A patch type photoelectric tilt switch

Abstract

The utility model provides a kind of patch type photoelectric tilt switch belongs to patch switch technical field, including infrared emission component, infrared emission component and infrared receiving component position are opposite, shade room inside movably is provided with shading bead, and the side of shade room is connected with infrared emission component, the other side of shade room is connected with infrared receiving component, the utility model is provided with horizontal installation mode and vertical installation mode two structures, effectively solve the problem of single installation mode, greatly improve the adaptability of switch in different installation scene, adopt patch type structure and installation technology, the patch type installation of adaptive circuit board, change traditional plug-in mode, install more convenient and efficient, through the design of shade room and shading bead and other structures, different detection inclination can be freely customized, solve the problem of insufficient flexibility in the prior art of detection inclination customization, meet the diversified needs of different application scenarios for tilt detection.

Description

Technical Field

[0001] This utility model relates to the field of surface mount switch technology, specifically a surface mount photoelectric tilt switch. Background Technology

[0002] In the field of photoelectric tilt sensing switches, a prior art "CN202310148576.1" discloses a surface-mount photoelectric tilt sensing switch. It uses a combination of an upper plate, a middle plate, a ball bearing, a pad, and a lower plate to achieve tilt detection by using the ball bearing to block the channel between the transmitting transistor assembly and the receiving transistor assembly. However, the installation method of the transmitting transistor assembly and the receiving transistor assembly of this surface-mount photoelectric tilt sensing switch is relatively simple, and the overall structure is not adaptable to horizontal and vertical installation modes, making it difficult to meet diverse installation requirements. At the same time, the connection and layout of its components also limits the customization flexibility of the detected tilt angle.

[0003] Moreover, existing photoelectric tilt sensing switches mostly adopt a plug-in mode, which is not convenient to install and does not perform well in terms of compatibility with surface mount technology. They cannot fully utilize the efficiency of modern circuit board surface mount technology, and they lack modularity and customizability in terms of structure. It is difficult to customize different detection tilt angles according to different application scenarios, which to some extent restricts their widespread application in various electronic devices. Utility Model Content

[0004] The purpose of this invention is to provide a patch-type photoelectric tilt switch to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a patch-type photoelectric tilt switch, comprising an infrared emitting component, an infrared receiving component, a light-shielding chamber, and a light-shielding bead. The infrared emitting component and the infrared receiving component are positioned opposite each other. The light-shielding bead is movably disposed inside the light-shielding chamber, and one side of the light-shielding chamber is connected to the infrared emitting component, while the other side of the light-shielding chamber is connected to the infrared receiving component. The infrared light emitted by the infrared emitting component passes through the light-shielding chamber and is received by the infrared receiving component. When the switch is tilted horizontally or vertically, the light-shielding bead rolls within the light-shielding chamber and blocks or conducts the infrared light, causing the infrared receiving component to output high and low levels and detect the tilt angle of the object in both light-shielding and light-transmitting states. The infrared emitting component, the infrared receiving component, and the light-shielding chamber are all patch-type structures.

[0006] As a preferred embodiment of this utility model: when the switch is installed horizontally, the infrared emitting assembly includes an infrared emitting lamp plate, an infrared emitting unit, an infrared emitting unit housing plate, and an infrared emitting perforated plate. The infrared emitting unit is fixedly installed on one side of the infrared emitting lamp plate, the infrared emitting unit housing plate is fixedly attached to one side of the infrared emitting lamp plate, and the infrared emitting perforated plate is fixedly attached to one side of the infrared emitting unit housing plate. The infrared emitting unit housing plate has a first through hole in the middle that is opposite to the light-emitting end of the infrared emitting unit and allows infrared light to pass through.

[0007] The infrared receiving component includes a phototransistor, a phototransistor perforated plate, a phototransistor housing plate, and a phototransistor lamp plate. The phototransistor is fixedly installed on one side of the phototransistor lamp plate, the phototransistor housing plate is fixedly attached to one side of the phototransistor, and the phototransistor perforated plate is fixedly attached to one side of the phototransistor housing plate. A second through hole is opened in the middle of the phototransistor perforated plate, which is opposite to the receiving end of the phototransistor and allows infrared light to pass through.

[0008] One side of the light-shielding chamber is fixedly connected to the other side of the infrared emitter aperture plate, and the other side of the light-shielding chamber is fixedly connected to the other side of the phototransistor aperture plate. One end of the light-shielding chamber is covered with a light-shielding cover, which is fastened and fixed to the light-shielding chamber and seals the internal funnel-shaped cavity. The infrared emitter is typically connected to the infrared emitter lamp plate, and the phototransistor is electrically connected to the phototransistor lamp plate.

[0009] As a preferred embodiment of this utility model: the light-shielding bead is a spherical bead made of light-shielding material, the diameter of the light-shielding bead is smaller than the width of one end of the light-shielding chamber, and the light-shielding bead can completely block infrared light passing through the light-shielding chamber.

[0010] As a preferred embodiment of this utility model: when the switch is installed vertically, it further includes a photoelectric integrated board, an identification board, a shielding board, a shielding board cover, and a bottom plate; the infrared emitter of the infrared emitting component and the phototransistor of the infrared receiving component are integrated on the same side of the photoelectric integrated board and electrically connected thereto.

[0011] One side of the signboard is fixedly connected to one side of the shielding plate via a shielding plate cover. The other side of the shielding plate is fixedly connected to one side of the light-shielding chamber. The other side of the light-shielding chamber is fixedly connected to the side of the optoelectronic integrated board equipped with an infrared emitter and a phototransistor. The infrared emitter and the phototransistor are respectively arranged opposite to the two ends of the light-shielding chamber. The side of the optoelectronic integrated board away from the light-shielding chamber is fixedly connected to the bottom plate.

[0012] The side of the light-shielding chamber away from the shielding plate is covered with a light-shielding cover, which is bonded and fixed to the light-shielding chamber to seal the internal cavity; the light-shielding bead is movably disposed in the light-shielding chamber, and its diameter is smaller than the width of the internal cavity of the light-shielding chamber, which can completely block the infrared light emitted by the infrared emitter to the phototransistor.

[0013] As a preferred embodiment of this utility model, the infrared emitting component, the infrared receiving component, and the various components of the light-shielding chamber are fixed together by surface mount welding or adhesive bonding, and the overall adapter circuit board is installed using a surface mount process.

[0014] As a preferred embodiment of this utility model, the surface of the frame is provided with a discharge hopper.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1) This utility model features two installation modes: horizontal and vertical. In the horizontal installation mode, the infrared emitting component is sequentially configured with an infrared emitter lamp plate, an infrared emitter, an infrared emitter housing plate, and an infrared emitter perforated plate. The infrared receiving component is sequentially configured with a phototransistor, a phototransistor perforated plate, a phototransistor housing plate, and a phototransistor lamp plate. The two sides of the light-shielding chamber are connected to the infrared emitter perforated plate and the phototransistor perforated plate, respectively. This makes the connection and signal transmission of each component more stable during horizontal installation, enabling accurate horizontal tilt detection. In the vertical installation mode, the infrared emitter and phototransistor are integrated into a photoelectric integrated board, along with an identification plate, a shielding plate, and a bottom plate, meeting the vertical installation and detection requirements. This effectively solves the problem of a single installation mode in the prior art and greatly improves the adaptability of the switch in different installation scenarios.

[0017] 2) In this utility model, the infrared emitting component, the infrared receiving component, and the light-shielding chamber are fixed together by surface-mount welding or adhesive bonding. The surface-mount structure and installation process are compatible with the surface-mount installation of circuit boards, which changes the traditional plug-in mode and makes the installation more convenient and efficient. Through the design of the light-shielding chamber and light-shielding beads, this utility model can freely customize different detection tilt angles, which solves the problem of insufficient customization flexibility of detection tilt angle in the prior art. It meets the diverse needs of tilt detection in different application scenarios and improves the practicality and market competitiveness of the product. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present invention;

[0019] Figure 2 This is a cross-sectional view of Embodiment 1 of the present invention;

[0020] Figure 3This is a split diagram of Embodiment 1 of the present invention;

[0021] Figure 4 This is one of the exploded schematic diagrams of Embodiment 1 of this utility model;

[0022] Figure 5 This is a schematic diagram of the structure of Embodiment 2 of this utility model;

[0023] Figure 6 This is a cross-sectional view of Embodiment 2 of the present invention;

[0024] Figure 7 This is a split diagram of Embodiment 2 of the present invention;

[0025] Figure 8 This is one of the exploded schematic diagrams of Embodiment 2 of this utility model.

[0026] In the diagram: 100, switch; 110, infrared emitting assembly; 111, infrared emitting lamp board; 112, infrared emitting; 113, infrared emitting compartment plate; 1131, first through hole; 114, infrared emitting perforated plate; 120, infrared receiving assembly; 121, phototransistor; 122, phototransistor perforated plate; 1221, second through hole; 123, phototransistor compartment plate; 124, phototransistor lamp board; 130, light-shielding chamber; 131, light-shielding cover; 200, light-shielding bead; 210, photoelectric integrated board; 220, identification plate; 230, shielding plate; 231, shielding plate cover; 240, bottom plate. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0028] Example 1

[0029] Please see Figure 1-4A surface-mount photoelectric tilt switch 100 is disclosed, comprising an infrared emitting component 110, an infrared receiving component 120, a light-shielding chamber 130, and a light-shielding bead 200. The infrared emitting component 110 and the infrared receiving component 120 are positioned opposite each other. The light-shielding bead 200 is movably disposed inside the light-shielding chamber 130, and one side of the light-shielding chamber 130 is connected to the infrared emitting component 110, while the other side of the light-shielding chamber 130 is connected to the infrared receiving component 120. The infrared light emitted by the infrared emitting component 110 passes through the light-shielding chamber 130 and is received by the infrared receiving component 120. When the switch 100 is tilted horizontally or vertically, the light-shielding bead 200 rolls within the light-shielding chamber 130 and blocks or conducts the red light, causing the infrared receiving component 120 to output high and low levels and detect the tilt angle of the object in the light-shielding and light-transmitting states. The infrared emitting component 110, the infrared receiving component 120, and the light-shielding chamber 130 are all surface-mount structures.

[0030] Specifically, when using the patch-type photoelectric tilt switch 100 for tilt detection, firstly, the infrared emitting component 110 continuously emits infrared light. Since the infrared emitting component 110 and the infrared receiving component 120 are positioned opposite each other, the infrared light emitted by the infrared emitting component 110 will pass through the light-shielding chamber 130 and propagate towards the infrared receiving component 120. When the switch 100 is in different installation scenarios in the horizontal or vertical direction, once tilting occurs, the light-shielding bead 200, which is movable inside the light-shielding chamber 130, will roll within the light-shielding chamber 130 due to gravity. If the light-shielding bead 200 rolls to the point where the infrared light propagates... Along the path, the infrared light will be blocked. At this time, the infrared receiving component 120 cannot receive the infrared light and outputs a high level. If the light-blocking bead 200 rolls away from the infrared light propagation path, the infrared light will be successfully conducted and received by the infrared receiving component 120, and the infrared receiving component 120 will output a low level. By changing the high and low level output by the infrared receiving component 120, the tilt angle of the object can be accurately detected. At the same time, the infrared emitting component 110, the infrared receiving component 120 and the light-blocking chamber 130 are all surface mount structures, which can be adapted to the surface mount installation requirements of the circuit board and meet the installation and use scenarios of different devices.

[0031] In this embodiment: when the switch 100 is in horizontal installation mode, the infrared emitting assembly 110 includes an infrared emitting lamp plate 111, an infrared emitting unit 112, an infrared emitting housing plate 113, and an infrared emitting perforated plate 114. The infrared emitting unit 112 is fixedly installed on one side of the infrared emitting lamp plate 111, the infrared emitting housing plate 113 is fixedly attached to one side of the infrared emitting lamp plate 111, and the infrared emitting perforated plate 114 is fixedly attached to one side of the infrared emitting housing plate 113. The infrared emitting housing plate 113 has a first through hole 1131 in the middle, which is opposite to the light-emitting end of the infrared emitting unit 112 and allows infrared light to pass through.

[0032] The infrared receiving assembly 120 includes a phototransistor 121, a phototransistor perforated plate 122, a phototransistor housing plate 123, and a phototransistor lamp plate 124. The phototransistor 121 is fixedly installed on one side of the phototransistor lamp plate 124, the phototransistor housing plate 123 is fixedly attached to one side of the phototransistor 121, and the phototransistor perforated plate 122 is fixedly attached to one side of the phototransistor housing plate 123. A second through hole 1221 is opened in the middle of the phototransistor perforated plate 122, which is opposite to the receiving end of the phototransistor 121 and allows infrared light to pass through.

[0033] One side of the light-shielding chamber 130 is fixedly connected to the other side of the infrared emitter aperture plate 114, and the other side of the light-shielding chamber 130 is fixedly connected to the other side of the phototransistor aperture plate 122. One end of the light-shielding chamber 130 is covered with a light-shielding cover 131, which is fastened and fixed to the light-shielding chamber 130 and seals the internal funnel-shaped cavity. The infrared emitter 112 is typically connected to the infrared emitter lamp plate 111, and the phototransistor 121 is electrically connected to the phototransistor lamp plate 124.

[0034] Specifically, when the switch 100 is installed horizontally, the infrared transmitter 112 in the infrared emitting assembly 110 is fixedly installed on one side of the infrared transmitter lamp plate 111. The infrared transmitter lamp plate 111 provides mounting support and circuit connection for the infrared transmitter 112, ensuring that the infrared transmitter 112 emits infrared light stably. The infrared transmitter housing plate 113 is fixedly attached to one side of the infrared transmitter lamp plate 111, forming a protection for the infrared transmitter 112. The first through hole 1131 in the middle of the infrared transmitter housing plate 113 is opposite to the light-emitting end of the infrared transmitter 112, ensuring that the infrared light emitted by the infrared transmitter 112 can pass smoothly through the first through hole 1131.

[0035] The infrared emitter perforated plate 114 is fixedly attached to one side of the infrared emitter compartment plate 113 to further regulate the infrared light propagation path. In the infrared receiver assembly 120, the phototransistor 121 is fixedly installed on one side of the phototransistor lamp plate 124. The phototransistor lamp plate 124 provides circuit connection for the phototransistor 121 to ensure that the phototransistor 121 works normally to receive infrared light. The phototransistor compartment plate 123 is fixedly attached to one side of the phototransistor 121 to protect the phototransistor 121. The phototransistor perforated plate 122 is fixedly attached to one side of the phototransistor compartment plate 123, and the second through hole 1221 in the middle is opposite to the receiving end of the phototransistor 121 to facilitate the passage of infrared light and its reception by the phototransistor 121.

[0036] One side of the light-shielding chamber 130 is fixedly connected to the other side of the infrared emitter aperture plate 114, and the other side is fixedly connected to the other side of the phototransistor aperture plate 122, so that the infrared light can propagate stably in the light-shielding chamber 130. The light-shielding cover 131 at one end of the light-shielding chamber 130 is fastened and fixed to the light-shielding chamber 130, sealing the internal funnel-shaped cavity and preventing the light-shielding bead 200 from falling out of the light-shielding chamber 130.

[0037] In use, the infrared emitter 112 obtains electrical energy to emit infrared light through a typical connection with the infrared emitter lamp plate 111. The infrared light passes through the first through hole 1131, the infrared emitter aperture plate 114, the light-shielding chamber 130, the phototransistor aperture plate 122, and the second through hole 1221 in sequence. If the switch 100 is tilted, the light-shielding bead 200 in the light-shielding chamber 130 rolls to block or conduct the infrared light. The phototransistor 121, through its electrical connection with the phototransistor lamp plate 124, converts the state of receiving infrared light into a high or low level output, thus completing the horizontal tilt detection.

[0038] In this embodiment: the light-shielding bead 200 is a spherical bead made of light-shielding material. The diameter of the light-shielding bead 200 is smaller than the width of one end of the light-shielding chamber 130. The light-shielding bead 200 can completely block infrared light passing through the light-shielding chamber 130.

[0039] Specifically, the light-shielding bead 200 is made of light-shielding material and is spherical. The spherical structure makes the light-shielding bead 200 roll more smoothly in the light-shielding chamber 130 and can quickly respond to the tilting action of the switch 100. Since the diameter of the light-shielding bead 200 is smaller than the width of one end of the cavity of the light-shielding chamber 130, it ensures that the light-shielding bead 200 has enough rolling space in the light-shielding chamber 130 and will not get stuck due to size mismatch.

[0040] When the switch 100 tilts, the light-shielding bead 200 rolls onto the infrared light propagation path. The properties of the light-shielding material allow the light-shielding bead 200 to completely block the infrared light passing through the light-shielding chamber 130, preventing partial leakage of infrared light and causing misjudgment by the infrared receiving component 120. If the light-shielding bead 200 rolls away from the infrared light propagation path, the infrared light can pass through the light-shielding chamber 130 without obstruction, ensuring that the infrared receiving component 120 can accurately receive the infrared light. This makes the high and low levels output by the infrared receiving component 120 more accurate, improving the accuracy of the switch 100 in detecting the tilt angle of objects and meeting the requirements for detection accuracy in different horizontal installation scenarios.

[0041] Example 2

[0042] Please refer to the detailed information. Figure 5-8The technical features that distinguish this embodiment from embodiment 1 are: when the switch 100 is in a vertical installation mode, it also includes a photoelectric integrated board 210, an identification board 220, a shielding board 230, a shielding board cover 231, and a bottom plate 240; the infrared emitter 112 of the infrared emitting component 110 and the phototransistor 121 of the infrared receiving component 120 are integrated on the same side of the photoelectric integrated board 210 and electrically connected thereto;

[0043] One side of the signboard 220 is fixedly connected to one side of the shielding plate 230 via the shielding plate cover 231. The other side of the shielding plate 230 is fixedly connected to one side of the light-shielding chamber 130. The other side of the light-shielding chamber 130 is fixedly connected to the side of the optoelectronic integrated board 210 where the infrared emitter 112 and the phototransistor 121 are provided. The infrared emitter 112 and the phototransistor 121 are respectively arranged opposite to the two ends of the light-shielding chamber 130. The side of the optoelectronic integrated board 210 away from the light-shielding chamber 130 is fixedly connected to the lower base plate 240.

[0044] A light-shielding cover 131 is provided on the side of the light-shielding chamber 130 away from the light-shielding plate 230. The light-shielding cover 131 is bonded and fixed to the light-shielding chamber 130 to seal the internal cavity. The light-shielding bead 200 is movably disposed in the light-shielding chamber 130. Its diameter is smaller than the width of the internal cavity of the light-shielding chamber 130, and it can completely block the infrared light emitted by the infrared emitter 112 to the phototransistor 121.

[0045] Specifically, when the switch 100 is installed in a vertical mode, the infrared transmitter 112 of the infrared emitting component 110 and the phototransistor 121 of the infrared receiving component 120 are integrated on the same side of the optoelectronic integrated board 210. The optoelectronic integrated board 210 provides an integrated installation platform and circuit connection for the two, reducing the space occupied by the components and adapting to the compact layout requirements of vertical installation. Furthermore, the infrared transmitter 112 and the phototransistor 121 are electrically connected to the optoelectronic integrated board 210 to ensure that the two can stably obtain power and transmit signals.

[0046] One side of the signboard 220 is fixedly connected to one side of the shielding plate 230 via the shielding plate cover 231. The signboard 220 can be marked with relevant information about the switch 100, making it convenient for installers to identify the installation direction. The other side of the shielding plate 230 is fixedly connected to one side of the light-shielding chamber 130, which plays a role in shielding and protecting one side of the light-shielding chamber 130.

[0047] The other side of the light-shielding chamber 130 is fixedly connected to the side of the optoelectronic integrated board 210 where the infrared emitter 112 and the phototransistor 121 are located. The infrared emitter 112 and the phototransistor 121 are respectively opposite to the two ends of the light-shielding chamber 130, ensuring that the infrared light emitted by the infrared emitter 112 can accurately enter the light-shielding chamber 130 and propagate toward the phototransistor 121. The side of the optoelectronic integrated board 210 away from the light-shielding chamber 130 is fixedly connected to the lower base plate 240. The lower base plate 240 provides bottom support for the entire switch 100, enhancing the stability when installed vertically. The light-shielding cover 131 on the side of the light-shielding chamber 130 away from the shielding plate 230 is bonded and fixed to the light-shielding chamber 130, sealing the internal cavity and preventing the light-shielding bead 200 from falling out.

[0048] In use, the infrared emitter 112 emits infrared light into the light-shielding chamber 130. If the switch 100 is tilted vertically, the light-shielding bead 200 inside the light-shielding chamber 130 rolls. Its diameter is smaller than the width of the internal cavity of the light-shielding chamber 130, so it can roll smoothly to block or conduct infrared light. When the light-shielding bead 200 blocks infrared light, the phototransistor 121 outputs a high level signal. When the light-shielding bead 200 conducts infrared light, the phototransistor 121 receives a signal and outputs a low level signal, thereby completing the vertical tilt detection.

[0049] In this embodiment, the components of the infrared emitting assembly 110, the infrared receiving assembly 120, and the light-shielding chamber 130 are fixed together by surface mount soldering or adhesive bonding, and the overall adapter circuit board is installed using a surface mount process.

[0050] Specifically, whether in horizontal or vertical installation mode, the components of the infrared emitting assembly 110, the infrared receiving assembly 120, and the light-shielding chamber 130 are fixed together by patch welding or adhesive bonding. This not only ensures that the components are firmly connected and prevents them from loosening due to vibration or other factors during the use of the switch 100, but also allows the components to form a compact overall structure, reducing space occupation.

[0051] When installed on the circuit board, the surface mount technology of the overall adapter circuit board eliminates the need for the traditional plug-in mode, which simplifies the installation process, improves installation efficiency, and also reduces the risk of damage to components during installation.

[0052] For example, in the horizontal installation mode, the patch welding of the infrared transmitter compartment plate 113 with the infrared transmitter lamp plate 111 and the infrared transmitter hole plate 114, and the adhesive bonding of the shielding plate 230 with the marking plate 220 and the light shielding chamber 130 in the vertical installation mode, can ensure the stable cooperation of each structure, ensure the normal emission, propagation and reception of infrared light, and thus ensure that the switch 100 can stably and accurately realize the tilt detection function in different installation scenarios, and meet the installation and performance requirements of various electronic devices for the patch photoelectric tilt switch 100.

[0053] The contents not described in detail in this description are existing technologies known to those skilled in the art. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A surface-mount photoelectric tilt switch, characterized in that: The system includes an infrared emitting component (110), an infrared receiving component (120), a light-shielding chamber (130), and a light-shielding bead (200). The infrared emitting component (110) and the infrared receiving component (120) are positioned opposite each other. The light-shielding bead (200) is movably disposed inside the light-shielding chamber (130). One side of the light-shielding chamber (130) is connected to the infrared emitting component (110), and the other side of the light-shielding chamber (130) is connected to the infrared receiving component (120). The infrared light emitted by component (110) passes through the light-shielding chamber (130) and is received by the infrared receiving component (120). When the switch is tilted horizontally or vertically, the light-shielding bead (200) rolls in the light-shielding chamber (130) and blocks or conducts the red light, so that the infrared receiving component (120) outputs high and low levels and detects the tilt angle of the object in the light-shielding and light-transmitting states. The infrared emitting component (110), the infrared receiving component (120) and the light-shielding chamber (130) are all surface-mount structures.

2. The surface-mount photoelectric tilt switch according to claim 1, characterized in that: When the switch is installed horizontally, the infrared emitting assembly (110) includes an infrared emitting lamp plate (111), an infrared emitting unit (112), an infrared emitting housing plate (113), and an infrared emitting perforated plate (114). The infrared emitting unit (112) is fixedly installed on one side of the infrared emitting lamp plate (111), the infrared emitting housing plate (113) is fixedly attached to one side of the infrared emitting lamp plate (111), and the infrared emitting perforated plate (114) is fixedly attached to one side of the infrared emitting housing plate (113). The infrared emitting housing plate (113) has a first through hole (1131) in the middle, which is opposite to the light-emitting end of the infrared emitting unit (112) and allows infrared light to pass through. The infrared receiving assembly (120) includes a phototransistor (121), a phototransistor perforated plate (122), a phototransistor housing plate (123), and a phototransistor lamp plate (124). The phototransistor (121) is fixedly installed on one side of the phototransistor lamp plate (124), the phototransistor housing plate (123) is fixedly attached to one side of the phototransistor (121), and the phototransistor perforated plate (122) is fixedly attached to one side of the phototransistor housing plate (123). A second through hole (1221) is opened in the middle of the phototransistor perforated plate (122) opposite to the receiving end of the phototransistor (121) and allowing infrared light to pass through. One side of the light-shielding chamber (130) is fixedly connected to the other side of the infrared emitter aperture plate (114), and the other side of the light-shielding chamber (130) is fixedly connected to the other side of the phototransistor aperture plate (122). One end of the light-shielding chamber (130) is covered with a light-shielding cover (131). The light-shielding cover (131) is fastened and fixed to the light-shielding chamber (130) and seals the funnel-shaped cavity inside. The infrared emitter (112) is typically connected to the infrared emitter lamp plate (111), and the phototransistor (121) is electrically connected to the phototransistor lamp plate (124).

3. A surface-mount photoelectric tilt switch according to claim 2, characterized in that: The light-shielding bead (200) is a spherical bead made of light-shielding material. The diameter of the light-shielding bead (200) is smaller than the width of one end of the light-shielding chamber (130). The light-shielding bead (200) can completely block infrared light passing through the light-shielding chamber (130).

4. A surface-mount photoelectric tilt switch according to claim 1, characterized in that: When the switch is installed vertically, it also includes an optoelectronic integrated board (210), an identification plate (220), a shielding plate (230), a shielding plate cover (231), and a bottom plate (240); the infrared emitter (112) of the infrared emitting component (110) and the phototransistor (121) of the infrared receiving component (120) are integrated on the same side of the optoelectronic integrated board (210) and electrically connected thereto; One side of the signboard (220) is fixedly connected to one side of the shielding plate (230) via the shielding plate cover (231). The other side of the shielding plate (230) is fixedly connected to one side of the light-shielding chamber (130). The other side of the light-shielding chamber (130) is fixedly connected to the side of the optoelectronic integrated board (210) equipped with an infrared emitter (112) and a phototransistor (121). The infrared emitter (112) and the phototransistor (121) are respectively arranged opposite to the two ends of the light-shielding chamber (130). The side of the optoelectronic integrated board (210) away from the light-shielding chamber (130) is fixedly connected to the bottom plate (240). The side of the light-shielding chamber (130) away from the shielding plate (230) is covered with a light-shielding cover (131), which is bonded and fixed to the light-shielding chamber (130) to seal the internal cavity; the light-shielding bead (200) is movably disposed in the light-shielding chamber (130), and its diameter is smaller than the width of the internal cavity of the light-shielding chamber (130), which can completely block the infrared light emitted by the infrared emitter (112) to the phototransistor (121).

5. A patch-type photoelectric tilt switch according to claim 2 or 4, characterized in that: The components of the infrared emitting assembly (110), infrared receiving assembly (120), and light-shielding chamber (130) are fixed together by patch welding or adhesive bonding.

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