage module, a load capacitor module, and a load resistor module; The plurality of power processing modules sequentially include: a load inductor module, an output load module, a second active load stage module, a second amplification module, and an input load module; A first capacitive coupling module is provided between the first amplification module and the second amplification module, and a second capacitive coupling module is provided between the first active load stage module and the second active load stage module.
3. The LNA according to claim 1, characterized in that, The plurality of signal processing modules sequentially include: an input load module, a third amplification module, a third active load stage module, and an output load module; The plurality of power processing modules sequentially include: a load inductor module, a fourth active load stage module, a fourth amplification module, and an RF input module; A third capacitive coupling module is provided between the third amplification module and the fourth amplification module, and a fourth capacitive coupling module is provided between the third active load stage module and the fourth active load stage module.
4. The LNA according to any one of claims 1-3, characterized in that, The multiple signal processing modules and the multiple power processing modules are all modular structures, and the LNA provides a reserved standard interface and installation position for each module.
5. The LNA according to claim 4, characterized in that, Also includes: The first adjustment structure is used to adjust the distance between the first amplification module and the second amplification module; The second adjustment structure is used to adjust the distance between the first active load stage module and the second active load stage module.
6. The LNA according to claim 4, characterized in that, Also includes: The third adjustment structure is used to adjust the distance between the third amplification module and the fourth amplification module; The fourth adjustment structure is used to adjust the distance between the third active load stage module and the fourth active load stage module.
7. The LNA according to claim 4, characterized in that, The multiple signal processing modules are arranged in a hierarchical manner to utilize the vertical space between the signal processing modules and shorten the path length of the signal path. And / or, the plurality of power processing modules are arranged in a layered manner to utilize the vertical space between the power processing modules and shorten the path length of the power path.
8. The LNA according to claim 1, characterized in that, Among the plurality of signal processing modules and the plurality of power processing modules, at least one target module is provided with a heat dissipation structure for heat dissipation treatment of the at least one target module.
9. A radio frequency circuit, characterized in that, include: The LNA as described in any one of claims 1-8.
10. An electronic device, characterized in that, Includes the radio frequency circuit as described in claim 9.